JP4625997B2 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
JP4625997B2
JP4625997B2 JP20764499A JP20764499A JP4625997B2 JP 4625997 B2 JP4625997 B2 JP 4625997B2 JP 20764499 A JP20764499 A JP 20764499A JP 20764499 A JP20764499 A JP 20764499A JP 4625997 B2 JP4625997 B2 JP 4625997B2
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light
light emitting
sealing portion
emitting diode
emitting element
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JP2001036147A (en
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広昭 為本
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

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Description

【０００１】
【発明の属する技術分野】
本発明は発光ダイオード、特に表面実装型の発光ダイオードに関する。
【０００２】
【従来の技術】
従来の表面実装型の発光ダイオードは、例えば、図５に示すように正の電極板２０２ａと負の電極板２０２ｂとが一体成形されたパッケージ２０１の凹部３内に発光素子４が透光性封止部８０によって封止されて構成されている。この図５に示す発光ダイオード（以下、第１の従来例という。）は、薄型化を目的とした表面実装型の発光ダイオードであるために、透光性封止部８０の表面が平坦でかつその平坦面がパッケージ２０１の凹部２０３の上面とほぼ一致するように透光性封止部８０が充填されている。
【０００３】
また、図６は第２の従来例の発光ダイオードの構成を示す断面図であって、この第２の従来例の発光ダイオードは、透光性封止部８０の表面を球面の凸形状としてパッケージ２０１の上面から突出させている点が第１の従来例とは異なり、他の部分は第１の従来例と同様に構成される。この第２の従来例において、透光性封止部８０の球面の外表面は、その焦点が発光素子４の発光点と一致又は発光点の上方に位置するようにその曲率が設定される。また、その球面は、樹脂で透光性封止部を形成する場合、キャスティングケース（型）を用いて所定の球面が形成される。
【０００４】
【発明が解決しようとする課題】
しかしながら、第１の従来例の発光ダイオードは、薄型化が可能であるが、透光性樹脂の表面で発光素子で発光された光が反射される等により発生した光を効率よく外部に放出することができないという問題点があった。
また、第１の従来例の発光ダイオードは、透光性樹脂の表面を平坦にしているので、集光性が悪いという問題点もあった。
また、第２の従来例の発光ダイオードは、透光性封止部８０の表面を凸形状として外部への出力効率を向上させることは可能であるが、薄型にできないという問題点があった。
このように従来の発光ダイオードにおいて、薄型化と高出力化とは相反するものであったために、その双方を満足させることができる発光ダイオードはなかった。
【０００５】
そこで、本発明は薄型化が可能でかつ集光性がよくしかも発光した光を外部に効率よく出力できる発光ダイオードを提供することを目的とする。
【０００６】
【課題を解決するための手段】
以上の目的を達成するために、本発明に係る発光ダイオードは、凹部を有するパッケージと、該凹部の底面に設けられた発光素子と、該発光素子を覆いかつ表面が球状の凸面になるように形成された透光性封止部とを備えた発光ダイオードであって、上記発光素子を、上記透光性封止部の球状の凸面の焦点と上記透光性封止部の表面との間に設けて上記球状の凸面の外周端部が上記発光素子の発光面より低くなるようにし、上記凹部の側面を上記透光性封止部を介して出射される光が前方に反射されるように傾斜させ、かつ
上記球状の凸面の端が上記凹部の傾斜した側面と上記凹部の底面との境界に一致するように上記透光性封止部を形成したことを特徴とする。
このように構成することにより、本発明の発光ダイオードは、上記発光素子で発光した光を、上記透光性封止部の球状の凹面を介して反射させることなく外部に出射することができ、かつ上記凹部の側面に入射した光を該表面で反射させて外部に出射することができる。
また、上記発光素子を、上記透光性封止部によって構成される凸レンズの焦点と上記透光性封止部の表面との間に設けるようにしているので、薄型にできる。
【０００７】
また、本発明に係る発光ダイオードは、上記球状の凸面の端が上記凹部の傾斜した側面と上記凹部の底面との境界に略一致するように上記透光性封止部を形成することが好ましい。このようにすると、上記発光素子から水平方向より下方に出射された光を傾斜面で反射させて外部に出射することができ、さらに外部出力効率を向上させることができる。
【０００８】
さらに、本発明に係る発光ダイオードは、上記透光性封止部の凸面の頂点が上記パッケージの上面より下に位置するように上記透光性封止部が形成されていることが好ましく、これによってさらに薄型化が可能となる。
【０００９】
また、本発明に係る発光ダイオードでは、上記パッケージを液晶ポリマー樹脂、PBT（ポリブチレンテレフタレート）樹脂及びセラミックスからなる群から選択される１つを用いて構成することができる。
【００１０】
さらに、本発明に係る発光ダイオードでは、上記発光素子がフリップチップ実装されていることが好ましい。
【００１１】
またさらに、本発明に係る発光ダイオードでは、上記発光素子に対する応力を緩和するために、上記透光性封止部をシリコン樹脂で形成することができる。
【００１２】
また、本発明に係る発光ダイオードでは、上記発光素子として窒化物半導体を含んで成る発光ダイオードを用いることができる。
【００１３】
【発明の実施の形態】
以下、図面を参照して本発明に係る実施の形態の発光ダイオードについて説明する。
本実施の形態の発光ダイオードは、図２に示すように、パッケージ１に形成された凹部３に設けられた発光素子４を透光性封止部８によって封止してなる発光ダイオードであって、以下のような各特徴を有する。
（１）透光性封止部８を、その表面が焦点を有する球面の凸形状となるように、かつその凸形状の表面の頂点がパッケージ１の上面より低くなるように形成した。
（２）発光素子４を、上記透光性封止部によって構成される凸レンズの焦点と上記透光性封止部の表面との間に位置するように設けた。
（３）凹部３の側面３ａを透光性樹脂を介して出射される光が前方に反射されるように傾斜させて形成した。
【００１４】
すなわち、本実施の形態の発光ダイオードは、（１）透光性封止部８を、その表面を凸形状としその凸形状の表面の頂点がパッケージ１の上面より低くなるように、かつ（２）発光素子４を、透光性封止部８の焦点と透光性封止部８の表面の間に位置するようにかつ透光性封止部８が凹部３内に収まるように設けることにより薄型化を実現し、（３）凹部３の側面３ａを傾斜させることにより透光性封止部８を介して出射される光をその傾斜した側面３ｃで反射させて外部に取り出せるようにし、薄型化及び光の取り出し効率の双方を満足させたものである。
【００１５】
以下、図１〜図３を用いて本実施の形態の発光素子について詳細に説明する。
尚、図１は本実施の形態の発光ダイオードを上方から見た平面図であり、図２は図１のＡ−Ａ’線についての断面図であり、図３は図１のＢ−Ｂ’線についての断面図である。
パッケージ１．
パッケージ１は、液晶ポリマー、ＰＢＴ（ポリブチレンテレフタレート）樹脂、セラミックス等の絶縁性部材よりなりその一部に凹部３が形成されている。このパッケージに使用される上記例示した絶縁性部材において、液晶ポリマーとＰＢＴ樹脂とを比較すると、耐熱性は液晶ポリマーが優れており、光反射性はＰＢＴ樹脂が優れている。また、これらの樹脂とセラミックスを比べると放熱性はセラミックスが優れているが、形状加工の自由度、コストは樹脂の方が優れている。本実施の形態では、発光ダイオードの使用環境等に応じて、各絶縁性部材の中から適したものを選択して用いることができる。
【００１６】
また、パッケージ１に形成された凹部３の側面の一部は図１及び図２に示すように、凹部が発光ダイオードの上方に向かって広がるようにされかつ白色あるいは銀白色に着色されて発光素子から出射された光に対する反射率を高くしている。
さらに、本実施の形態では、凹部を各々外部接続電極が設けられた方向に長くその一方向に直交する他の方向については短くなるように形成している。また、その一方向両側の面を傾斜させて傾斜面を形成している。
これによって、外部接続電極２ａ，２ｂ間には十分なギャップを確保しつつ、その直交方向は幅を狭くでき、発光ダイオード素子をより小型化できる。
【００１７】
また、パッケージ１は、凹部３の底面で露出と外表面にその一部が露出するように設けられた電極２ａ，２ｂを備え、その凹部３の底面に露出した電極２ａ，２ｂにそれぞれ発光素子の正負の電極が接続される。
この電極２ａ，２ｂは樹脂を用いたパッケージでは、りん青銅等の金属板からなる電極板を例えば一体成形により形成することができ、セラミックを用いたパッケージではＷやＮｉ等のメタライズ層として形成することができる。
【００１８】
発光素子４．
本実施の形態において、発光素子４は一方の主面に正電極５ａと負電極５ｂとがいずれも形成されている発光素子であって、発光素子４はその正電極５ａ及び負電極５ｂをそれぞれパッケージ１の底面に露出させた電極２ａ，２ｂに対向させてハンダ等の導電性接着剤により接続することによりパッケージ１に固定される。
【００１９】
透光性封止部８．
透光性封止部８はシリコーン、エポキシ、変性アクリル、不飽和ポリエステル等の透光性樹脂、あるいはガラス等の無機材料で形成され、発光素子４を保護する機能と、発光素子４から出射される光を集光するレンズの機能とを併せ持つ封止部であり以下のように形成される。
すなわち、透光性封止部８はその外表面（上表面）が１点で焦点を結ぶ球面の凸形状となるように、かつその凸形状の外表面の頂点がパッケージ１の上面より低くなるように形成する。また、その外表面により形成される焦点が発光素子４より下に形成されるように、透光性封止部８の外表面の曲率を比較的大きく設定する。これによって、発光素子４を透光性封止部８の球面の表面により形成される凸レンズの焦点と上記透光性封止部８の外表面との間に位置させるようにできる。
【００２０】
さらに、透光性封止部８の外表面の外周端部は、凹部３の底面の外周とほぼ一致するように透光性封止部８を形成している。
またさらに、透光性封止部８はその外表面の中心軸上に発光素子４の発光部中心が位置するように形成する。
上述のような形状の透光性封止部８は、樹脂を用いる場合は以下のようにして容易に作製できる。
【００２１】
まず、パッケージ１の凹部３の側面３ａに、フッ素あるいはシリコーン等の封止樹脂をはじく樹脂薄膜を、塗布あるいは蒸着により形成する。
次に、該凹部３に粘度を所定の値に設定した封止樹脂を、所定量だけ滴下する。
このような方法を用い、封止樹脂をはじく樹脂薄膜の厚さ、成分を封止樹脂の濡れ性に応じて適切に選択して封止樹脂を滴下すると、封止樹脂の表面張力により、封止樹脂が凹部３の底面をほぼ覆いかつ側壁に這い上がらないようにでき、所望の凸形状の外表面を有する透光性封止部８を形成することができる。
【００２２】
このように、本実施の形態では、透光性封止部８の外表面の曲率半径が比較的大きくかつ薄いので、透光性封止部８は、透光性樹脂を用いてポッティング（単に樹脂を滴下させること）により寸法精度よく形成することができる。すなわち、本実施の形態では樹脂の表面張力を利用して滴下する樹脂量を所定の量とすることにより透光性封止部８の外表面を所望の曲率半径の球面とすることができる。従って、第２の従来例のキャスティングケースを用いて所定の球面としていた方法に比較すると、本工程の製造コストを安価にできる。
もちろん本発明では、一般的な封止法であるキャスティングケースの雌型を使って透光性封止部８の表面形状が所定の形状になるように形成してもよい。
尚、透光性封止部８を形成するための樹脂等の材料は、等方性の屈折率を有するものが望ましいが、本発明は特にこれに限定されるものではない。
【００２３】
以上のように構成された実施の形態の発光ダイオードにおいて、透光性封止部８の表面を球面の凸面としているので、発光素子４から出射された光は、透光性封止部８の表面に比較的小さな入射角で入射し、全反射されることなく発光ダイオードの外部に出射される。従って、透光性封止部の表面を平坦にした第１の従来例に比較して、透光性封止部の表面における臨界角反射で再び透光性封止部内に戻される光の割合を少なくでき、外部に出射される光量を多くできる。
【００２４】
また、本実施の形態の発光ダイオードにおいては、透光性封止部８の外表面の外周端部を凹部３の底面の外周とほぼ一致するように透光性封止部８を形成し、発光素子４の発光出力面である上面より、透光性封止部８の外表面の外周端部が低くなるようにしている。これによって、本実施の形態では、発光素子４から下方に向けて出射された光も有効に上方に取り出すことができる。
【００２５】
すなわち、図４に示すように、例えば、発光素子４の端部から出射された光Ｌ１は、透光性封止部８の外表面上の点１０１にその点１０１における法線１０５に対して入射角θ１で入射する。点１０１に入射した光Ｌ１は透過光Ｌ２として法線１０５に対してθ２の角度で透光性封止部８の外部に出射され、パッケージ１の凹部３の側面３ａで反射されて、出射光Ｌとして発光ダイオードの上方に出射される。
【００２６】
ここで、出射角θ２は透光性封止部８の屈折率をｎ１、外部（空間）の屈折率ｎ２とすると、次の（１）式で表される。
θ２＝ｓｉｎ-1（ｎ２／ｎ１・ｓｉｎθ１）…（１）
また、法線１０５と水平方向の成す角度θ３と角度θ２とが次の（２）式で表される関係があるときは、透光性封止部８から外部に出力される光は必ず水平より下の方向を向くことになる。
θ２≧θ３…（２）
従って、（１）式を（２）式に代入することにより得られる次の（３）式を満足するように発光素子から出射される光は、必ず水平より下の方向を向くことになり、傾斜した反射側面が存在しないと前方に出射されることはない。
ｓｉｎ-1（ｎ２／ｎ１・ｓｉｎθ１）≧θ３…（３）
【００２７】
しかしながら、本実施の形態では、透光性封止部８の外表面の外周端部は、凹部３の底面の外周とほぼ一致するように透光性封止部８を形成し発光素子４の発光出力面である上面より、透光性封止部８の外表面の外周端部が低くなるようにしているので、本実施の形態では、発光素子４から下方に向けて出射された光も有効に上方に取り出すことができる。これによって、本実施の形態の発光ダイオードは、第２の従来例に比較してさらに効率的に発光素子で発光した光を外部に出射することができる。
尚、図４において、１０３の符号を付して示す点は焦点であり、１０４の符号を付して示す１点鎖線は、焦点と透光性封止部の外表面の頂点とを結ぶ透光性封止部の軸である。
【００２８】
また、以上のように構成された実施の形態の発光ダイオードは、上述のように、発光素子４で発光した光を効率良く出射することができる以外に以下のような優れた特徴を有する。
まず第１に、パッケージ１の凹部３から突出しないように、透光性封止部８を形成しているので、第２の従来例に比較して薄型にできる。
また第２に、透光性封止部８の凸面である外表面をパッケージ１の上面より低くなるように形成しているので、本実施の形態の発光ダイオードをマウンター等で実装する時にノズルで吸着しても、封止樹脂にノズルが直接接触することがない。従って、硬化後の封止樹脂の表面の硬度を高くする必要はなく、封止樹脂として柔軟なシリコン樹脂等を採用することができる。このような柔軟な封止樹脂を用いると、その内部応力を極めて小さくでき、封止樹脂による応力が発光部電極とパッケージ電極の接合部に作用して断線させるという不良も防止することができる。
【００２９】
また、本実施の形態では、発光素子４の電極面を下、すなわちパッケージ１の電極２ａ，２ｂと対向させて搭載し、ワイヤを使用せずに接続する、いわゆるフリップチップ接続で実装した例を示した。このように本発明の構成と該フリップチップ接続を組み合わせれば、接続用のワイヤを無くすことができ、パッケージ１の凹部３の深さを小さくすることができ、さらに発光ダイオードを薄型にできる。尚、本発明は実施の形態として示したフリップチップボンディングの発光ダイオードに限られるものではなく、ワイヤを用いた接続を用いた場合でも、ワイャ接続を用いた従来例と比べると、高出力/薄型発光素子が得られることは言うまでもない。
またさらに、実施の形態では１つの発光素子を用いたものを例として示したが、本発明は複数の発光素子を凹部に収納したものにも適用することができ、このようにしても、実施の形態と同様の作用効果が得られる。
また、凹部に複数の発光ダイオードチップを搭載することによりにすることでフルカラーの表面実装型多色発光ダイオードを実現することもできる。
【００３０】
【発明の効果】
以上、詳細に説明したように、本発明に係る発光ダイオードは、パッケージの凹部に設けられた発光素子と、該凹部を覆いかつ表面が球状の凸面になるように形成された透光性封止部とを備え、上記発光素子を、上記透光性封止部によって構成される凸レンズの焦点と上記透光性封止部の表面との間に設け、かつ上記凹部の側面を上記透光性封止部を介して出射される光を前方に反射させるように傾斜させているので、上記発光素子で発光した光を、上記透光性封止部の球状の凹面を介してに反射させることなく外部に出射することができ、かつ上記凹部の側面に入射した光を該表面で反射させて外部に出射することができる。また、上記発光素子を、上記透光性封止部によって構成される凸レンズの焦点と上記透光性封止部の表面との間に設けるようにしているので、薄型にできる。
従って、本発明によれば、薄型化が可能でかつ集光性がよくしかも発光した光を外部に効率よく出力できる発光ダイオードを提供することができる。
【図面の簡単な説明】
【図１】 本発明に係る実施の形態の発光ダイオードの平面図である。
【図２】 図１のＡ−Ａ’線についての断面図である。
【図３】 図１のＢ−Ｂ’線についての断面図である。
【図４】 実施の形態の発光ダイオードにおいて、発光素子から出力された光の経路を説明するための模式図である。
【図５】 第１の従来例の発光ダイオードの断面図である。
【図６】 第２の従来例の発光ダイオードの断面図である。
【符号の説明】
１…パッケージ、
２ａ，２ｂ…電極、
３…凹部、
３ａ…凹部の側面、
４…発光素子、
５ａ…正電極、
５ｂ…負電極、
８…透光性封止部。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting diode, and more particularly to a surface mount type light emitting diode.
[0002]
[Prior art]
For example, as shown in FIG. 5, a conventional surface-mount type light emitting diode has a light-emitting element 4 in a recess 3 of a package 201 in which a positive electrode plate 202a and a negative electrode plate 202b are integrally formed. It is configured to be sealed by a stopper 80. The light-emitting diode shown in FIG. 5 (hereinafter referred to as the first conventional example) is a surface-mounted light-emitting diode for the purpose of reducing the thickness, and thus the surface of the light-transmitting sealing portion 80 is flat and The translucent sealing part 80 is filled so that the flat surface substantially coincides with the upper surface of the recess 203 of the package 201.
[0003]
FIG. 6 is a cross-sectional view showing the configuration of the light emitting diode of the second conventional example. The light emitting diode of the second conventional example is packaged with the surface of the translucent sealing portion 80 having a spherical convex shape. Unlike the first conventional example, the other part is configured in the same manner as the first conventional example in that it protrudes from the upper surface of 201. In the second conventional example, the curvature of the outer surface of the spherical surface of the translucent sealing portion 80 is set so that the focal point thereof coincides with the light emitting point of the light emitting element 4 or is located above the light emitting point. The spherical surface is formed with a predetermined spherical surface using a casting case (mold) when the translucent sealing portion is formed of resin.
[0004]
[Problems to be solved by the invention]
However, although the light-emitting diode of the first conventional example can be thinned, the light generated by the light emitted from the light-emitting element on the surface of the translucent resin is efficiently emitted to the outside. There was a problem that it was not possible.
Further, the light emitting diode of the first conventional example has a problem that the light condensing property is poor because the surface of the translucent resin is made flat.
In addition, the light emitting diode of the second conventional example has a problem that although it is possible to improve the output efficiency to the outside by making the surface of the translucent sealing portion 80 convex, it cannot be thinned.
As described above, in the conventional light emitting diode, since the reduction in thickness and the increase in output are contradictory, there is no light emitting diode that can satisfy both of them.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode that can be thinned, has good light collecting properties, and can efficiently output emitted light to the outside.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a light-emitting diode according to the present invention includes a package having a recess, a light-emitting element provided on the bottom surface of the recess, and a spherical convex surface covering the light-emitting element. A light-emitting diode having a light-transmitting sealing portion formed between the focal point of the spherical convex surface of the light-transmitting sealing portion and the surface of the light-transmitting sealing portion; light outer peripheral end portion of the convex surface of the spherical to be lower than the emission surface of the light emitting device and the side surface of the upper Symbol recess emitted through the translucent sealing portion is reflected forward provided It is inclined to, and
The translucent sealing portion is formed such that an end of the spherical convex surface coincides with a boundary between an inclined side surface of the concave portion and a bottom surface of the concave portion .
By comprising in this way, the light emitting diode of the present invention can emit the light emitted by the light emitting element to the outside without reflecting through the spherical concave surface of the translucent sealing portion, In addition, the light incident on the side surface of the recess can be reflected by the surface and emitted to the outside.
Further, since the light emitting element is provided between the focal point of the convex lens constituted by the light transmitting sealing portion and the surface of the light transmitting sealing portion, the light emitting element can be thinned.
[0007]
In the light-emitting diode according to the present invention, it is preferable that the translucent sealing portion is formed so that the end of the spherical convex surface substantially coincides with the boundary between the inclined side surface of the concave portion and the bottom surface of the concave portion. . In this way, the light emitted downward from the horizontal direction from the light emitting element can be reflected by the inclined surface and emitted to the outside, and the external output efficiency can be further improved.
[0008]
Further, in the light emitting diode according to the present invention, it is preferable that the translucent sealing portion is formed so that the vertex of the convex surface of the translucent sealing portion is located below the upper surface of the package. Can further reduce the thickness.
[0009]
In the light-emitting diode according to the present invention, the package can be configured using one selected from the group consisting of a liquid crystal polymer resin, a PBT (polybutylene terephthalate) resin, and ceramics.
[0010]
Furthermore, in the light emitting diode according to the present invention, the light emitting element is preferably flip-chip mounted.
[0011]
Furthermore, in the light emitting diode according to the present invention, the light-transmitting sealing portion can be formed of silicon resin in order to relieve stress on the light emitting element.
[0012]
In the light emitting diode according to the present invention, a light emitting diode including a nitride semiconductor can be used as the light emitting element.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a light emitting diode according to an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 2, the light-emitting diode of the present embodiment is a light-emitting diode in which a light-emitting element 4 provided in a recess 3 formed in a package 1 is sealed with a light-transmitting sealing portion 8. Each has the following characteristics.
(1) The translucent sealing portion 8 was formed so that the surface thereof had a spherical convex shape having a focal point, and the apex of the convex surface was lower than the upper surface of the package 1.
(2) The light emitting element 4 was provided so as to be positioned between the focal point of the convex lens constituted by the light transmitting sealing portion and the surface of the light transmitting sealing portion.
(3) The side surface 3a of the recess 3 is formed so as to be inclined so that light emitted through the translucent resin is reflected forward.
[0014]
That is, in the light emitting diode of the present embodiment, (1) the translucent sealing portion 8 has a convex surface and the top of the convex surface is lower than the top surface of the package 1 (2 ) The light emitting element 4 is provided so as to be positioned between the focal point of the translucent sealing portion 8 and the surface of the translucent sealing portion 8 and so that the translucent sealing portion 8 is accommodated in the recess 3. (3) By tilting the side surface 3a of the recess 3, the light emitted through the translucent sealing portion 8 is reflected by the tilted side surface 3c and can be extracted to the outside. Both thickness reduction and light extraction efficiency are satisfied.
[0015]
Hereinafter, the light-emitting element of the present embodiment will be described in detail with reference to FIGS.
1 is a plan view of the light emitting diode according to the present embodiment as viewed from above, FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. 1, and FIG. 3 is BB ′ in FIG. It is sectional drawing about a line.
Package 1.
The package 1 is made of an insulating member such as a liquid crystal polymer, PBT (polybutylene terephthalate) resin, or ceramics, and a recess 3 is formed in a part thereof. In the above-described insulating member used in this package, when the liquid crystal polymer and the PBT resin are compared, the heat resistance is superior to the liquid crystal polymer, and the light reflectivity is superior to the PBT resin. In addition, when these resins and ceramics are compared, ceramics is superior in heat dissipation, but the degree of freedom of shape processing and cost is superior in resins. In the present embodiment, a suitable material can be selected and used from each insulating member according to the usage environment of the light emitting diode.
[0016]
Further, as shown in FIGS. 1 and 2, a part of the side surface of the recess 3 formed in the package 1 is formed so that the recess extends toward the upper side of the light emitting diode and is colored white or silver white. The reflectance with respect to the light emitted from is increased.
Furthermore, in this embodiment, the recesses are formed so as to be long in the direction in which the external connection electrodes are provided, and to be short in the other direction orthogonal to the one direction. In addition, inclined surfaces are formed by inclining surfaces on both sides in one direction.
As a result, while securing a sufficient gap between the external connection electrodes 2a and 2b, the width in the orthogonal direction can be narrowed, and the light emitting diode element can be further downsized.
[0017]
Further, the package 1 includes electrodes 2a and 2b provided so as to be exposed at the bottom surface of the recess 3 and partly exposed at the outer surface, and the electrodes 2a and 2b exposed at the bottom surface of the recess 3 are respectively light emitting elements. The positive and negative electrodes are connected.
The electrodes 2a and 2b can be formed by, for example, integrally forming an electrode plate made of a metal plate such as phosphor bronze in a package using a resin, and formed as a metallized layer of W or Ni in a package using a ceramic. be able to.
[0018]
Light emitting element 4.
In the present embodiment, the light emitting element 4 is a light emitting element in which both the positive electrode 5a and the negative electrode 5b are formed on one main surface, and the light emitting element 4 includes the positive electrode 5a and the negative electrode 5b, respectively. The electrode is fixed to the package 1 by connecting the electrodes 2a and 2b exposed on the bottom surface of the package 1 with a conductive adhesive such as solder.
[0019]
Translucent sealing part8.
The translucent sealing portion 8 is formed of a translucent resin such as silicone, epoxy, modified acrylic, unsaturated polyester, or an inorganic material such as glass, and has a function of protecting the light emitting element 4 and is emitted from the light emitting element 4. It is a sealing portion that also has the function of a lens that collects the light to be collected, and is formed as follows.
That is, the translucent sealing portion 8 has a spherical convex shape whose outer surface (upper surface) is focused at one point, and the apex of the convex outer surface is lower than the upper surface of the package 1. To form. Further, the curvature of the outer surface of the translucent sealing portion 8 is set to be relatively large so that the focal point formed by the outer surface is formed below the light emitting element 4. Thus, the light emitting element 4 can be positioned between the focal point of the convex lens formed by the spherical surface of the translucent sealing portion 8 and the outer surface of the translucent sealing portion 8.
[0020]
Further, the translucent sealing portion 8 is formed so that the outer peripheral end of the outer surface of the translucent sealing portion 8 substantially coincides with the outer periphery of the bottom surface of the recess 3.
Furthermore, the translucent sealing part 8 is formed so that the center of the light emitting part of the light emitting element 4 is located on the central axis of the outer surface.
When the resin is used, the translucent sealing portion 8 having the above-described shape can be easily manufactured as follows.
[0021]
First, a resin thin film that repels a sealing resin such as fluorine or silicone is formed on the side surface 3a of the recess 3 of the package 1 by coating or vapor deposition.
Next, a predetermined amount of a sealing resin whose viscosity is set to a predetermined value is dropped into the recess 3.
Using such a method, when the thickness of the resin thin film repelling the sealing resin and the components are appropriately selected according to the wettability of the sealing resin and the sealing resin is dropped, the sealing resin is sealed by the surface tension of the sealing resin. The stop resin substantially covers the bottom surface of the concave portion 3 and does not crawl up on the side wall, and the translucent sealing portion 8 having a desired convex outer surface can be formed.
[0022]
Thus, in the present embodiment, since the radius of curvature of the outer surface of the light-transmitting sealing portion 8 is relatively large and thin, the light-transmitting sealing portion 8 is potted using a light-transmitting resin (simply It can be formed with high dimensional accuracy by dropping the resin. That is, in the present embodiment, the outer surface of the translucent sealing portion 8 can be a spherical surface having a desired radius of curvature by setting the amount of resin dropped using the surface tension of the resin to a predetermined amount. Therefore, the manufacturing cost of this process can be reduced as compared with the method of using the casting case of the second conventional example to obtain a predetermined spherical surface.
Of course, in the present invention, a female shape of a casting case which is a general sealing method may be used so that the surface shape of the translucent sealing portion 8 becomes a predetermined shape.
In addition, although materials, such as resin for forming the translucent sealing part 8, have an isotropic refractive index, this invention is not specifically limited to this.
[0023]
In the light emitting diode of the embodiment configured as described above, since the surface of the light-transmitting sealing portion 8 is a spherical convex surface, the light emitted from the light-emitting element 4 is transmitted through the light-transmitting sealing portion 8. The light is incident on the surface at a relatively small incident angle and is emitted outside the light emitting diode without being totally reflected. Therefore, as compared with the first conventional example in which the surface of the light-transmitting sealing portion is flattened, the ratio of light that is returned again into the light-transmitting sealing portion by the critical angle reflection on the surface of the light-transmitting sealing portion The amount of light emitted to the outside can be increased.
[0024]
Further, in the light emitting diode of the present embodiment, the translucent sealing portion 8 is formed so that the outer peripheral end portion of the outer surface of the translucent sealing portion 8 substantially coincides with the outer periphery of the bottom surface of the concave portion 3. The outer peripheral end portion of the outer surface of the translucent sealing portion 8 is made lower than the upper surface which is the light emission output surface of the light emitting element 4. Thus, in the present embodiment, light emitted downward from the light emitting element 4 can also be effectively extracted upward.
[0025]
That is, as shown in FIG. 4, for example, the light L <b> 1 emitted from the end of the light emitting element 4 is pointed on the point 101 on the outer surface of the translucent sealing portion 8 with respect to the normal 105 at the point 101. Incident light is incident at an incident angle θ1. The light L1 incident on the point 101 is emitted as the transmitted light L2 to the outside of the translucent sealing portion 8 at an angle θ2 with respect to the normal line 105, reflected by the side surface 3a of the recess 3 of the package 1, and emitted light. L is emitted above the light emitting diode.
[0026]
Here, the emission angle θ2 is expressed by the following equation (1), where n1 is the refractive index of the light-transmitting sealing portion 8 and n2 is the refractive index of the outside (space).
θ2 = sin −1 (n2 / n1 · sin θ1) (1)
When the angle θ3 and the angle θ2 formed by the normal 105 and the horizontal direction are expressed by the following equation (2), the light output from the translucent sealing portion 8 is always horizontal. It will face in the lower direction.
θ2 ≧ θ3 (2)
Therefore, the light emitted from the light-emitting element so as to satisfy the following formula (3) obtained by substituting the formula (1) into the formula (2) must be directed downward from the horizontal. If there is no inclined reflective side surface, it will not be emitted forward.
sin −1 (n2 / n1 · sin θ1) ≧ θ3 (3)
[0027]
However, in the present embodiment, the light-transmitting sealing portion 8 is formed so that the outer peripheral end portion of the outer surface of the light-transmitting sealing portion 8 substantially coincides with the outer periphery of the bottom surface of the recess 3. Since the outer peripheral end portion of the outer surface of the translucent sealing portion 8 is lower than the upper surface which is the light emission output surface, in the present embodiment, the light emitted downward from the light emitting element 4 is also It can be effectively removed upward. As a result, the light emitting diode of the present embodiment can emit light emitted from the light emitting element more efficiently than the second conventional example.
In FIG. 4, the point denoted by reference numeral 103 is a focal point, and the one-dot chain line denoted by reference numeral 104 is a transparent line connecting the focal point and the vertex of the outer surface of the translucent sealing portion. It is an axis | shaft of a light sealing part.
[0028]
Moreover, the light emitting diode of the embodiment configured as described above has the following excellent features in addition to being able to efficiently emit the light emitted from the light emitting element 4 as described above.
First, since the translucent sealing portion 8 is formed so as not to protrude from the recess 3 of the package 1, it can be made thinner than the second conventional example.
Secondly, since the outer surface which is the convex surface of the light-transmitting sealing portion 8 is formed so as to be lower than the upper surface of the package 1, when the light emitting diode of the present embodiment is mounted with a mounter or the like, the nozzle is used. Even if it adsorb | sucks, a nozzle does not contact a sealing resin directly. Therefore, it is not necessary to increase the hardness of the surface of the sealing resin after curing, and a flexible silicon resin or the like can be employed as the sealing resin. When such a flexible sealing resin is used, the internal stress can be made extremely small, and a defect that the stress due to the sealing resin acts on the joint between the light emitting portion electrode and the package electrode and is disconnected can be prevented.
[0029]
In the present embodiment, an example in which the electrode surface of the light emitting element 4 is mounted on the lower side, that is, facing the electrodes 2a and 2b of the package 1, and connected without using wires, so-called flip chip connection is used. Indicated. Thus, by combining the configuration of the present invention and the flip chip connection, the connection wire can be eliminated, the depth of the recess 3 of the package 1 can be reduced, and the light emitting diode can be made thinner. Note that the present invention is not limited to the flip chip bonding light emitting diode shown in the embodiment, and even when a connection using a wire is used, compared with the conventional example using a wire connection, a high output / thinness Needless to say, a light emitting element can be obtained.
Furthermore, in the embodiment, an example in which one light emitting element is used is shown as an example, but the present invention can also be applied to a case in which a plurality of light emitting elements are housed in a recess. The same effect as that of the embodiment can be obtained.
In addition, a full-color surface-mounted multicolor light-emitting diode can be realized by mounting a plurality of light-emitting diode chips in the recess.
[0030]
【The invention's effect】
As described above in detail, the light-emitting diode according to the present invention includes a light-emitting element provided in a concave portion of a package, and a translucent sealing formed so as to cover the concave portion and have a spherical convex surface. And the light emitting element is provided between the focal point of the convex lens constituted by the light-transmitting sealing portion and the surface of the light-transmitting sealing portion, and the side surface of the concave portion is the light-transmitting property. Since the light emitted through the sealing portion is inclined so as to reflect forward, the light emitted from the light emitting element is reflected through the spherical concave surface of the translucent sealing portion. The light incident on the side surface of the recess can be reflected by the surface and emitted to the outside. Further, since the light emitting element is provided between the focal point of the convex lens constituted by the light transmitting sealing portion and the surface of the light transmitting sealing portion, the light emitting element can be thinned.
Therefore, according to the present invention, it is possible to provide a light-emitting diode that can be reduced in thickness, has good light collecting properties, and can efficiently output emitted light to the outside.
[Brief description of the drawings]
FIG. 1 is a plan view of a light emitting diode according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AA ′ in FIG.
FIG. 3 is a cross-sectional view taken along line BB ′ of FIG.
FIG. 4 is a schematic diagram for explaining a path of light output from the light emitting element in the light emitting diode of the embodiment.
FIG. 5 is a cross-sectional view of a light emitting diode of a first conventional example.
FIG. 6 is a cross-sectional view of a light emitting diode of a second conventional example.
[Explanation of symbols]
1 ... Package,
2a, 2b ... electrodes,
3 ... recess,
3a: side surface of the recess,
4 ... Light emitting element,
5a ... Positive electrode,
5b ... negative electrode,
8: Translucent sealing part.

Claims (6)

凹部を有するパッケージと、該凹部の底面に設けられた発光素子と、該発光素子を覆いかつ表面が球状の凸面になるように形成された透光性封止部とを備えた発光ダイオードであって、
上記発光素子を、上記透光性封止部の球状の凸面の焦点と上記透光性封止部の表面との間に設けて上記球状の凸面の外周端部が上記発光素子の発光面より低くなるようにし、
上記凹部の側面を上記透光性封止部を介して出射される光が前方に反射されるように傾斜させ、かつ
上記球状の凸面の端が上記凹部の傾斜した側面と上記凹部の底面との境界に一致するように上記透光性封止部を形成したことを特徴とする発光ダイオード。A light emitting diode comprising a package having a recess, a light emitting element provided on the bottom surface of the recess, and a translucent sealing portion that covers the light emitting element and has a spherical convex surface. And
The light-emitting element is provided between the focal point of the spherical convex surface of the light-transmitting sealing portion and the surface of the light-transmitting sealing portion, and the outer peripheral end of the spherical convex surface is more than the light-emitting surface of the light-emitting element. To lower,
The sides of the upper Symbol recess is inclined so that light is emitted through the translucent sealing portion is reflected forward, and
The light-emitting diode, wherein the light- transmitting sealing portion is formed so that an end of the spherical convex surface coincides with a boundary between an inclined side surface of the concave portion and a bottom surface of the concave portion . 上記透光性封止部の凸面の頂点が上記パッケージの上面より下に位置するように上記透光性封止部が形成されている請求項１記載の発光ダイオード。  The light-emitting diode according to claim 1, wherein the light-transmitting sealing portion is formed such that a vertex of a convex surface of the light-transmitting sealing portion is positioned below the upper surface of the package. 上記パッケージが液晶ポリマー樹脂、PBT（ポリブチレンテレフタレート）樹脂及びセラミックスからなる群から選択される１つからなる請求項１又は２記載の発光ダイオード。  3. The light emitting diode according to claim 1, wherein the package is made of one selected from the group consisting of a liquid crystal polymer resin, a PBT (polybutylene terephthalate) resin, and ceramics. 上記発光素子がフリップチップ実装されている請求項１〜３のうちのいずれか１つに記載の発光ダイオード。The light emitting diode according to any one of claims 1 to 3 , wherein the light emitting element is flip-chip mounted. 上記透光性封止部はシリコン樹脂からなる請求項１〜４のうちのいずれか１項に記載の発光ダイオード。The transmissive sealing portion light-emitting diode according to any one of claims 1-4 comprising a silicone resin. 上記発光素子は窒化物半導体を含んで成る請求項１〜５のうちのいずれか１項に記載の発光ダイオード。The light emitting diode according to any one of claims 1 to 5 , wherein the light emitting element comprises a nitride semiconductor.
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