JP4617941B2 - 回路形成基板の製造方法 - Google Patents
回路形成基板の製造方法 Download PDFInfo
- Publication number
- JP4617941B2 JP4617941B2 JP2005076815A JP2005076815A JP4617941B2 JP 4617941 B2 JP4617941 B2 JP 4617941B2 JP 2005076815 A JP2005076815 A JP 2005076815A JP 2005076815 A JP2005076815 A JP 2005076815A JP 4617941 B2 JP4617941 B2 JP 4617941B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate material
- stage state
- substrate
- circuit forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Description
(1)金属箔、もしくは支持体に張り付けられた金属箔、もしくは支持体に張り付けられ回路パターンを形成された金属箔
(2)層間接続手段を備えたBステージ状態基板材料
(3)回路、金属箔、層間接続手段のうち一つ以上を備えたBステージ状態基板材料
(4)回路もしくは金属箔を備えたCステージ状態基板材料もしくは回路もしくは金属箔と層間接続手段を備えたCステージ状態基板材料
のうち、
少なくとも1種以上の前記Bステージ状態基板材料及び2種以上の前記金属箔もしくは前記基板材料を積層物として積層し仮止めする積層工程と、
前記積層物の表層に回路を形成し多層の回路形成基板とする工程とを備え、
前記回路形成基板は複数の個別回路形成基板で構成される集合回路形成基板が複数配置されたものであり、
前記積層物を積層し仮止めする積層工程は、1枚の前記Bステージ状態基板材料に対して2枚の前記Cステージ状態基板材料を互いに当接して積層し、
前記集合回路形成基板のいくつかは2枚の前記Cステージ状態基板材料をまたがる形で配置されることを特徴とする回路形成基板の製造方法としたものであり、ワークサイズの大きな回路形成基板の製造が可能となり、また、積層後のワークサイズでの有効範囲すなわち回路形成基板としての使用可能範囲が増加することにより、集合回路形成基板の取り数を増加させ、効率的かつ低コストの回路形成基板の製造が可能となる等の効果を有する。
さらに、使用する基板材料の歩留まりを向上させ、個別回路形成基板の生産性を高める等の効果を有する。
図1(a)〜(d)は本発明の実施の形態における回路形成基板の製造方法を示す工程断面図である。
2 プリプレグ
3 層間接続部
4 ビア穴
5 導電性ペースト
6 銅箔
7 回路
8 シート
9 レーザービア穴
10 レーザービア
11 ツールマーク
12、12a 集合回路形成基板
13 個別回路形成基板
14 コア基板材料当接部
Claims (6)
- (1)金属箔、もしくは支持体に張り付けられた金属箔、もしくは支持体に張り付けられ回路パターンを形成された金属箔
(2)層間接続手段を備えたBステージ状態基板材料
(3)回路、金属箔、層間接続手段のうち一つ以上を備えたBステージ状態基板材料
(4)回路もしくは金属箔を備えたCステージ状態基板材料もしくは回路もしくは金属箔と層間接続手段を備えたCステージ状態基板材料
のうち、
少なくとも1種以上の前記Bステージ状態基板材料及び2種以上の前記金属箔もしくは前記基板材料を積層物として積層し仮止めする積層工程と、
前記積層物の表層に回路を形成し多層の回路形成基板とする工程とを備え、
前記回路形成基板は複数の個別回路形成基板で構成される集合回路形成基板が複数配置されたものであり、
前記積層物を積層し仮止めする積層工程は、
1枚の前記Bステージ状態基板材料に対して2枚の前記Cステージ状態基板材料を互いに当接して積層し、
前記集合回路形成基板のいくつかは2枚の前記Cステージ状態基板材料をまたがる形で配置されることを特徴とする回路形成基板の製造方法。 - 積層工程の前に、前記積層工程において積層する2枚以上のCステージ状態基板材料が当接する部分を所望寸法まで切断する切断工程を備えることを特徴とする請求項1に記載の回路形成基板の製造方法。
- 前記当接する部位は少なくとも1つの集合回路形成基板内の互いに隣接する個別回路形成基板の間に位置することを特徴とする請求項1に記載の回路形成基板の製造方法。
- Cステージ状態基板材料は互いに当接する部分は、嵌合する形状に形成されていることを特徴とする請求項1に記載の回路形成基板の製造方法。
- 切断は、ダイシング法で行うことを特徴とする請求項2に記載の回路形成基板の製造方法。
- Cステージ状態基板材料は表面に回路および導電ペーストで形成された層間接続部を備え、
多層の回路形成基板の表層はレーザービアを備えることを特徴とする請求項3または請求項4に記載の回路形成基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005076815A JP4617941B2 (ja) | 2005-03-17 | 2005-03-17 | 回路形成基板の製造方法 |
CN2006800081638A CN101142863B (zh) | 2005-03-17 | 2006-03-16 | 电路形成基板的制造方法 |
PCT/JP2006/305252 WO2006098406A1 (ja) | 2005-03-17 | 2006-03-16 | 回路形成基板の製造方法 |
TW095108967A TW200640327A (en) | 2005-03-17 | 2006-03-16 | Method of manufacturing circuit forming board |
US11/814,037 US7685707B2 (en) | 2005-03-17 | 2006-03-16 | Method for manufacturing circuit forming substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005076815A JP4617941B2 (ja) | 2005-03-17 | 2005-03-17 | 回路形成基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006261390A JP2006261390A (ja) | 2006-09-28 |
JP2006261390A5 JP2006261390A5 (ja) | 2008-05-01 |
JP4617941B2 true JP4617941B2 (ja) | 2011-01-26 |
Family
ID=36991747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005076815A Expired - Fee Related JP4617941B2 (ja) | 2005-03-17 | 2005-03-17 | 回路形成基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7685707B2 (ja) |
JP (1) | JP4617941B2 (ja) |
CN (1) | CN101142863B (ja) |
TW (1) | TW200640327A (ja) |
WO (1) | WO2006098406A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5061673B2 (ja) * | 2007-03-19 | 2012-10-31 | パナソニック株式会社 | 回路基板と回路基板の製造方法 |
JP5041291B2 (ja) * | 2007-11-05 | 2012-10-03 | 大日本印刷株式会社 | 非接触icカードの製造方法 |
US20120090883A1 (en) * | 2010-10-13 | 2012-04-19 | Qualcomm Incorporated | Method and Apparatus for Improving Substrate Warpage |
CN102595809A (zh) * | 2012-03-14 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | 高密度互联印刷电路板的制作方法 |
CN102625604B (zh) * | 2012-03-20 | 2014-10-01 | 柏承科技(昆山)股份有限公司 | 高密度互联印制板的制造方法 |
CN103369872A (zh) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | 多层印刷电路板的压合方法 |
CN103338600A (zh) * | 2013-05-10 | 2013-10-02 | 华为技术有限公司 | Pcb结构及其制造方法,以及埋入器件pcb的制造方法 |
US10433413B2 (en) * | 2014-08-15 | 2019-10-01 | Unimicron Technology Corp. | Manufacturing method of circuit structure embedded with heat-dissipation block |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04286188A (ja) * | 1991-03-15 | 1992-10-12 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
JPH08116171A (ja) * | 1994-10-18 | 1996-05-07 | Matsushita Electric Ind Co Ltd | プリント配線板の製造方法及びそれに用いる多面取りの製造用フィルム |
JP2000133912A (ja) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Works Ltd | 樹脂付き金属箔及びその製造方法 |
JP2000151102A (ja) * | 1998-11-16 | 2000-05-30 | Matsushita Electric Ind Co Ltd | 多層回路基板の製造方法 |
JP2000216518A (ja) * | 1999-01-21 | 2000-08-04 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2000307246A (ja) * | 1999-04-26 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 回路形成基板の製造方法および回路形成基板材料 |
JP2001024326A (ja) * | 1999-07-08 | 2001-01-26 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
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US2001A (en) * | 1841-03-12 | Sawmill | ||
US4A (en) * | 1836-08-10 | Stock | ||
US2003A (en) * | 1841-03-12 | Improvement in horizontal windivhlls | ||
US6A (en) * | 1836-08-10 | Thomas blanghard | ||
US5A (en) * | 1836-08-10 | Thomas blancharjq | ||
US2000A (en) * | 1841-03-12 | Improvement in the manufacture of starch | ||
US3795047A (en) * | 1972-06-15 | 1974-03-05 | Ibm | Electrical interconnect structuring for laminate assemblies and fabricating methods therefor |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5175047A (en) * | 1990-08-09 | 1992-12-29 | Teledyne Industries, Inc. | Rigid-flex printed circuit |
JPH05251865A (ja) | 1991-02-28 | 1993-09-28 | Toppan Printing Co Ltd | プリント配線板の製造方法 |
JP2601128B2 (ja) | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | 回路形成用基板の製造方法および回路形成用基板 |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
JP2937933B2 (ja) * | 1997-03-24 | 1999-08-23 | 富山日本電気株式会社 | 多層プリント配線板の製造方法 |
TWI242398B (en) * | 2000-06-14 | 2005-10-21 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of manufacturing the same |
JP2003249753A (ja) | 2002-02-25 | 2003-09-05 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
-
2005
- 2005-03-17 JP JP2005076815A patent/JP4617941B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-16 WO PCT/JP2006/305252 patent/WO2006098406A1/ja active Application Filing
- 2006-03-16 US US11/814,037 patent/US7685707B2/en not_active Expired - Fee Related
- 2006-03-16 TW TW095108967A patent/TW200640327A/zh not_active IP Right Cessation
- 2006-03-16 CN CN2006800081638A patent/CN101142863B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04286188A (ja) * | 1991-03-15 | 1992-10-12 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
JPH08116171A (ja) * | 1994-10-18 | 1996-05-07 | Matsushita Electric Ind Co Ltd | プリント配線板の製造方法及びそれに用いる多面取りの製造用フィルム |
JP2000133912A (ja) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Works Ltd | 樹脂付き金属箔及びその製造方法 |
JP2000151102A (ja) * | 1998-11-16 | 2000-05-30 | Matsushita Electric Ind Co Ltd | 多層回路基板の製造方法 |
JP2000216518A (ja) * | 1999-01-21 | 2000-08-04 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2000307246A (ja) * | 1999-04-26 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 回路形成基板の製造方法および回路形成基板材料 |
JP2001024326A (ja) * | 1999-07-08 | 2001-01-26 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101142863B (zh) | 2012-08-29 |
TW200640327A (en) | 2006-11-16 |
WO2006098406A1 (ja) | 2006-09-21 |
JP2006261390A (ja) | 2006-09-28 |
TWI372010B (ja) | 2012-09-01 |
US20090183366A1 (en) | 2009-07-23 |
CN101142863A (zh) | 2008-03-12 |
US7685707B2 (en) | 2010-03-30 |
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