JP4863782B2 - 処理液供給装置 - Google Patents
処理液供給装置 Download PDFInfo
- Publication number
- JP4863782B2 JP4863782B2 JP2006168365A JP2006168365A JP4863782B2 JP 4863782 B2 JP4863782 B2 JP 4863782B2 JP 2006168365 A JP2006168365 A JP 2006168365A JP 2006168365 A JP2006168365 A JP 2006168365A JP 4863782 B2 JP4863782 B2 JP 4863782B2
- Authority
- JP
- Japan
- Prior art keywords
- processing liquid
- pump
- flow rate
- control
- liquid supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 title claims description 41
- 238000012545 processing Methods 0.000 claims description 35
- 238000007599 discharging Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
Claims (2)
- 処理液貯留タンクと、マニュアル運転とサーボ制御の切替可能な固定数/サーボ回路を使って処理液を供給するポンプと、処理液を吐出するノズルとを有する処理液供給装置において、この処理液供給装置は前記ノズルからの処理液の吐出量を定量化するために、
前記ポンプとノズルの間に挿入された、ディスペンスのON/OFF実行時にON初期吐出時から吐出される処理液の吐出量を積算する流量積算が可能な流量計を備え、この流量計はノズルからの吐出量によってポンプの回転数を可変させるフィードバックシステムを有し、
このフィードバックシステムは、サーボモータ制御によってポンプ立ち上がり時の流量制御を行う際に、既定時間まではフィードバックシステムを使わずにサーボ回転数固定のマニュアル運転によって固定数制御を使い、その後に積算流量が一定となるようにフィードバック制御に切り替えてサーボモータの回転数を制御することを特徴とする処理液供給装置。 - 請求項1に記載の処理液供給装置において、前記流量計は電磁式、超音波式、回転式のいずれかであることを特徴とする処理液供給装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006168365A JP4863782B2 (ja) | 2006-06-19 | 2006-06-19 | 処理液供給装置 |
TW096119177A TW200804682A (en) | 2006-06-19 | 2007-05-29 | Treatment solution supply apparatus |
CN2007101111849A CN101092957B (zh) | 2006-06-19 | 2007-06-14 | 处理液供给装置 |
KR1020070059321A KR100875338B1 (ko) | 2006-06-19 | 2007-06-18 | 처리액 공급장치 |
US11/820,430 US7717295B2 (en) | 2006-06-19 | 2007-06-19 | Treatment solution supply apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006168365A JP4863782B2 (ja) | 2006-06-19 | 2006-06-19 | 処理液供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007330935A JP2007330935A (ja) | 2007-12-27 |
JP4863782B2 true JP4863782B2 (ja) | 2012-01-25 |
Family
ID=38860344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006168365A Active JP4863782B2 (ja) | 2006-06-19 | 2006-06-19 | 処理液供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7717295B2 (ja) |
JP (1) | JP4863782B2 (ja) |
KR (1) | KR100875338B1 (ja) |
CN (1) | CN101092957B (ja) |
TW (1) | TW200804682A (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101639633B (zh) * | 2008-07-29 | 2012-02-29 | 和舰科技(苏州)有限公司 | 一种显影液供给管路 |
CN101738868B (zh) * | 2008-11-14 | 2012-07-25 | 沈阳芯源微电子设备有限公司 | 一种高精度光刻胶分配泵控制装置及其控制方法 |
WO2010146928A1 (ja) * | 2009-06-19 | 2010-12-23 | タツモ株式会社 | 基板用塗布装置 |
JP5533246B2 (ja) * | 2010-05-19 | 2014-06-25 | トヨタ自動車株式会社 | 塗布装置 |
JP5255660B2 (ja) * | 2011-01-18 | 2013-08-07 | 東京エレクトロン株式会社 | 薬液供給方法及び薬液供給システム |
US20180325342A1 (en) * | 2011-04-12 | 2018-11-15 | Diversey, Inc. | Cleaning device with single tank recycling system |
JP6074356B2 (ja) | 2013-12-18 | 2017-02-01 | 日東電工株式会社 | 塗工装置及び塗工膜の製造方法 |
CN104826775B (zh) * | 2015-03-09 | 2017-07-07 | 佛山市锦德机械设备有限公司 | 一种自动化制鞋生产线上的智能注胶供料方法及其*** |
JP6007281B1 (ja) | 2015-04-16 | 2016-10-12 | 日東電工株式会社 | 塗工装置及び塗工膜の製造方法 |
JP6450650B2 (ja) * | 2015-06-16 | 2019-01-09 | 東京エレクトロン株式会社 | 処理装置、処理方法および記憶媒体 |
JP6915498B2 (ja) * | 2017-10-23 | 2021-08-04 | 東京エレクトロン株式会社 | ノズル待機装置、液処理装置及び液処理装置の運転方法並びに記憶媒体 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840170A (ja) * | 1981-08-31 | 1983-03-09 | Matsushita Electric Works Ltd | フロ−コ−タ−塗装機 |
JPS61147256A (ja) * | 1984-12-20 | 1986-07-04 | Fujitsu Ltd | スプレ−現像装置 |
CN85205330U (zh) * | 1985-12-09 | 1987-01-14 | 武汉市自动化研究所 | ***式超声流量计 |
JPH03248330A (ja) * | 1990-02-26 | 1991-11-06 | Hitachi Maxell Ltd | 磁気記録媒体の製造方法 |
JP2580408B2 (ja) * | 1991-05-28 | 1997-02-12 | 橋本電機工業株式会社 | 接着剤混和物自動塗布装置 |
US5647386A (en) * | 1994-10-04 | 1997-07-15 | Entropic Systems, Inc. | Automatic precision cleaning apparatus with continuous on-line monitoring and feedback |
JP3426447B2 (ja) * | 1996-09-26 | 2003-07-14 | 敏弘 大海 | 自動給水装置 |
JPH10216605A (ja) * | 1997-01-31 | 1998-08-18 | Sony Corp | 薬液回転塗布装置 |
JPH11108708A (ja) * | 1997-09-30 | 1999-04-23 | Dainippon Screen Mfg Co Ltd | 流量測定装置および基板処理装置 |
KR20010031132A (ko) * | 1997-10-15 | 2001-04-16 | 미야무라 심뻬이 | 유량센서, 유량계 및 액체토출기기의 토출량 제어장치 |
CN2367378Y (zh) * | 1999-03-30 | 2000-03-08 | 林庆雄 | 具有滤芯更换显示机构的过滤装置 |
JP4486222B2 (ja) * | 2000-06-02 | 2010-06-23 | 本田技研工業株式会社 | 粘性材料の塗布装置 |
US6524463B2 (en) * | 2001-07-16 | 2003-02-25 | Technic, Inc. | Method of processing wafers and other planar articles within a processing cell |
JP3976167B2 (ja) | 2001-08-17 | 2007-09-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4894109B2 (ja) * | 2001-08-27 | 2012-03-14 | 大日本印刷株式会社 | ダイコート制御方法 |
US7654414B2 (en) * | 2002-02-07 | 2010-02-02 | Pall Corporation | Liquids dispensing systems and methods |
JP3866194B2 (ja) | 2002-12-20 | 2007-01-10 | 株式会社ハルテック | 鋼トラスウエブpc橋の格点構造 |
JP2006007075A (ja) * | 2004-06-24 | 2006-01-12 | Nagase & Co Ltd | 薬液供給管理装置 |
JP4422006B2 (ja) * | 2004-12-08 | 2010-02-24 | 東京エレクトロン株式会社 | 処理装置及び処理液供給方法及び処理液供給プログラム |
US7431015B2 (en) * | 2006-01-31 | 2008-10-07 | Honeywell International Inc. | Fuel metering system proportional bypass valve error compensation system and method |
-
2006
- 2006-06-19 JP JP2006168365A patent/JP4863782B2/ja active Active
-
2007
- 2007-05-29 TW TW096119177A patent/TW200804682A/zh not_active IP Right Cessation
- 2007-06-14 CN CN2007101111849A patent/CN101092957B/zh active Active
- 2007-06-18 KR KR1020070059321A patent/KR100875338B1/ko active IP Right Grant
- 2007-06-19 US US11/820,430 patent/US7717295B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007330935A (ja) | 2007-12-27 |
KR100875338B1 (ko) | 2008-12-22 |
TWI336370B (ja) | 2011-01-21 |
TW200804682A (en) | 2008-01-16 |
US20070289529A1 (en) | 2007-12-20 |
US7717295B2 (en) | 2010-05-18 |
CN101092957A (zh) | 2007-12-26 |
KR20070120434A (ko) | 2007-12-24 |
CN101092957B (zh) | 2011-06-15 |
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