JP4749794B2 - 温度測定方法及びその装置 - Google Patents
温度測定方法及びその装置 Download PDFInfo
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- JP4749794B2 JP4749794B2 JP2005227619A JP2005227619A JP4749794B2 JP 4749794 B2 JP4749794 B2 JP 4749794B2 JP 2005227619 A JP2005227619 A JP 2005227619A JP 2005227619 A JP2005227619 A JP 2005227619A JP 4749794 B2 JP4749794 B2 JP 4749794B2
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- temperature
- measuring
- resistance value
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- temperature measuring
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- 238000000034 method Methods 0.000 title claims description 14
- 238000009529 body temperature measurement Methods 0.000 claims description 80
- 238000000691 measurement method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 229910006585 β-FeSi Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Description
2 配線パターン
2a 基準温度測定手段
3 配線パターン
4 基材
5 測温対象部
6 測温基準部
8 熱電対温度センサ
10 電圧測定器
11 抵抗値測定手段
12 電流電圧測定器
13 抵抗値算出部
14 基準温度算出部
15 特性データ
16 絶対温度演算部
Claims (2)
- 熱電対温度センサ(8)を構成する二種の配線(2)(3)の互いに接合した先端部の測温接点(7)を測温対象部(5)に配置すると共に、互いに離間した終端部(P1)(P1)を測温基準部(6)に配置し、測温基準部(6)と測温対象部(5)の温度差に応じた起電力を前記終端部から出力する温度測定方法において、
前記測温基準部(6)と測温対象部(5)の温度差を表す熱起電力を測定する工程と、
前記熱電対温度センサ(8)を構成する二種の配線(2)(3)のうち、前記測温基準部(6)において温度変化に応じて抵抗値を変化する少なくとも一部の配線部分を基準温度測定手段(2a)として、該基準温度測定手段(2a)の抵抗値を検出し、該抵抗値に基づいて測温基準部(6)の基準絶対温度を測定する工程と、
前記基準絶対温度と前記熱起電力に基づいて、測温対象部(5)の測定温度を計測する工程とから成ることを特徴とする温度測定方法。 - 熱電対温度センサ(8)を構成する二種の配線(2)(3)の互いに接合した先端部の測温接点(7)を測温対象部(5)に配置すると共に、互いに離間した終端部(P1)(P1)を測温基準部(6)に配置し、測温基準部(6)と測温対象部(5)の温度差に応じた起電力を前記終端部から出力する温度測定装置において、
前記熱電対温度センサ(8)を構成する二種の配線(2)(3)のうち、前記測温基準部(6)において温度変化に応じて抵抗値を変化する少なくとも一部の配線部分により基準温度測定手段(2a)を構成し、該基準温度測定手段(2a)の抵抗値を検知する抵抗値測定手段(11)と、検知した抵抗値に基づいて測温基準部(6)の基準絶対温度を検出する基準温度算出手段(14)を設けており、
前記基準絶対温度と前記熱起電力に基づいて、測温対象部(5)の測定温度を計測するように構成したことを特徴とする温度測定装置。
Priority Applications (1)
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JP2005227619A JP4749794B2 (ja) | 2005-08-05 | 2005-08-05 | 温度測定方法及びその装置 |
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JP2005227619A JP4749794B2 (ja) | 2005-08-05 | 2005-08-05 | 温度測定方法及びその装置 |
Publications (2)
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JP2007040917A JP2007040917A (ja) | 2007-02-15 |
JP4749794B2 true JP4749794B2 (ja) | 2011-08-17 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009058346A (ja) * | 2007-08-31 | 2009-03-19 | Seiko Instruments Inc | 温度センサ |
KR100995920B1 (ko) | 2008-09-11 | 2010-11-22 | 한국전기연구원 | 저온안정화 회로가 장착된 서모파일형 열전센서 |
JP5807483B2 (ja) * | 2011-09-27 | 2015-11-10 | 日本電気株式会社 | 温度測定装置、および温度測定方法 |
JP2019049318A (ja) * | 2017-09-11 | 2019-03-28 | 日本電気株式会社 | 計測機能付き軸受 |
JP2021197810A (ja) * | 2020-06-12 | 2021-12-27 | 日立Astemo株式会社 | 回転電機の固定子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS51108676A (ja) * | 1975-03-20 | 1976-09-27 | Babuhitachi Enjiniaringu Saabi | Tanikiekisetsushokubakoshugosochi |
JPS6161438A (ja) * | 1984-09-03 | 1986-03-29 | Toshiba Corp | 半導体集積回路装置 |
JP2526247B2 (ja) * | 1987-06-19 | 1996-08-21 | 新日本無線株式会社 | サ−モパイル |
JPH102807A (ja) * | 1996-06-14 | 1998-01-06 | Chino Corp | 熱電対測定装置 |
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