JP4920969B2 - 電気メッキ装置 - Google Patents
電気メッキ装置 Download PDFInfo
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- JP4920969B2 JP4920969B2 JP2005375489A JP2005375489A JP4920969B2 JP 4920969 B2 JP4920969 B2 JP 4920969B2 JP 2005375489 A JP2005375489 A JP 2005375489A JP 2005375489 A JP2005375489 A JP 2005375489A JP 4920969 B2 JP4920969 B2 JP 4920969B2
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Description
10 メッキ槽
20 アノード
30 主基板
30a 表面(アノード対向面)
30b 裏面(アノード対向面とは反対側の面)
32 メイン電極部材
32a 電極薄板部
32b 電極棒
33 絶縁材
35 メイン電源
40 補助基板
40b 電極棒
45 サブ電源
Claims (5)
- メッキ槽内に配置したカソードである主基板と、この主基板に所定間隔をあけて対向配置したアノードと、主基板の周囲に該主基板とは電気的に非接続で配置した補助基板と、アノードと主基板の間及びアノードと補助基板の間にそれぞれ電流を供給する電源とを有する電気メッキ装置において、
前記主基板と前記補助基板の各々に、前記電源からの給電点を複数設け、かつ、前記補助基板に設けた複数の給電点は、前記主基板に設けた複数の給電点に対して、隣り合う給電点の中間位置からいずれか一方の給電点側へずらして配置されていることを特徴とする電気メッキ装置。 - 請求項1記載の電気メッキ装置において、前記給電点は、前記主基板と前記補助基板の各々に少なくとも4以上設けられている電気メッキ装置。
- 請求項1または2記載の電気メッキ装置において、前記主基板は円板状をなし、前記補助基板は該主基板の外周を囲む円環状をなしていて、前記複数の給電点は、前記主基板及び前記補助基板の周方向に等間隔で設けられている電気メッキ装置。
- 請求項1ないし3のいずれか一項に記載の電気メッキ装置において、前記補助基板の給電点は、該補助基板の表裏面に対して直交させて設けた複数の電極棒により形成されている電気メッキ装置。
- 請求項1ないし4のいずれか一項に記載の電気メッキ装置において、前記主基板の給電点は、該主基板の外周に接する導電板と、この導電板に対して直交させて設けた複数の電極棒とにより形成されている電気メッキ装置。
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Application Number | Priority Date | Filing Date | Title |
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JP2005375489A JP4920969B2 (ja) | 2005-12-27 | 2005-12-27 | 電気メッキ装置 |
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JP2005375489A JP4920969B2 (ja) | 2005-12-27 | 2005-12-27 | 電気メッキ装置 |
Publications (2)
Publication Number | Publication Date |
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JP2007177277A JP2007177277A (ja) | 2007-07-12 |
JP4920969B2 true JP4920969B2 (ja) | 2012-04-18 |
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Application Number | Title | Priority Date | Filing Date |
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JP2005375489A Expired - Fee Related JP4920969B2 (ja) | 2005-12-27 | 2005-12-27 | 電気メッキ装置 |
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JP (1) | JP4920969B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190059209A (ko) * | 2017-11-22 | 2019-05-30 | 가부시키가이샤 에바라 세이사꾸쇼 | 전기 도금 장치에 있어서의 급전점의 배치의 결정 방법 및 직사각형의 기판을 도금하기 위한 전기 도금 장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55152200A (en) * | 1979-05-17 | 1980-11-27 | Fujitsu Ltd | Electroplating |
JPH04318199A (ja) * | 1991-04-16 | 1992-11-09 | Fujitsu Ltd | 電解めっき装置 |
JP3112119B2 (ja) * | 1992-04-30 | 2000-11-27 | 沖電気工業株式会社 | 半導体ウエハのメッキ装置 |
JP3523449B2 (ja) * | 1997-05-06 | 2004-04-26 | 株式会社中央製作所 | ハンガー給電の安全保護方法 |
JP2001152396A (ja) * | 1999-11-25 | 2001-06-05 | Hitachi Ltd | 半導体製造装置及び半導体製造方法 |
JP2005171307A (ja) * | 2003-12-10 | 2005-06-30 | Tdk Corp | ウエハ、その製造方法及びメッキ装置 |
JP4317045B2 (ja) * | 2004-01-29 | 2009-08-19 | Tdk株式会社 | 電気メッキ方法及び電気メッキ装置 |
-
2005
- 2005-12-27 JP JP2005375489A patent/JP4920969B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190059209A (ko) * | 2017-11-22 | 2019-05-30 | 가부시키가이샤 에바라 세이사꾸쇼 | 전기 도금 장치에 있어서의 급전점의 배치의 결정 방법 및 직사각형의 기판을 도금하기 위한 전기 도금 장치 |
KR102515885B1 (ko) | 2017-11-22 | 2023-03-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 전기 도금 장치에 있어서의 급전점의 배치의 결정 방법 및 직사각형의 기판을 도금하기 위한 전기 도금 장치 |
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JP2007177277A (ja) | 2007-07-12 |
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