JP4744237B2 - 回路基板の冷却機構 - Google Patents
回路基板の冷却機構 Download PDFInfo
- Publication number
- JP4744237B2 JP4744237B2 JP2005245145A JP2005245145A JP4744237B2 JP 4744237 B2 JP4744237 B2 JP 4744237B2 JP 2005245145 A JP2005245145 A JP 2005245145A JP 2005245145 A JP2005245145 A JP 2005245145A JP 4744237 B2 JP4744237 B2 JP 4744237B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling fan
- substrate
- cooling
- circuit board
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
2 冷却ファン
2a 送風面
3〜6 放熱板
3a 受風面
7〜10 トランス
11〜14 トランジスタ
15 ノイズ防止用金属板(金属板)
15a 折曲部
16、17 連結部
Claims (4)
- 基板上に配設される複数の放熱板と、該複数の放熱板の一部に送風する冷却ファンとを含み、前記基板及び該基板上に配設される電子部品を冷却する回路基板の冷却機構であって、
前記基板の一端には、前記基板を接地することにより前記電子部品からの電磁波ノイズの漏出を防止する金属板が付設され、前記金属板を前記基板に沿ってL字状に折り曲げて折曲部が形成されており、前記冷却ファンを前記折曲部の内側に前記基板に対し垂直に配置するとともに、前記冷却ファンからの送風を受ける放熱板の受風面を前記冷却ファンの軸流方向に対し斜めに配置し、前記金属板と前記冷却ファンからの送風を受ける放熱板との間、及び前記金属板と前記冷却ファンからの送風を受けない放熱板との間に連結部を設けることにより、前記冷却ファンからの送風を受ける放熱板と前記冷却ファンからの送風を受けない放熱板とを前記金属板及び前記連結部を介して連結することを特徴とする回路基板の冷却機構。 - 前記基板の前記冷却ファンが配置される部分には切り欠き部が形成されることを特徴とする請求項1に記載の回路基板の冷却機構。
- 前記折曲部の少なくとも一部が前記基板の表面側若しくは裏面側に突設されており、前記冷却ファンは、送風面が前記基板により分割されるように配置されることを特徴とする請求項1又は請求項2に記載の回路基板の冷却機構。
- 前記冷却ファンの軸流方向に対する前記受風面の角度は、前記冷却ファンからの送風が送風方向下流側に配置された他の放熱板及び電子部品の少なくとも一方に誘導されるように設定されることを特徴とする請求項1乃至請求項3のいずれかに記載の回路基板の冷却機構。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005245145A JP4744237B2 (ja) | 2005-08-26 | 2005-08-26 | 回路基板の冷却機構 |
US11/509,235 US7551437B2 (en) | 2005-08-26 | 2006-08-24 | Cooling mechanism for circuit board |
CNB2006101099522A CN100512614C (zh) | 2005-08-26 | 2006-08-25 | 电路基板的冷却机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005245145A JP4744237B2 (ja) | 2005-08-26 | 2005-08-26 | 回路基板の冷却機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007059731A JP2007059731A (ja) | 2007-03-08 |
JP4744237B2 true JP4744237B2 (ja) | 2011-08-10 |
Family
ID=37779254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005245145A Expired - Fee Related JP4744237B2 (ja) | 2005-08-26 | 2005-08-26 | 回路基板の冷却機構 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7551437B2 (ja) |
JP (1) | JP4744237B2 (ja) |
CN (1) | CN100512614C (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140058A (ja) * | 2006-11-30 | 2008-06-19 | Toshiba Corp | 電子機器 |
CN201156862Y (zh) * | 2008-01-28 | 2008-11-26 | 鸿富锦精密工业(深圳)有限公司 | 具有导风板的网络设备 |
FR2948485B1 (fr) * | 2009-07-24 | 2011-10-21 | Sagem Comm | Dispositif d'accueil pour disque dur |
WO2011024319A1 (ja) * | 2009-08-31 | 2011-03-03 | 富士通株式会社 | 電子機器 |
JP5702962B2 (ja) * | 2010-07-20 | 2015-04-15 | 株式会社東芝 | 電子機器の放熱構造 |
CN103687414B (zh) * | 2012-08-30 | 2016-12-21 | 台达电子工业股份有限公司 | 大功率机柜散热***及静止无功补偿*** |
JP6311664B2 (ja) | 2015-06-30 | 2018-04-18 | 京セラドキュメントソリューションズ株式会社 | ヒートシンクおよびヒートシンクを備える回路基板 |
JP6447416B2 (ja) * | 2015-08-25 | 2019-01-09 | 京セラドキュメントソリューションズ株式会社 | 画像形成装置 |
JP6488997B2 (ja) * | 2015-11-27 | 2019-03-27 | 京セラドキュメントソリューションズ株式会社 | 回路基板及び電子機器 |
US9696769B1 (en) * | 2015-12-31 | 2017-07-04 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Compute chassis having a lid that secures and removes air baffles |
CN106502340B (zh) * | 2016-11-02 | 2019-06-28 | 英业达科技有限公司 | 服务器 |
JP2020126410A (ja) * | 2019-02-04 | 2020-08-20 | Necパーソナルコンピュータ株式会社 | 電子機器の製造方法及び回路基板 |
CN117374726B (zh) * | 2023-12-07 | 2024-03-19 | 合肥玉卓光电科技有限公司 | 一种高集成度、大功率的智能化半导体激光电源及*** |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02140893U (ja) * | 1989-04-28 | 1990-11-26 | ||
JPH0613364U (ja) * | 1992-07-13 | 1994-02-18 | 株式会社ケンウッド | 電動ファン |
JP3413992B2 (ja) | 1994-10-20 | 2003-06-09 | 富士通株式会社 | 集積回路の遮蔽構造 |
JP3178985B2 (ja) * | 1995-03-24 | 2001-06-25 | 株式会社東芝 | 携帯形電子機器 |
US5831847A (en) * | 1997-02-05 | 1998-11-03 | Jerome Industries Corp. | Power supply with separated airflows |
KR100322468B1 (ko) * | 1997-02-12 | 2002-04-22 | 윤종용 | 컴퓨터의팬고정장치와컴퓨터의팬고정장치를사용하는휴대용컴퓨터 |
US6134104A (en) * | 1997-12-29 | 2000-10-17 | Compaq Computer Corporation | Multi-drive portable computer |
JP3473499B2 (ja) | 1999-05-25 | 2003-12-02 | タイガー魔法瓶株式会社 | 電気部品の冷却構造 |
US6515858B2 (en) * | 2000-06-06 | 2003-02-04 | Unipower Corporation | Thermal distribution system |
US6483699B1 (en) * | 2000-07-20 | 2002-11-19 | Silicon Graphics, Inc. | Baffle system for air cooled computer assembly |
SE0003189D0 (sv) * | 2000-09-08 | 2000-09-08 | Emerson Energy Systems Ab | A spring device for pressing an electronic component towards a heat sink body |
GB2371681A (en) * | 2001-01-17 | 2002-07-31 | Sun Microsystems Inc | Fan carrier for a computer system |
JP2002314278A (ja) * | 2001-04-10 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 電子部品の空冷装置 |
JP2002182545A (ja) | 2001-09-28 | 2002-06-26 | Canon Inc | 画像形成装置 |
TWI225767B (en) * | 2003-06-13 | 2004-12-21 | Delta Electronics Inc | Heat-dissipating module structure for electronic apparatus |
JP3788798B2 (ja) * | 2003-10-03 | 2006-06-21 | 船井電機株式会社 | 電子機器装置および画像形成装置 |
JP4207755B2 (ja) * | 2003-11-07 | 2009-01-14 | 株式会社豊田自動織機 | 電子機器装置 |
JP2005183651A (ja) * | 2003-12-19 | 2005-07-07 | Fujitsu Ltd | 筐体および付加装置 |
US7345873B2 (en) * | 2004-09-29 | 2008-03-18 | General Electric Company | System and method for cooling electronic systems |
US7220178B2 (en) * | 2004-10-20 | 2007-05-22 | Alpha Networks Inc. | Receiving slot frame with fan |
JP5031327B2 (ja) * | 2006-11-08 | 2012-09-19 | 任天堂株式会社 | 電子機器 |
-
2005
- 2005-08-26 JP JP2005245145A patent/JP4744237B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-24 US US11/509,235 patent/US7551437B2/en not_active Expired - Fee Related
- 2006-08-25 CN CNB2006101099522A patent/CN100512614C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100512614C (zh) | 2009-07-08 |
JP2007059731A (ja) | 2007-03-08 |
CN1921746A (zh) | 2007-02-28 |
US20070047202A1 (en) | 2007-03-01 |
US7551437B2 (en) | 2009-06-23 |
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