JP4777406B2 - Memsマイクロホンパッケージ - Google Patents
Memsマイクロホンパッケージ Download PDFInfo
- Publication number
- JP4777406B2 JP4777406B2 JP2008258431A JP2008258431A JP4777406B2 JP 4777406 B2 JP4777406 B2 JP 4777406B2 JP 2008258431 A JP2008258431 A JP 2008258431A JP 2008258431 A JP2008258431 A JP 2008258431A JP 4777406 B2 JP4777406 B2 JP 4777406B2
- Authority
- JP
- Japan
- Prior art keywords
- mems microphone
- metal case
- chip
- pcb
- microphone package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Pressure Sensors (AREA)
Description
104 保持部材
106 PCB
10 MEMSマイクロホンチップ
20 ASICチップ
110 金属メッシュ
Claims (5)
- 内部に部品が挿入されるように一面が開放された四角筒状で、カーリングが容易であるように開放側の端部の角部を面取りした金属ケースと、
MEMSマイクロホンチップとASICチップが実装され、前記金属ケースに挿入されるPCBと、
カーリング過程で前記PCBを保持し、前記金属ケースと前記PCBの間に空間を形成するための保持部材と、
を備えることを特徴とするMEMSマイクロホンパッケージ。 - 前記金属ケースは、開放面に隣接する4つの側面の端部の角部を面取りし、カーリングの際に前記各側面の端部が相隣接する前記側面の端部と互いに重ならないようにし、前記金属ケースの底面には音響ホールが形成されていることを特徴とする請求項1に記載のMEMSマイクロホンパッケージ。
- 前記MEMSマイクロホンパッケージは、前記金属ケースの音響ホールを介して内部に異物及び電子波が流入することを遮断するための金属メッシュをさらに備えることを特徴とする請求項2に記載のMEMSマイクロホンパッケージ。
- 前記PCBは、一面に前記MEMSマイクロホンチップと前記ASICチップが実装されており、他面の縁部分には前記金属ケースとの接続のための導電パターンが形成されると共に、他面の中央付近には電源端子、出力端子及び接地端子を含む接続端子が形成されていることを特徴とする請求項1に記載のMEMSマイクロホンパッケージ。
- 前記MEMSマイクロホンチップは、シリコンウェハ上にMEMS技術を利用してバックプレートを形成した後、スペーサを介してダイアフラムが形成された構造からなり、
前記ASICチップは、
前記MEMSマイクロホンチップがコンデンサマイクロホンとして動作するようにバイアス電圧を提供する電圧ポンプと、
前記MEMSマイクロホンチップを通じて感知された電気的な音響信号を増幅またはインピーダンス整合させて、前記接続端子を介して外部に提供するためのバッファ増幅器と、
から構成されることを特徴とする請求項4に記載のMEMSマイクロホンパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070104981A KR100925558B1 (ko) | 2007-10-18 | 2007-10-18 | 멤스 마이크로폰 패키지 |
KR10-2007-0104981 | 2007-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009100471A JP2009100471A (ja) | 2009-05-07 |
JP4777406B2 true JP4777406B2 (ja) | 2011-09-21 |
Family
ID=40260696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008258431A Expired - Fee Related JP4777406B2 (ja) | 2007-10-18 | 2008-10-03 | Memsマイクロホンパッケージ |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP2051539A1 (ja) |
JP (1) | JP4777406B2 (ja) |
KR (1) | KR100925558B1 (ja) |
CN (1) | CN201195694Y (ja) |
MY (1) | MY150111A (ja) |
SG (1) | SG152176A1 (ja) |
TW (1) | TWM345339U (ja) |
WO (1) | WO2009051317A1 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401774B (zh) * | 2010-01-18 | 2013-07-11 | Chipmos Technologies Inc | 微機電晶片封裝結構及其製造方法 |
KR101109102B1 (ko) * | 2010-01-18 | 2012-01-31 | 주식회사 비에스이 | 멤스 마이크로폰 패키지 |
CN102238455A (zh) * | 2010-04-23 | 2011-11-09 | 安国国际科技股份有限公司 | 具有电磁波接收器的声音感测器 |
US8737674B2 (en) | 2011-02-11 | 2014-05-27 | Infineon Technologies Ag | Housed loudspeaker array |
US8879767B2 (en) | 2011-08-19 | 2014-11-04 | Knowles Electronics, Llc | Acoustic apparatus and method of manufacturing |
KR101320574B1 (ko) | 2011-11-30 | 2013-10-23 | 주식회사 비에스이 | 멤스 마이크로폰 |
US20130284537A1 (en) * | 2012-04-26 | 2013-10-31 | Knowles Electronics, Llc | Acoustic Assembly with Supporting Members |
KR101339909B1 (ko) * | 2012-04-30 | 2013-12-10 | 전자부품연구원 | 마이크로폰 패키지 |
KR101224448B1 (ko) * | 2012-04-30 | 2013-01-21 | (주)파트론 | 센서 패키지 및 그의 제조 방법 |
KR101334578B1 (ko) * | 2012-05-11 | 2013-11-28 | 한국기계연구원 | 개구부를 포함하는 전자기기 패키지 |
KR101493510B1 (ko) * | 2014-01-03 | 2015-02-16 | 주식회사 비에스이 | 외부 회로와 연결되기 위한 단자가 두 개인 멤스 마이크로폰 |
KR20160127212A (ko) | 2015-04-23 | 2016-11-03 | (주)이미지스테크놀로지 | 멤스 마이크로폰 및 그 제조방법 |
KR101700571B1 (ko) | 2016-06-24 | 2017-02-01 | (주)이미지스테크놀로지 | 멤스 마이크로폰 |
KR101698312B1 (ko) | 2016-06-24 | 2017-01-23 | (주)이미지스테크놀로지 | 멤스 마이크로폰 및 그 제조방법 |
KR101949593B1 (ko) | 2017-05-30 | 2019-02-18 | 서울대학교산학협력단 | 멤스 장치 |
KR101949594B1 (ko) | 2017-05-30 | 2019-04-29 | 서울대학교산학협력단 | 멤스 트랜스듀서 패키지 및 이를 포함하는 멤스 장치 |
CN108282731B (zh) * | 2018-03-07 | 2024-01-16 | 钰太芯微电子科技(上海)有限公司 | 一种声学传感器及微机电麦克风封装结构 |
CN110278519A (zh) * | 2019-08-01 | 2019-09-24 | 华景科技无锡有限公司 | 一种硅麦克风 |
CN110808240A (zh) * | 2019-10-31 | 2020-02-18 | 北京燕东微电子有限公司 | 层叠封装结构及其制造方法 |
CN111050259A (zh) * | 2019-12-26 | 2020-04-21 | 歌尔科技有限公司 | 麦克风封装结构以及电子设备 |
KR20240014981A (ko) | 2022-07-26 | 2024-02-02 | 엘지이노텍 주식회사 | 멤스 마이크로폰 |
KR20240014979A (ko) | 2022-07-26 | 2024-02-02 | 엘지이노텍 주식회사 | 멤스 마이크로폰 |
KR20240014980A (ko) | 2022-07-26 | 2024-02-02 | 엘지이노텍 주식회사 | 멤스 마이크로폰 |
KR20240014978A (ko) | 2022-07-26 | 2024-02-02 | 엘지이노텍 주식회사 | 멤스 마이크로폰 |
CN115665635B (zh) * | 2022-11-10 | 2023-09-05 | 广范企业发展(连云港)有限公司 | 一种mems麦克风及其生产方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3574774B2 (ja) * | 2000-03-22 | 2004-10-06 | ホシデン株式会社 | エレクトレットコンデンサマイクロホン |
US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
KR100544283B1 (ko) | 2004-01-20 | 2006-01-24 | 주식회사 비에스이 | 표면실장을 위한 평행육면체형 콘덴서 마이크로폰 |
KR100544279B1 (ko) * | 2004-02-27 | 2006-01-23 | 주식회사 비에스이 | 평행육면체형 지향성 콘덴서 마이크로폰 |
KR100675024B1 (ko) * | 2005-06-13 | 2007-01-30 | 주식회사 비에스이 | 콘덴서 마이크로폰의 도전 베이스 및 이를 이용한 콘덴서마이크로폰 |
KR100675027B1 (ko) * | 2005-08-10 | 2007-01-30 | 주식회사 비에스이 | 실리콘 콘덴서 마이크로폰 및 이를 위한 실장 방법 |
US7419853B2 (en) * | 2005-08-11 | 2008-09-02 | Hymite A/S | Method of fabrication for chip scale package for a micro component |
SG130158A1 (en) | 2005-08-20 | 2007-03-20 | Bse Co Ltd | Silicon based condenser microphone and packaging method for the same |
KR100632694B1 (ko) * | 2005-08-20 | 2006-10-16 | 주식회사 비에스이 | 일렉트릿 콘덴서 마이크로폰 |
JP2007150507A (ja) * | 2005-11-25 | 2007-06-14 | Matsushita Electric Works Ltd | マイクロホンパッケージ |
WO2007142383A1 (en) * | 2006-06-02 | 2007-12-13 | Bse Co., Ltd. | Condenser microphone for smd using sealing pad and method of making the same |
KR100797440B1 (ko) * | 2006-09-05 | 2008-01-23 | 주식회사 비에스이 | 사각통 형상의 일렉트릿 콘덴서 마이크로폰 |
-
2007
- 2007-10-18 KR KR1020070104981A patent/KR100925558B1/ko not_active IP Right Cessation
-
2008
- 2008-03-14 TW TW097204492U patent/TWM345339U/zh not_active IP Right Cessation
- 2008-04-03 WO PCT/KR2008/001862 patent/WO2009051317A1/en active Application Filing
- 2008-04-16 CN CNU2008201055567U patent/CN201195694Y/zh not_active Expired - Lifetime
- 2008-09-29 EP EP08017149A patent/EP2051539A1/en not_active Withdrawn
- 2008-10-03 JP JP2008258431A patent/JP4777406B2/ja not_active Expired - Fee Related
- 2008-10-10 MY MYPI20084028A patent/MY150111A/en unknown
- 2008-10-17 SG SG200807780-2A patent/SG152176A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG152176A1 (en) | 2009-05-29 |
TWM345339U (en) | 2008-11-21 |
KR20090039375A (ko) | 2009-04-22 |
WO2009051317A1 (en) | 2009-04-23 |
JP2009100471A (ja) | 2009-05-07 |
EP2051539A1 (en) | 2009-04-22 |
CN201195694Y (zh) | 2009-02-18 |
KR100925558B1 (ko) | 2009-11-05 |
MY150111A (en) | 2013-11-29 |
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