JP4606302B2

JP4606302B2 - Light emitting device

Info

Publication number: JP4606302B2
Application number: JP2005312711A
Authority: JP
Inventors: 大輔作本; 裕樹森; 真吾松浦; 民男草野
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2005-01-27
Filing date: 2005-10-27
Publication date: 2011-01-05
Anticipated expiration: 2025-10-27
Also published as: JP2006237557A

Description

本発明は、発光素子を収容する発光装置に関する。 The present invention relates to a light emitting device that houses a light emitting element.

発光ダイオード（ＬＥＤ）や半導体レーザ（ＬＤ）等の発光素子を用いた発光装置は、今後さらなる低消費電力化や長寿命化が進むものと予測されていることから注目されており、近年、各種インジケーター、光センサー、ディスプレイ、ホトカプラ、バックライト、光プリンタヘッド等の種々の分野で使用され始めている。従来の発光素子を搭載するための発光素子収納パッケージ（以下、単にパッケージともいう）の断面図を図１５に示す。 Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention because they are expected to further reduce power consumption and extend their life. It has begun to be used in various fields such as indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. FIG. 15 is a cross-sectional view of a light-emitting element storage package (hereinafter also simply referred to as a package) for mounting a conventional light-emitting element.

図１５に示すように、従来のパッケージは、基板１１を有しており、配線導体（図示せず）を介してパッケージ内の搭載部１１ａに搭載された発光素子１３に外部から電力が供給され、発光素子１３が作動可能となる。 As shown in FIG. 15, the conventional package has a substrate 11, and power is supplied from the outside to the light emitting element 13 mounted on the mounting portion 11a in the package via a wiring conductor (not shown). The light emitting element 13 becomes operable.

基板１１の上面の外周部には、搭載部１１ａを取り囲むように接合された、反射部材１２が設けられている。 On the outer peripheral portion of the upper surface of the substrate 11, a reflecting member 12 joined so as to surround the mounting portion 11a is provided.

発光素子１３は、基板１１の搭載部１１ａ上にダイボンドされるとともに、発光素子１３の電極と搭載部１１ａの周辺に配置した配線導体とが電気的に接続される。しかる後、反射部材１２の内側に透明樹脂１７を発光素子１３を覆うように充填し熱硬化させることにより、発光素子１３を保護するとともに発光素子１３をパッケージに強固に密着させて発光装置と成すことができる。または、発光素子１３の側面や上面に蛍光体や蛍光体を混入した透明樹脂を塗布した後に、反射部材１２の内側に透明樹脂１７を充填し熱硬化させることで、発光素子１３からの光を蛍光体により波長変換し、所望の波長スペクトルを有する光を取り出せる発光装置と成すことができる。なお反射部材１２の上面には、必要に応じて透光性の蓋体（図示せず）を接合させることもできる。 The light emitting element 13 is die-bonded on the mounting portion 11a of the substrate 11, and the electrode of the light emitting element 13 and the wiring conductor arranged around the mounting portion 11a are electrically connected. Thereafter, the inside of the reflecting member 12 is filled with the transparent resin 17 so as to cover the light emitting element 13, and is thermally cured, thereby protecting the light emitting element 13 and firmly adhering the light emitting element 13 to the package to form a light emitting device. be able to. Alternatively, after applying a phosphor or a transparent resin mixed with a phosphor on the side surface or top surface of the light emitting element 13, the transparent resin 17 is filled inside the reflecting member 12 and thermally cured, so that the light from the light emitting element 13 is emitted. It is possible to form a light emitting device that can convert the wavelength with a phosphor and extract light having a desired wavelength spectrum. A translucent lid (not shown) can be bonded to the upper surface of the reflecting member 12 as necessary.

この発光装置は、外部電気回路から供給される駆動電流によって発光素子１３を発光させることで可視光を放出することができる。近年、この発光装置を照明用として利用するようになってきており、高輝度、放熱性の点でより高特性のものが要求されている。また、照明用として使用する場合には寿命が重要な問題となるため、長寿命な発光装置が要求されている。 This light-emitting device can emit visible light by causing the light-emitting element 13 to emit light by a drive current supplied from an external electric circuit. In recent years, this light-emitting device has been used for illumination, and a device having higher characteristics in terms of high luminance and heat dissipation is required. In addition, when used for illumination, the lifetime is an important issue, and thus a long-life light emitting device is required.

そこで、最近では発光装置の発光輝度を向上させるために、反射部材１２や基板１１をより反射率の高い材料で構成することが検討されている。
特開２００２−３４４０２９号公報 Therefore, recently, in order to improve the light emission luminance of the light emitting device, it has been studied to configure the reflecting member 12 and the substrate 11 with a material having higher reflectance.
JP 2002-344029 A

しかしながら、上記従来のパッケージは、発光素子１３が作動したときに発生した熱が効率よく放散されず、パッケージ内に熱がこもって、発光素子１３の温度が著しく上昇し、フォノン散乱などによって発光効率が低下するという問題があった。 However, the conventional package does not efficiently dissipate heat generated when the light-emitting element 13 is operated, so that heat is trapped in the package and the temperature of the light-emitting element 13 is remarkably increased. There was a problem that decreased.

また、発光素子１３が作動時に発生する熱や、外部環境の温度変化等が繰り返し印加されて、基板１１と反射部材１２との熱膨張係数差に因って発光素子１３と配線導体のパターンの実装部やパッケージに応力が生じ、発光素子収納パッケージ全体に曲げモーメントが生じるという問題があった。その結果、基板１１や基板１１と反射部材１２との結合部にクラックが発生したり、発光素子１３にピエゾ効果が生じたり、基板１１と反射部材１２、発光素子１３と基板１１とが剥離するという問題があった。このため、配線導体等に断線等の電気的接続不良が発生し、発光素子収納パッケージから放出される光の強度分布や照射面における照度分布にムラが生じたり、出力光が不安定なものとなったり、発光装置を長期間にわたって高信頼性を維持して作動することが出来ないという問題点を有していた。特に、発光装置が局部照明の用途等に使用される場合、光の強度分布や照度分布の不安定性は重要な問題点となる。 In addition, the heat generated when the light emitting element 13 is activated, the temperature change of the external environment, and the like are repeatedly applied, and the pattern of the light emitting element 13 and the wiring conductor is changed due to the difference in the thermal expansion coefficient between the substrate 11 and the reflecting member 12. There is a problem that stress is generated in the mounting portion and the package, and a bending moment is generated in the entire light emitting element storage package. As a result, a crack is generated in the substrate 11 or a joint between the substrate 11 and the reflecting member 12, a piezo effect is generated in the light emitting element 13, or the substrate 11 and the reflecting member 12, and the light emitting element 13 and the substrate 11 are peeled off. There was a problem. For this reason, an electrical connection failure such as disconnection occurs in the wiring conductor, etc., the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiation surface are uneven, or the output light is unstable. Or the light emitting device cannot be operated with high reliability over a long period of time. In particular, when the light-emitting device is used for local illumination or the like, instability of light intensity distribution and illuminance distribution is an important problem.

したがって、本発明はかかる従来の問題点に鑑みて完成されたものであり、その目的は、放熱性が高く、発光素子が発光する光を外部に均一に効率よく放射させ、光の強度分布や照度分布が安定した光学的特性が得られ、また、クラック等の不良を低減した、高品質な発光装置を提供することにある。 Therefore, the present invention has been completed in view of such conventional problems, and the object thereof is high heat dissipation, and the light emitted from the light emitting element is uniformly and efficiently radiated to the outside. An object of the present invention is to provide a high-quality light-emitting device in which optical characteristics with a stable illuminance distribution are obtained and defects such as cracks are reduced.

本発明の一つの態様によれば、発光装置は、配線導体を有する基板と、基板の上面に実装されているとともに配線導体に電気的に接続された発光素子と、発光素子を囲んでいる反射部材とを備えている。平面透視において、反射部材の側面は、基板の側面より外側に位置している。反射部材は、前記基板が配置される外部回路基板と反射部材との間に空隙が設けられるように、基板の上に設けられている。 According to one aspect of the present invention, a light emitting device includes a substrate having a wiring conductor, a light emitting element mounted on the upper surface of the substrate and electrically connected to the wiring conductor, and a reflection surrounding the light emitting element. And a member. In planar perspective, the side surface of the reflecting member is located outside the side surface of the substrate. Reflecting member, so that the gap is provided between the external circuit board and the reflecting member to which the substrate is placed, it is provided on the substrate.

本発明の発光装置は、発光素子と、発光素子が搭載された基板と、基板の上方に形成された反射面を有し、基板の側面を部分的に覆う反射部材とを有することにより、従来では、基板に接合されていた反射部材の下面外側の部位が外気に露出するため、その露出した反射部材の表面から熱を有効に放出することができる。特に、基板より外側に位置する反射部材の下面を、側面視して基板の下面の高さ位置よりも上方に位置させたことにより、基板と反射部材と外部回路基板との間に隙間が形成されて、そこに入り込んだ外気に伝えられた熱が、自然対流によって隙間から発光装置の外部上方に向かって移動する。その結果、放熱性を高くすることができる。 The light-emitting device of the present invention includes a light-emitting element, a substrate on which the light-emitting element is mounted, and a reflective member that has a reflective surface formed above the substrate and partially covers the side surface of the substrate. Then, since the site | part of the lower surface outer side of the reflecting member joined to the board | substrate is exposed to external air, heat | fever can be discharge | released effectively from the surface of the exposed reflecting member. In particular, a gap is formed between the substrate, the reflecting member, and the external circuit board by positioning the lower surface of the reflecting member located outside the substrate above the height position of the lower surface of the substrate in a side view. Then, the heat transferred to the outside air that has entered there moves from the gap toward the upper outside of the light emitting device by natural convection. As a result, heat dissipation can be increased.

また、発光素子から発生される熱を効率よく発光装置の外部に放熱できることにより、発光素子の温度が著しく上昇することを抑制できる。このためフォノン散乱などにより生じていた発光効率の低下も抑制される。 In addition, since the heat generated from the light emitting element can be efficiently dissipated to the outside of the light emitting device, the temperature of the light emitting element can be prevented from significantly increasing. For this reason, a decrease in luminous efficiency caused by phonon scattering or the like is also suppressed.

また、上述のように放熱性が高くなることに加え、基板と反射部材との接触する面積が小さくなることにより、発光素子の作動時に生じた熱や、外部環境の温度変化が繰り返し印加されても、基板と反射部材との熱膨張係数差に因る応力が生じるのを緩和できる。さらに、基板と反射部材との接触面積が小さいために、製造工程などにおいて外的な応力が反射部材に加わった場合にも、反射部材から基板に応力が伝わることを有効に抑制できる。その結果、発光素子収納パッケージ全体に生じる曲げモーメントを抑制でき、基板や、基板と反射部材との接合部におけるクラックの発生、または発光素子に生じるピエゾ効果、あるいは基板と反射部材、基板と発光素子との剥離を有効に抑制することができる。このため、配線導体等に断線等の電気的接続不良が発生せず、発光素子収納パッケージから放出される光の強度分布や照射面における照度分布のムラを抑制し、出力光を安定なものとし、発光装置を長期間にわたって高信頼性を維持して作動できる。 In addition to increasing heat dissipation as described above, the contact area between the substrate and the reflecting member is reduced, so that heat generated during operation of the light emitting element and temperature change of the external environment are repeatedly applied. However, the stress caused by the difference in thermal expansion coefficient between the substrate and the reflecting member can be reduced. Furthermore, since the contact area between the substrate and the reflecting member is small, even when an external stress is applied to the reflecting member in a manufacturing process or the like, it is possible to effectively suppress the stress from being transmitted from the reflecting member to the substrate. As a result, the bending moment generated in the entire light emitting element storage package can be suppressed, the occurrence of cracks in the substrate, the joint between the substrate and the reflecting member, or the piezo effect generated in the light emitting element, or the substrate and the reflecting member, the substrate and the light emitting element. Can be effectively suppressed. Therefore, there is no electrical connection failure such as disconnection in the wiring conductor, etc., the uneven distribution of the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiated surface is suppressed, and the output light is stabilized. The light emitting device can be operated with high reliability over a long period of time.

本発明の発光装置について以下に詳細に説明する。図１は本発明の発光装置について実施の形態の一例を示す断面図である。図１において、基板１の上面に発光素子３が搭載されており、基板１の上面には発光素子３を取り囲む反射部材２が形成されている。なお、本明細書の説明において用いられる上下左右という表現は、単に図面上の各部の位置関係を説明するものであり、実使用における位置関係を規定するものではない。 The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In FIG. 1, a light emitting element 3 is mounted on the upper surface of a substrate 1, and a reflecting member 2 surrounding the light emitting element 3 is formed on the upper surface of the substrate 1. Note that the expressions “upper, lower, left and right” used in the description of the present specification merely describe the positional relationship between the respective parts on the drawings, and do not define the positional relationship in actual use.

本発明の発光装置に用いられる発光素子収納パッケージは、上面に発光素子３の搭載部１ａを有するとともに、基板の上面から下面にかけて導電路（図示せず）を形成したセラミックス等から成る基板１と、基板１の上面に搭載部１ａを取り囲む反射面２ａを有して取着された反射部材２とを有しており、基板１の側面（外側面）を、平面視で反射部材２の側面（外側面）よりも内側に位置させるとともに、基板１よりも外側に位置する反射部材２の下面を、側面視して基板１の下面の高さ位置Ａ−Ａ’よりも上方に位置させている。 The light emitting element storage package used in the light emitting device of the present invention includes a substrate 1 made of ceramics or the like having a mounting portion 1a for the light emitting element 3 on the upper surface and a conductive path (not shown) formed from the upper surface to the lower surface of the substrate. And a reflection member 2 attached to the upper surface of the substrate 1 with a reflection surface 2a surrounding the mounting portion 1a. The side surface (outer surface) of the substrate 1 is a side surface of the reflection member 2 in plan view. The lower surface of the reflecting member 2 positioned outside the substrate 1 is positioned higher than the height position AA ′ of the lower surface of the substrate 1 when viewed from the side. Yes.

本発明の基板１は、発光素子３を支持し搭載するための支持部材として機能する。基板１には発光素子３の搭載部１ａが設けられており、発光素子３が樹脂接着剤や錫（Ｓｎ）−鉛（Ｐｂ）半田、Ａｕ−Ｓｎ等の低融点ロウ材等を介して取着される。そして、発光素子３の熱は、樹脂接着剤や低融点ロウ材を介して基板１に伝達され外部に効率よく放散されることにより、発光素子３の作動性を良好に維持する。また、発光素子３から出射される光は、反射面２ａで反射されて外部に放射される。 The substrate 1 of the present invention functions as a support member for supporting and mounting the light emitting element 3. The substrate 1 is provided with a mounting portion 1a for the light emitting element 3, and the light emitting element 3 is removed via a resin adhesive, a tin (Sn) -lead (Pb) solder, a low melting point brazing material such as Au-Sn, or the like. Worn. And the heat | fever of the light emitting element 3 maintains the operativity of the light emitting element 3 favorably by being transmitted to the board | substrate 1 via a resin adhesive and a low melting-point brazing material, and being efficiently dissipated outside. The light emitted from the light emitting element 3 is reflected by the reflecting surface 2a and emitted to the outside.

また、基板１は、酸化アルミニウム質焼結体（アルミナセラミックス）、窒化アルミニウム質焼結体、ガラスセラミックス等のセラミックス等から成り、基板１の中央部には搭載部１ａが形成されている。また、搭載部１ａの近傍からは、発光素子収納パッケージの外側にかけて導出する配線導体（図示せず）が形成されている。 The substrate 1 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, glass ceramics, and the like, and a mounting portion 1 a is formed at the center of the substrate 1. Further, a wiring conductor (not shown) is formed from the vicinity of the mounting portion 1a so as to lead out to the outside of the light emitting element storage package.

また、基板１に形成した配線導体は例えばＷ，Ｍｏ，Ｍｎ，Ｃｕ等のメタライズ層で形成しており、例えばＷ等の粉末に有機溶剤、溶媒を添加混合して得た金属ペーストを、所定パターンに印刷塗布し焼成することによって基板１に形成させる。この配線導体の表面には、酸化防止のためとボンディングワイヤ（図示せず）を強固に接続するために、厚さ０.５〜９μｍのＮｉ層や厚さ０.５〜５μｍのＡｕ層等の金属層をメッキ法により被着させておくと良い。 The wiring conductor formed on the substrate 1 is formed of a metallized layer such as W, Mo, Mn, or Cu. For example, a metal paste obtained by adding an organic solvent or a solvent to a powder such as W is mixed with a predetermined paste. The substrate 1 is formed by printing and applying to a pattern and baking. In order to prevent oxidation and to firmly connect a bonding wire (not shown) on the surface of the wiring conductor, a Ni layer having a thickness of 0.5 to 9 μm, an Au layer having a thickness of 0.5 to 5 μm, etc. The metal layer is preferably deposited by a plating method.

また、反射部材２はＡｌ，ステンレス（ＳＵＳ）,Ａｇ，鉄（Ｆｅ）−Ｎｉ−コバルト（Ｃｏ）合金，Ｆｅ−Ｎｉ合金等の金属や樹脂、セラミックス等からなる。反射部材２が金属からなる場合、内周面を研磨等の方法で鏡面化することにより、内周面を発光素子３から発せられる可視光を良好に反射することのできる反射面２ａとすることができる。また、樹脂やセラミックス等からなる場合、内周面にメッキや蒸着等で金属層を形成することにより、内周面を発光素子３から発せられる可視光を良好に反射することのできる反射面２ａとすることができる。発光素子３からの可視光の反射効率の高い反射面２ａをより簡単に製造することができるという観点、および酸化等による腐食を防止することができるという観点からは、反射部材２はＡｌやＳＵＳから成ることが好ましい。また、このような反射部材２は、金属からなる場合、その材料のインゴットに切削加工、圧延加工や打ち抜き加工等の従来周知の金属加工を施すことによって、所定形状に形成される。 The reflecting member 2 is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe) -Ni-cobalt (Co) alloy, Fe-Ni alloy, resin, ceramics, or the like. When the reflecting member 2 is made of metal, the inner peripheral surface is made to be a mirror surface by a method such as polishing, so that the inner peripheral surface is a reflecting surface 2a that can favorably reflect visible light emitted from the light emitting element 3. Can do. In the case of being made of resin, ceramics, or the like, a reflective surface 2a that can favorably reflect visible light emitted from the light emitting element 3 on the inner peripheral surface by forming a metal layer on the inner peripheral surface by plating or vapor deposition. It can be. From the viewpoint that the reflecting surface 2a having high reflection efficiency of visible light from the light emitting element 3 can be more easily manufactured and that corrosion due to oxidation or the like can be prevented, the reflecting member 2 is made of Al or SUS. Preferably it consists of. Further, when such a reflecting member 2 is made of metal, the reflecting member 2 is formed into a predetermined shape by subjecting an ingot of the material to conventionally known metal processing such as cutting, rolling, and punching.

また、基板１および反射部材２は、セラミックスから成ることがより好ましい。すなわち、基板１と発光素子３との熱膨張差が小さくなり、発光素子３から発生する熱や外部環境の熱によって発生する、基板１と発光素子３との間の応力が抑制される。さらに、基板１と反射部材２との熱膨張係数差に起因して発生する、基体１と反射部材２との接合部における応力や反射面２ａの変形が抑制される。さらにまた、セラミックスは透水性が小さいので、基板１および反射部材２から水分が浸入することによる耐水性を向上できる。また、樹脂材料や金属材料と比して、セラミックスは、例えば、Ｐｂ（鉛）−Ｓｎ（錫）半田やＡｕ（金）−Ｓｎ半田、Ａｕ−Ｓｉ（珪素）半田、Ａｕ−Ｇｅ（ゲルマニウム）半田、Ｓｎ−Ａｇ（銀）半田、Ｓｎ−Ａｇ−Ｃｕ（銅）半田等の半田による半田付け時に熱変質を生じにくく、さらに、大気や大気中の水分や酸素等によるセラミックス表面の酸化や腐食も少ないことから、基板および反射部材の反射率の劣化を抑制できる。その結果、発光装置は、長期間にわたり光出力の低下を抑制しつつ発光素子３を安定して作動させることができる。 The substrate 1 and the reflecting member 2 are more preferably made of ceramics. That is, the difference in thermal expansion between the substrate 1 and the light emitting element 3 is reduced, and the stress between the substrate 1 and the light emitting element 3 generated by heat generated from the light emitting element 3 or heat of the external environment is suppressed. Further, the stress at the joint between the base 1 and the reflecting member 2 and the deformation of the reflecting surface 2a, which are caused by the difference in thermal expansion coefficient between the substrate 1 and the reflecting member 2, are suppressed. Furthermore, since the water permeability of ceramics is small, it is possible to improve the water resistance due to moisture entering from the substrate 1 and the reflecting member 2. In addition, compared with resin materials and metal materials, ceramics are, for example, Pb (lead) -Sn (tin) solder, Au (gold) -Sn solder, Au-Si (silicon) solder, Au-Ge (germanium). Thermal degradation is unlikely to occur during soldering with solder such as solder, Sn-Ag (silver) solder, Sn-Ag-Cu (copper) solder, and oxidation and corrosion of the ceramic surface due to air, moisture, oxygen, etc. Therefore, deterioration of the reflectance of the substrate and the reflecting member can be suppressed. As a result, the light emitting device can stably operate the light emitting element 3 while suppressing a decrease in light output over a long period of time.

発光素子３が窒化ガリウム系化合物半導体の場合、発光層が形成される基体として、熱膨張係数が約５×10-6／℃であるサファイア基体が用いられる。また、発光素子３がガリウム砒素系化合物半導体の場合、ガリウム砒素系化合物半導体の熱膨張係数は約６×10-6／℃である。また、基体１および反射部材２として酸化アルミニウム質焼結体を用いる場合、酸化アルミニウム質焼結体の熱膨張係数は約６×10-6／℃であり、上記の発光素子３との熱膨張係数差を小さくできる。一方、基体１がエポキシ樹脂や液晶ポリマ（ＬＣＰ）樹脂から成る場合、熱膨張係数が約20×10-6／℃となり、上記の発光素子３との熱膨張係数差が大きくなり、基体１と発光素子３との接合部に応力が集中し、発光素子３がフリップチップ実装される発光装置では電気的な接続不良が発生し、発光素子３を正常に作動させることができなくなる場合がある。また、基体１と発光素子３との接合部に発生する応力が発光素子３の発光層に集中するため、発光素子３はピエゾ効果による波長のズレが発生するとともに、発光装置から放出される光の色が変化したり、強度がバラついたり、光ムラが発生したりして、照明装置に用いる光源として良好な照明光を得ることが難しくなる。 When the light emitting element 3 is a gallium nitride compound semiconductor, a sapphire substrate having a thermal expansion coefficient of about 5 × 10 −6 / ° C. is used as the substrate on which the light emitting layer is formed. When the light emitting element 3 is a gallium arsenide compound semiconductor, the thermal expansion coefficient of the gallium arsenide compound semiconductor is about 6 × 10 −6 / ° C. When an aluminum oxide sintered body is used as the substrate 1 and the reflecting member 2, the aluminum oxide sintered body has a thermal expansion coefficient of about 6 × 10 −6 / ° C., and the thermal expansion with the light emitting element 3 described above. The coefficient difference can be reduced. On the other hand, when the substrate 1 is made of an epoxy resin or a liquid crystal polymer (LCP) resin, the thermal expansion coefficient is about 20 × 10 −6 / ° C., and the difference in thermal expansion coefficient from the light emitting element 3 is increased. In some cases, stress concentrates on the joint with the light emitting element 3, and in the light emitting device in which the light emitting element 3 is flip-chip mounted, an electrical connection failure occurs, and the light emitting element 3 cannot be operated normally. In addition, since the stress generated at the junction between the substrate 1 and the light emitting element 3 is concentrated on the light emitting layer of the light emitting element 3, the light emitting element 3 generates a wavelength shift due to the piezo effect and light emitted from the light emitting device. It is difficult to obtain good illumination light as a light source used in the illumination device because the color of the light source changes, the intensity varies, or the light unevenness occurs.

また、基板１および反射部材２は、白色系のセラミックス、例えば、酸化アルミニウム質焼結体，酸化ジルコニウム質焼結体（ジルコニアセラミックス）、酸化イットリウム質焼結体（イットリアセラミックス）または酸化チタン質焼結体（チタニアセラミックス）から成ることがより好ましい。なお、白色系とは、少なくとも紫外領域から可視光領域にわたる反射率の最大値と最小値との差分が、10％以内の反射特性を有するものである。基板１および反射部材２に白色系のセラミックスを用いることにより、紫外領域から可視光領域にわたって効率のよい波長依存性の少ない反射部材２とできる。 The substrate 1 and the reflecting member 2 are made of white ceramics such as an aluminum oxide sintered body, a zirconium oxide sintered body (zirconia ceramics), an yttrium oxide sintered body (yttria ceramics), or a titanium oxide sintered body. More preferably, it is made of a knot (titania ceramics). Note that the white system has a reflection characteristic in which the difference between the maximum value and the minimum value of the reflectance from at least the ultraviolet region to the visible light region is within 10%. By using white ceramics for the substrate 1 and the reflecting member 2, the reflecting member 2 can be made efficient and less wavelength dependent from the ultraviolet region to the visible light region.

そして、反射部材２は、基板１の上面に搭載部１ａを取り囲むように形成されており、反射部材２の外側面は、基板１よりも外側に位置させているとともに、基板１よりも外側に位置する反射部材２の下面を、側面視して基板１の下面の高さ位置Ａ−Ａ’よりも上方に位置させている。このため、基板１と反射部材２との接触面積が小さくなり、従来では、基板１１に接合していた反射部材１２の部位が外気に露出するため、その露出した反射部材２の表面から熱を有効に放出することができる。 The reflecting member 2 is formed on the upper surface of the substrate 1 so as to surround the mounting portion 1a, and the outer surface of the reflecting member 2 is positioned outside the substrate 1 and outside the substrate 1. The lower surface of the reflecting member 2 is positioned above the height position AA ′ of the lower surface of the substrate 1 when viewed from the side. For this reason, the contact area between the substrate 1 and the reflection member 2 is reduced, and the portion of the reflection member 12 that is conventionally bonded to the substrate 11 is exposed to the outside air, so heat is applied from the exposed surface of the reflection member 2. It can be effectively released.

また、基板１よりも外側に位置する反射部材２の下面を、側面視して基板１の下面の高さ位置Ａ−Ａ’よりも上方に位置させたことにより、基板１と反射部材２と外部回路基板４との間に隙間が形成される。この隙間に外気が入り込み、外気が自然対流を起こすことによって、反射部材２から隙間に存在する外気に伝えられた熱が発光装置外部の上方へと移動し、放熱性をさらに高くすることができる。 Further, the lower surface of the reflecting member 2 positioned outside the substrate 1 is positioned above the height position AA ′ of the lower surface of the substrate 1 in a side view, whereby the substrate 1 and the reflecting member 2 A gap is formed between the external circuit board 4 and the external circuit board 4. When the outside air enters the gap and the outside air causes natural convection, the heat transferred from the reflecting member 2 to the outside air existing in the gap moves to the outside of the light emitting device, and the heat dissipation can be further enhanced. .

また、このようにして発光素子３の放熱性が高まるため、発光素子３が高温になって劣化し、発光強度が低下することを抑制できる。 Moreover, since the heat dissipation of the light emitting element 3 is increased in this manner, the light emitting element 3 can be prevented from being deteriorated at a high temperature and the emission intensity being lowered.

また、基板１と接触する反射部材２の表面積を小さくできることにより、発光素子３の作動時に生じた熱や、外部環境の温度変化が繰り返し印加されても、基板１と反射部材２との熱膨張係数差に因る応力が生じるのを緩和できる。さらに、基板１と反射部材２との接触面積が小さいために、製造工程などにおいて外的な応力が反射部材２に加わった場合にも、反射部材２から基板１に応力が伝わることを有効に抑制できる。その結果、発光素子収納パッケージ全体に生じる曲げモーメントを抑制でき、基板１や、基板１と反射部材２との接合部におけるクラックの発生、または発光素子３に生じるピエゾ効果、あるいは基板１と反射部材２との剥離を有効に抑制することができる。従って、配線導体等に断線等の電気的接続不良が発生せず、発光素子収納パッケージから放出される光の強度分布や照射面における照度分布のムラを抑制し、出力光を安定なものとし、長期間にわたって高信頼性を維持して発光装置を作動できる。 Further, since the surface area of the reflecting member 2 in contact with the substrate 1 can be reduced, the thermal expansion between the substrate 1 and the reflecting member 2 can be achieved even when heat generated during the operation of the light emitting element 3 or temperature changes in the external environment are repeatedly applied. It is possible to mitigate the occurrence of stress due to the coefficient difference. Further, since the contact area between the substrate 1 and the reflecting member 2 is small, it is effective that the stress is transmitted from the reflecting member 2 to the substrate 1 even when an external stress is applied to the reflecting member 2 in a manufacturing process or the like. Can be suppressed. As a result, the bending moment generated in the entire light emitting element storage package can be suppressed, the generation of cracks in the substrate 1 or the joint between the substrate 1 and the reflecting member 2, the piezo effect generated in the light emitting element 3, or the substrate 1 and the reflecting member. 2 can be effectively suppressed. Therefore, electrical connection defects such as disconnection do not occur in the wiring conductor, etc., suppressing unevenness in the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiated surface, and stabilizing the output light, The light emitting device can be operated while maintaining high reliability over a long period of time.

さらに、基板１から反射部材２へと熱が移動する経路が狭くなるため、基板１から反射部材２へ熱が伝達されるのを有効に防げ、熱による反射部材２の歪み等が生じにくくなるため、発光素子３で発生した光を安定に外部に放出できる。 Furthermore, since the path through which heat moves from the substrate 1 to the reflecting member 2 is narrowed, it is possible to effectively prevent heat from being transferred from the substrate 1 to the reflecting member 2, and distortion of the reflecting member 2 due to heat is less likely to occur. Therefore, the light generated in the light emitting element 3 can be stably emitted to the outside.

また、好ましくは図３に示すように基板１の外側面を、平面視で反射部材２の外側面よりも内側に位置させるとともに、基板１よりも外側に位置する反射部材２の下面を、側面視して基板１の上面の高さ位置Ｂ−Ｂ’上か、または基板１の上面の高さ位置Ｂ−Ｂ’よりも上方に位置させるのがよい。基板１の上面の高さ位置Ｂ−Ｂ’よりも上方に反射部材２を位置させることによって、基板１と反射部材２と外部回路基板４との間の隙間がより大きくなるとともに基板１の全外側面が外気に露出するため、放熱性をより向上させることができる。 Further, preferably, as shown in FIG. 3, the outer surface of the substrate 1 is positioned on the inner side of the outer surface of the reflecting member 2 in a plan view, and the lower surface of the reflecting member 2 positioned on the outer side of the substrate 1 is As viewed, it may be positioned above the height position BB ′ of the upper surface of the substrate 1 or above the height position BB ′ of the upper surface of the substrate 1. By positioning the reflecting member 2 above the height position BB ′ on the upper surface of the substrate 1, the gap between the substrate 1, the reflecting member 2, and the external circuit substrate 4 becomes larger and all of the substrate 1 is Since the outer surface is exposed to the outside air, the heat dissipation can be further improved.

また、図５で示すように基板１の上面に接着させた反射部材２の外面を、上方に反るように形成すると、基板１と反射部材２との隙間がより大きくなるため、隙間に熱がこもるのを有効に抑制できるとともに、基板１の側面から上方向への外気の自然対流が起こりやすくなり、さらに放熱性が高まるので好ましい。たとえ、発光素子３の熱が基板１に伝わり、基板１から反射部材２に熱が伝わっても、基板１と反射部材２と外部回路基板４との間の隙間が大きくなるため、熱がより対流しやすくなり、より熱を外部に放熱しやすくなる。その結果、高温に因る発光素子３の劣化や、発光強度の低下をより有効に抑制できる。そして、発光素子収納パッケージから放出される光の強度分布や照射面における照度分布にムラが生じず、より安定した光を出力し、発光装置を長期間にわたり高信頼性でかつ安定して作動することができる。 Further, as shown in FIG. 5, when the outer surface of the reflecting member 2 bonded to the upper surface of the substrate 1 is formed to warp upward, the gap between the substrate 1 and the reflecting member 2 becomes larger, so that the gap is heated. It is preferable because it is possible to effectively suppress the accumulation, and natural convection of the outside air from the side surface of the substrate 1 tends to occur upward, and the heat dissipation is further improved. Even if the heat of the light emitting element 3 is transferred to the substrate 1 and the heat is transferred from the substrate 1 to the reflecting member 2, the gap between the substrate 1, the reflecting member 2 and the external circuit board 4 is increased, so that the heat is further increased. It becomes easier to convection, and it becomes easier to dissipate heat to the outside. As a result, it is possible to more effectively suppress the deterioration of the light emitting element 3 due to the high temperature and the decrease in light emission intensity. In addition, there is no unevenness in the intensity distribution of light emitted from the light-emitting element storage package and the illuminance distribution on the irradiation surface, and more stable light is output, and the light-emitting device operates with high reliability and stability over a long period of time. be able to.

また、基板１の側面は傾斜するのが好ましい。なぜなら基板１の側面が傾斜することで基板１が外気に露出する表面積が大きくなるためであり、これによって発光素子３から発生した熱を基板１から発光装置外部に効率よく放熱できるためである。 Further, the side surface of the substrate 1 is preferably inclined. This is because the side surface of the substrate 1 is inclined to increase the surface area of the substrate 1 that is exposed to the outside air, whereby heat generated from the light emitting element 3 can be efficiently radiated from the substrate 1 to the outside of the light emitting device.

特に、図６で示したように、基板１の深さ方向に伴って基板１の断面積が大きくなるように基板１が形成される場合、外部回路基板４により大きな面積で接続することができるため、発光素子３で発生した熱がより発光装置外部に拡散されやすくなり、より効率よく熱の放散をすることができ好ましい。 In particular, as shown in FIG. 6, when the substrate 1 is formed so that the cross-sectional area of the substrate 1 increases in the depth direction of the substrate 1, the external circuit substrate 4 can be connected with a larger area. Therefore, heat generated in the light emitting element 3 is more easily diffused to the outside of the light emitting device, and heat can be more efficiently dissipated, which is preferable.

また、反射部材２と接する部位の基板１の面積は、反射部材２の下面の面積に対して３分の２倍を超えると、反射部材２と基板１との接触面積とが大きくなりすぎ、反射部材２の下面が外気に十分に露出されず、また外気の自然対流も生じ難くなり、放熱性が悪くなるとともに、反射部材２と基板１との熱膨張係数差に因る応力を抑制し難くなる。また、２０分の１倍未満であると、基板１が反射部材２を十分に保持できず、反射部材２の安定性が欠けてしまう。よって、放熱性および安定性の観点から、反射部材２と接する部位の基板１の面積は、反射部材２の下面の面積に対して２０分の１倍以上３分の２倍以下とするのが好ましい。 Further, if the area of the substrate 1 in contact with the reflecting member 2 exceeds two thirds of the area of the lower surface of the reflecting member 2, the contact area between the reflecting member 2 and the substrate 1 becomes too large. The lower surface of the reflecting member 2 is not sufficiently exposed to the outside air, and natural convection of the outside air is less likely to occur, heat dissipation is deteriorated, and stress due to the difference in thermal expansion coefficient between the reflecting member 2 and the substrate 1 is suppressed. It becomes difficult. On the other hand, if the ratio is less than 1/20, the substrate 1 cannot sufficiently hold the reflecting member 2, and the stability of the reflecting member 2 is lost. Therefore, from the viewpoint of heat dissipation and stability, the area of the substrate 1 in contact with the reflecting member 2 should be set to 1/20 or less to 2/3 or less of the area of the lower surface of the reflecting member 2. preferable.

図７に、外部回路基板に実装した実施の形態の参考例を示す。反射部材２と基板１と外部回路基板４との隙間に放熱性のよい金属や導電性樹脂などを形成してもよい。これにより、隙間に形成した金属６などを介して外部へ放熱するとともに、金属６等が発光素子収納パッケージを保持し、外部回路基板とのズレを抑制して、長期間にわたり正常かつ安定に作動させることができる。

FIG. 7 shows a reference example of the embodiment mounted on an external circuit board. A metal or conductive resin having good heat dissipation may be formed in the gap between the reflecting member 2, the substrate 1, and the external circuit substrate 4. As a result, heat is radiated to the outside through the metal 6 formed in the gap, and the metal 6 etc. holds the light emitting element storage package, suppresses the deviation from the external circuit board, and operates normally and stably over a long period of time. Can be made.

なお、光反射面２ａは、その断面形状が図１に示すように平坦（直線状）であってもよく、また、図４に示すように円弧状（曲面状）であってもよい。円弧状とする場合、発光素子３の光をまんべんなく反射させて指向性の高い光を外部により均一に放射することができる。 The light reflecting surface 2a may be flat (straight) as shown in FIG. 1, or may be arcuate (curved) as shown in FIG. In the case of the circular arc shape, the light from the light emitting element 3 can be evenly reflected so that highly directional light can be radiated uniformly from the outside.

また、さらに好ましくは、基板１の外側面が、平面視で反射部材２の外側面よりも全周にわたって内側に位置するのが好ましい。これにより、基板１の外側面が、平面視で反射部材２の外側面よりも全周にわたって内側に位置する前よりも、容量の大きい外気層が存在することとなり、発光素子３の作動時に発生する熱が反射部材２から外部にさらに有効に放熱でき、基板１と反射部材２との熱膨張係数差に起因する発光素子収納パッケージ内部に生じる応力や、製造工程において発光素子収納パッケージに生じる応力が、反射部材２から基板１に伝わることをさらに有効に緩和できる。その結果、反射部材２から基板１に伝わる曲げモーメントをさらに抑制でき、基板１にクラックや割れ、発光素子３が基板１から剥離するのを、一層抑制できる。 More preferably, the outer surface of the substrate 1 is preferably located on the inner side over the entire circumference of the outer surface of the reflecting member 2 in plan view. As a result, an outside air layer having a larger capacity exists than before the outside surface of the substrate 1 is located on the inner side over the entire circumference of the outside surface of the reflecting member 2 in plan view, and is generated when the light emitting element 3 is operated. Heat can be radiated more effectively from the reflecting member 2 to the outside, and stress generated in the light emitting element storage package due to the difference in thermal expansion coefficient between the substrate 1 and the reflecting member 2 or stress generated in the light emitting element storage package in the manufacturing process However, transmission from the reflecting member 2 to the substrate 1 can be more effectively mitigated. As a result, the bending moment transmitted from the reflecting member 2 to the substrate 1 can be further suppressed, and cracks and cracks in the substrate 1 and separation of the light emitting element 3 from the substrate 1 can be further suppressed.

また、好ましくは反射面２ａは、基板１の上面に対して３５〜７０度の角度で傾斜しているのがよい。これにより、搭載部１ａに搭載した発光素子３の光を、傾斜した反射面２ａで良好に反射させ、外部に放射角度４５度以内の範囲で光を良好に放射することができ、本発明の発光素子収納パッケージを使用した発光装置の発光効率や輝度、光度を極めて高いものとすることができる。なお、光の放射角度とは、発光素子３の中心を通る基板１に直交する平面上での光の広がりの角度のことであり、反射部材２の横断面における開口形状が円形状であれば放射角度は反射面２ａの全周にわたって一定である。また、反射部材２の横断面における開口形状が楕円形状などの偏りがある場合は、放射角度はその最大値である。 The reflecting surface 2a is preferably inclined at an angle of 35 to 70 degrees with respect to the upper surface of the substrate 1. As a result, the light of the light emitting element 3 mounted on the mounting portion 1a can be favorably reflected by the inclined reflecting surface 2a, and the light can be radiated to the outside within a range of a radiation angle of 45 degrees or less. The light emission efficiency, luminance, and luminous intensity of the light emitting device using the light emitting element storage package can be made extremely high. The light emission angle is an angle of light spread on a plane orthogonal to the substrate 1 passing through the center of the light emitting element 3, and if the opening shape in the cross section of the reflecting member 2 is circular. The radiation angle is constant over the entire circumference of the reflecting surface 2a. In addition, when the opening shape in the cross section of the reflecting member 2 is biased such as an elliptical shape, the radiation angle is the maximum value.

また、反射面２ａは、基板１の上面となす角度が３５度未満になると放射角度が４５度を超えて広がり、分散した光の量が多くなり、光の輝度や光度が低下しやすくなる。一方、角度が７０度を超えると、発光素子収納パッケージの外部に発光素子３の光が良好に放射されずに発光素子収納パッケージ内で乱反射しやすくなる。 In addition, when the angle between the reflection surface 2a and the upper surface of the substrate 1 is less than 35 degrees, the radiation angle spreads beyond 45 degrees, the amount of dispersed light increases, and the brightness and brightness of light tend to decrease. On the other hand, when the angle exceeds 70 degrees, the light from the light emitting element 3 is not emitted well outside the light emitting element accommodation package, and is easily diffusely reflected in the light emitting element accommodation package.

なお、反射面２ａの形状が逆円錐状である場合は、反射面２ａと基板１の上面とのなす角度を全周にわたって３５〜７０度とするのがよい。また、反射面２ａの形状が四角錐状である場合は、少なくとも一対の対向する内面が基板の上面に対して３５〜７０度で傾斜しているのがよい。好ましくは、内面の全面が基板１の上面に対して３５〜７０度で傾斜しているのがよい。これにより、発光効率をきわめて高いものとすることができる。 In addition, when the shape of the reflective surface 2a is an inverted conical shape, the angle formed by the reflective surface 2a and the upper surface of the substrate 1 is preferably 35 to 70 degrees over the entire circumference. Moreover, when the shape of the reflective surface 2a is a quadrangular pyramid shape, it is preferable that at least a pair of opposed inner surfaces be inclined at 35 to 70 degrees with respect to the upper surface of the substrate. Preferably, the entire inner surface is inclined at 35 to 70 degrees with respect to the upper surface of the substrate 1. Thereby, the luminous efficiency can be made extremely high.

また、反射面２ａの算術平均粗さＲａは、０.００４〜４μｍとするのが好ましい。即ち、反射面２ａの算術平均粗さＲａが、４μｍを超える場合、発光素子収納パッケージに収容された発光素子３の光を正反射させて発光素子収納パッケージの上方に出射させることが困難になり、光強度が減衰したり偏りが発生したりしやすくなる。また、反射面２ａの算術平均粗さＲａが０.００４μｍ未満の場合、このような面を安定かつ効率よく形成することが困難となるとともに、製品コストが高くなりやすい。なお、反射面２ａのＲａを上記の範囲とするには、従来周知の電解研磨加工，化学研磨加工もしくは切削加工により形成することができる。また、金型の面精度を利用した転写加工により形成する方法を用いてもよい。 Moreover, it is preferable that arithmetic mean roughness Ra of the reflective surface 2a shall be 0.004-4 micrometers. That is, when the arithmetic average roughness Ra of the reflecting surface 2a exceeds 4 μm, it becomes difficult to regularly reflect the light of the light emitting element 3 accommodated in the light emitting element accommodation package and emit it above the light emitting element accommodation package. The light intensity is easily attenuated or biased. Further, when the arithmetic average roughness Ra of the reflecting surface 2a is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. In addition, in order to make Ra of the reflective surface 2a into said range, it can form by a conventionally well-known electrolytic polishing process, a chemical polishing process, or a cutting process. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

また、反射部材２は、図８（ａ），（ｂ）の断面図および一部を切断した斜視図に示すように、反射部材２の外側面２ｂを取り囲むように設けられた反射枠体８を備えていることがより好ましい。反射枠体８は、Ａｌ，ＳＵＳ,Ａｇ，Ｆｅ−Ｎｉ−Ｃｏ合金，Ｆｅ−Ｎｉ合金，Ｃｕ−Ｗ合金等の金属、アルミナセラミックス，ジルコニアセラミックス，イットリアセラミックスまたはチタニアセラミックス等のセラミックス、または、テフロン（登録商標）樹脂，フッ素系樹脂，液晶ポリマー，エポキシ樹脂，シリコーン樹脂，アクリル樹脂，ポリカーボネート等の樹脂等から成り、反射部材２の外周に嵌着または樹脂接着剤１０を介して反射部材２の外周に接合される。 In addition, as shown in the sectional views of FIGS. 8A and 8B and a perspective view in which a part of the reflecting member 2 is cut, the reflecting frame 8 is provided so as to surround the outer surface 2b of the reflecting member 2. It is more preferable to have. The reflective frame 8 is made of metal such as Al, SUS, Ag, Fe—Ni—Co alloy, Fe—Ni alloy, Cu—W alloy, ceramics such as alumina ceramics, zirconia ceramics, yttria ceramics, titania ceramics, or Teflon. (Registered trademark) Resin, fluorine resin, liquid crystal polymer, epoxy resin, silicone resin, acrylic resin, polycarbonate, etc., and the like. Joined to the outer periphery.

これにより、発光素子収納パッケージの製造工程において、発光素子収納パッケージに熱が繰り返し加えられたり、発光装置を作動させる際に発生する発光素子３からの熱や外部環境による熱が反射部材２に伝達されたりしても、反射部材２の熱による変形、すなわち熱膨張または熱収縮が、反射枠体８によって拘束されて抑制される。その結果、基板１と反射部材２との接合部に集中する応力やクラックの発生、または基板１と反射部材２との剥離を抑制できるとともに、発光装置から放出される光の配光分布の変動を抑制できる。さらに、反射枠体８は、発光装置を作動させる際に、発光素子３から反射部材２へ伝導される熱を効率よく大気中に放散できる構成とすることもできる。 Thereby, in the manufacturing process of the light emitting element storage package, heat is repeatedly applied to the light emitting element storage package, or heat from the light emitting element 3 generated when the light emitting device is operated or heat from the external environment is transmitted to the reflecting member 2. Even if it is done, deformation due to heat of the reflecting member 2, that is, thermal expansion or contraction, is restrained by the reflecting frame 8 and suppressed. As a result, it is possible to suppress the occurrence of stress and cracks concentrated on the joint between the substrate 1 and the reflecting member 2, or the separation between the substrate 1 and the reflecting member 2, and the fluctuation of the light distribution of light emitted from the light emitting device. Can be suppressed. Furthermore, the reflective frame 8 can be configured to efficiently dissipate heat conducted from the light emitting element 3 to the reflective member 2 into the atmosphere when the light emitting device is operated.

例えば、熱膨張係数が約25×10-6／℃、ヤング率が約70ＧＰａであるＡｌから成る反射部材２の外側面２ｂに、熱膨張係数が約６×10-6／℃、ヤング率が約280ＧＰａである酸化アルミニウム質焼結体から成る反射枠体８を取着する場合、反射部材２より熱膨張や熱収縮が小さく剛性が高い反射枠体８が、反射部材２の水平方向に膨張するような変形を拘束して抑制できる。その結果、発光素子収納パッケージおよび発光装置は、反射部材２の変形によって発生する、基板１と反射部材２との接合部において集中する応力やクラックの発生、あるいは基板１と反射部材２との剥離や、発光装置から放出される光の配光分布の変動を抑制できる。さらに、反射枠体８が反射部材２の水平方向への熱膨張による変形または熱収縮によって発生する、基板１への曲げモーメントを抑制できることにより、発光素子収納パッケージおよび発光装置は、配線導体等に断線等の電気的接続不良が発生せずに歩留まり良く製造される。従って、発光素子収納パッケージおよび発光装置は、長期間にわたって気密性が保持されるとともに正常に作動させることができる。 For example, the outer surface 2b of the reflecting member 2 made of Al having a thermal expansion coefficient of about 25 × 10 −6 / ° C. and a Young's modulus of about 70 GPa has a thermal expansion coefficient of about 6 × 10 −6 / ° C. and a Young's modulus. When attaching the reflective frame body 8 made of an aluminum oxide sintered body of about 280 GPa, the reflective frame body 8 having a smaller thermal expansion and thermal shrinkage and higher rigidity than the reflective member 2 expands in the horizontal direction of the reflective member 2. Such deformation can be restrained and restrained. As a result, in the light emitting element storage package and the light emitting device, stress or cracks concentrated at the joint between the substrate 1 and the reflecting member 2 generated due to the deformation of the reflecting member 2, or peeling between the substrate 1 and the reflecting member 2 occur. In addition, fluctuations in the light distribution of light emitted from the light emitting device can be suppressed. Furthermore, since the reflecting frame 8 can suppress bending moment to the substrate 1 caused by deformation or thermal contraction of the reflecting member 2 due to thermal expansion in the horizontal direction, the light emitting element storage package and the light emitting device can be connected to a wiring conductor or the like. It is manufactured with good yield without causing electrical connection failure such as disconnection. Accordingly, the light-emitting element storage package and the light-emitting device can be normally operated while maintaining airtightness for a long period of time.

また、例えば熱伝導率が約20Ｗ／ｍ・Ｋである酸化アルミニウム質焼結体から成る反射部材２の外側面２ｂに、熱伝導率が約200Ｗ／ｍ・ＫであるＡｌから成る反射枠体８を取着する場合、発光装置を作動させる際の発光素子３から反射部材２に伝導した熱が、反射部材２の内部に籠もらず、接着剤10を介して反射枠体８に伝導される。このように、発光装置は、その外表面でかつ発光装置の垂直方向に、熱伝導率が大きい反射枠体８が配置されることにより、発光装置の放熱面積を増加させることができ、反射部材２の熱膨張や熱収縮による変形が抑制され、発光装置は所望の配光分布を有する光を安定して放出することができるとともに、発光素子３の波長変動や光特性の劣化を抑制できる。 Further, for example, on the outer surface 2b of the reflecting member 2 made of an aluminum oxide sintered body having a thermal conductivity of about 20 W / m · K, a reflecting frame made of Al having a thermal conductivity of about 200 W / m · K. 8, the heat conducted from the light emitting element 3 to the reflecting member 2 when the light emitting device is operated is not conducted inside the reflecting member 2 but is conducted to the reflecting frame 8 through the adhesive 10. The Thus, the light emitting device can increase the heat dissipation area of the light emitting device by disposing the reflective frame 8 having a large thermal conductivity on the outer surface and in the vertical direction of the light emitting device, and thus the reflecting member. 2 is suppressed, and the light emitting device can stably emit light having a desired light distribution, and can suppress the wavelength variation of the light emitting element 3 and the deterioration of optical characteristics.

また、反射枠体８は、アルミニウムから成ることがより好ましい。これにより、反射枠体８は、酸化による不動態膜が形成されて反射率の変化が少なくなるので、発光素子３からの光を効率よくかつ作動環境による反射率の変化が少ない発光素子収納パッケージを作製できる。また、アルミニウムは、紫外領域から可視光領域における反射率の波長依存性が少ないので、発光素子３から発する紫外領域から可視光領域の光の波長が変化しても、光出力の変動が少ない安定した光出力を維持できる発光装置を作製できる。 Moreover, it is more preferable that the reflection frame 8 is made of aluminum. As a result, the reflection frame 8 is formed with a passivated film due to oxidation, and the change in reflectance is reduced. Therefore, the light-emitting element storage package that efficiently emits light from the light-emitting element 3 and has little change in reflectance due to the operating environment. Can be produced. In addition, since aluminum has less wavelength dependency of reflectance from the ultraviolet region to the visible light region, even if the light wavelength from the ultraviolet region to the visible light region emitted from the light emitting element 3 is changed, the light output fluctuation is small and stable. Thus, a light emitting device capable of maintaining the light output can be manufactured.

さらに、アルミニウムから成る反射枠体８を用いることにより、酸化アルミニウム質焼結体等から成る透光性の反射部材２を透過して反射部材２の側面から出る光を遮光することができる。これによって、発光装置を表示用の光源として用いる際には、発光装置の発光面と非発光面とのコントラストがより明確になり、表示用の光源として視認性の優れた発光装置を作製できる。また、発光素子３が青色領域から紫外領域において発光するものである場合には、反射部材２を透過する高エネルギー光を遮光することができることになる。 Further, by using the reflecting frame 8 made of aluminum, it is possible to block the light emitted from the side surface of the reflecting member 2 through the translucent reflecting member 2 made of an aluminum oxide sintered body or the like. Accordingly, when the light-emitting device is used as a light source for display, the contrast between the light-emitting surface and the non-light-emitting surface of the light-emitting device becomes clearer, and a light-emitting device with excellent visibility can be manufactured as a light source for display. Further, when the light emitting element 3 emits light in the blue region to the ultraviolet region, the high energy light transmitted through the reflecting member 2 can be shielded.

さらに反射部材２と基板１との接合は、シリコーン系やエポキシ系等の樹脂接着剤や、Ａｇ−Ｃｕロウ等の金属ロウ材やＰｂ−Ａｕ−Ｓｎ−Ａｕ−Ｓｎ−ケイ素（Ｓｉ）,Ｓｎ−Ａｇ−Ｃｕ等の半田等により行われる。なお、このような接着剤や半田等の接合材は、基板１および反射部材２の材質や熱膨張係数等を考慮して適宜選定すればよく、特に限定されるものではない。また、基板１と反射部材２との接合の高信頼性が必要とされる場合、好ましくは金属ロウ材や半田により接合するのがよい。 Further, the reflective member 2 and the substrate 1 are joined by a resin adhesive such as silicone or epoxy, a metal brazing material such as Ag-Cu brazing, Pb-Au-Sn-Au-Sn-silicon (Si), Sn. -It is performed with solder such as Ag-Cu. Such a bonding material such as an adhesive and solder may be appropriately selected in consideration of the material of the substrate 1 and the reflecting member 2, the thermal expansion coefficient, and the like, and is not particularly limited. In addition, when high reliability of bonding between the substrate 1 and the reflecting member 2 is required, it is preferable to bond with a metal brazing material or solder.

かくして、本発明の発光装置に用いられる発光素子収納パッケージは、基板１の搭載部１ａに発光素子３を搭載するとともに、発光素子３をＡｕやＡｌ等のボンディングワイヤおよび配線導体を介して発光素子収納パッケージの外部の外部電気回路に電気的に導通させることができる。そして、反射部材２の内側に透明樹脂等の透光性部材５を充填し熱硬化させて発光素子３を覆う被覆層を形成し、必要に応じて反射部材２の上面に透光性の蓋体（図示せず）を半田や樹脂接着剤等で接合することにより本発明の発光装置となる。または、発光素子３の側面や上面に蛍光体もしくは蛍光体を混入した透明樹脂等を塗布した後、発光素子３を覆う透光性部材５を充填し熱硬化させ、反射部材２の上面に透光性の蓋体を半田や樹脂接着剤等で接合することにより、発光素子３の光を蛍光体により波長変換し所望の波長スペクトルを有する光を取り出すことができる発光装置となる。 Thus, in the light emitting element storage package used in the light emitting device of the present invention, the light emitting element 3 is mounted on the mounting portion 1a of the substrate 1, and the light emitting element 3 is connected to the light emitting element 3 via bonding wires and wiring conductors such as Au and Al. It can be electrically connected to an external electric circuit outside the storage package. Then, a translucent member 5 such as a transparent resin is filled inside the reflecting member 2 and thermally cured to form a coating layer that covers the light emitting element 3, and a translucent lid is formed on the upper surface of the reflecting member 2 as necessary. A light emitting device of the present invention is obtained by bonding a body (not shown) with solder, a resin adhesive, or the like. Alternatively, a phosphor or a transparent resin mixed with a phosphor is applied to the side surface and the upper surface of the light emitting element 3, and then the light transmissive member 5 covering the light emitting element 3 is filled and thermally cured. By joining the optical lid with solder, resin adhesive, or the like, the light emitting device 3 is capable of taking out light having a desired wavelength spectrum by converting the wavelength of the light from the light emitting element 3 using a phosphor.

また、本発明の発光装置は、図９（ａ），（ｂ）の断面図および一部断面斜視図に示すように、上記の発光素子収納パッケージと、搭載部１ａに搭載された発光素子３と、反射枠体８の開口部を塞ぐように配置された、発光素子３からの光の一部または全部を波長変換する波長変換部材９とを備えているものである。これにより、発光装置は、発光素子３から発生する熱に起因した波長変換部材９の特性劣化を抑制できる。すなわち、波長変換部材９を反射枠体８の上端面８ｂに配置する場合、発光素子３から波長変換部材９までの放熱経路が長くなり熱抵抗が増加するとともに、例えば、接着剤１０にシリコーン樹脂やアクリル樹脂，エポキシ樹脂等の樹脂接着剤を用いた際は、これらの樹脂接着剤によって発光素子３から波長変換部材９までの熱抵抗がより増加し、発光素子３からの熱が波長変換部材９に伝熱され難くなる。その結果、波長変換部材９の母材としてエポキシ樹脂やアクリル樹脂を用いた際は、加熱による母材の黄変および透過率の劣化を抑制できる。さらに、波長変換部材９に充填された蛍光体の酸化，還元反応等の化学反応が加速されることによる光出力の劣化を抑制できる。さらにまた、波長変換部材９の下面の外周部より下方に放出される光が、反射部材２または反射枠体８の上端面８ｂで上方に反射されることにより、波長変換部材９から上方に放出される光が増加し、発光装置の光出力や輝度が向上する。 In addition, as shown in the cross-sectional views and partial cross-sectional perspective views of FIGS. 9A and 9B, the light-emitting device of the present invention includes the light-emitting element storage package and the light-emitting element 3 mounted on the mounting portion 1a. And a wavelength conversion member 9 that converts the wavelength of a part or all of the light from the light emitting element 3 disposed so as to close the opening of the reflection frame 8. Thereby, the light-emitting device can suppress the characteristic deterioration of the wavelength conversion member 9 due to the heat generated from the light-emitting element 3. That is, when the wavelength conversion member 9 is disposed on the upper end surface 8b of the reflection frame 8, the heat radiation path from the light emitting element 3 to the wavelength conversion member 9 becomes longer and the thermal resistance increases. When a resin adhesive such as acrylic resin or epoxy resin is used, the thermal resistance from the light emitting element 3 to the wavelength converting member 9 is further increased by these resin adhesives, and the heat from the light emitting element 3 is converted to the wavelength converting member. Heat transfer to 9 is difficult. As a result, when an epoxy resin or an acrylic resin is used as the base material of the wavelength conversion member 9, yellowing of the base material due to heating and deterioration of the transmittance can be suppressed. Furthermore, it is possible to suppress degradation of light output due to acceleration of chemical reactions such as oxidation and reduction reactions of the phosphor filled in the wavelength conversion member 9. Furthermore, the light emitted downward from the outer peripheral portion of the lower surface of the wavelength conversion member 9 is reflected upward by the reflection member 2 or the upper end surface 8b of the reflection frame 8, thereby emitting upward from the wavelength conversion member 9. As a result, the light output and luminance of the light emitting device are improved.

また、図１０（ａ），（ｂ）、図１１（ａ），（ｂ）、図１２（ａ），（ｂ）、図１３（ａ），（ｂ）、図１４（ａ），（ｂ）に示す断面図および一部断面斜視図のように、反射部材２の外側面２ｂを取り囲み、反射枠体８の上端面８ｂが反射部材２の上端面より上方に位置するように設けられた反射枠体８を備えているとともに、波長変換部材９が反射枠体８の内側に配置されることがより好ましい。これにより、波長変換部材９の上面から放出される光が増加し、発光装置の光出力が向上する。すなわち、波長変換部材９の下面の外周部より下方に放出される光は、反射部材２の上端面で上方に反射され、さらに、波長変換部材９に含有された蛍光体を励起させずに、波長変換部材９の側方に放出される発光素子３の光は、反射枠体８の内周面８ａによって波長変換部材９の内部に反射され、再び蛍光体を励起することができる。その結果、発光装置は、波長変換部材９によって波長変換される光が増加し、発光装置の光出力や発光効率および輝度を向上できる。 10 (a), (b), FIG. 11 (a), (b), FIG. 12 (a), (b), FIG. 13 (a), (b), FIG. 14 (a), (b). ) And the partial cross-sectional perspective view, the outer surface 2b of the reflecting member 2 is surrounded, and the upper end surface 8b of the reflecting frame 8 is provided above the upper end surface of the reflecting member 2. It is more preferable that the reflection frame body 8 is provided and the wavelength conversion member 9 is disposed inside the reflection frame body 8. Thereby, the light emitted from the upper surface of the wavelength conversion member 9 is increased, and the light output of the light emitting device is improved. That is, the light emitted downward from the outer peripheral portion of the lower surface of the wavelength conversion member 9 is reflected upward at the upper end surface of the reflection member 2, and further, without exciting the phosphor contained in the wavelength conversion member 9, The light of the light emitting element 3 emitted to the side of the wavelength conversion member 9 is reflected to the inside of the wavelength conversion member 9 by the inner peripheral surface 8a of the reflection frame 8, and the phosphor can be excited again. As a result, in the light emitting device, the light whose wavelength is converted by the wavelength conversion member 9 increases, and the light output, light emission efficiency, and luminance of the light emitting device can be improved.

なお、反射枠体８が導電性部材から成る場合、図１４（ａ），（ｂ）に示すように発光装置駆動回路基板や、基板１の側方に取り出すように設置されたリード端子（図示せず）との電気的導通を防止するために、反射枠体８の下面が反射部材２の下面より上方に配置されるように取着するとよい。 When the reflection frame 8 is made of a conductive member, as shown in FIGS. 14 (a) and 14 (b), the light emitting device drive circuit board and lead terminals installed so as to be taken out to the side of the board 1 (see FIG. (Not shown) may be attached so that the lower surface of the reflecting frame 8 is disposed above the lower surface of the reflecting member 2.

さらにまた、図１１（ａ），（ｂ）、図１３（ａ），（ｂ）、図１４（ａ），（ｂ）に示す断面図および一部断面斜視図のように、透光性部材７を第１の反射部材２の上面より下側に充填し、波長変換部材９を第１の反射部材２の上面に配置することにより、透光性部材７の上面と波長変換部材９の下面との間に空隙部２０を設ける場合、波長変換部材９の内部から下方向に出力される可視光の一部が、波長変換部材９の下面と空隙部２０との界面で上方向に全反射される。その結果、発光装置は、波長変換部材９から上方に放出される可視光が増加し、発光装置の光出力が向上する。 Furthermore, as shown in the cross-sectional view and the partial cross-sectional perspective view shown in FIGS. 11 (a), 11 (b), 13 (a), 13 (b), 14 (a), 14 (b), the translucent member. 7 is filled below the upper surface of the first reflecting member 2, and the wavelength converting member 9 is disposed on the upper surface of the first reflecting member 2, whereby the upper surface of the translucent member 7 and the lower surface of the wavelength converting member 9. A part of visible light output downward from the inside of the wavelength conversion member 9 is totally reflected upward at the interface between the lower surface of the wavelength conversion member 9 and the gap 20. Is done. As a result, in the light emitting device, visible light emitted upward from the wavelength conversion member 9 is increased, and the light output of the light emitting device is improved.

また、発光素子３は、少なくとも紫外領域から青色領域の光を放出する発光素子３であることがより好ましい。すなわち、発光素子３からの光を波長変換する波長変換部材９に、発光素子３の光によって励起され蛍光を発生する蛍光体を含有させた場合、少なくとも紫外領域から青色領域の短波長でエネルギーの高い発光素子３の光によって、発光素子３の光より長波長でエネルギーの低い蛍光に変換する蛍光体の波長変換効率は向上し、発光装置の光出力が増加する。 The light emitting element 3 is more preferably a light emitting element 3 that emits light in at least the ultraviolet region to the blue region. That is, when the wavelength conversion member 9 that converts the wavelength of light from the light emitting element 3 contains a phosphor that is excited by the light of the light emitting element 3 to generate fluorescence, the energy of the energy is reduced at a short wavelength from at least the ultraviolet region to the blue region. The high light-emitting element 3 light improves the wavelength conversion efficiency of the phosphor that converts the fluorescent light having a longer wavelength and lower energy than the light of the light-emitting element 3, and increases the light output of the light-emitting device.

なお、発光素子３から発生する光の紫外領域とは、可視光の短波長端360〜400ｎｍを上限とし、下限は１ｎｍくらいまでの波長範囲の電磁波とする（理化学事典第５版／岩波書店）。また、青色領域とは、可視光の短波長端360〜400ｎｍを下限とし、上限は495ｎｍくらいまでの波長範囲とする（ＪＩＳＺ8701 ＸＹＺ表色系の色度座標）。 In addition, the ultraviolet region of the light generated from the light emitting element 3 is the upper limit of the short wavelength end of visible light of 360 to 400 nm, and the lower limit is an electromagnetic wave having a wavelength range of up to about 1 nm (Rikagaku Encyclopedia 5th edition / Iwanami Shoten) . Further, the blue region has a short wavelength end of 360 to 400 nm of visible light as a lower limit, and an upper limit as a wavelength range up to about 495 nm (chromaticity coordinates of JIS Z8701 XYZ color system).

また、本発明の発光装置は、１個のものを光源として所定の配置となるように設置したことにより、または複数個を、例えば、格子状や千鳥状，放射状，複数の発光装置から成る、円状や多角形状の発光装置群を同心状に複数群形成したもの等の所定の配置となるように設置したことにより、照明装置とすることができる。これにより、従来の照明装置よりも強度ムラの抑制されたものとすることができる。 In addition, the light emitting device of the present invention is provided by arranging one light source as a predetermined light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. A lighting device can be obtained by installing the light emitting device groups in a circular shape or a polygonal shape so as to have a predetermined arrangement such as a plurality of concentric groups. Thereby, intensity unevenness can be suppressed as compared with the conventional lighting device.

また、本発明の発光装置を光源として所定の配置に設置するとともに、これらの発光装置の周囲に任意の形状に光学設計した反射治具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射できる照明装置とすることができる。 In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

例えば、図１６，図１７に示す平面図，断面図のように複数個の発光装置１０１が発光装置駆動回路基板１０２に複数列に配置され、発光装置１０１の周囲に任意の形状に光学設計した反射治具１０３が設置されて成る照明装置の場合、隣接する一列上に配置された複数個の発光装置１０１において、隣り合う発光装置１０１との間隔が最短に成らないような配置、いわゆる千鳥状とすることが好ましい。隣り合う発光装置１０１間の距離が長くなることにより、隣接する発光装置１０１間の熱的な干渉が有効に抑制され、発光装置１０１が実装された発光装置駆動回路基板１０２内における熱のこもりが抑制され、発光装置１０１の外部に効率よく熱が放散される。 For example, a plurality of light emitting devices 101 are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. 16 and 17, and are optically designed in an arbitrary shape around the light emitting device 101. In the case of an illuminating device in which the reflecting jig 103 is installed, in a plurality of light emitting devices 101 arranged on adjacent rows, an arrangement in which the interval between adjacent light emitting devices 101 is not shortest, a so-called staggered pattern It is preferable that By increasing the distance between the adjacent light emitting devices 101, the thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and the heat buildup in the light emitting device driving circuit board 102 on which the light emitting devices 101 are mounted. It is suppressed and heat is efficiently dissipated outside the light emitting device 101.

また、照明装置が、図１８，図１９に示す平面図，断面図のような発光装置駆動回路基板１０２上に複数の発光装置１０１から成る円状や多角形状の発光装置１０１群を、同心状に複数群形成した照明装置の場合、１つの円状や多角形状の発光装置１０１群における発光装置１０１の配置数を照明装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置１０１同士の間隔を適度に保ちながら発光装置１０１をより多く配置することができ、照明装置の照度をより向上させることができる。また、照明装置の中央部の発光装置１０１の密度を低くして発光装置駆動回路基板１０２の中央部における熱のこもりを抑制することができる。よって、発光装置駆動回路基板１０２内における温度分布が一様となり、照明装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、発光装置１０１の温度上昇を抑制することができる。その結果、発光装置１０１は長期間にわたり安定して動作することができるとともに長寿命の照明装置を作製することができる。 Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of a plurality of lighting devices formed in a group, it is preferable to increase the number of light emitting devices 101 arranged in one circular or polygonal light emitting device 101 group toward the outer peripheral side from the center side of the lighting device. As a result, more light emitting devices 101 can be arranged while maintaining an appropriate interval between the light emitting devices 101, and the illuminance of the lighting device can be further improved. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 is uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time and a long-life lighting device can be manufactured.

このような照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装，展示用照明器具、街路用照明器具、誘導灯器具および信号装置、舞台およびスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサー、医療用ライト、車載ライト等が挙げられる。 Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signal devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, and in-vehicle lights.

なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行なうことは何等支障ない。例えば、発光装置より出射される光を任意に集光し拡散させる光学レンズや平板状の透光性の蓋体を半田や樹脂接合剤等で接合することにより、所望する放射角度で光を取り出すことができるとともに発光装置内部への耐浸水性が改善され長期信頼性が向上する。また、ボンディングワイヤによる光損失を抑制するために、基板１にメタライズ配線を形成し、そのメタライズ配線に半田を介して発光素子３を電気的に接続するフリップチップ実装をした発光装置でもよい。 It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are not hindered without departing from the gist of the present invention. For example, light is extracted at a desired radiation angle by joining an optical lens that arbitrarily collects and diffuses light emitted from the light emitting device or a flat light-transmitting lid with solder or a resin bonding agent. In addition, the water resistance into the light emitting device is improved and the long-term reliability is improved. Further, in order to suppress light loss due to the bonding wire, a light emitting device in which metallized wiring is formed on the substrate 1 and the light emitting element 3 is electrically connected to the metallized wiring via solder may be used.

本発明の発光素子収納パッケージを外部回路基板に実装した実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. 図１の発光素子収納パッケージの平面図である。It is a top view of the light emitting element storage package of FIG. 本発明の発光素子収納パッケージを外部回路基板に実装した実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. 本発明の発光素子収納パッケージを外部回路基板に実装した実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. 本発明の発光素子収納パッケージを外部回路基板に実装した実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. 本発明の発光素子収納パッケージを外部回路基板に実装した実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. 発光素子収納パッケージを外部回路基板に実装した実施の形態の参考例を示す断面図である。It is sectional drawing which shows the reference example of embodiment which mounted the light emitting element storage package in the external circuit board. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図および一部断面斜視図である。It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. 従来の発光素子収納パッケージを外部回路基板に実装した断面図である。It is sectional drawing which mounted the conventional light emitting element accommodation package on the external circuit board. 本発明の照明装置の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the illuminating device of this invention. 図９の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図１１の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG.

符号の説明Explanation of symbols

１：基板
１ａ：搭載部
２：反射部材
２ａ：反射面
３：発光素子
７：透光性部材
８：反射枠体
Ａ−Ａ’：本発明の発光素子収納パッケージを側面視して基板１の下面の高さ位置
DESCRIPTION OF SYMBOLS 1: Board | substrate 1a: Mounting part 2: Reflection member 2a: Reflection surface 3: Light emitting element 7: Translucent member 8: Reflection frame AA ': Side view of the light emitting element accommodation package of this invention of the board | substrate 1 Bottom height position

Claims

配線導体を有する基板と、
前記基板の上面に実装されているとともに、前記配線導体に電気的に接続された発光素子と、
前記発光素子を囲んでいる反射部材とを備えており、
平面透視において、前記反射部材の側面が、前記基板の側面より外側に位置しているとともに、
前記基板が配置される外部回路基板と前記反射部材との間に空隙が設けられるように、前記反射部材が、前記基板の上に設けられていることを特徴とする発光装置。 A substrate having a wiring conductor;
A light emitting device mounted on the upper surface of the substrate and electrically connected to the wiring conductor;
A reflective member surrounding the light emitting element,
In planar perspective, the side surface of the reflecting member is located outside the side surface of the substrate,
As the air gap is provided between the reflecting member and an external circuit board on which the substrate is placed, the light emitting device wherein the reflecting member, characterized in that provided on the substrate.

アルミニウムを含んでおり、前記反射部材を囲むように前記反射部材の前記側面に固定されおり、前記発光素子から前記反射部材へ伝導される熱を放散させる反射枠体をさらに備えていることを特徴とする請求項１記載の発光装置。 It further comprises a reflective frame that contains aluminum, is fixed to the side surface of the reflective member so as to surround the reflective member, and dissipates heat conducted from the light emitting element to the reflective member. The light-emitting device according to claim 1.