JP4694637B2 - 気相成長装置 - Google Patents
気相成長装置 Download PDFInfo
- Publication number
- JP4694637B2 JP4694637B2 JP2009138563A JP2009138563A JP4694637B2 JP 4694637 B2 JP4694637 B2 JP 4694637B2 JP 2009138563 A JP2009138563 A JP 2009138563A JP 2009138563 A JP2009138563 A JP 2009138563A JP 4694637 B2 JP4694637 B2 JP 4694637B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- chamber
- suction nozzle
- vapor phase
- phase growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本体と蓋から構成されたチャンバーと、前記チャンバー内に、被成膜物載置台と、前記被成膜物載置台をチャンバー中心軸回りに回転させる機構と、前記被成膜物載置台上の塵埃を除去する手段とを備えた気相成長装置において、前記塵埃除去手段は、前記チャンバー外に回転軸を有するアームを備え、前記アーム端に前記被成膜物載置台に対して非接触な吸引ノズルを有し、前記アーム回転によって前記吸引ノズルを前記チャンバーの内から外、および外から内へ移動できることを特徴とする気相成長装置。
前記吸引ノズル幅が被成膜物載置台幅と同じ、またはそれ以上であることを特徴とする第1の構成の気相成長装置。
前記アーム回転軸は、回転時にアームを上下動させるカム機構を備えていることを特徴とする第1または第2の構成の気相成長装置。
前記アームは、鉛直下向きに延びているストッパーを備えていることを特徴とする第1〜第3の何れかの構成の気相成長装置。
2 掃除手段(除去手段)
3 グローブボックス
4 チャンバー本体
5 上下動機構
6 チャンバー蓋
7 基板(被成膜物)
8 基板トレイ
9 基板トレイ載置台(被成膜物載置台)
10 サセプタ
11 回転機構
21 吸引ノズル
22 アーム
23 移動機構
24 配管チューブ
25 第1の回転軸シャフト部(第1の軸部)
25a シャフト本体(第1の軸本体)
25b ステッピングモータ(動力源)
25c 磁性流体シール
26 第2の回転軸シャフト部(第2の軸部)
26a シャフト本体(第2の軸本体)
26b ベアリング(軸受)
27 カム機構
27a カムフォロア
27b カム面
28 ストッパー
Claims (6)
- 本体と蓋とから構成されたチャンバーと、
上記チャンバー内に配置された被成膜物載置台と、
上記被成膜物載置台上の塵埃を除去する除去手段とを備えた気相成長装置であって、
上記除去手段は、
上記被成膜物載置台へ延びたアームと、
上記アームの端部に設けられた吸引ノズルと、
上記チャンバーの中心軸と平行な第1の方向に延びた第1の軸部を上記チャンバー外部に有し、該第1の軸部を回転軸として上記アームを回転させることにより、上記吸引ノズルを、上記チャンバーの外部から内部へ、及び外部から内部へ移動させる移動機構とを備え、
上記移動機構は、
上記第1の方向および上記アームの長手方向に対し垂直な、第2の方向に延びた第2の軸部と、
さらに、上記第1の軸部を回転軸とした上記アームの回転に伴い、上記アームを上記第2の軸部を回転軸として回転させることにより、上記吸引ノズルを、第1の方向において上下動させるカム機構とを備えたことを特徴とする気相成長装置。 - 上記チャンバーの中心軸を回転軸として、上記被成膜物載置台を回転させる回転機構を備えたことを特徴とする請求項1に記載の気相成長装置。
- 上記アームの長手方向において、上記吸引ノズルの幅は、上記被成膜物載置台の幅以上になっていることを特徴とする請求項1また2に記載の気相成長装置。
- 上記第2の軸部は、上記第1の軸部と上記アームとの接続部分に設けられた第2の軸本体と、上記第2の軸本体の軸受とを備えたことを特徴とする請求項1に記載の気相成長装置。
- 上記アームは、上記第1の方向において、鉛直下向きに延びたストッパーを備えたことを特徴とする請求項1〜4の何れか1項に記載の気相成長装置。
- 上記第1の軸部は、
上記アームにおける吸引ノズルと反対側の端部に接続した第1の軸本体と、
上記第1の軸本体を回転させる動力源とを備えたことを特徴とする請求項1〜5の何れか1項に記載の気相成長装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009138563A JP4694637B2 (ja) | 2009-06-09 | 2009-06-09 | 気相成長装置 |
PCT/JP2010/059114 WO2010143544A1 (ja) | 2009-06-09 | 2010-05-28 | 気相成長装置 |
TW99118461A TWI422695B (zh) | 2009-06-09 | 2010-06-07 | 氣相成長裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009138563A JP4694637B2 (ja) | 2009-06-09 | 2009-06-09 | 気相成長装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010287631A JP2010287631A (ja) | 2010-12-24 |
JP4694637B2 true JP4694637B2 (ja) | 2011-06-08 |
Family
ID=43308799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009138563A Expired - Fee Related JP4694637B2 (ja) | 2009-06-09 | 2009-06-09 | 気相成長装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4694637B2 (ja) |
TW (1) | TWI422695B (ja) |
WO (1) | WO2010143544A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023223991A1 (ja) * | 2022-05-19 | 2023-11-23 | 株式会社ニューフレアテクノロジー | 半導体製造装置のメインテナンス方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766108A (ja) * | 1993-08-31 | 1995-03-10 | Dainippon Screen Mfg Co Ltd | 処理液塗布装置 |
JPH1022204A (ja) * | 1996-07-05 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2001341054A (ja) * | 2000-06-02 | 2001-12-11 | Mitsubishi Motors Corp | 平面ラップ盤のワーク着脱装置 |
JP2002080122A (ja) * | 2000-09-04 | 2002-03-19 | Matsushita Electric Ind Co Ltd | 移載装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58210162A (ja) * | 1982-06-02 | 1983-12-07 | Toshiba Corp | 蒸着装置の浄化方法及びその装置 |
JPH04176867A (ja) * | 1990-11-13 | 1992-06-24 | Kawasaki Steel Corp | 多段式真空差圧室の防塵装置 |
JP4521056B2 (ja) * | 2006-05-15 | 2010-08-11 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置および記録媒体 |
-
2009
- 2009-06-09 JP JP2009138563A patent/JP4694637B2/ja not_active Expired - Fee Related
-
2010
- 2010-05-28 WO PCT/JP2010/059114 patent/WO2010143544A1/ja active Application Filing
- 2010-06-07 TW TW99118461A patent/TWI422695B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766108A (ja) * | 1993-08-31 | 1995-03-10 | Dainippon Screen Mfg Co Ltd | 処理液塗布装置 |
JPH1022204A (ja) * | 1996-07-05 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2001341054A (ja) * | 2000-06-02 | 2001-12-11 | Mitsubishi Motors Corp | 平面ラップ盤のワーク着脱装置 |
JP2002080122A (ja) * | 2000-09-04 | 2002-03-19 | Matsushita Electric Ind Co Ltd | 移載装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2010143544A1 (ja) | 2010-12-16 |
TW201103993A (en) | 2011-02-01 |
JP2010287631A (ja) | 2010-12-24 |
TWI422695B (zh) | 2014-01-11 |
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