JP4878662B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
JP4878662B2
JP4878662B2 JP2011526335A JP2011526335A JP4878662B2 JP 4878662 B2 JP4878662 B2 JP 4878662B2 JP 2011526335 A JP2011526335 A JP 2011526335A JP 2011526335 A JP2011526335 A JP 2011526335A JP 4878662 B2 JP4878662 B2 JP 4878662B2
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group
compound
general formula
photosensitive resin
resin composition
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Japanese (ja)
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JPWO2011135887A1 (ja
Inventor
智史 渋井
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Asahi Kasei E Materials Corp
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Asahi Kasei E Materials Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011526335A 2010-04-28 2011-02-09 感光性樹脂組成物 Active JP4878662B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011526335A JP4878662B2 (ja) 2010-04-28 2011-02-09 感光性樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010104180 2010-04-28
JP2010104180 2010-04-28
JP2011526335A JP4878662B2 (ja) 2010-04-28 2011-02-09 感光性樹脂組成物
PCT/JP2011/052766 WO2011135887A1 (ja) 2010-04-28 2011-02-09 感光性樹脂組成物

Related Child Applications (1)

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JP2011224218A Division JP2012027490A (ja) 2010-04-28 2011-10-11 感光性樹脂組成物

Publications (2)

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JP4878662B2 true JP4878662B2 (ja) 2012-02-15
JPWO2011135887A1 JPWO2011135887A1 (ja) 2013-07-18

Family

ID=44861208

Family Applications (2)

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JP2011526335A Active JP4878662B2 (ja) 2010-04-28 2011-02-09 感光性樹脂組成物
JP2011224218A Pending JP2012027490A (ja) 2010-04-28 2011-10-11 感光性樹脂組成物

Family Applications After (1)

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JP2011224218A Pending JP2012027490A (ja) 2010-04-28 2011-10-11 感光性樹脂組成物

Country Status (5)

Country Link
JP (2) JP4878662B2 (zh)
KR (1) KR101344125B1 (zh)
CN (1) CN102439520B (zh)
TW (1) TWI425052B (zh)
WO (1) WO2011135887A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103988127B (zh) 2011-12-09 2019-04-19 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、半导体装置及显示体装置
JP2014059463A (ja) * 2012-09-18 2014-04-03 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP6348419B2 (ja) * 2012-09-18 2018-06-27 旭化成株式会社 感光性樹脂組成物
JP6116954B2 (ja) * 2013-03-22 2017-04-19 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
KR101705755B1 (ko) 2013-12-19 2017-02-10 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
JP6805475B2 (ja) * 2014-09-09 2020-12-23 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
KR102456965B1 (ko) * 2015-03-04 2022-10-21 도레이 카부시키가이샤 감광성 수지 조성물, 수지 경화막의 제조 방법 및 반도체 장치
US10705425B2 (en) * 2015-03-27 2020-07-07 Toray Industries, Inc. Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device
CN108139669B (zh) * 2015-09-28 2021-02-26 东洋纺株式会社 凸版印刷原版用感光性树脂组合物以及用其得到的凸版印刷原版
US11592743B2 (en) * 2016-02-05 2023-02-28 Hd Microsystems, Ltd. Positive-type photosensitive resin composition
WO2017134701A1 (ja) * 2016-02-05 2017-08-10 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物
JP6259033B2 (ja) * 2016-09-01 2018-01-10 旭化成株式会社 感光性樹脂組成物
CN109716235B (zh) * 2016-09-20 2022-11-18 太阳控股株式会社 正型感光性树脂组合物、干膜、固化物、印刷电路板及半导体元件
JP6523419B2 (ja) * 2017-12-07 2019-05-29 旭化成株式会社 感光性樹脂組成物
JP2020531651A (ja) * 2018-07-20 2020-11-05 エルジー・ケム・リミテッド ポリイミド樹脂およびこれを含むネガティブ型感光性樹脂組成物
US11456266B2 (en) * 2019-10-31 2022-09-27 Taiwan Semiconductor Manufacturing Co., Ltd. Bump structure and method of manufacturing bump structure
US11681220B2 (en) * 2020-03-05 2023-06-20 Sumitomo Chemical Company, Limited Resist composition and method for producing resist pattern
CN111880371B (zh) * 2020-08-13 2022-05-03 常州华睿芯材科技有限公司 光刻胶及亚胺类材料的图案化方法
CN114702634B (zh) * 2022-03-16 2023-07-07 陕西科技大学 一种3d打印用改性酚醛树脂及制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005242343A (ja) * 2004-01-27 2005-09-08 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP2007171945A (ja) * 2005-11-24 2007-07-05 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子
JP2007304506A (ja) * 2006-05-15 2007-11-22 Fujifilm Corp 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
JP2008297231A (ja) * 2007-05-30 2008-12-11 Nippon Kayaku Co Ltd ヒドロキシアミド基含有脂環式ポリイミド及びその前駆体、並びにそれらを用いたポジ型感光性樹脂組成物、並びにそれらの硬化物
JP2009109591A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性ポリアミド樹脂組成物、感光性ドライフィルムおよびそれらを用いたカバーレイ
JP2009114266A (ja) * 2007-11-02 2009-05-28 Sumitomo Bakelite Co Ltd ポリベンゾオキサゾール前駆体共重合体、ポジ型感光性樹脂組成物、ポリベンゾオキサゾール共重合体、保護膜および半導体装置
WO2009081950A1 (ja) * 2007-12-26 2009-07-02 Asahi Kasei E-Materials Corporation 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物
WO2010001780A1 (ja) * 2008-07-03 2010-01-07 旭化成イーマテリアルズ株式会社 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0431971B1 (en) * 1989-12-07 1995-07-19 Kabushiki Kaisha Toshiba Photosensitive composition and resin-encapsulated semiconductor device
SG135954A1 (en) * 2003-04-07 2007-10-29 Toray Industries Positive-type photosensitive resin composition
JP2007169585A (ja) * 2005-09-20 2007-07-05 Manac Inc 低線熱膨張係数を有するポリエステルイミドおよびその前駆体、ならびにこれらの製造方法
JP4929982B2 (ja) * 2006-10-30 2012-05-09 住友ベークライト株式会社 感光性樹脂組成物、絶縁膜、保護膜および電子機器
WO2008096601A1 (ja) * 2007-02-09 2008-08-14 Sony Chemical & Information Device Corporation 感光性ポリイミド樹脂組成物
JP5417323B2 (ja) * 2008-05-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005242343A (ja) * 2004-01-27 2005-09-08 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP2007171945A (ja) * 2005-11-24 2007-07-05 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子
JP2007304506A (ja) * 2006-05-15 2007-11-22 Fujifilm Corp 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
JP2008297231A (ja) * 2007-05-30 2008-12-11 Nippon Kayaku Co Ltd ヒドロキシアミド基含有脂環式ポリイミド及びその前駆体、並びにそれらを用いたポジ型感光性樹脂組成物、並びにそれらの硬化物
JP2009109591A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性ポリアミド樹脂組成物、感光性ドライフィルムおよびそれらを用いたカバーレイ
JP2009114266A (ja) * 2007-11-02 2009-05-28 Sumitomo Bakelite Co Ltd ポリベンゾオキサゾール前駆体共重合体、ポジ型感光性樹脂組成物、ポリベンゾオキサゾール共重合体、保護膜および半導体装置
WO2009081950A1 (ja) * 2007-12-26 2009-07-02 Asahi Kasei E-Materials Corporation 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物
WO2010001780A1 (ja) * 2008-07-03 2010-01-07 旭化成イーマテリアルズ株式会社 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物

Also Published As

Publication number Publication date
JPWO2011135887A1 (ja) 2013-07-18
WO2011135887A1 (ja) 2011-11-03
KR20120022712A (ko) 2012-03-12
JP2012027490A (ja) 2012-02-09
CN102439520A (zh) 2012-05-02
TW201144383A (en) 2011-12-16
KR101344125B1 (ko) 2013-12-20
TWI425052B (zh) 2014-02-01
CN102439520B (zh) 2014-08-27

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