JP4905537B2 - アンテナ装置 - Google Patents
アンテナ装置 Download PDFInfo
- Publication number
- JP4905537B2 JP4905537B2 JP2009249789A JP2009249789A JP4905537B2 JP 4905537 B2 JP4905537 B2 JP 4905537B2 JP 2009249789 A JP2009249789 A JP 2009249789A JP 2009249789 A JP2009249789 A JP 2009249789A JP 4905537 B2 JP4905537 B2 JP 4905537B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- gap
- antenna
- terminal
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 33
- 238000004891 communication Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 18
- 238000009966 trimming Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
Description
本発明のアンテナ装置について、図1、2を用いて説明する。図1は、本発明の実施例1におけるアンテナの概観図、図2は、本発明の実施例1におけるアンテナ装置の概観図である。
実施例2は、チップアンテナを2つの周波数に対応させた場合であり、図7〜図9を用いて説明する。なお、実施例1と同様の部分は実施例1を援用する。
2 基体
3、4 端子
5 ギャップ
6 第1の導電膜
7 第2の導電膜
8 基板
9 グランドパターン
10、11 導体パターン
12 マッチング素子
13 給電部
21 チップアンテナ
22 基体
23、24、25 端子
26、27 ギャップ
28 第1の導電膜
29 第2の導電膜
30 第3の導電膜
31 第4の導電膜
32 基板
33 グランドパターン
34、35、36 導体パターン
37 マッチング素子
38 給電部
Claims (1)
- 基板上に設けられた基体と、
前記基体を形成された導電膜と、
前記導電膜を第1の導電膜と第2の導電膜とに電気的に分割するギャップ部と、
前記第1の導電膜に接続され、前記基板上に設けられた給電部と、
前記第2の導電膜に導体を介して接続されるグランド部と、を備え、
前記ギャップ部は前記基体の中央に配置され、
前記給電部、前記第1の導電膜、前記ギャップ部、前記第2の導電膜、前記導体、前記グランド部の順に直列に接続され、前記ギャップ部の容量成分をC、前記第2の導電膜のインダクタ成分をL1、前記導体のインダクタ成分をL2とすると、通信周波数fは以下の式で成り立つことを特徴とするアンテナ装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009249789A JP4905537B2 (ja) | 2009-10-30 | 2009-10-30 | アンテナ装置 |
EP10189517A EP2320516B1 (en) | 2009-10-30 | 2010-10-29 | Antenna and communication device equipped with the same |
US12/915,163 US20110102270A1 (en) | 2009-10-30 | 2010-10-29 | Antenna and communication device equipped with the same |
CN2010205938951U CN202067892U (zh) | 2009-10-30 | 2010-11-01 | 天线和装配有该天线的通信设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009249789A JP4905537B2 (ja) | 2009-10-30 | 2009-10-30 | アンテナ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011097392A JP2011097392A (ja) | 2011-05-12 |
JP4905537B2 true JP4905537B2 (ja) | 2012-03-28 |
Family
ID=43548814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009249789A Expired - Fee Related JP4905537B2 (ja) | 2009-10-30 | 2009-10-30 | アンテナ装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110102270A1 (ja) |
EP (1) | EP2320516B1 (ja) |
JP (1) | JP4905537B2 (ja) |
CN (1) | CN202067892U (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103563173B (zh) * | 2011-05-25 | 2016-06-08 | 株式会社村田制作所 | 天线装置及通信终端装置 |
JP5995059B2 (ja) * | 2012-05-15 | 2016-09-21 | 三菱マテリアル株式会社 | アンテナ装置 |
CN111403908B (zh) * | 2020-03-24 | 2021-06-08 | Oppo广东移动通信有限公司 | 一种天线组件和电子设备 |
WO2023204461A1 (ko) * | 2022-04-22 | 2023-10-26 | 삼성전자 주식회사 | 그라운드를 확장하기 위한 구조를 포함하는 안테나 모듈 및 이를 포함하는 전자 장치 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1093320A (ja) * | 1996-09-18 | 1998-04-10 | Murata Mfg Co Ltd | チップアンテナ |
JPH1131913A (ja) * | 1997-05-15 | 1999-02-02 | Murata Mfg Co Ltd | チップアンテナ及びそれを用いた移動体通信機 |
JPH1127025A (ja) * | 1997-07-03 | 1999-01-29 | Murata Mfg Co Ltd | アンテナ装置 |
US6124831A (en) * | 1999-07-22 | 2000-09-26 | Ericsson Inc. | Folded dual frequency band antennas for wireless communicators |
JP2003037428A (ja) * | 2001-05-16 | 2003-02-07 | Furukawa Electric Co Ltd:The | 線状アンテナ |
KR100616509B1 (ko) * | 2002-05-31 | 2006-08-29 | 삼성전기주식회사 | 광대역 칩 안테나 |
WO2004084344A1 (en) * | 2003-03-18 | 2004-09-30 | Sony Ericsson Mobile Communications Ab | Compact diversity antenna |
EP1460715A1 (en) * | 2003-03-20 | 2004-09-22 | Hitachi Metals, Ltd. | Surface mount type chip antenna and communication equipment using the same |
FI118748B (fi) * | 2004-06-28 | 2008-02-29 | Pulse Finland Oy | Pala-antenni |
KR100634883B1 (ko) * | 2004-10-13 | 2006-10-17 | 삼성전자주식회사 | 이중대역 칩 안테나 모듈 |
JP3883565B1 (ja) * | 2006-02-28 | 2007-02-21 | Tdk株式会社 | チップアンテナ |
EP2216853B1 (en) * | 2007-10-26 | 2012-01-18 | TDK Corporation | Antenna device and wireless communication equipment using the same |
JP2009249789A (ja) | 2008-04-09 | 2009-10-29 | Oji Paper Co Ltd | 新聞広告用紙 |
-
2009
- 2009-10-30 JP JP2009249789A patent/JP4905537B2/ja not_active Expired - Fee Related
-
2010
- 2010-10-29 EP EP10189517A patent/EP2320516B1/en not_active Not-in-force
- 2010-10-29 US US12/915,163 patent/US20110102270A1/en not_active Abandoned
- 2010-11-01 CN CN2010205938951U patent/CN202067892U/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN202067892U (zh) | 2011-12-07 |
JP2011097392A (ja) | 2011-05-12 |
EP2320516B1 (en) | 2013-03-20 |
EP2320516A1 (en) | 2011-05-11 |
US20110102270A1 (en) | 2011-05-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10490349B2 (en) | Coil component and method for manufacturing the same | |
KR102442384B1 (ko) | 코일 부품 및 그 제조방법 | |
US9412509B2 (en) | Multilayer electronic component having conductive patterns and board having the same | |
KR102025708B1 (ko) | 칩 전자부품 및 그 실장기판 | |
JP5304220B2 (ja) | アンテナ装置、アンテナ装置を含むプリント基板、及びアンテナ装置を含む無線通信装置 | |
US10312014B2 (en) | Inductor with improved inductance for miniaturization and method of manufacturing the same | |
KR102565701B1 (ko) | 코일 부품 | |
CN105210292B (zh) | 调谐***、装置以及方法 | |
JP2015076601A (ja) | 積層型インダクタ及びその製造方法 | |
JP2004336250A (ja) | アンテナ整合回路、アンテナ整合回路を有する移動体通信装置、アンテナ整合回路を有する誘電体アンテナ | |
US20150137929A1 (en) | Multilayer inductor | |
US20150187486A1 (en) | Multilayer electronic component and manufacturing method thereof | |
JP4905537B2 (ja) | アンテナ装置 | |
KR102047561B1 (ko) | 칩 전자부품 및 그 실장기판 | |
KR101153496B1 (ko) | 적층형 인덕터 및 적층형 인덕터 제조 방법 | |
US20210036098A1 (en) | Capacitor | |
KR102064072B1 (ko) | 인덕터 | |
CN110534287B (zh) | 电感器 | |
CN110676029B (zh) | 电感器 | |
JP4661547B2 (ja) | アンテナ装置 | |
US8462051B2 (en) | Chip antenna and antenna apparatus | |
JP5729559B2 (ja) | アンテナ装置 | |
US20100225545A1 (en) | Capacitive-feed antenna and wireless communication apparatus having the same | |
JP6057163B2 (ja) | アンテナ装置 | |
JP6032001B2 (ja) | アンテナ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110311 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110628 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110922 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20110930 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111213 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111226 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150120 Year of fee payment: 3 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4905537 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150120 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |