M345339 八、新型說明： 【新型所屬之技術領域】 本新型係關於微機電系統麥克風封裝（MEMS MICROPHONE PACKAGE)。具體地説，本新型係關於如 下的微機電系統麥克風封裂，其中，利用將金屬殼體的端 部彎曲來進行箝位（clamping)的組裝程序，使殼體接地 在主板上，從而屏蔽噪音以保護微機電系統（MEMS) 麥 克風晶片，大大提高音質，並節約製造成本。 【先前技術】 典型的電容麥克風包括：膜片（diaphragm)，該膜片 在侧電極上附著有柔軟的膜（membrane )，借助聲壓 — tic pressure )進行振動；以及背板（back plate )， 板借助間隔物與膜片保持一定間隔，並與膜片相互對 '片和3板形成電各器的平行電極板，通過對兩個電 φ °附加直/;,L電壓或在任何一個電極板上形成駐極體 (^=tret)，從而使兩個電極板之間具有電荷。這種典型 •奋麥克風由如τ的捲曲（痕ling)方式組裝：在圓筒 次層疊膜片和間隔物、第—基座、背板、第二 彎，衣有電路的PCB之後’將殼體的端部向PCB側折 間的矩電容麥克風組裝體中，當膜片及背 利用電路對該而變：時’電容器的電容發生變 〜兒谷^：化進行處理’從而提供基於聲壓 5 M345339 的電信號。 通信產品中使用的電容麥克風是利用高分子膜在背板 上形成駐極體的駐極體電容麥克風，這種駐極體電容麥克 風具有價格低的優點，但是實現小型化時受限制。因此， 將如下的麥克風晶片稱爲矽電容麥克風晶片（silicon condenser microphone chip)或微機電系統（MEMS，MicroM345339 Eight, new description: [New technology field] This new type is related to MEMS MICROPHONE PACKAGE. Specifically, the present invention relates to a microelectromechanical system microphone chipping in which a housing is grounded on a main board by bending an end portion of a metal case for clamping, thereby shielding noise To protect micro-electro-mechanical systems (MEMS) microphone chips, the sound quality is greatly improved and manufacturing costs are saved. [Prior Art] A typical condenser microphone includes a diaphragm having a soft film attached to a side electrode, vibrated by a tic pressure, and a back plate. The plate is spaced apart from the diaphragm by spacers, and forms a parallel electrode plate with the diaphragms opposite to the diaphragm and the three plates, by adding two wires to the electric φ °, L voltage or at any one of the electrodes An electret (^=tret) is formed on the plate so that there is a charge between the two electrode plates. This typical • excitement microphone is assembled by a curling method such as τ: after the cylindrical sub-laminated diaphragm and spacer, the first base, the back plate, the second bend, and the circuit-coated PCB In the moment-capacitance microphone assembly in which the end of the body is folded toward the PCB side, when the diaphragm and the back-use circuit are changed: when the capacitance of the capacitor is changed, the processing is performed to provide sound-based pressure. 5 M345339 electrical signal. The condenser microphone used in the communication product is an electret condenser microphone in which an electret is formed on the back plate by using a polymer film. This electret condenser microphone has the advantage of being low in price, but is limited in miniaturization. Therefore, the following microphone chip is called a silicon condenser microphone chip or a microelectromechanical system (MEMS, Micro).
Electro Mechanical System)麥克風晶片，其中.，爲了麥克 風的超小型化，在矽片中適用半導體製造技術及微機械加 工（micromachining)技術，以模（die)形態實現電容結 構。爲了保護麥克風晶片不受外部干擾，應對這種微機電 糸統麥克風晶片（MEMS microphone chip)進行封裝。 對微機電系統（MEMS)麥克風晶片進行封裝的技術 在2004年8月24日公告的美國專利第6,781，231號“切斷 環境及干涉的 MEMS 封裝（MICROELECTROMECHANICAL SYSTEM PACKAGE WITH ENVIRONMENTAL AND INTE 無線 射頻ERENCE SHIELD) ’’已有所公開。這種MEMS麥克風 封裝如第一圖所示，利用導電性黏合劑36將具有導電層或 由導體構成的殼體34附著於PCB基板32上，形成外殼 (housing)。參照第一圖，PCB基板32上安裝有微機電系 統麥克風晶片10及用於電驅動微機電系統麥克風晶片1〇 並進行信號處理的特定用途集成電路（ASIC，ApplicationElectro Mechanical System), in order to miniaturize the microphone, use semiconductor manufacturing technology and micromachining technology in the cymbal to realize the capacitor structure in a die form. In order to protect the microphone chip from external interference, such a MEMS microphone chip should be packaged. A technique for encapsulating a microelectromechanical system (MEMS) microphone chip is disclosed in U.S. Patent No. 6,781,231, issued on Aug. 24, 2004, the disclosure of which is incorporated herein by reference. The 'MEMS microphone package is as shown in the first figure, and a housing 34 having a conductive layer or a conductor is attached to the PCB substrate 32 by a conductive adhesive 36 to form a housing. Referring to the first figure, a MEMS microphone chip 10 and an application-specific integrated circuit (ASIC, Application) for electrically driving the MEMS microphone chip and performing signal processing are mounted on the PCB substrate 32.
Specific IntegratedCircuit )晶片 20,形成有聲孔 34a 的殼 體34利用黏合劑36附著於PCB基板32上，從而保護内 部的微機電糸統麥克風晶片1 〇。 M345339 以-:2微機電系統⑽MS)麥克風晶侧 以一走機電系統⑽MS)麥克風晶 黏合劑將殼體付罢於pCR其士 μ ^在使用 板上的h 切殼_接在卩⑶基 時，外^題：結錢顯裝絲在主板上 ㈣切: 和主板之間流入到作爲電介質的 >:的=音的屏蔽效果微弱。尤其是，最近比較 級仃的天線内置财機存在如下問 線位置轉克風位錄近， 客聽件致使天 到火^ π + 謂的無線射雜音易於流入 以彳lit 風的域射㈣音料尤冑重要，作 以在的微機㈣齡克風縣不㈣足_要求條件。— ㈣H對於使用黏合舰殼體附著於咖基板上或將 ί又t接到PCB基板上的微機㈣統麥克風之封裝方式， 金屬殼體以將部件固定於金屬殼體内來組裝麥克風 二=ΓΓ有所不同，上述微機電系統麥克風封 ==要_用於黏合或焊接的機械設備，從而存在在 構乘新的製造流程時費用較多的問題。 【新型内容】 於t新型是爲了解决上述問題而提出的，本新型目的在 、’ 供-種《電系統麥克 序二r將金屬殼體的端部二= 性，且無需添加製造tMfm 〜 特 1有％夠以低成本製造。 M345339 封/的，爾罐麥克風 朗出=克風難安裝以板上的絲中，容易 個圓轉克風時，容易執行在殼體内***多 =殼體的端部彎曲而進行籍位的捲曲程序，但 時，稜角部分難^ ^，因此以往的微機The specific integrated circuit is formed on the substrate 32 by the adhesive 36 to protect the internal MEMS microphone chip 1 . M345339 with -: 2 MEMS (10) MS) microphone crystal side with a walking electromechanical system (10) MS) microphone crystal bonding agent to pay the shell to the pCR qi ^ ^ on the use of the board c shell _ connected to the 卩 (3) base , outside the ^ title: the money to display the silk on the motherboard (four) cut: and the motherboard into the dielectric as a > = = the shielding effect is weak. In particular, the antennas of the comparatively high-level antennas have the following lines of information. The position of the line is close to the wind position, and the guest listens to the sky. ^ π + The wireless noise is easy to flow into the field of the 彳lit wind. It is especially important to make the computer (4) age Kefeng County not (four) foot _ requirements. — (4) H For the packaging method of the microcomputer (4) microphone that is attached to the coffee substrate using the bonded ship shell or connected to the PCB substrate, the metal shell is assembled with the component in the metal casing to assemble the microphone. The difference is that the above-mentioned MEMS microphone seal == wants to be used for bonding or welding of mechanical equipment, so there is a problem that it is more expensive when constructing a new manufacturing process. [New content] The new type of t is proposed to solve the above problems. The purpose of this new type is to provide a tMfm~ special for the end of the metal casing. 1% is enough to manufacture at low cost. M345339 sealed /, the tank microphone is out = the wind is difficult to install in the wire on the board, when it is easy to turn the wind, it is easy to insert more in the housing = the end of the shell is bent to carry the position Curl program, but when the angular part is difficult ^ ^, so the previous microcomputer
I f f ^ ^ ^ ^ #I ^ r, It.F# ^ ^ PCB 土板上或將*體焊接到PCB基板上的方式。 * 的賴電系統麥克風封裝中，爲了使四邊形麥 5 ι ,進仃捲曲，在麥克風的四邊形殼體端部設置切 角，並使用支撑件，以便在安裝有微機電系統麥克風晶片 ! Β’、四物威體之間形成空間。這種本新型的微機電 糸統麥克簡裝的特徵在於，該軸㈣統麥克風封裝具 備至屬成體，该金屬殼體爲一面開口的方筒形，以便能 鈞將夕個部件插人到内部，並在開口侧端部的稜角部進行 7角，以便容易進行捲曲；PCB基板，該pc]3基板上安 衣有MEMS麥克風晶片和ASIC晶片，該pcB基板*** 在该殼體中；以及支撑件，該支撑件用於支撑上述PCB基 板’以便在殼體與PC]B基板之間形成空間。 該殼體是一面開口的方筒形，對開口面的四個稜角進 行切角’以防止捲曲時各面的端部與鄰接面的殼體端部相 互重逢。並且爲了使外部聲音流入，在該殼體的底表面或 該PCB基板之中的任何一個上形成有聲孔。 而且’该PCB基板的一面設置有MEMS麥克風晶片 M345339I f f ^ ^ ^ ^ #I ^ r, It.F# ^ ^ The way to solder the body to the PCB substrate on the PCB. * In the mic system microphone package, in order to make the quadrilateral wheat 5 ι, curling, set the chamfer at the end of the quadrilateral housing of the microphone, and use the support member to install the MEMS microphone chip! Β', A space is formed between the four objects. The novel micro-electromechanical system microphone is characterized in that the shaft (four) system microphone package has a sub-body shape, and the metal shell has an open square tubular shape so as to insert the outer part into the interior. And performing 7 corners at the corners of the open side end portions for easy curling; a PCB substrate on which the MEMS microphone chip and the ASIC wafer are mounted, the pcB substrate being inserted in the case; and supporting The support member is for supporting the above-mentioned PCB substrate 'to form a space between the casing and the PC]B substrate. The casing is in the shape of a square cylinder having an open side, and the four corners of the opening face are chamfered to prevent the end portions of the respective faces from reciprocating with the end portions of the abutting faces when curling. And in order to allow external sound to flow in, a sound hole is formed on any one of the bottom surface of the casing or the PCB substrate. Moreover, one side of the PCB substrate is provided with a MEMS microphone chip M345339
7卜逛具備金屬網 的聲孔進入，並 和ASIC晶片等，另一面的周全 連接的導電圖案，同時在另一® 端子、輸出（OUTPUT )端子、 端子。 並且，該微機電系統麥克風封裝另: 眼，該金屬網眼用於防止異物通過該殼體7Bus the sound hole with the metal mesh, and the ASIC chip, etc., the other side of the conductive pattern is connected at the same time, at the other ® terminal, output (OUTPUT) terminal, terminal. Moreover, the MEMS microphone package further includes: an eye, the metal mesh is used to prevent foreign matter from passing through the housing
ί本新型’在採用將金屬殼體的端部彎曲以進行箝 位的捲曲方式製造的微機電系統（MEMS)麥克 k4㉟外部澡音進入到内部的微機 片，能夠大大改善音質。 =2封裝安裝在主板上時，將殼體的彎曲的端部直接 Α板上，形成一種法拉第杯（Faraday cup)結構， =’將本新型的MEMS麥克風封裝使用於通信應 二可提尚屏蔽噪音的性能，即使天線和麥克風靠近， 杯二切斷天線的無線射頻噪音流人到天線’從而保持良 好的音質特性。 T k 益且，根據本新型，在封裝微機電系統麥克風晶片時， 添f製造投備，能夠以低成本製造，在進行捲曲時， 问形咸體的端部不會與鄰接面的端部重疊 而易於進行捲 ’亚且能夠借助支撑件防止在捲曲作業中殼體的形 狀發生變形。 9 M345339 【實施方式】 本新31以及通過本新型的實施而實 > 過下面說明本新型的較佳實施例進一I見的=课題將透 施例口是A 了％ BH 、 夕加以確定。以下眘 園…明本新型而例示的，並不限定本新型= 〜面切開之一立體圖。第一『摅、笔糸統麥克風封. 電_克風封裝的側 例的微機電系統麥克風封裝的仰視圖。 ’斤型- 如弟—圖至第四圖所示’根據本新型的四邊形電容 f風由如下部分構成：金屬殼體⑽，該金屬殼體1〇2爲 面開Π的方筒形，以便能夠將多個部件插人到内部，並 在開口侧端部職的稜角娜進行切角（chamfering)， 乂便夺易進行捲曲，PCB基板1〇6，該PCB基板1〇6上安 襞有MEMS麥克風晶片1〇&ASIC晶片2〇，該pcB基板 1〇6***在殼體102中；以及支撑件1〇4，該支撑件1〇4用 於支撑該PCB基板1〇6，以便在殼體ι〇2及pCB基板ι〇6 <間形成空間。 本新型的麥克風封裝中使用的金屬殼體丨〇2如第五圖 所示，爲一面開口的方筒形，對開口面的四個稜角1()2b進 行切角，以便在捲曲時防止各面的端部1〇2c及鄰接面的殼 發端部102c相互重疊，而且殼體的底表面上形成有聲孔 1〇2a。此時，根據電容麥克風的聲音流入結構，聲孔i〇2a 也可以形成於PCB基板1〇6上，而不是在殼體102上。 10 M345339 ”年?月>^鲁丨i 並且，本新型的麥克風封裝中使用的支撑件 六圖所示’爲方環形，該支撑件104位於殼體ι〇2的底表 面及PCB基板1〇6之間，在捲曲殼體端部咖時，支撑 PCB基板106，並形成内部空間。即，在根據本新型的麥 克風封裝議中，捲曲時殼體的端部略及鄰接面的端部、 l〇2c不重疊，而易於進行捲曲作業’並且能夠借助支撑件 104防止在捲曲作業中殼體102的形狀變形。 並且，本新型的MEMS麥克風封装1㈧中使用的pcB 基板106的一面安裝有MEMS麥克風晶片i〇 &asic晶 片2〇等，另一面的周邊部上形成有用於連接殼體1〇2的i 電圖案’並且在另一面的中央附近形成有電源（Vdd)端 端子 '接地（_)端子等連接端 子⑽。在本新型的實施例中舉出了形成有四個連接端子 但連接端子的數量根據需要形成編 p可。被機電系統（MEMS)麥克風晶片1G的 ^在似形成背板之後，隔_^ 風ίΓΛ途集成電路（織）晶片20與从聽麥克 下於處理電信號，該ASlc晶片由如 邻刀構成.電壓栗，該電壓栗提供偏壓，使 統（MEMS)麥克風晶片⑺作爲 "、二 大-，該緩衝放大器將透過MEMS麥克 · 應的音頻電信號放大或阻抗(i :曰：. 端子⑽料科m 過連接 以便容⑻繼域子8糾出結構’ 11 M345339 本新型的MEMS麥克風封裝⑽透過如下方式完成組 在—面開口的方筒形金屬殼體102中***方環形的支 才手件104’將安叙有MEMS麥克風晶片1〇及ASIC晶片2〇 的PCB基板106***到支撑件1〇4之上，然後進行將殼體 的端部H)2c彎曲到PCB基板1〇6侧使之與導電圖案緊貼 的捲曲程序，從而完成組裝。 採甩這種方式完成組裝的本新型的MEMS麥克風封旁 如第二圖至第四圖所示’殼體1G2内插人有支撑件 104，支撑件1()4支撑安裝有電路部件的pcB基板⑽，以 形成内部空間’殼體的端部1G2e透過捲曲與⑽基板1〇6 腎目i 〇 而且，本新型的MEMS麥克風封裝1〇〇如第三圖所 示’利用表面安裝技術（SMT)或焊接方式等安裝到主板 200上’ PCB基板1〇6的連接端子1〇8與對應的主板2〇〇 的各墊片204連接，殼體的彎曲的端部1〇以與主板如〇 ，地圖案2G2連接，將麥克風整體電屏蔽，形成—種法拉 第杯，由此能夠切斷外部噪音流入到麥克風内部。而且， 將本新型的麥克風封裝！⑽用於手機的情况下，即使天線 與麥克風接近，也能夠切斷天線的無線射頻噪音流 線，保持良好的音質特性。 參照第三圖，對於安裝於主板上的麥克 100，當從主板2GG通過電源端子和接地端子供給電力日士 x 由ASIC晶片20的電壓泵生成的適當的偏壓施加到= 系統麥克風晶片1G上，在微機電系統麥克風晶片1〇的腹 12 M345339 >；及背板之間形成電荷。The novel micro-electromechanical system (MEMS) microphone k435, which is manufactured by crimping the end of the metal casing for clamping, enters the internal micro-computer, which can greatly improve the sound quality. When the package is mounted on the main board, the bent end of the case is directly attached to the board to form a Faraday cup structure. = 'The new MEMS microphone package is used for communication. The performance of the noise, even if the antenna and the microphone are close, the cup 2 cuts off the antenna's radio frequency noise to the antenna' to maintain good sound quality. According to the present invention, when the MEMS microphone chip is packaged, it can be manufactured at a low cost, and when curling, the end of the salty body does not end with the end of the abutting surface. The overlap is easy to carry out the roll and the deformation of the shape of the casing during the curling operation can be prevented by means of the support. 9 M345339 [Embodiment] This new 31 and the implementation of the present invention will be described below. The following is a description of the preferred embodiment of the present invention. The problem is that the application port is A% BH, and is determined by the evening. . The following cautious gardens...the new and exemplified ones are not limited to the one-dimensional view of the present invention. The first "摅, 糸 麦克风 麦克风 麦克风 麦克风 . 电 电 电 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。. '金型-如弟-图至图四图' The quadrilateral capacitor f wind according to the present invention is composed of a metal casing (10) which is a square tubular shape of a face-opening so that It is possible to insert a plurality of components into the inside, and perform chamfering at the edge of the opening side end, and it is easy to curl, and the PCB substrate 1〇6 is mounted on the PCB substrate 1〇6. a MEMS microphone chip 1 〇 & ASIC chip 2 〇, the pcB substrate 1 〇 6 is inserted in the housing 102; and a support member 〇 4 for supporting the PCB substrate 1 〇 6 so as to A space is formed between the casing ι〇2 and the pCB substrate 〇6 < The metal casing 丨〇2 used in the microphone package of the present invention has a square tubular shape with an open side as shown in the fifth figure, and cuts the four corners 1() 2b of the open surface to prevent each of the curls from being curled. The end portion 1〇2c of the surface and the shell end portion 102c of the abutting surface overlap each other, and the sound hole 1〇2a is formed on the bottom surface of the casing. At this time, according to the sound inflow structure of the condenser microphone, the sound hole i〇2a may be formed on the PCB substrate 1〇6 instead of the casing 102. 10 M345339 『年?月>^鲁丨i And, the support member used in the microphone package of the present invention has a square ring shape, and the support member 104 is located on the bottom surface of the casing 〇2 and the PCB substrate 1 Between the crucibles 6, when the end of the shell is crimped, the PCB substrate 106 is supported and an internal space is formed. That is, in the microphone package according to the present invention, the end portion of the housing is slightly abutted to the end of the abutting surface. L〇2c does not overlap, and is easy to perform the curling operation' and can prevent deformation of the shape of the casing 102 during the curling operation by the support member 104. Further, one side of the pcB substrate 106 used in the MEMS microphone package 1(8) of the present invention is mounted. The MEMS microphone chip i〇&asic wafer 2, etc., the other side of the peripheral portion is formed with an i-electric pattern '' for connecting the housing 1〇2 and a power supply (Vdd) terminal terminal' is grounded near the center of the other side. (_) terminal (10) such as a terminal. In the embodiment of the present invention, four connection terminals are formed, but the number of connection terminals is formed as needed. The electromechanical system (MEMS) microphone chip 1G is similar. Forming the back Thereafter, the integrated circuit (wafer) chip 20 and the slave microphone are processed to process an electrical signal, and the ASlc chip is composed of, for example, a neighboring knife. The voltage pump provides a bias voltage to make a unified (MEMS) microphone. The chip (7) acts as ", the second largest, and the buffer amplifier will amplify or impedance the audio signal through the MEMS microphone. (i: 曰:. terminal (10) material m is connected to allow (8) to follow the domain 8 to correct the structure' 11 M345339 The MEMS microphone package (10) of the present invention is completed by inserting a square ring-shaped hand piece 104' into the square-shaped metal case 102 opened in the face-to-face manner, and the MEMS microphone chip 1 and the ASIC chip 2 will be described. The PCB's PCB substrate 106 is inserted over the support member 〇4, and then a crimping process is performed to bend the end portion H) 2c of the case to the side of the PCB substrate 1〇6 so as to be in close contact with the conductive pattern, thereby completing the assembly. The MEMS microphone seal of the present invention which is assembled in this manner is as shown in the second to fourth figures. The housing 1G2 has a support member 104 interposed therein, and the support member 1 (4) supports the pcB substrate on which the circuit component is mounted. (10) to form the inner space 'end of the shell 1G2e through the crimp and (10) substrate 1〇6 kidney mesh i 〇 and the new MEMS microphone package 1 is mounted on the main board 200 by surface mount technology (SMT) or soldering method as shown in the third figure. The connecting terminals 1〇8 of the 1〇6 are connected to the corresponding pads 204 of the corresponding main board 2〇〇, and the bent end 1〇 of the housing is connected with the main board such as the ground pattern 2G2, and the whole microphone is electrically shielded to form A Faraday cup, which cuts off external noise and flows into the inside of the microphone. Moreover, the microphone of this new type is packaged! (10) In the case of a mobile phone, even if the antenna is close to the microphone, the radio frequency noise stream of the antenna can be cut off, and good sound quality characteristics are maintained. Referring to the third figure, for the mic 100 mounted on the main board, when the power supply from the main board 2GG is supplied through the power supply terminal and the ground terminal, an appropriate bias voltage generated by the voltage pump of the ASIC wafer 20 is applied to the system microphone chip 1G. , a charge is formed between the ventral 12 M345339 >; and the backplane of the MEMS microphone chip.
正充丨 當外部聲壓透過殼體的聲孔·流人到麥克風内 部時，微機電系統麥克風晶片10的膜片振動，由此膜月及 背板之間的電容變化’這種電容的變化在ASIC晶片2〇的 緩衝放大器中被放大爲電信號，透過輸出端子輪到 200 〇 ， 暇將根據本新型另—實補微機電系統麥克風 封裝-面切開的立體圖。第八圖是根據本新型另—實施例 微機電系統麥克風封裝的側剖面圖。 士第圖及第八圖所示’根據本新型另—實施例微機 電系統麥克風封裝由如下部分構成：金屬殼體1〇2，該金 屬殼體102爲-面開口的方筒形，以便能夠將多個部件插 入到内部，並在開口側端部102c的稜角102b部分進行切 角，以便容易進行捲曲，並且在底表面形成有聲孔102a; 金屬網眼110,該金屬網眼110用於切斷異物透過聲孔1〇2& •流入到内部；支撑件1〇4,該支撑件104用於支撑該PCB '基板106 ’以便在殼體1〇2及PCB基板106之間形成空間； 以及PCB基板106 ’該PCB基板106上安裝有MEMS麥 克風晶片10及ASIC晶片20，該PCB基板106***在殼 體102中。 本新型另一實施例的MEMS麥克風封裝在第二圖所示 的結構上附加了金屬網眼110，該金屬網眼11()防止異物 透過聲孔102a流入到内部，並切斷外部噪音流入。由此， 進一步提高屏蔽性能，即除了異物之外，還能夠切斷無線 13 M345339 射頻噪音通過聲孔l〇2a流入到内部，從而特性 提高。 步有所 來切麥克風封裝，除了附加金屬網眼U。 述貫，例相同。因此省略說明。 之外兵上 技術1"^照_所示的實_說明了本新型，本領域的 Γ該㈣理解可以由上述的本新型進行各種變形 或等價變 換而得到其它實施例 圖 式簡單說明】 第 A圖是傳統網眼麥克風封裝之一侧剖面圖 弟二圖是根據本新型實例的 立體圖。 網眼麥克風封裴一截面之 面圖。 第一圖疋根據本新型實例的網眼麥克風封裝 之一侧剖 是根據本新型實例的網眼麥克風封裝之一仰視 第五圖是根據本新型實例的網眼麥克風封裝盒子之一 第四廣1 圖 立體圖。 撑件之 第/、圖是根據本新型實例的網眼麥克風封 一立體圖。 、叉 面之根據本新型另―實例的網眼麥克風封裝1 弟八圖是根據本新型另-實例的網眼麥克風封琴之 14 M345339 侧剖面圖。When the external sound pressure is transmitted through the sound hole of the casing to the inside of the microphone, the diaphragm of the MEMS microphone chip 10 vibrates, thereby changing the capacitance between the film month and the back plate. The ASIC chip 2 〇 buffer amplifier is amplified into an electrical signal, through the output terminal wheel 200 〇, 暇 according to the new alternative - MIC micro-mechanical system package - face cut perspective view. Figure 8 is a side cross-sectional view of a microelectromechanical system microphone package in accordance with another embodiment of the present invention. As shown in the figure and the eighth figure, the microelectromechanical system microphone package according to the present invention is composed of a metal case 1〇2 which is a square tube having a face-opening to enable A plurality of members are inserted into the inside, and a corner is cut at a portion of the corner 102b of the opening-side end portion 102c so as to be easily curled, and a sound hole 102a is formed on the bottom surface; a metal mesh 110 for cutting The foreign matter is passed through the sound hole 1〇2& • flows into the interior; the support member 1〇4 is used to support the PCB 'substrate 106' to form a space between the casing 1〇2 and the PCB substrate 106; PCB substrate 106 'The MEMS microphone chip 10 and the ASIC wafer 20 are mounted on the PCB substrate 106, and the PCB substrate 106 is inserted in the housing 102. The MEMS microphone package of another embodiment of the present invention is attached with a metal mesh 110 to the structure shown in Fig. 2, which prevents foreign matter from flowing into the inside through the sound hole 102a, and cuts off external noise inflow. As a result, the shielding performance is further improved, that is, in addition to the foreign matter, it is possible to cut off the wireless 13 M345339 radio frequency noise flowing into the inside through the sound hole l〇2a, thereby improving the characteristics. Step by step to cut the microphone package, in addition to the metal mesh U. The description is the same. Therefore, the description is omitted. The present invention has been described in the context of the technology, and the present invention is described in the following. (4) The understanding of the present invention can be variously modified or equivalently converted to obtain a simple description of other embodiments. Figure A is a side cross-sectional view of a conventional mesh microphone package. Figure 2 is a perspective view of an example according to the present invention. The mesh microphone is sealed with a cross section. The first figure is a side view of a mesh microphone package according to the present example. One of the mesh microphone packages according to the present example is a bottom view. The fifth figure is one of the mesh microphone package boxes according to the present example. Figure stereo view. The figure / of the struts is a perspective view of the mesh microphone according to the present example. The mesh microphone package according to another novel example of the present invention is a side view of a 14 M345339 of a mesh microphone sealed according to another embodiment of the present invention.
【主要元件符號說明】 10 微電機系統麥克風晶片 20 特定應用積體電路晶片 32 PCB基板 34 盒子 34a 音頻孔 36 黏合劑 100 麥克風封裝 102 盒子 102a 音頻孔 102b 菱角 102c 端部 104 支撑件 106 PCB基板 108 連接端口 200 主板 202 接地模板 204 襯墊 15[Main component symbol description] 10 Micro motor system microphone chip 20 Application specific integrated circuit chip 32 PCB substrate 34 Box 34a Audio hole 36 Adhesive 100 Microphone package 102 Box 102a Audio hole 102b Water angle 102c End 104 Support member 106 PCB substrate 108 Connection port 200 main board 202 grounding template 204 pad 15