JPH07263754A - Led element and manufacture of it - Google Patents
Led element and manufacture of itInfo
- Publication number
- JPH07263754A JPH07263754A JP7990994A JP7990994A JPH07263754A JP H07263754 A JPH07263754 A JP H07263754A JP 7990994 A JP7990994 A JP 7990994A JP 7990994 A JP7990994 A JP 7990994A JP H07263754 A JPH07263754 A JP H07263754A
- Authority
- JP
- Japan
- Prior art keywords
- led
- electrode
- led chip
- chip
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は複数のＬＥＤチップを１
枚の支持部材に固定しているＬＥＤ素子とその製造方法
に関する。BACKGROUND OF THE INVENTION The present invention includes a plurality of LED chips.
The present invention relates to an LED element fixed to a single support member and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】同一面に一対の電極のあるＬＥＤチップ
を支持部材に固定するＬＥＤが、特開平４−１０６７１
号公報に記載されている。この公報に記載されるＬＥＤ
を図１に示す。このＬＥＤは、ＬＥＤチップ１の背面に
電極を設けるので、発光面に電極とリード線とを設ける
必要がない。このため、ＬＥＤチップの電極やリード線
が発光を遮ることがなく、ＬＥＤチップの発光を有効に
利用して明るくできる特長がある。この構造のＬＥＤ
は、同一面に設けた電極に、互いに絶縁されるリード線
を接続する構造をしている。図１のＬＥＤは、ＬＥＤチ
ップ１の２つの電極２を互いに絶縁して接続するため
に、支持部材を２分割して電極部材３としている。電極
部材３は金属製で、上端をＬＥＤチップ１の下面の電極
２に接続している。２つの電極部材３は、互いに絶縁す
る必要がある。接触するとリード線３がショートするか
らである。このため２つの電極部材３は、多少隙間がで
きるように配設している。2. Description of the Related Art An LED in which an LED chip having a pair of electrodes on the same surface is fixed to a supporting member is disclosed in JP-A-4-10671.
It is described in Japanese Patent Publication No. LED described in this publication
Is shown in FIG. Since this LED has electrodes on the back surface of the LED chip 1, it is not necessary to provide electrodes and lead wires on the light emitting surface. Therefore, there is a feature that the light emission of the LED chip can be effectively utilized and the light can be made bright without the light emission being blocked by the electrode or the lead wire of the LED chip. LED of this structure
Has a structure in which lead wires insulated from each other are connected to electrodes provided on the same surface. In the LED of FIG. 1, in order to insulate and connect the two electrodes 2 of the LED chip 1, the support member is divided into two to form an electrode member 3. The electrode member 3 is made of metal, and its upper end is connected to the electrode 2 on the lower surface of the LED chip 1. The two electrode members 3 need to be insulated from each other. This is because the lead wire 3 is short-circuited when it makes contact. For this reason, the two electrode members 3 are arranged so as to form a gap.
【０００３】さらに、特開平５−２１８４６号公報に
も、同一面に一対の電極のあるＬＥＤチップを支持部材
に固定するＬＥＤが記載される。この公報に記載される
ＬＥＤを図２に示す。このＬＥＤは、ＬＥＤチップ１の
下面に設けた一対の電極２を導電性ろう材４を介して電
極部材３に接続している。電極部材３は金属製で、ショ
ートしないように離して配設されている。Further, Japanese Laid-Open Patent Publication No. 5-21846 describes an LED in which an LED chip having a pair of electrodes on the same surface is fixed to a supporting member. The LED described in this publication is shown in FIG. In this LED, a pair of electrodes 2 provided on the lower surface of an LED chip 1 is connected to an electrode member 3 via a conductive brazing material 4. The electrode members 3 are made of metal and are arranged apart from each other so as not to cause a short circuit.
【０００４】[0004]
【発明が解決しようとする課題】図１と図２に示すよう
に、金属製の電極部材３にＬＥＤチップ１の電極２を接
続するＬＥＤは、能率よく多量生産するのが難しい。２
本の電極部材３を一定の間隔で正確に離して支持し、こ
れにＬＥＤチップ１を１個づつ接続して製造するからで
ある。さらに、２分割した電極部材３にＬＥＤチップ１
を固定しているＬＥＤは、小さいＬＥＤチップ１の電極
２を正確に電極部材３に接続するのが難しい。分離され
た２つの電極部材３に１個のＬＥＤチップ１を接続する
からである。２つの電極部材３の相対位置がずれると、
ＬＥＤチップ１の電極２は正確に接続できなくなる。As shown in FIGS. 1 and 2, it is difficult to efficiently mass-produce an LED in which an electrode 2 of an LED chip 1 is connected to an electrode member 3 made of metal. Two
This is because the electrode members 3 of the book are supported by being separated from each other at regular intervals and the LED chips 1 are connected one by one to the manufacture. Furthermore, the LED chip 1 is attached to the electrode member 3 divided into two parts
It is difficult to accurately connect the electrode 2 of the small LED chip 1 to the electrode member 3 of the LED fixing the LED. This is because one LED chip 1 is connected to the two separated electrode members 3. When the relative positions of the two electrode members 3 are displaced,
The electrodes 2 of the LED chip 1 cannot be connected accurately.
【０００５】さらに、図１と図２に示す構造のＬＥＤ
は、ＬＥＤチップ１を小さくすることが難しい。小さい
ＬＥＤチップ１は、電極２を正確に電極部材３に接続す
るのが難しいからである。小さいＬＥＤチップ１を電極
部材３に接続するために、２分割した電極部材３を、相
当に接近させる必要がある。２つの電極部材３を著しく
接近させると、電極部材３が接触してショートしやすく
なる。このため、電極部材３の間隔を著しく狭くするこ
とが難しく、ＬＥＤチップ１を小さくすることが難し
い。大きなＬＥＤチップ１は、１枚のウエハーからの製
造個数が少なくなって、部品コストを高くする。Further, an LED having the structure shown in FIGS. 1 and 2.
Is difficult to make the LED chip 1 small. This is because it is difficult for the small LED chip 1 to accurately connect the electrode 2 to the electrode member 3. In order to connect the small LED chip 1 to the electrode member 3, the two-divided electrode member 3 needs to be considerably close to each other. If the two electrode members 3 are extremely close to each other, the electrode members 3 come into contact with each other and a short circuit easily occurs. Therefore, it is difficult to make the interval between the electrode members 3 extremely small, and it is difficult to make the LED chip 1 small. The large LED chip 1 reduces the number of products manufactured from one wafer, which increases the component cost.
【０００６】本発明者は、多数のＬＥＤチップを同時に
支持部材に固定するために、図３に示す構造のＬＥＤ素
子を試作した。このＬＥＤ素子は、支持部材５をアルミ
ナ等の絶縁部材６で構成している。絶縁部材６である支
持部材５には、互いに離して一定の間隔で金属製の電極
端子７を固定している。この構造のＬＥＤ素子は、一対
の電極端子７を支持部材５に固定しているので、２つの
電極端子７の相対位置を極めて高精度に製造できる。ま
た、２つの電極端子７が互いに相対的に移動することも
ないので、接続したＬＥＤチップ１の電極２から離れる
ことを防止できる特長がある。The present inventor prototyped an LED device having a structure shown in FIG. 3 in order to simultaneously fix a large number of LED chips to a supporting member. In this LED element, the supporting member 5 is composed of an insulating member 6 such as alumina. The metal electrode terminals 7 are fixed to the support member 5, which is the insulating member 6, at a constant distance from each other. In the LED element having this structure, the pair of electrode terminals 7 are fixed to the support member 5, so that the relative positions of the two electrode terminals 7 can be manufactured with extremely high accuracy. Further, since the two electrode terminals 7 do not move relative to each other, there is a feature that it can be prevented from separating from the electrode 2 of the connected LED chip 1.
【０００７】この構造のＬＥＤ素子は、ＬＥＤチップ１
を支持部材５の定位置に一個づつ固定するのには理想的
な構造であるが、多数のＬＥＤチップ１を支持部材５に
固定するとき、全てのＬＥＤチップ１が位置ずれしない
ように固定するのは難しい。とくに、多数のＬＥＤチッ
プ１を支持部材５に押し付けて固定するときに、位置ず
れしやすい欠点がある。また、多数のＬＥＤチップを正
確に配設して、支持部材に固定するために、能率よく多
量生産するのが難しい欠点もある。The LED element having this structure is the LED chip 1
It is an ideal structure to fix the LED chips 1 at fixed positions one by one, but when fixing a large number of LED chips 1 to the support member 5, all the LED chips 1 are fixed so as not to be displaced. Is difficult. In particular, when a large number of LED chips 1 are pressed against the support member 5 to be fixed, there is a drawback that the LED chips 1 are easily displaced. In addition, since a large number of LED chips are accurately arranged and fixed to a supporting member, it is difficult to efficiently mass-produce them.
【０００８】支持部材５に固定するＬＥＤチップ１の位
置がずれると、ＬＥＤチップ１の電極２を正確に電極端
子７に接続できなくなる。また、ＬＥＤチップ１の電極
２を電極端子７に接続する導電性ろう材４がブリッジを
起こして電極端子７をショートする弊害も発生する。If the position of the LED chip 1 fixed to the supporting member 5 is displaced, the electrode 2 of the LED chip 1 cannot be accurately connected to the electrode terminal 7. In addition, the conductive brazing material 4 that connects the electrode 2 of the LED chip 1 to the electrode terminal 7 may cause a bridge to short-circuit the electrode terminal 7.
【０００９】導電性ろう材のショートを防止するために
は、電極端子の隙間を広くすればよいが、この間隔を広
くするとＬＥＤチップの電極間隔も広くする必要があ
り、ＬＥＤチップを小型化できなくなる。このため、こ
の構造のＬＥＤ素子は、小さいＬＥＤチップを多数に支
持部材に固定して能率よく安価に多量生産できなくなる
欠点がある。In order to prevent the conductive brazing material from short-circuiting, the gap between the electrode terminals may be widened. However, if this gap is widened, it is necessary to widen the electrode gap between the LED chips, and the LED chip can be miniaturized. Disappear. For this reason, the LED element having this structure has a drawback that a large number of small LED chips are fixed to the support member and efficient mass production cannot be performed at low cost.
【００１０】本発明は、さらにこの欠点を解決すること
を目的に開発されたもので、本発明の重要な目的は、多
数の小さいＬＥＤチップを正確に支持部材に固定して、
電極端子のショートを有効に防止し、能率よく安価に多
量生産できるＬＥＤ素子とその製造方法とを提供するに
ある。The present invention was developed with the object of resolving this drawback. An important object of the present invention is to fix a large number of small LED chips to a support member accurately.
It is an object of the present invention to provide an LED element capable of effectively preventing a short circuit of an electrode terminal and efficiently mass-producing it at low cost, and a manufacturing method thereof.
【００１１】[0011]
【課題を解決するための手段】本発明のＬＥＤ素子は、
前述の目的を達成するために下記の構成を備える。ＬＥ
Ｄ素子は、同一面に一対の電極２を有するＬＥＤチップ
１と、複数個のＬＥＤチップ１を一定の配列で固定して
いる支持部材５とを備える。支持部材５は、絶縁部材６
とこの絶縁部材６に互いに接近して固定されている一対
の電極端子７とを有する。電極端子７は導電性ろう材４
を介してＬＥＤチップ１の電極２に接続されている。さ
らに支持部材５は、それぞれのＬＥＤチップ１を嵌入し
て所定の位置に配列して位置決めする複数の位置決嵌入
部８を備えている。この位置決嵌入部８の底部に電極端
子７を配設している。ＬＥＤチップ１が位置決嵌入部８
に嵌入され、ＬＥＤチップ１の電極２が導電性ろう材４
を介して電極端子７に接続されている。The LED device of the present invention comprises:
In order to achieve the above-mentioned object, the following configurations are provided. LE
The D element includes an LED chip 1 having a pair of electrodes 2 on the same surface, and a support member 5 that fixes the plurality of LED chips 1 in a fixed array. The support member 5 is an insulating member 6
And a pair of electrode terminals 7 fixed to the insulating member 6 in close proximity to each other. The electrode terminal 7 is a conductive brazing material 4
It is connected to the electrode 2 of the LED chip 1 via. Further, the supporting member 5 is provided with a plurality of positioning fitting portions 8 into which the respective LED chips 1 are fitted and arranged at predetermined positions for positioning. The electrode terminal 7 is arranged at the bottom of the position fitting portion 8. The LED chip 1 is the positioning fitting portion 8
And the electrode 2 of the LED chip 1 is inserted into the conductive brazing material 4
It is connected to the electrode terminal 7 via.
【００１２】さらにまた、本発明のＬＥＤ素子は、好ま
しくは、ＬＥＤチップ１を、外形が非円形である非円形
ＬＥＤチップ１とし、このＬＥＤチップ１を嵌入する支
持部材５の位置決嵌入部８も、内形を非円形とする非円
形位置決嵌入部８とするFurthermore, in the LED element of the present invention, preferably, the LED chip 1 is a non-circular LED chip 1 having a non-circular outer shape, and the positioning fitting portion 8 of the supporting member 5 into which the LED chip 1 is fitted. Also has a non-circular positioning fitting portion 8 whose inner shape is non-circular.
【００１３】さらに、本発明の製造方法は、複数のＬＥ
Ｄチップ１を嵌入して位置決めする支持部材５の位置決
嵌入部８にＬＥＤチップ１を嵌入して位置決めし、位置
決めされた複数のＬＥＤチップ１をゴム状弾性部材９で
押圧し、ＬＥＤチップ１の電極２を導電性ろう材４を介
して支持部材５に設けられた電極端子７に接続してＬＥ
Ｄ素子を製造する。Further, the manufacturing method of the present invention is provided with a plurality of LEs.
The LED chip 1 is fitted into the positioning fitting portion 8 of the support member 5 for fitting and positioning the D chip 1 and positioned, and the plurality of positioned LED chips 1 are pressed by the rubber-like elastic member 9, so that the LED chip 1 The LE electrode 2 is connected to the electrode terminal 7 provided on the supporting member 5 via the conductive brazing material 4 and LE.
A D element is manufactured.
【００１４】[0014]
【作用】本発明のＬＥＤ素子は、その好ましい実施例を
示す図４の断面図に示すように、支持部材５に複数のＬ
ＥＤチップ１を固定している。支持部材５は絶縁部材６
に電極端子７を固定したもので、一対の電極端子７が互
いに接近して絶縁部材６に固定されている。多数のＬＥ
Ｄチップ１は、一定の配列で規則的に並べられて支持部
材５に固定されている。支持部材５は、ＬＥＤチップ１
を正確な位置に配列するために、ＬＥＤチップ１を嵌入
する位置決嵌入部８を設けている。位置決嵌入部８は、
ここにＬＥＤチップ１を嵌入できる形状と大きさをして
いる。位置決嵌入部８に嵌入されるＬＥＤチップ１は、
電極２を支持部材５の電極端子７に位置させている。し
たがって、図４に示すＬＥＤ素子は、それぞれの位置決
嵌入部８に多数のＬＥＤチップ１を嵌入し、この状態で
ＬＥＤチップ１を支持部材５に押し付けて、全てのＬＥ
Ｄチップ１の電極２を支持部材５の電極端子７に確実に
接続して製造できる。In the LED device of the present invention, as shown in the sectional view of FIG.
The ED chip 1 is fixed. Support member 5 is insulating member 6
A pair of electrode terminals 7 are fixed to the insulating member 6 by approaching each other. Many LEs
The D chips 1 are regularly arranged in a fixed array and fixed to the support member 5. The support member 5 is the LED chip 1
In order to arrange the LED chips at the correct positions, the position fitting portion 8 into which the LED chips 1 are fitted is provided. The position fitting section 8 is
The LED chip 1 has such a shape and size that it can be fitted therein. The LED chip 1 fitted in the positioning fitting portion 8 is
The electrode 2 is located on the electrode terminal 7 of the support member 5. Therefore, in the LED element shown in FIG. 4, a large number of LED chips 1 are fitted into the respective positioning fitting portions 8, and in this state, the LED chips 1 are pressed against the supporting member 5 so that all the LE chips are mounted.
The electrode 2 of the D chip 1 can be reliably connected to the electrode terminal 7 of the supporting member 5 for manufacture.
【００１５】多数のＬＥＤチップ１を支持部材５の位置
決嵌入部８に嵌入して、電極２を電極端子７に接続する
とき、複数のＬＥＤチップ１をゴム状弾性部材９で押圧
することができる。ゴム状弾性部材９で多数のＬＥＤチ
ップ１を押圧するとき、ＬＥＤチップ１は位置決嵌入部
８に嵌入されて位置ずれが防止される。したがって、本
発明のＬＥＤ素子は、ゴム状弾性部材９で多数のＬＥＤ
チップ１を押圧してＬＥＤチップ１を支持部材５に連結
できる。このとき、多数のＬＥＤチップ１は正確な位置
にあって、規則的に配列される。このため、本発明のＬ
ＥＤ素子は、小さいＬＥＤチップ１を多数に装備するも
のを、簡単かつ容易に、しかも能率よく高い歩留で多量
生産できる特長がある。When a large number of LED chips 1 are fitted into the positioning fitting portion 8 of the supporting member 5 and the electrodes 2 are connected to the electrode terminals 7, the plurality of LED chips 1 can be pressed by the rubber-like elastic member 9. it can. When a large number of LED chips 1 are pressed by the rubber-like elastic member 9, the LED chips 1 are fitted into the positioning fitting portion 8 to prevent displacement. Therefore, the LED element of the present invention has the rubber-like elastic member 9 for a large number of LEDs.
The LED chip 1 can be connected to the support member 5 by pressing the chip 1. At this time, a large number of LED chips 1 are located at correct positions and regularly arranged. Therefore, L of the present invention
The ED element has a feature that a large number of small LED chips 1 can be easily and easily mass-produced with high yield.
【００１６】このようにして製造されたＬＥＤ素子は、
１枚の支持部材５に多数のＬＥＤチップ１を固定してい
る。また、図４の矢印で示すようにＬＥＤチップ１の間
で切断して、多数のＬＥＤに分離することができる。１
枚の支持部材５に多数のＬＥＤチップ１を固定したＬＥ
Ｄ素子を切断して多数のＬＥＤを製造する方法は、一個
づつＬＥＤを製造する従来の方法に比較して極めて能率
よくＬＥＤを製造できる。The LED device manufactured in this way is
A large number of LED chips 1 are fixed to one support member 5. Further, as shown by the arrow in FIG. 4, the LED chips 1 can be cut into a plurality of LEDs to be separated. 1
LE in which a large number of LED chips 1 are fixed to a single supporting member 5
The method of manufacturing a large number of LEDs by cutting the D element can manufacture the LEDs extremely efficiently as compared with the conventional method of manufacturing LEDs one by one.
【００１７】図４に示す構造のＬＥＤ素子は、下記の工
程でＬＥＤチップ１を支持部材５に固定する。 (1) ＬＥＤチップ１の電極２と、支持部材５の電極端
子７に低融点の金属である導電性ろう材４を付着させ
る。 (2) 支持部材５に規則的に設けられた多数の位置決嵌
入部８に、ＬＥＤチップ１を嵌入する。 (3) 位置決嵌入部８に嵌入した多数のＬＥＤチップ１
の表面をゴム状弾性部材９で押圧する。押圧されるＬＥ
Ｄチップ１は、位置決嵌入部８に嵌入されているので、
位置ずれすることがない。 (4) 多数のＬＥＤチップ１を押圧する状態で加熱し、
導電性ろう材４を溶融してＬＥＤチップ１の電極２を電
極端子７に接続する。In the LED element having the structure shown in FIG. 4, the LED chip 1 is fixed to the supporting member 5 in the following steps. (1) A conductive brazing material 4 which is a low melting point metal is attached to the electrode 2 of the LED chip 1 and the electrode terminal 7 of the supporting member 5. (2) The LED chips 1 are fitted into a large number of positioning fitting portions 8 which are regularly provided on the support member 5. (3) A large number of LED chips 1 fitted in the positioning fitting portion 8
The surface of is pressed by the rubber-like elastic member 9. LE to be pressed
Since the D chip 1 is fitted in the positioning fitting portion 8,
There is no displacement. (4) Heating while pressing a large number of LED chips 1,
The conductive brazing material 4 is melted and the electrode 2 of the LED chip 1 is connected to the electrode terminal 7.
【００１８】多数のＬＥＤに分離するには、図４の矢印
と図５の鎖線で示すように、ＬＥＤチップ１の中間で支
持部材５を切断する。In order to divide into a large number of LEDs, the support member 5 is cut in the middle of the LED chip 1 as shown by the arrow in FIG. 4 and the chain line in FIG.
【００１９】[0019]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。ただし、以下に示す実施例は、本発明の技術思想
を具体化するためのＬＥＤ素子を例示するものであっ
て、本発明はＬＥＤ素子とその製造方法とを下記のもの
に特定しない。Embodiments of the present invention will be described below with reference to the drawings. However, the embodiments described below exemplify the LED element for embodying the technical idea of the present invention, and the present invention does not specify the LED element and the manufacturing method thereof as follows.
【００２０】さらに、この明細書は、特許請求の範囲を
理解し易いように、実施例に示される部材に対応する番
号を、「特許請求の範囲の欄」、「作用の欄」、および
「課題を解決するための手段の欄」に示される部材に付
記している。ただ、特許請求の範囲に示される部材を、
実施例の部材に特定するものでは決してない。Further, in this specification, for easy understanding of the claims, the numbers corresponding to the members shown in the embodiments are referred to as "claims column", "action column", and "action column". It is added to the members shown in the section of "Means for Solving the Problems". However, the members shown in the claims are
It is by no means specific to the members of the examples.
【００２１】図４と図５に示すＬＥＤ素子は、複数のＬ
ＥＤチップ１と、複数個のＬＥＤチップ１を一定の配列
で固定している支持部材５とを備える。The LED element shown in FIGS. 4 and 5 has a plurality of L elements.
An ED chip 1 and a support member 5 that fixes a plurality of LED chips 1 in a fixed arrangement are provided.
【００２２】図４のＬＥＤチップ１は、下面に一対の電
極２を有し、電極２に通電すると上方に光を放射する構
造をしている。ＬＥＤチップ１には、例えばＧａＩｎＮ
系の青色発光ＬＥＤを使用する。このＬＥＤチップ１
は、ＧａＩｎＮ系の青色発光ＬＥＤのウエハーに電子ビ
ーム蒸着により金を蒸着し、リフトオフの手法でパター
ンを形成し、これをチップ状に切断したものを使用す
る。ＬＥＤチップ１は一辺を３５０μｍ□とする正方形
とする。ＬＥＤチップ１には、青色発光ＬＥＤに代わっ
て、同一面に電極２を有し、電極面と反対面に光を放射
する全てのものを使用できる。The LED chip 1 of FIG. 4 has a pair of electrodes 2 on the lower surface, and has a structure in which light is emitted upward when the electrodes 2 are energized. For the LED chip 1, for example, GaInN
A blue emitting LED of the system is used. This LED chip 1
In this case, gold is vapor-deposited by electron beam vapor deposition on a wafer of a GaInN-based blue light-emitting LED, a pattern is formed by a lift-off method, and this is cut into chips. The LED chip 1 is a square with one side of 350 μm □. Instead of the blue light emitting LED, the LED chip 1 may be any one that has the electrode 2 on the same surface and emits light to the surface opposite to the electrode surface.
【００２３】支持部材５は、絶縁部材６に金属製の電極
端子７を固定したものである。電極端子７は、互いに接
近して絶縁部材６に固定されている。電極端子７は、導
電性ろう材４を介してＬＥＤチップ１の電極２に電気的
に接続される。導電性ろう材４は、ＬＥＤチップ１の電
極２を電極端子７に電気的に接続できる全てのろう材、
例えば、半田などの低融点金属、導電剤と接着剤とを混
練りした金属ペーストが使用できる。The supporting member 5 comprises an insulating member 6 and a metal electrode terminal 7 fixed thereto. The electrode terminals 7 are fixed to the insulating member 6 close to each other. The electrode terminal 7 is electrically connected to the electrode 2 of the LED chip 1 via the conductive brazing material 4. The conductive brazing material 4 is any brazing material capable of electrically connecting the electrode 2 of the LED chip 1 to the electrode terminal 7,
For example, a low melting point metal such as solder, or a metal paste obtained by kneading a conductive agent and an adhesive can be used.
【００２４】絶縁部材６はアルミナ、シリカ、耐熱製の
プラスチック板で製作される。アルミナ製の絶縁部材６
は、耐熱製があって安価に多量生産でき、しかも充分な
強度があるので理想的な特性がある。金属製の電極端子
７は、絶縁部材６を上下に貫通して固定されている。電
極端子７は絶縁部材６の上面に表出する部分でＬＥＤチ
ップ１の電極２に接続される。The insulating member 6 is made of alumina, silica, or a heat-resistant plastic plate. Alumina insulation member 6
Has an ideal characteristic because it is made of heat-resistant material, can be mass-produced at low cost, and has sufficient strength. The metal electrode terminal 7 is fixed by vertically penetrating the insulating member 6. The electrode terminal 7 is connected to the electrode 2 of the LED chip 1 at the portion exposed on the upper surface of the insulating member 6.
【００２５】支持部材５である絶縁部材６は、複数のＬ
ＥＤチップ１を一定の配列で綺麗に並べて固定するため
に、上面に開口して位置決嵌入部８を設けている。ＬＥ
Ｄチップ１は、絶縁部材６の位置決嵌入部８に嵌入して
正確に位置決めされる。位置決嵌入部８は、３５０μｍ
□のＬＥＤチップ１を、正確に位置決めして嵌入できる
ように、４００μｍ□としている。位置決嵌入部８の内
形は、ＬＥＤチップ１を位置ずれなく嵌入できるよう
に、ＬＥＤチップ１の外形よりも多少大きい程度に設計
する。たとえば、ＬＥＤチップ１の外周と位置決嵌入部
８の内周との隙間を１０〜２００μｍ、好ましくは２０
〜１５０μｍ、さらに好ましくは３０〜１００μｍとな
るように設計する。位置決嵌入部８を小さくすると、Ｌ
ＥＤチップ１を正確に位置ずれなく嵌入できる。ただ、
位置決嵌入部８が小さすぎると、ＬＥＤチップ１を位置
決嵌入部８に嵌入するのに手間がかかる欠点がある。位
置決嵌入部８の内形は、ＬＥＤチップ１を能率よく嵌入
できると共に、位置ずれしないように設計される。位置
決嵌入部８は、ＬＥＤチップ１を嵌入して定位置に配設
できる深さに設計される。位置決嵌入部８の好ましい深
さは、ＬＥＤチップ１の厚さよりも多少深く、あるいは
ＬＥＤチップ１の厚さよりも多少浅い状態である。The insulating member 6, which is the supporting member 5, has a plurality of L
In order to fix the ED chips 1 in a fixed arrangement by neatly arranging them, a positioning fitting portion 8 is provided on the upper surface. LE
The D chip 1 is fitted into the positioning fitting portion 8 of the insulating member 6 and is accurately positioned. Positioning fitting part 8 is 350 μm
The square LED chip 1 is 400 μm square so that it can be accurately positioned and fitted. The internal shape of the position fitting portion 8 is designed to be slightly larger than the outer shape of the LED chip 1 so that the LED chip 1 can be fitted without displacement. For example, the gap between the outer periphery of the LED chip 1 and the inner periphery of the positioning fitting portion 8 is 10 to 200 μm, preferably 20.
˜150 μm, more preferably 30 to 100 μm. When the position fitting part 8 is made smaller, L
The ED chip 1 can be fitted accurately without displacement. However,
If the positioning fitting portion 8 is too small, it takes a lot of time to fit the LED chip 1 into the positioning fitting portion 8. The internal shape of the position fitting portion 8 is designed so that the LED chip 1 can be fitted efficiently and the position does not shift. The position fitting portion 8 is designed to have a depth such that the LED chip 1 can be fitted therein and arranged at a fixed position. The preferable depth of the position fitting portion 8 is a little deeper than the thickness of the LED chip 1 or a little shallower than the thickness of the LED chip 1.
【００２６】図４に示す支持部材５は、絶縁部材６に凹
部を形成して位置決嵌入部８としている。位置決嵌入部
８は、ＬＥＤチップ１を嵌入して定位置に配設できるす
べての形状とすることができる。例えば、図示しない
が、ＬＥＤチップを配設する周囲に凸部を形成して凸部
の内側に位置決嵌入部を形成することもできる。In the supporting member 5 shown in FIG. 4, a recess is formed in the insulating member 6 to serve as a positioning fitting portion 8. The position fitting portion 8 may have any shape that allows the LED chip 1 to be fitted therein and arranged at a fixed position. For example, although not shown, a convex portion may be formed around the LED chip and the positioning fitting portion may be formed inside the convex portion.
【００２７】図４と図５に示すように、ＬＥＤチップ１
と位置決嵌入部８とを方形状にしたＬＥＤ素子は、ＬＥ
Ｄチップ１を正確な姿勢で正確な位置に配設して支持部
材５に固定できる特長がある。方形状の位置決嵌入部８
に方形状のＬＥＤチップ１を嵌入する状態を、図６ない
し図８に示している。これ等の図に示すＬＥＤチップ１
は方形状であるために、位置決嵌入部８で回転すること
がなく、正確な姿勢で支持部材５に固定される。As shown in FIGS. 4 and 5, the LED chip 1
The LED element having a square shape for the positioning fitting portion 8 is LE
There is a feature that the D-chip 1 can be fixed to the support member 5 by arranging the D-chip 1 in a correct posture at a correct position. Square shaped position fitting part 8
The state in which the rectangular LED chip 1 is fitted in is shown in FIGS. 6 to 8. LED chip 1 shown in these figures
Since it has a rectangular shape, it does not rotate at the position fitting portion 8 and is fixed to the support member 5 in an accurate posture.
【００２８】さらに、図９と図１０に示すように、長方
形のＬＥＤチップ１を、楕円形の位置決嵌入部８に嵌入
して、ＬＥＤチップ１の姿勢を正確にして固定すること
もできる。以上のように、ＬＥＤチップ１と位置決嵌入
部８とを非円形に形成し、ＬＥＤチップ１が位置決嵌入
部８の内部で回転できないようにすると、ＬＥＤチップ
１の姿勢を特定して支持部材５に固定できる特長があ
る。Further, as shown in FIGS. 9 and 10, the rectangular LED chip 1 can be fitted into the oval positioning fitting portion 8 to fix the LED chip 1 in a correct posture. As described above, when the LED chip 1 and the positioning fitting portion 8 are formed in a non-circular shape so that the LED chip 1 cannot rotate inside the positioning fitting portion 8, the posture of the LED chip 1 is specified and supported. It has the feature that it can be fixed to the member 5.
【００２９】ＬＥＤチップ１が位置決嵌入部８に嵌入さ
れると、ＬＥＤチップ１の電極２が電極端子７に接続さ
れるように、電極端子７は位置決嵌入部８の底部に配設
して絶縁部材６に固定されている。一対の電極端子７の
間には、導電性ろう材４の溜凹部を設けている。溜凹部
は、図４に示すように、ＬＥＤチップ１の電極２を電極
端子７に接続するとき、導電性ろう材４を流入させて、
導電性ろう材４がショートするのを防止する。図４の絶
縁部材６は、さらに確実にショートを阻止するために、
溜凹部の底部に隔壁を設けている。隔壁は溜凹部に流入
する導電性ろう材４を区画してショートをより確実に防
止する特長がある。The electrode terminal 7 is arranged at the bottom of the positioning fitting portion 8 so that the electrode 2 of the LED chip 1 is connected to the electrode terminal 7 when the LED chip 1 is fitted in the positioning fitting portion 8. And is fixed to the insulating member 6. A recess for accommodating the conductive brazing material 4 is provided between the pair of electrode terminals 7. As shown in FIG. 4, when the electrodes 2 of the LED chip 1 are connected to the electrode terminals 7, the recesses allow the conductive brazing material 4 to flow in,
The conductive brazing material 4 is prevented from short-circuiting. Insulating member 6 of FIG.
A partition wall is provided at the bottom of the reservoir recess. The partition wall has a feature of partitioning the conductive brazing material 4 flowing into the reservoir recess to more surely prevent a short circuit.
【００３０】支持部材５の位置決嵌入部８にＬＥＤチッ
プ１を嵌入して、電極２を電極端子７に接続した後、位
置決嵌入部８の開口部を被覆するように、プラスチック
でモールドする。プラスチックモールド１０は、位置決
嵌入部８とＬＥＤチップ１の間に侵入して、位置決嵌入
部８の開口部を完全に密閉する。この形状のプラスチッ
クモールド１０は、ＬＥＤチップ１をＬＥＤチップ１に
確実に支持部材５に固定すると共に、ＬＥＤチップ１を
埋設状態に保護する。After the LED chip 1 is fitted into the positioning fitting portion 8 of the supporting member 5 and the electrode 2 is connected to the electrode terminal 7, it is molded with plastic so as to cover the opening of the positioning fitting portion 8. . The plastic mold 10 penetrates between the positioning fitting portion 8 and the LED chip 1 to completely seal the opening of the positioning fitting portion 8. The plastic mold 10 having this shape securely fixes the LED chip 1 to the LED chip 1 on the support member 5 and protects the LED chip 1 in an embedded state.
【００３１】図４と図５に示すＬＥＤ素子は、下記の工
程で製造する。 (1) ＧａＩｎＮ系の青色発光ＬＥＤのウエハーに、電
子ビーム蒸着により金を蒸着し、リフトオフの手法でパ
ターンを形成し、これをチップ状に切断してＬＥＤチッ
プ１を製作する。使用するＬＥＤチップ１には、同一面
に電極２のある全てのものが使用できるのは言うまでも
ない。The LED element shown in FIGS. 4 and 5 is manufactured by the following steps. (1) Gold is vapor-deposited on a GaInN-based blue light-emitting LED wafer by electron beam vapor deposition, a pattern is formed by a lift-off method, and the LED chip 1 is manufactured by cutting the pattern into chips. It goes without saying that all of the LED chips 1 to be used having the electrodes 2 on the same surface can be used.
【００３２】(2) 図５に示すように、一定のピッチで
規則的に配列した位置決嵌入部８のある支持部材５を用
意する。支持部材５の電極端子７を半田メッキして、こ
こに導電性ろう材４を付着させる。(2) As shown in FIG. 5, a supporting member 5 having positioning fitting portions 8 regularly arranged at a constant pitch is prepared. The electrode terminal 7 of the supporting member 5 is plated with solder, and the conductive brazing material 4 is attached thereto.
【００３３】(3) 支持部材５の位置決嵌入部８に、Ｌ
ＥＤチップ１を１個ずつ嵌入する。ＬＥＤチップ１は、
電極２を電極端子７に接続する姿勢として位置決嵌入部
８に嵌入する。(3) At the position fitting fitting portion 8 of the supporting member 5,
Insert the ED chips 1 one by one. LED chip 1
The electrode 2 is fitted into the positioning fitting portion 8 so that the electrode 2 is connected to the electrode terminal 7.
【００３４】(4) 全ての位置決嵌入部８にＬＥＤチッ
プ１を嵌入した支持部材５を、真空圧着機に搬入して並
べ、真空圧着機を真空にした後約２００℃に昇温し、図
１１に示すように、ゴム状弾性部材９を介して圧着し、
圧着状態に保持して冷却する。ゴム状弾性部材９がＬＥ
Ｄチップ１を圧着する圧力は２ｋｇ／ｃｍ2に調整す
る。この状態で導電性ろう材４が溶融され、ＬＥＤチッ
プ１の電極２は電極端子７に接続される。(4) The supporting members 5 in which the LED chips 1 have been fitted in all the positioning fitting portions 8 are carried into the vacuum crimping machine and arranged, and the vacuum crimping machine is evacuated and then heated to about 200 ° C. As shown in FIG. 11, the rubber-like elastic member 9 is used for pressure bonding,
Hold in the crimped state and cool. The rubber-like elastic member 9 is LE
The pressure for pressing the D chip 1 is adjusted to 2 kg / cm 2 . In this state, the conductive brazing material 4 is melted and the electrode 2 of the LED chip 1 is connected to the electrode terminal 7.
【００３５】(5) 常温になるまで冷却した後、位置決
嵌入部８の開口部を閉塞する状態でプラスチックをモー
ルドする。プラスチックモールド１０のプラスチックは
エポキシ樹脂が最適である。光線の透過率が高く充分な
強度を有するからである。ただ、エポキシ樹脂に代わっ
てシリコーン樹脂等も使用できる。(5) After cooling to room temperature, plastic is molded in a state where the opening of the positioning fitting portion 8 is closed. Epoxy resin is most suitable for the plastic of the plastic mold 10. This is because it has a high light transmittance and a sufficient strength. However, a silicone resin or the like can be used instead of the epoxy resin.
【００３６】このようにして、１枚の支持部材５に多数
のＬＥＤチップ１を固定したＬＥＤ素子が製造される。
このようにして製造されたＬＥＤ素子を分割してＬＥＤ
とする。この場合、図５の鎖線で示すように、位置決嵌
入部８の境界で支持部材５を切断する。In this way, an LED element in which a large number of LED chips 1 are fixed to one support member 5 is manufactured.
The LED element thus manufactured is divided into LEDs.
And In this case, as shown by the chain line in FIG. 5, the support member 5 is cut at the boundary of the positioning fitting portion 8.
【００３７】１枚の支持部材５に多数のＬＥＤチップ１
を固定してＬＥＤ素子を製造し、これを切断してＬＥＤ
を製造する方法は、電極部材３にＬＥＤチップ１を載せ
てリード線３を接続する方法とは比較にならないほど能
率よくＬＥＤを製造できる。A large number of LED chips 1 are provided on one support member 5.
LED is manufactured by fixing the
The method of manufacturing the LED can manufacture the LED with an efficiency far higher than the method of mounting the LED chip 1 on the electrode member 3 and connecting the lead wire 3.
【００３８】[0038]
【発明の効果】本発明のＬＥＤ素子とその製造方法は、
多数のＬＥＤチップを正確に配設して支持部材に固定で
きる特長がある。それは、支持部材を絶縁部材と電極部
材とで構成し、電極部材を絶縁部材に固定すると共に、
絶縁部材にＬＥＤチップを嵌入して位置決めする位置決
嵌入部を設けているからである。位置決嵌入部に嵌入さ
れるＬＥＤチップは、支持部材に配列する状態において
も、また、ＬＥＤチップの電極を支持部材の電極部材に
接続する状態においても位置ずれすることがない。さら
に、ＬＥＤチップを位置決嵌入部に嵌入すると、ＬＥＤ
チップの電極が電極端子に接続されるように、位置決嵌
入部の底部に一対の電極端子を配設している。このた
め、絶縁部材の位置決嵌入部にＬＥＤチップを嵌入させ
ると、ＬＥＤチップが定位置に配設されると共に、この
状態でＬＥＤチップの電極は正確に電極端子に接続され
る。したがって、本発明のＬＥＤ素子は、簡単かつ容易
に、しかも多数の小さいＬＥＤチップを支持部材の正確
な位置に規則的に位置ずれなく固定できる特長がある。The LED element of the present invention and the method for manufacturing the same are
It has a feature that many LED chips can be accurately arranged and fixed to a supporting member. That is, the supporting member is composed of an insulating member and an electrode member, and the electrode member is fixed to the insulating member.
This is because the positioning fitting portion for fitting and positioning the LED chip in the insulating member is provided. The LED chips fitted into the positioning fitting portion do not shift in position even when arranged in the support member or when the electrodes of the LED chips are connected to the electrode members of the support member. Furthermore, when the LED chip is fitted into the positioning fitting part, the LED
A pair of electrode terminals is provided at the bottom of the positioning fitting portion so that the electrodes of the chip are connected to the electrode terminals. Therefore, when the LED chip is fitted into the positioning fitting portion of the insulating member, the LED chip is arranged at a fixed position, and in this state, the electrode of the LED chip is accurately connected to the electrode terminal. Therefore, the LED element of the present invention has a feature that it is possible to simply and easily fix a large number of small LED chips to an accurate position of the support member regularly without displacement.
【００３９】さらに本発明のＬＥＤ素子とその製造方法
は、ＬＥＤチップの電極を電極端子に正確に接続でき、
ショートする弊害を防止できる特長がある。それは、Ｌ
ＥＤチップの電極を電極端子に正確に配設することがで
きるからである。電極端子とＬＥＤチップの電極との相
対位置がずれると、電極がブリッジの状態となって、電
極端子をショートすることがある。しかしながら本発明
のＬＥＤ素子は、電極と電極端子とを正確な相対位置に
配設できるので、この弊害がなく、ＬＥＤチップの電極
を電極端子に正確に接続できる特長がある。とくに、本
発明のＬＥＤ素子は、ＬＥＤチップを小さくし、さら
に、多数のＬＥＤチップを１枚の支持部材に固定して集
積度を高くしても、歩留が低下しない優れた特長があ
る。それは、小さいＬＥＤチップを支持部材の位置決嵌
入部に正確に配設して固定できるからである。したがっ
て、本発明のＬＥＤ素子とその製造方法は、集積度の高
いＬＥＤ素子を、簡単かつ容易に、しかも安価に多量生
産できる優れた特長を実現する。さらに、ＬＥＤ素子を
１個のＬＥＤに分割する方法は、極めて能率よく高精度
なＬＥＤを安価に多量生産できる特長がある。Furthermore, according to the LED element and the manufacturing method thereof of the present invention, the electrode of the LED chip can be accurately connected to the electrode terminal,
There is a feature that can prevent the harmful effect of short circuit. It is L
This is because the electrodes of the ED chip can be accurately arranged on the electrode terminals. If the relative positions of the electrode terminals and the electrodes of the LED chip are deviated, the electrodes may be in a bridge state and the electrode terminals may be short-circuited. However, since the LED element of the present invention can dispose the electrode and the electrode terminal at accurate relative positions, it does not have this problem and has the advantage that the electrode of the LED chip can be accurately connected to the electrode terminal. In particular, the LED device of the present invention has an excellent feature that the yield is not reduced even if the LED chip is made small and a large number of LED chips are fixed to one supporting member to increase the degree of integration. This is because a small LED chip can be accurately arranged and fixed in the positioning fitting portion of the supporting member. Therefore, the LED device and the method for manufacturing the same according to the present invention realize an excellent feature that LED devices with high integration can be mass-produced easily and easily at low cost. Furthermore, the method of dividing the LED element into one LED has a feature that extremely efficient and highly accurate LEDs can be mass-produced at low cost.
【図１】従来のＬＥＤの一例を示す断面図FIG. 1 is a sectional view showing an example of a conventional LED.
【図２】従来のＬＥＤの一例を示す断面図FIG. 2 is a sectional view showing an example of a conventional LED.
【図３】本発明者が先に開発したＬＥＤ素子の断面図FIG. 3 is a cross-sectional view of an LED element previously developed by the present inventor.
【図４】本発明の実施例にかかるＬＥＤ素子の断面図FIG. 4 is a sectional view of an LED element according to an embodiment of the present invention.
【図５】本発明の実施例にかかるＬＥＤ素子の平面図FIG. 5 is a plan view of an LED device according to an embodiment of the present invention.
【図６】本発明の他の実施例にかかるＬＥＤ素子の製造
工程を示す斜視図FIG. 6 is a perspective view showing a manufacturing process of an LED device according to another embodiment of the present invention.
【図７】図６に示す方法で製造したＬＥＤ素子の平面図7 is a plan view of an LED device manufactured by the method shown in FIG.
【図８】図６に示す方法で製造したＬＥＤ素子の平面図FIG. 8 is a plan view of an LED element manufactured by the method shown in FIG.
【図９】本発明の他の実施例にかかるＬＥＤ素子の平面
図FIG. 9 is a plan view of an LED device according to another embodiment of the present invention.
【図１０】本発明の他の実施例にかかるＬＥＤ素子の平
面図FIG. 10 is a plan view of an LED device according to another embodiment of the present invention.
【図１１】図４に示すＬＥＤ素子の製造工程を示す断面
図11 is a cross-sectional view showing the manufacturing process of the LED element shown in FIG.
【符号の説明】 １…ＬＥＤチップ ２…電極 ３…電極部材 ４…導電性ろう材 ５…支持部材 ６…絶縁部材 ７…電極端子 ８…位置決嵌入部 ９…ゴム状弾性部材 １０…プラスチックモールド[Explanation of Codes] 1 ... LED chip 2 ... Electrode 3 ... Electrode member 4 ... Conductive brazing material 5 ... Supporting member 6 ... Insulating member 7 ... Electrode terminal 8 ... Positioning fitting portion 9 ... Rubber-like elastic member 10 ... Plastic mold
Claims (3)
チップ(1)と、複数個のＬＥＤチップ(1)を一定の配列で
固定している支持部材(5)とを備え、支持部材(5)は、絶
縁部材(6)とこの絶縁部材(6)に互いに接近して固定され
ている一対の電極端子(7)とを有し、電極端子(7)は導電
性ろう材(4)を介してＬＥＤチップ(1)の電極(2)に接続
されており、さらに支持部材(5)は、それぞれのＬＥＤ
チップ(1)を嵌入して所定の位置に配列して位置決めす
る複数の位置決嵌入部(8)を備えており、この位置決嵌
入部(8)の底部に電極端子(7)が配設されており、ＬＥＤ
チップ(1)が位置決嵌入部(8)に嵌入されて電極(2)を電
極端子(7)に接続しているＬＥＤ素子。1. An LED having a pair of electrodes (2) on the same surface.
It comprises a chip (1) and a support member (5) fixing a plurality of LED chips (1) in a fixed arrangement, and the support member (5) comprises an insulating member (6) and this insulating member (6). ) Has a pair of electrode terminals (7) fixed close to each other, and the electrode terminals (7) are connected to the electrodes (2) of the LED chip (1) through the conductive brazing material (4). In addition, the support member (5) is
It is equipped with a plurality of positioning fittings (8) for fitting the chips (1) and arranging and positioning them in a predetermined position, and the electrode terminals (7) are arranged at the bottom of the positioning fittings (8). Has been installed, LED
An LED element in which a chip (1) is fitted in a positioning fitting part (8) to connect an electrode (2) to an electrode terminal (7).
非円形ＬＥＤチップで、このＬＥＤチップ(1)を嵌入す
る支持部材(5)の位置決嵌入部(8)の内形も非円形である
非円形位置決嵌入部である請求項１記載のＬＥＤ素子。2. The LED chip (1) is a non-circular LED chip having a non-circular outer shape, and the positioning fitting part (8) of the support member (5) into which the LED chip (1) is fitted has a non-circular shape. The LED element according to claim 1, wherein the LED element is a circular non-circular positioning fitting portion.
決めする支持部材(5)の位置決嵌入部(8)にＬＥＤチップ
(1)を嵌入して位置決めし、位置決めされた複数のＬＥ
Ｄチップ(1)をゴム状弾性部材(9)で押圧し、ＬＥＤチッ
プ(1)の電極(2)を導電性ろう材(4)を介して支持部材(5)
に設けられた電極端子(7)に接続するＬＥＤ素子の製造
方法。3. An LED chip is mounted on a positioning fitting portion (8) of a supporting member (5) for fitting and positioning a plurality of LED chips (1).
(1) is inserted and positioned, and a plurality of LEs are positioned
The D chip (1) is pressed by the rubber-like elastic member (9), and the electrode (2) of the LED chip (1) is supported through the conductive brazing material (4) to the supporting member (5).
A method for manufacturing an LED element connected to an electrode terminal (7) provided in a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7990994A JP3267045B2 (en) | 1994-03-24 | 1994-03-24 | LED element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7990994A JP3267045B2 (en) | 1994-03-24 | 1994-03-24 | LED element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07263754A true JPH07263754A (en) | 1995-10-13 |
| JP3267045B2 JP3267045B2 (en) | 2002-03-18 |
Family
ID=13703419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7990994A Expired - Fee Related JP3267045B2 (en) | 1994-03-24 | 1994-03-24 | LED element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3267045B2 (en) |
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