JP4906051B2 - 表示装置 - Google Patents
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- JP4906051B2 JP4906051B2 JP2005502613A JP2005502613A JP4906051B2 JP 4906051 B2 JP4906051 B2 JP 4906051B2 JP 2005502613 A JP2005502613 A JP 2005502613A JP 2005502613 A JP2005502613 A JP 2005502613A JP 4906051 B2 JP4906051 B2 JP 4906051B2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/871—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
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Description
本発明の実施の形態を、図面を用いて詳細に説明する。
本発明の実施の形態を、図面を用いて詳細に説明する。
Claims (6)
- 第1の基板に接して設けられた下地膜と、
前記下地膜上に設けられた、一層が有機樹脂材料を有する絶縁層と、
前記絶縁層上に設けられた、複数の発光素子から成る表示部と、
前記絶縁層上に、前記表示部の外側に設けられたシール材と、
前記シール材の外側で、前記下地膜及び前記絶縁層の外端部側面を被覆する封止膜と、
前記シール材により前記第1の基板に固着された第2の基板と、を有し、
前記シール材は前記封止膜に接し、
前記封止膜はTi、Mo、WもしくはSiの元素から選ばれた一種、または複数種からなり、
前記封止膜は前記第1の基板上に接して設けられていることを特徴とする表示装置。 - 第1の基板に接して設けられた下地膜と、
前記下地膜上に設けられた、一層が有機樹脂材料を有する絶縁層と、
前記絶縁層上に設けられた、複数の発光素子から成る表示部と、
前記絶縁層上に、前記表示部の外側に設けられたシール材と、
前記下地膜及び前記絶縁層に設けられた開口部を被覆し、かつ前記開口部内で前記第1の基板と接する封止膜と、
前記シール材により前記第1の基板に固着された第2の基板と、を有し、
前記シール材は前記封止膜に接し、
前記封止膜はTi、Mo、WもしくはSiの元素から選ばれた一種、または複数種からなることを特徴とする表示装置。 - 第1の基板に接して設けられた下地膜と、
前記下地膜上に設けられた、一層が有機樹脂材料を有する絶縁層と、
前記絶縁層上に設けられた、複数の発光素子から成る表示部と、
前記絶縁層上に、前記表示部の外側に設けられたシール材と、
前記下地膜及び前記絶縁層に設けられた複数の開口部を被覆し、かつ前記複数の開口部内で前記第1の基板と接する封止膜と、
前記シール材により前記第1の基板に固着された第2の基板と、を有し、
前記シール材は前記封止膜に接し、
前記封止膜はTi、Mo、WもしくはSiの元素から選ばれた一種、または複数種からなることを特徴とする表示装置。 - 請求項1乃至3のいずれか一項において、前記有機樹脂材料はアクリル、ポリアミド、ポリイミドまたはアルキル基を含む酸化珪素から選ばれた一種、または複数種からなることを特徴とする表示装置。
- 請求項1乃至4のいずれか一項において、前記発光素子は有機発光材料を用いることを特徴とする表示装置。
- 請求項1乃至5のいずれか一項において、前記下地膜上に設けられたTFTを有することを特徴とする表示装置。
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PCT/JP2003/015764 WO2004057920A1 (ja) | 2002-12-19 | 2003-12-10 | 表示装置及び表示装置の作製方法 |
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JP2020037437A Withdrawn JP2020107610A (ja) | 2002-12-19 | 2020-03-05 | 表示装置 |
JP2021127425A Withdrawn JP2021185568A (ja) | 2002-12-19 | 2021-08-03 | 表示装置 |
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JP2020037437A Withdrawn JP2020107610A (ja) | 2002-12-19 | 2020-03-05 | 表示装置 |
JP2021127425A Withdrawn JP2021185568A (ja) | 2002-12-19 | 2021-08-03 | 表示装置 |
JP2021127424A Withdrawn JP2021192366A (ja) | 2002-12-19 | 2021-08-03 | 表示装置 |
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JP (11) | JP4906051B2 (ja) |
KR (1) | KR100890957B1 (ja) |
CN (2) | CN1729719B (ja) |
AU (1) | AU2003288999A1 (ja) |
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TWI322455B (en) | 2010-03-21 |
JP6085012B2 (ja) | 2017-02-22 |
JP6553150B2 (ja) | 2019-07-31 |
JPWO2004057920A1 (ja) | 2006-04-27 |
AU2003288999A1 (en) | 2004-07-14 |
JP2017224616A (ja) | 2017-12-21 |
JP2016219433A (ja) | 2016-12-22 |
US8179040B2 (en) | 2012-05-15 |
JP2012094524A (ja) | 2012-05-17 |
KR20050084297A (ko) | 2005-08-26 |
JP2018036661A (ja) | 2018-03-08 |
US7190115B2 (en) | 2007-03-13 |
WO2004057920A1 (ja) | 2004-07-08 |
JP5969203B2 (ja) | 2016-08-17 |
JP2014063748A (ja) | 2014-04-10 |
JP5921517B2 (ja) | 2016-05-24 |
TW200415698A (en) | 2004-08-16 |
JP2021192366A (ja) | 2021-12-16 |
JP2020107610A (ja) | 2020-07-09 |
JP2016001327A (ja) | 2016-01-07 |
CN101882668A (zh) | 2010-11-10 |
KR100890957B1 (ko) | 2009-03-27 |
JP6691246B2 (ja) | 2020-04-28 |
JP2019091705A (ja) | 2019-06-13 |
CN101882668B (zh) | 2012-05-09 |
JP2021185568A (ja) | 2021-12-09 |
JP6391634B2 (ja) | 2018-09-19 |
CN1729719B (zh) | 2010-09-15 |
US20080116795A1 (en) | 2008-05-22 |
JP6491276B2 (ja) | 2019-03-27 |
CN1729719A (zh) | 2006-02-01 |
US20040185301A1 (en) | 2004-09-23 |
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