JP4617869B2 - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
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- JP4617869B2 JP4617869B2 JP2004371247A JP2004371247A JP4617869B2 JP 4617869 B2 JP4617869 B2 JP 4617869B2 JP 2004371247 A JP2004371247 A JP 2004371247A JP 2004371247 A JP2004371247 A JP 2004371247A JP 4617869 B2 JP4617869 B2 JP 4617869B2
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- Prior art keywords
- refrigerant tank
- refrigerant
- heating element
- base plate
- cooling device
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
これによると、冷媒槽を形成する容器はフレームによりろう付け工程後の剛性が確保されるため、冷媒槽容器を発熱体に押し付けた際の冷媒槽容器の変形が抑制される。また、銅材より成る伝熱特性が高いベースプレートを介して冷媒と発熱体との間の熱移動を行うことができる。したがって、銅の高い伝熱特性を生かしながら、冷媒槽容器を発熱体に適切な荷重で押し付けることができる。
本発明の第1実施形態について説明する。図1は第1実施形態に係る沸騰冷却装置の正面図、図2は図1の右側面図、図3は図1の平面図、図4は本実施形態の沸騰冷却装置に発熱体90が取り付けられた状態を示す側面図、図5は図1のA−A線に沿う断面図、図6は図1の沸騰冷却装置における要部を分解して示す斜視図である。
本発明の第2実施形態について説明する。図7は第2実施形態に係る沸騰冷却装置の要部の断面図、図8は第2実施形態に係る沸騰冷却装置の要部を分解して示す斜視図である。本実施形態は、冷媒槽1を形成する容器の構成が第1実施形態と異なっている。なお、第1実施形態と同一もしくは均等部分には同一の符号を付し、その説明を省略する。
本発明の第3実施形態について説明する。図9は第3実施形態に係る沸騰冷却装置の要部の断面図、図10は第3実施形態に係る沸騰冷却装置の要部を分解して示す斜視図である。本実施形態は、第2実施形態におけるベースプレート16の形状を変更して、ブロック18を不要にしたものである。なお、第2実施形態と同一もしくは均等部分には同一の符号を付し、その説明を省略する。
上記実施形態では、補強材122またはフレーム17は、ステンレスを用いたが、他の鉄系材料(例えば炭素鋼)を用いてもよい。
Claims (8)
- 内部に液相の冷媒を貯留するとともに、外表面に発熱体(90)が取り付けられる冷媒槽(1)と、前記発熱体(90)の熱によって沸騰した前記冷媒を冷却して凝縮させた後に前記冷媒槽(1)に戻す放熱部(2)とを備え、前記冷媒槽(1)と前記放熱部(2)がろう付けにて接合される沸騰冷却装置において、
前記冷媒槽(1)を形成する容器は、銅材より成り、一方の面が前記冷媒槽(1)の内部に露出するとともに他方の面に前記発熱体(90)が接触するブロック(13)と、銅材より成る外皮(121)間に補強材(122)を挟んだ3層構造材にて形成されるとともに前記ブロック(13)に接合される積層プレート(12)とを有し、
前記補強材(122)は、ろう付け工程後の剛性が前記銅材よりも高い材料から成ることを特徴とする沸騰冷却装置。 - 前記積層プレート(12)は、前記冷媒槽(1)の内部と外部を連通させる開口部(123)を備え、前記開口部(123)に前記ブロック(13)が配置されていることを特徴とする請求項1に記載の沸騰冷却装置。
- 前記補強材(122)は、鋼材より成ることを特徴とする請求項1または2に記載の沸騰冷却装置。
- 内部に液相の冷媒を貯留するとともに、外表面に発熱体(90)が取り付けられる冷媒槽(1)と、前記発熱体(90)の熱によって沸騰した前記冷媒を冷却して凝縮させた後に前記冷媒槽(1)に戻す放熱部(2)とを備え、前記冷媒槽(1)と前記放熱部(2)がろう付けにて接合される沸騰冷却装置において、
前記冷媒槽(1)を形成する容器は、銅材より成るとともに一方の面が前記冷媒槽(1)の内部に露出するベースプレート(16)と、銅材より成り、一方の面が前記ベースプレート(16)に接触するとともに他方の面に前記発熱体(90)が接触するブロック(18)と、前記ベースプレート(16)のうち前記ブロック(18)が接触しない部位に配置された補強用のフレーム(17)とを有し、
前記フレーム(17)は、ろう付け工程後の剛性が前記銅材よりも高い材料から成ることを特徴とする沸騰冷却装置。 - 前記フレーム(17)は、前記ベースプレート(16)の外表面側に位置するとともに、前記ベースプレート(16)の外表面と前記冷媒槽(1)の外部とを連通させる開口部(171)を備え、前記開口部(171)に前記ブロック(18)が配置されていることを特徴とする請求項4に記載の沸騰冷却装置。
- 内部に液相の冷媒を貯留するとともに、外表面に発熱体(90)が取り付けられる冷媒槽(1)と、前記発熱体(90)の熱によって沸騰した前記冷媒を冷却して凝縮させた後に前記冷媒槽(1)に戻す放熱部(2)とを備え、前記冷媒槽(1)と前記放熱部(2)がろう付けにて接合される沸騰冷却装置において、
前記冷媒槽(1)を形成する容器は、銅材より成り、一方の面が前記冷媒槽(1)の内部に露出するるとともに他方の面に前記発熱体(90)が接触するベースプレート(16)と、前記ベースプレート(16)のうち前記発熱体(90)が接触しない部位に配置された補強用のフレーム(17)とを有し、
前記フレーム(17)は、ろう付け工程後の剛性が前記銅材よりも高い材料から成ることを特徴とする沸騰冷却装置。 - 前記フレーム(17)は、前記ベースプレート(16)の外表面側に位置するとともに、前記ベースプレート(16)の外表面と前記冷媒槽(1)の外部とを連通させる開口部(171)を備え、
前記ベースプレート(16)における前記発熱体(90)が接触する部位は、前記開口部(171)から前記冷媒槽(1)の外側に向かって突出していることを特徴とする請求項6に記載の沸騰冷却装置。 - 前記フレーム(17)は、鋼材より成ることを特徴とする請求項4ないし7のいずれか1つに記載の沸騰冷却装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004371247A JP4617869B2 (ja) | 2004-12-22 | 2004-12-22 | 沸騰冷却装置 |
US11/300,110 US7658223B2 (en) | 2004-12-22 | 2005-12-14 | Boiling and cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004371247A JP4617869B2 (ja) | 2004-12-22 | 2004-12-22 | 沸騰冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006177613A JP2006177613A (ja) | 2006-07-06 |
JP4617869B2 true JP4617869B2 (ja) | 2011-01-26 |
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ID=36594239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004371247A Expired - Fee Related JP4617869B2 (ja) | 2004-12-22 | 2004-12-22 | 沸騰冷却装置 |
Country Status (2)
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US (1) | US7658223B2 (ja) |
JP (1) | JP4617869B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2009063703A1 (ja) * | 2007-11-15 | 2011-03-31 | 日本電気株式会社 | 沸騰冷却装置 |
CN101738114B (zh) * | 2008-11-25 | 2012-11-21 | 富准精密工业(深圳)有限公司 | 平板式热管及其制造方法 |
US20110232881A1 (en) * | 2010-03-26 | 2011-09-29 | Hamilton Sundstrand Corporation | Corrugated Graphite Sheet Heat Transfer Device |
JP6088405B2 (ja) * | 2013-11-27 | 2017-03-01 | Necパーソナルコンピュータ株式会社 | ヒートシンクの取付構造および基板 |
US11035622B1 (en) | 2014-05-09 | 2021-06-15 | Minco Products, Inc. | Thermal conditioning assembly |
DK3115729T3 (en) | 2015-07-09 | 2019-04-01 | Abb Schweiz Ag | HEAT EXCHANGE |
JP6151813B1 (ja) * | 2016-03-23 | 2017-06-21 | 株式会社神戸製鋼所 | ベーパチャンバーの製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0679492A (ja) * | 1992-08-27 | 1994-03-22 | Hitachi Cable Ltd | ろう付用銅/ステンレス/銅の三層クラッド材 |
JP2001024374A (ja) * | 1999-07-09 | 2001-01-26 | Furukawa Electric Co Ltd:The | 高発熱密度発熱体用ヒートシンク |
JP2004311519A (ja) * | 2003-04-02 | 2004-11-04 | Denso Corp | 沸騰冷却装置 |
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US5103290A (en) * | 1989-06-16 | 1992-04-07 | General Electric Company | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip |
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JPH08264694A (ja) * | 1995-03-20 | 1996-10-11 | Calsonic Corp | 電子部品用冷却装置 |
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
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US6317322B1 (en) * | 2000-08-15 | 2001-11-13 | The Furukawa Electric Co., Ltd. | Plate type heat pipe and a cooling system using same |
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JP2004037074A (ja) | 2003-07-29 | 2004-02-05 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとそれを用いた冷却構造 |
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JP4046703B2 (ja) * | 2004-03-04 | 2008-02-13 | 三菱電機株式会社 | ヒートシンク |
TWI235817B (en) * | 2004-03-26 | 2005-07-11 | Delta Electronics Inc | Heat-dissipating module |
US6957692B1 (en) * | 2004-08-31 | 2005-10-25 | Inventec Corporation | Heat-dissipating device |
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-
2004
- 2004-12-22 JP JP2004371247A patent/JP4617869B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-14 US US11/300,110 patent/US7658223B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0679492A (ja) * | 1992-08-27 | 1994-03-22 | Hitachi Cable Ltd | ろう付用銅/ステンレス/銅の三層クラッド材 |
JP2001024374A (ja) * | 1999-07-09 | 2001-01-26 | Furukawa Electric Co Ltd:The | 高発熱密度発熱体用ヒートシンク |
JP2004311519A (ja) * | 2003-04-02 | 2004-11-04 | Denso Corp | 沸騰冷却装置 |
Also Published As
Publication number | Publication date |
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US20060131001A1 (en) | 2006-06-22 |
JP2006177613A (ja) | 2006-07-06 |
US7658223B2 (en) | 2010-02-09 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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LAPS | Cancellation because of no payment of annual fees |