JP4839251B2 - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
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- JP4839251B2 JP4839251B2 JP2007079887A JP2007079887A JP4839251B2 JP 4839251 B2 JP4839251 B2 JP 4839251B2 JP 2007079887 A JP2007079887 A JP 2007079887A JP 2007079887 A JP2007079887 A JP 2007079887A JP 4839251 B2 JP4839251 B2 JP 4839251B2
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- bonding
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- 238000000034 method Methods 0.000 title claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 67
- 238000003384 imaging method Methods 0.000 claims description 26
- 238000001514 detection method Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Description
前記ボンディング後画像位置ずれの認識処理は、前記した半導体チップに対するボンディング後の画像取込みの後に、次の半導体チップをボンディングセンターに搬送し、該半導体チップのボンディング点画像を撮像装置で取込み、そのボンディング点位置ずれを算出するボンディング点位置認識処理を行った後、補正されたボンディング点にワイヤボンディングする該ワイヤボンディング中に行うことを特徴とする。
2(2A、2B、2C) 半導体チップ
3 試料
4 ワイヤ
10 ワイヤボンディング装置
11 撮像装置
11a 中心軸
15 キャピラリ
15a 中心軸
20 半導体チップ2Aの搬送
21 ボンディング点位置画像取込み
22 ボンディング点位置認識処理
23 認識終了
24 ワイヤボンディング
25 ボンディング後の画像取込み
26 ボンディング後画像認識処理
27 認識終了
30 半導体チップ2Bの搬送
31 ボンディング点位置画像取込み
32 ボンディング点位置認識処理
33 認識終了
34 ワイヤボンディング
35 ボンディング後の画像取込み
36 ボンディング後画像認識処理
37 認識終了
50 ボンディングセンター
Claims (1)
- ワイヤが挿通されたキャピラリと、このキャピラリとオフセットして配設された撮像装置とを備えたワイヤボンディング装置によって、ボンディングセンターに搬送された半導体チップのボンディング点画像を撮像装置で取込み、そのボンディング点位置ずれを算出するボンディング点位置認識処理を行った後、補正されたボンディング点にワイヤボンディングし、この半導体チップに対するボンディング後の画像取込みを行い、その後にボンディング後画像位置ずれの認識処理を行い、画像位置ずれがある場合には前記オフセット量を補正してワイヤボンディングを行うワイヤボンディング方法において、
前記ボンディング後画像位置ずれの認識処理は、前記した半導体チップに対するボンディング後の画像取込みの後に、次の半導体チップをボンディングセンターに搬送し、該半導体チップのボンディング点画像を撮像装置で取込み、そのボンディング点位置ずれを算出するボンディング点位置認識処理を行った後、補正されたボンディング点にワイヤボンディングする該ワイヤボンディング中に行うことを特徴とするワイヤボンディング方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007079887A JP4839251B2 (ja) | 2007-03-26 | 2007-03-26 | ワイヤボンディング方法 |
TW096131000A TW200839907A (en) | 2007-03-26 | 2007-08-22 | Wire bonding method |
KR1020070099757A KR100910744B1 (ko) | 2007-03-26 | 2007-10-04 | 와이어 본딩 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007079887A JP4839251B2 (ja) | 2007-03-26 | 2007-03-26 | ワイヤボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008243984A JP2008243984A (ja) | 2008-10-09 |
JP4839251B2 true JP4839251B2 (ja) | 2011-12-21 |
Family
ID=39914992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007079887A Expired - Fee Related JP4839251B2 (ja) | 2007-03-26 | 2007-03-26 | ワイヤボンディング方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4839251B2 (ja) |
KR (1) | KR100910744B1 (ja) |
TW (1) | TW200839907A (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04343235A (ja) * | 1991-05-21 | 1992-11-30 | Mitsubishi Electric Corp | ワイヤボンディング装置 |
JPH06326163A (ja) * | 1993-05-12 | 1994-11-25 | Hitachi Ltd | 超音波ワイヤボンディング装置 |
JP3101853B2 (ja) * | 1994-04-27 | 2000-10-23 | 株式会社新川 | ボンデイング座標のティーチング方法 |
JPH0917822A (ja) * | 1995-06-30 | 1997-01-17 | Sony Corp | 半導体製造装置及び方法 |
JPH0936164A (ja) * | 1995-07-21 | 1997-02-07 | Mitsubishi Electric Corp | 半導体製造装置および半導体装置の製造方法 |
JP3298795B2 (ja) * | 1996-07-16 | 2002-07-08 | 株式会社新川 | リードフレームの搬送データ設定方法 |
JP3455137B2 (ja) | 1999-06-14 | 2003-10-14 | 株式会社新川 | ワイヤボンディング方法及び装置 |
-
2007
- 2007-03-26 JP JP2007079887A patent/JP4839251B2/ja not_active Expired - Fee Related
- 2007-08-22 TW TW096131000A patent/TW200839907A/zh not_active IP Right Cessation
- 2007-10-04 KR KR1020070099757A patent/KR100910744B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200839907A (en) | 2008-10-01 |
JP2008243984A (ja) | 2008-10-09 |
KR100910744B1 (ko) | 2009-08-05 |
TWI351068B (ja) | 2011-10-21 |
KR20080087631A (ko) | 2008-10-01 |
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