JP4562498B2 - 携帯端末機 - Google Patents
携帯端末機 Download PDFInfo
- Publication number
- JP4562498B2 JP4562498B2 JP2004333800A JP2004333800A JP4562498B2 JP 4562498 B2 JP4562498 B2 JP 4562498B2 JP 2004333800 A JP2004333800 A JP 2004333800A JP 2004333800 A JP2004333800 A JP 2004333800A JP 4562498 B2 JP4562498 B2 JP 4562498B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- shield frame
- generating component
- main pcb
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
Description
前記サーマルペーストは、前記発熱部品から発生した熱を前記シールドフレームに伝達すると共に、前記シールドフレームから前記メインPCBに衝撃が伝達されることを防止し得る粘性を有する材質から形成されていてもよい。
前記サーマルペーストは、粘性を有するアルミニウム粉から形成されていてもよい。
前記放熱装置は、前記メインPCBに実装された前記発熱部品の表面に付着された第1の放熱板と、前記シールドフレームの表面に付着された第2の放熱板と、前記第1の放熱板と第2の放熱板との間に接着されて熱伝逹経路を形成するサーマルペーストとを含んでいてもよい。
前記第1の放熱板及び第2の放熱板は、一枚の銅板または複数枚の銅薄テープが積層されて形成されていてもよい。
前記サーマルペーストは、外部の衝撃が前記シールドフレームを通して前記メインPCBに伝達されることを防止し得る衝撃緩和可能な粘性を有する材質から形成されていてもよい。
前記サーマルペーストは、アルミニウム粉から形成されていてもよい。
50:発熱部品
52:メインPCB
54:キーパッドPCB
56:シールドフレーム
60:熱伝導性物質
62、72、84:サーマルペースト
70:放熱板
80:第1放熱板
82:第2放熱板
Claims (7)
- メインPCBと、
前記メインPCB上に実装された発熱部品と、
前記メインPCBから発生する電磁波を遮蔽すると共に、前記メインPCBを支持するシールドフレームと、
前記発熱部品と前記シールドフレームとの間に少なくとも一つ以上設置され、前記発熱部品から発生した熱を直接的に前記シールドフレームに伝達する熱伝逹経路を形成する放熱装置と
を含む携帯端末機であって、
前記シールドフレームの表面には、電磁波遮蔽膜が塗布されると共に、熱伝導性物質が塗布され、
前記放熱装置は、前記発熱部品と前記シールドフレームとの間に接着され、前記発熱部品から発生した熱を前記シールドフレームに伝達するサーマルペーストを含み、
前記熱伝導性物質は、前記発熱部品のまわりに包囲領域を形成し、前記熱伝導性物質は、前記シールドフレームの表面と、前記包囲領域の外側の位置における前記メインPCBの表面とに挟まれている部分を含む、携帯端末機。 - 前記サーマルペーストは、前記発熱部品から発生した熱を前記シールドフレームに伝達すると共に、前記シールドフレームから前記メインPCBに衝撃が伝達されることを防止し得る粘性を有する材質から形成されている、請求項1に記載の携帯端末機。
- 前記サーマルペーストは、粘性を有するアルミニウム粉から形成されている、請求項2に記載の携帯端末機。
- 前記放熱装置は、
前記メインPCBに実装された前記発熱部品の表面に付着された第1の放熱板と、
前記シールドフレームの表面に付着された第2の放熱板と、
前記第1の放熱板と第2の放熱板との間に接着されて熱伝逹経路を形成するサーマルペーストと
を含む、請求項1に記載の携帯端末機。 - 前記第1の放熱板及び第2の放熱板は、一枚の銅板または複数枚の銅薄テープが積層されて形成されている、請求項4に記載の携帯端末機。
- 前記サーマルペーストは、外部の衝撃が前記シールドフレームを通して前記メインPCBに伝達されることを防止し得る衝撃緩和可能な粘性を有する材質から形成されている、請求項4に記載の携帯端末機。
- 前記サーマルペーストは、アルミニウム粉から形成されている、請求項6に記載の携帯端末機。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030083149A KR100652621B1 (ko) | 2003-11-21 | 2003-11-21 | 휴대용 단말기의 방열장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005159346A JP2005159346A (ja) | 2005-06-16 |
JP4562498B2 true JP4562498B2 (ja) | 2010-10-13 |
Family
ID=36655479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004333800A Active JP4562498B2 (ja) | 2003-11-21 | 2004-11-17 | 携帯端末機 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7286360B2 (ja) |
EP (1) | EP1533840B1 (ja) |
JP (1) | JP4562498B2 (ja) |
KR (1) | KR100652621B1 (ja) |
CN (1) | CN100373999C (ja) |
AT (1) | ATE382953T1 (ja) |
DE (1) | DE602004010998T2 (ja) |
RU (1) | RU2291599C2 (ja) |
Cited By (1)
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KR101926470B1 (ko) * | 2014-03-11 | 2018-12-07 | 주식회사 아모그린텍 | 이중 방열 시트, 그의 제조 방법 및 그를 구비한 휴대용 단말기 |
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JP2003198173A (ja) * | 2001-12-27 | 2003-07-11 | Nec Tokin Corp | 電磁波遮蔽放熱シートおよび電磁波抑制放熱シート |
JP3744420B2 (ja) * | 2001-12-28 | 2006-02-08 | 富士通株式会社 | 熱伝導性樹脂組成物およびそれを使用した電子部品装置 |
US6744640B2 (en) * | 2002-04-10 | 2004-06-01 | Gore Enterprise Holdings, Inc. | Board-level EMI shield with enhanced thermal dissipation |
JP2003318585A (ja) * | 2002-04-24 | 2003-11-07 | Toshiba Corp | 電子機器 |
JP3812902B2 (ja) * | 2003-02-07 | 2006-08-23 | 北川工業株式会社 | 低融点金属シート及びその製造方法 |
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- 2004-11-18 DE DE602004010998T patent/DE602004010998T2/de active Active
- 2004-11-19 CN CNB2004100471580A patent/CN100373999C/zh active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101926470B1 (ko) * | 2014-03-11 | 2018-12-07 | 주식회사 아모그린텍 | 이중 방열 시트, 그의 제조 방법 및 그를 구비한 휴대용 단말기 |
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Publication number | Publication date |
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RU2004133862A (ru) | 2006-04-27 |
KR100652621B1 (ko) | 2006-12-06 |
US20050111194A1 (en) | 2005-05-26 |
CN100373999C (zh) | 2008-03-05 |
JP2005159346A (ja) | 2005-06-16 |
US7286360B2 (en) | 2007-10-23 |
EP1533840A1 (en) | 2005-05-25 |
CN1625327A (zh) | 2005-06-08 |
DE602004010998D1 (de) | 2008-02-14 |
ATE382953T1 (de) | 2008-01-15 |
DE602004010998T2 (de) | 2008-12-24 |
KR20050049235A (ko) | 2005-05-25 |
EP1533840B1 (en) | 2008-01-02 |
RU2291599C2 (ru) | 2007-01-10 |
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