JP4821800B2 - コイル端部の予備メッキ方法 - Google Patents
コイル端部の予備メッキ方法 Download PDFInfo
- Publication number
- JP4821800B2 JP4821800B2 JP2008134508A JP2008134508A JP4821800B2 JP 4821800 B2 JP4821800 B2 JP 4821800B2 JP 2008134508 A JP2008134508 A JP 2008134508A JP 2008134508 A JP2008134508 A JP 2008134508A JP 4821800 B2 JP4821800 B2 JP 4821800B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- coil
- coil end
- mass
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 90
- 229910045601 alloy Inorganic materials 0.000 claims description 35
- 239000000956 alloy Substances 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 238000003672 processing method Methods 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 40
- 229910052802 copper Inorganic materials 0.000 description 31
- 230000003628 erosive effect Effects 0.000 description 18
- 238000005476 soldering Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- 238000009413 insulation Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 9
- 230000004907 flux Effects 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910020888 Sn-Cu Inorganic materials 0.000 description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- 229910017816 Cu—Co Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920005749 polyurethane resin Polymers 0.000 description 3
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- 239000002320 enamel (paints) Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910020630 Co Ni Inorganic materials 0.000 description 1
- 229910002440 Co–Ni Inorganic materials 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Coating With Molten Metal (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
コイル端部の絶縁被覆材の除去と予備メッキは、コイル端部にフラックスを塗布し、その後、該端部を溶融はんだ中に浸漬することにより行うのが普通である。溶融はんだの熱により絶縁被覆材が溶けると、コイル端部に塗布したフラックスが浸漬したコイル端部の周囲に浮く。その結果、絶縁被覆材が除去され、銅線が露出したところにフラックスが作用して、溶融はんだの銅線への金属結合の形成が助長される。
1.Cu:1.5〜8質量%、Co:0.01〜2質量%、Ni:0.01〜1質量%、残部Snからなり、液相線温度が420 ℃以下である鉛フリーはんだ合金の溶融はんだにコイル端部を浸漬して、コイル端部に該はんだを予備メッキすることを特徴とするコイル端部の処理方法。
銅溶解速度:
はんだ槽の中ではんだを400 ℃の温度で溶融状態にしておく。次に、コイルの端部にフラックスを塗布し、該端部をはんだ槽の溶融はんだ中に10秒、20秒、30秒の各時間浸漬して銅線の線径を測定し、銅食われにより銅線の線径減少速度を求め、これを銅溶解速度とする。
ウエッティングバランス法により、10×30×0.3mm のCu板を400 ℃の溶融はんだ中に浸漬した時の濡れ時間 (ゼロクロスタイム) を測定する。
Claims (5)
- Cu:1.5〜8質量%、Co:0.01〜2質量%、Ni:0.01〜1質量%、残部Snからなり、液相線温度が420 ℃以下である鉛フリーはんだ合金の溶融はんだにコイル端部を浸漬して、コイル端部に該はんだを予備メッキすることを特徴とするコイル端部の処理方法。
- さらに前記鉛フリーはんだ合金が、P 、Ge、Gaからなる群から選ばれる1種以上を合計量で0.001〜0.5 質量%含有することを特徴とする、請求項1記載のコイル端部の処理方法。
- さらに前記鉛フリーはんだ合金が、Ag :0.05〜2 質量%含有することを特徴とする請求項1または2記載のコイル端部の処理方法。
- 溶融はんだに絶縁被覆層を備えたコイル端部を浸漬することにより、予備メッキと同時に、コイル端部の絶縁被覆の除去を行うことを特徴とする請求項1ないし3のいずれかに記載のコイル端部の処理方法。
- 請求項1〜4のいずれかに記載の処理方法でコイル端部に鉛フリーはんだ合金を付着させたコイル。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008134508A JP4821800B2 (ja) | 2002-10-15 | 2008-05-22 | コイル端部の予備メッキ方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002300028 | 2002-10-15 | ||
JP2002300028 | 2002-10-15 | ||
JP2008134508A JP4821800B2 (ja) | 2002-10-15 | 2008-05-22 | コイル端部の予備メッキ方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003354962A Division JP2004154864A (ja) | 2002-10-15 | 2003-10-15 | 鉛フリーはんだ合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008266791A JP2008266791A (ja) | 2008-11-06 |
JP4821800B2 true JP4821800B2 (ja) | 2011-11-24 |
Family
ID=32500696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008134508A Expired - Lifetime JP4821800B2 (ja) | 2002-10-15 | 2008-05-22 | コイル端部の予備メッキ方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7172726B2 (ja) |
JP (1) | JP4821800B2 (ja) |
CN (1) | CN100364711C (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060104855A1 (en) * | 2004-11-15 | 2006-05-18 | Metallic Resources, Inc. | Lead-free solder alloy |
CN1313240C (zh) * | 2005-05-09 | 2007-05-02 | 天津大学 | 铜锌铝形状记忆合金颗粒增强型锡银复合焊料及制备方法 |
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
CN100351035C (zh) * | 2005-10-28 | 2007-11-28 | 亚通电子有限公司 | 无铅焊料 |
CN101947701B (zh) * | 2010-09-29 | 2014-11-12 | 广州汉源新材料有限公司 | 一种高温低溶铜率无铅焊料 |
WO2014084242A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社日本スペリア社 | 低融点ろう材 |
GB201312388D0 (en) * | 2013-07-10 | 2013-08-21 | Cambridge Entpr Ltd | Materials and methods for soldering and soldered products |
CN103406687A (zh) * | 2013-08-20 | 2013-11-27 | 四川朗峰电子材料有限公司 | Sn-Cu-Ni系合金焊锡材料及其应用 |
CN103586599A (zh) * | 2013-11-12 | 2014-02-19 | 宁波市鄞州恒迅电子材料有限公司 | 无铅焊锡丝 |
JP2015170434A (ja) * | 2014-03-06 | 2015-09-28 | 株式会社オートネットワーク技術研究所 | 電磁シールド部材およびワイヤハーネス |
US10286497B2 (en) * | 2014-04-30 | 2019-05-14 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
JP5842973B1 (ja) * | 2014-09-04 | 2016-01-13 | 千住金属工業株式会社 | 端子予備メッキ用鉛フリーはんだ合金及び電子部品 |
CN104690442A (zh) * | 2015-03-17 | 2015-06-10 | 湖南新瑞化工有限公司 | 一种低熔点无铅焊料合金及其制作方法 |
CN105140209A (zh) * | 2015-06-26 | 2015-12-09 | 江苏师范大学 | 一种用于3D封装芯片堆叠的In基互连材料 |
CN105382442A (zh) * | 2015-11-30 | 2016-03-09 | 苏州龙腾万里化工科技有限公司 | 一种加铜焊锡条 |
CN107538149B (zh) * | 2017-10-25 | 2019-09-24 | 郑州轻工业学院 | 一种Sn-Cu-Co-Ni无铅焊料及其制备方法 |
JP6394777B2 (ja) * | 2017-12-13 | 2018-09-26 | 株式会社オートネットワーク技術研究所 | 電磁シールド部材、ワイヤハーネスおよび電磁シールド部材の製造方法 |
JP6369620B1 (ja) * | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | はんだ合金 |
TWI820277B (zh) * | 2018-12-27 | 2023-11-01 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
CN114045412B (zh) * | 2021-10-08 | 2022-08-16 | 安徽贵乾新材料有限公司 | 一种环保锡条制造方法及其成型模具 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5520403A (en) * | 1978-07-20 | 1980-02-13 | Seiko Epson Corp | Soldering material of armor part for portable watch |
JP3684811B2 (ja) * | 1998-01-28 | 2005-08-17 | 株式会社村田製作所 | 半田および半田付け物品 |
JP3829475B2 (ja) * | 1998-05-13 | 2006-10-04 | 株式会社村田製作所 | Cu系母材接合用のはんだ組成物 |
JPH11329177A (ja) * | 1998-05-15 | 1999-11-30 | Hajime Terada | 光電スイッチ |
JP3501700B2 (ja) | 1999-10-25 | 2004-03-02 | 石川金属株式会社 | 銅くわれ防止無鉛はんだ |
JP2001129682A (ja) * | 1999-10-29 | 2001-05-15 | Topy Ind Ltd | 熱サイクル特性に優れたSn基Pbフリー半田 |
JP2001205476A (ja) * | 2000-01-27 | 2001-07-31 | Sumitomo Metal Mining Co Ltd | 合金ろう材 |
JP3775172B2 (ja) | 2000-05-22 | 2006-05-17 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
US6660226B1 (en) | 2000-08-07 | 2003-12-09 | Murata Manufacturing Co., Ltd. | Lead free solder and soldered article |
JP3599101B2 (ja) | 2000-12-11 | 2004-12-08 | 株式会社トッパンNecサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
JP2002222708A (ja) * | 2001-01-24 | 2002-08-09 | Toko Inc | 鉛フリー半田を用いた小型コイル |
US20030091463A1 (en) * | 2001-02-27 | 2003-05-15 | Koichi Izumida | Unleaded solder alloy and electronic components using it |
JP2002307186A (ja) * | 2001-04-13 | 2002-10-22 | Taiyo Yuden Co Ltd | コイル部品 |
JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
JP3768849B2 (ja) * | 2001-08-27 | 2006-04-19 | 白光株式会社 | 半田ごて用の半田 |
JP2004122227A (ja) * | 2002-07-31 | 2004-04-22 | Topy Ind Ltd | 無鉛はんだ合金 |
-
2003
- 2003-10-10 US US10/682,305 patent/US7172726B2/en not_active Expired - Lifetime
- 2003-10-15 CN CNB2003101013585A patent/CN100364711C/zh not_active Expired - Lifetime
-
2008
- 2008-05-22 JP JP2008134508A patent/JP4821800B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2008266791A (ja) | 2008-11-06 |
US20040115088A1 (en) | 2004-06-17 |
CN1496780A (zh) | 2004-05-19 |
CN100364711C (zh) | 2008-01-30 |
US7172726B2 (en) | 2007-02-06 |
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