JP4745814B2 - プローブの研磨部材 - Google Patents
プローブの研磨部材 Download PDFInfo
- Publication number
- JP4745814B2 JP4745814B2 JP2005364879A JP2005364879A JP4745814B2 JP 4745814 B2 JP4745814 B2 JP 4745814B2 JP 2005364879 A JP2005364879 A JP 2005364879A JP 2005364879 A JP2005364879 A JP 2005364879A JP 4745814 B2 JP4745814 B2 JP 4745814B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- polishing
- inclined surface
- sheet
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 171
- 238000005498 polishing Methods 0.000 title claims description 142
- 239000000463 material Substances 0.000 title description 3
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 14
- 238000007689 inspection Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
10A 傾斜面
11 研磨層
13 クッション層
20 プローブカード
21 プローブ
30 載置台
31 支持台
31A 傾斜面
Claims (3)
- 被検査体の電気的特性検査を行うプローブカードに配列された複数のプローブを研磨するために上記被検査体を載置する載置台に付設された支持台上に配置され、上記プローブカードを複数回に分けて研磨する研磨部材において、上記研磨部材は研磨シートとして形成されており、上記研磨シートの外周縁部には内側から外側に向けて下降する傾斜面が形成されており、上記傾斜面は研磨時に上記傾斜面に位置する上記プローブが上記傾斜面の外側に向うに連れて上記傾斜面から遠ざかるように形成されていることを特徴とするプローブの研磨部材。
- 上記支持台は、上記支持台の外周縁部には内側から外側に向けて下降する傾斜面を有し、この傾斜面において上記研磨シートの傾斜面が形成されていることを特徴とする請求項1に記載のプローブの研磨部材。
- 上記研磨シートは、研磨層と、研磨層の下側に形成されたクッション層と、を有することを特徴とする請求項1または請求項2に記載のプローブの研磨部材。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005364879A JP4745814B2 (ja) | 2005-12-19 | 2005-12-19 | プローブの研磨部材 |
KR1020060127521A KR100806398B1 (ko) | 2005-12-19 | 2006-12-14 | 프로브의 연마 방법 및 연마 부재 |
US11/611,516 US7465218B2 (en) | 2005-12-19 | 2006-12-15 | Probe polishing method and probe polishing member |
TW095147498A TWI404594B (zh) | 2005-12-19 | 2006-12-18 | The grinding method of the probe and the grinding member |
CN2006101687399A CN1986152B (zh) | 2005-12-19 | 2006-12-19 | 探针的研磨方法和研磨部件 |
US11/971,697 US20080182483A1 (en) | 2005-12-19 | 2008-01-09 | Probe polishing method and probe polishing member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005364879A JP4745814B2 (ja) | 2005-12-19 | 2005-12-19 | プローブの研磨部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007170835A JP2007170835A (ja) | 2007-07-05 |
JP4745814B2 true JP4745814B2 (ja) | 2011-08-10 |
Family
ID=38174266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005364879A Expired - Fee Related JP4745814B2 (ja) | 2005-12-19 | 2005-12-19 | プローブの研磨部材 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7465218B2 (ja) |
JP (1) | JP4745814B2 (ja) |
KR (1) | KR100806398B1 (ja) |
CN (1) | CN1986152B (ja) |
TW (1) | TWI404594B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1946886B1 (en) * | 2007-01-19 | 2010-03-17 | Fujitsu Limited | Capillary, capillary polishing method, and capillary polishing apparatus |
JP5082799B2 (ja) * | 2007-11-26 | 2012-11-28 | 富士通セミコンダクター株式会社 | 洗浄装置 |
WO2009099183A1 (ja) * | 2008-02-06 | 2009-08-13 | Kabushiki Kaisha Toshiba | プローブ針およびその製造方法 |
JP5191312B2 (ja) * | 2008-08-25 | 2013-05-08 | 東京エレクトロン株式会社 | プローブの研磨方法、プローブ研磨用プログラム及びプローブ装置 |
CN102928761B (zh) * | 2012-11-20 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | 晶圆测试***及晶圆测试方法 |
JP6220596B2 (ja) * | 2013-08-01 | 2017-10-25 | 東京エレクトロン株式会社 | プローバ |
CN105583695A (zh) * | 2014-10-22 | 2016-05-18 | 中芯国际集成电路制造(上海)有限公司 | 探针的清针方法及探针 |
CN105575841B (zh) * | 2015-12-15 | 2019-08-02 | 北京中电科电子装备有限公司 | 一种晶圆测量装置 |
KR101755281B1 (ko) * | 2016-03-17 | 2017-07-19 | 주식회사 새한마이크로텍 | 프로브핀 제조장치 및 제조방법 |
CN107263256B (zh) * | 2017-08-11 | 2019-05-10 | 烟台三维汽车配件有限公司 | 一种注塑模具拉料针端部旋磨装置 |
CN109262412B (zh) * | 2018-09-20 | 2024-04-19 | 矽电半导体设备(深圳)股份有限公司 | 磨针台驱动结构及全自动探针台 |
JP7477393B2 (ja) * | 2020-08-03 | 2024-05-01 | 株式会社日本マイクロニクス | 検査用接続装置 |
TWI752749B (zh) * | 2020-12-07 | 2022-01-11 | 中華精測科技股份有限公司 | 提高垂直探針卡之微探針研磨效率的方法 |
TWI747720B (zh) * | 2021-01-19 | 2021-11-21 | 吉而特科技股份有限公司 | 具定位效果的自動磨針機 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10300777A (ja) * | 1997-04-22 | 1998-11-13 | Sumitomo 3M Ltd | プローブカード針先研磨材 |
JPH1154572A (ja) * | 1997-07-31 | 1999-02-26 | Tokyo Electron Ltd | プローブ装置 |
JPH11145219A (ja) * | 1997-11-10 | 1999-05-28 | Tokyo Electron Ltd | クリーニング機構及びクリーニング方法 |
JP2004304185A (ja) * | 2003-03-20 | 2004-10-28 | Nitto Denko Corp | クリーニングシートとその製造方法、及びこのクリーニングシートを有する搬送部材 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5897424A (en) * | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
JP3144672B2 (ja) * | 1997-01-22 | 2001-03-12 | 東京エレクトロン株式会社 | プローブ装置及びプローブ針の研磨方法 |
TW377482B (en) * | 1997-04-08 | 1999-12-21 | Tokyo Electron Ltd | Cleaner with protuberances for inspection, inspection apparatus and inspection method for integrated circuits |
US6306187B1 (en) * | 1997-04-22 | 2001-10-23 | 3M Innovative Properties Company | Abrasive material for the needle point of a probe card |
JPH1187438A (ja) * | 1997-09-03 | 1999-03-30 | Mitsubishi Electric Corp | プローブ先端のクリーニング部材ならびにクリーニング方法、および半導体ウェーハのテスト方法 |
US6019663A (en) * | 1998-02-20 | 2000-02-01 | Micron Technology Inc | System for cleaning semiconductor device probe |
JPH11238768A (ja) * | 1998-02-20 | 1999-08-31 | Japan Electronic Materials Corp | プローブ先端クリーニングシート |
US6443809B1 (en) * | 1999-11-16 | 2002-09-03 | Chartered Semiconductor Manufacturing, Ltd. | Polishing apparatus and method for forming an integrated circuit |
KR20020022862A (ko) * | 2000-09-21 | 2002-03-28 | 윤종용 | 테스트 프로브 연마용 연마 웨이퍼 |
JP3888197B2 (ja) * | 2001-06-13 | 2007-02-28 | 三菱電機株式会社 | プローブ先端付着異物の除去部材、プローブ先端付着異物のクリーニング方法およびプロービング装置 |
US6908364B2 (en) * | 2001-08-02 | 2005-06-21 | Kulicke & Soffa Industries, Inc. | Method and apparatus for probe tip cleaning and shaping pad |
US7182672B2 (en) * | 2001-08-02 | 2007-02-27 | Sv Probe Pte. Ltd. | Method of probe tip shaping and cleaning |
-
2005
- 2005-12-19 JP JP2005364879A patent/JP4745814B2/ja not_active Expired - Fee Related
-
2006
- 2006-12-14 KR KR1020060127521A patent/KR100806398B1/ko active IP Right Grant
- 2006-12-15 US US11/611,516 patent/US7465218B2/en active Active
- 2006-12-18 TW TW095147498A patent/TWI404594B/zh active
- 2006-12-19 CN CN2006101687399A patent/CN1986152B/zh not_active Expired - Fee Related
-
2008
- 2008-01-09 US US11/971,697 patent/US20080182483A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10300777A (ja) * | 1997-04-22 | 1998-11-13 | Sumitomo 3M Ltd | プローブカード針先研磨材 |
JPH1154572A (ja) * | 1997-07-31 | 1999-02-26 | Tokyo Electron Ltd | プローブ装置 |
JPH11145219A (ja) * | 1997-11-10 | 1999-05-28 | Tokyo Electron Ltd | クリーニング機構及びクリーニング方法 |
JP2004304185A (ja) * | 2003-03-20 | 2004-10-28 | Nitto Denko Corp | クリーニングシートとその製造方法、及びこのクリーニングシートを有する搬送部材 |
Also Published As
Publication number | Publication date |
---|---|
KR100806398B1 (ko) | 2008-02-21 |
KR20070065218A (ko) | 2007-06-22 |
TW200730297A (en) | 2007-08-16 |
TWI404594B (zh) | 2013-08-11 |
US20080182483A1 (en) | 2008-07-31 |
CN1986152B (zh) | 2010-05-19 |
US7465218B2 (en) | 2008-12-16 |
JP2007170835A (ja) | 2007-07-05 |
US20070141956A1 (en) | 2007-06-21 |
CN1986152A (zh) | 2007-06-27 |
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