JP5028650B2 - 携帯電話装置 - Google Patents
携帯電話装置 Download PDFInfo
- Publication number
- JP5028650B2 JP5028650B2 JP2008071574A JP2008071574A JP5028650B2 JP 5028650 B2 JP5028650 B2 JP 5028650B2 JP 2008071574 A JP2008071574 A JP 2008071574A JP 2008071574 A JP2008071574 A JP 2008071574A JP 5028650 B2 JP5028650 B2 JP 5028650B2
- Authority
- JP
- Japan
- Prior art keywords
- resin member
- mobile phone
- phone device
- circuit board
- speaker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Description
図1には、この発明の実施の形態に係る携帯電話装置1の外観斜視図を示してある。また、図2には、この携帯電話装置1を図1の線II-IIで切断した断面図を示してある。
Claims (3)
- 複数の電子部品を実装した回路基板を保持し且つスピーカーを装置の表面に露出して保持するとともに装置の外殻を形成する第2の樹脂部材と、
上記スピーカーの裏面側の前記外殻内に配置される第1の樹脂部材と、
上記スピーカーの周辺で装置の表面に露出して設けられた第3の樹脂部材と、を有し、
上記第1の樹脂部材が上記第2の樹脂部材より熱伝導率が高く且つ上記回路基板に密着しており、
上記第3の樹脂部材は、上記第2の樹脂部材より熱伝導率が低く、
上記第1の樹脂部材は、上記第3の樹脂部材との間に上記回路基板を挟む位置にあることを特徴とする携帯電話装置。 - 上記回路基板は、熱伝導層を有し、上記第1の樹脂部材は、この熱伝導層に接触していることを特徴とする請求項1に記載の携帯電話装置。
- 上記第2の樹脂部材は、発泡性樹脂であることを特徴とする請求項1に記載の携帯電話装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008071574A JP5028650B2 (ja) | 2008-03-19 | 2008-03-19 | 携帯電話装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008071574A JP5028650B2 (ja) | 2008-03-19 | 2008-03-19 | 携帯電話装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009231907A JP2009231907A (ja) | 2009-10-08 |
JP5028650B2 true JP5028650B2 (ja) | 2012-09-19 |
Family
ID=41246875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008071574A Expired - Fee Related JP5028650B2 (ja) | 2008-03-19 | 2008-03-19 | 携帯電話装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5028650B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018059464A1 (zh) * | 2016-09-28 | 2018-04-05 | 华为技术有限公司 | 电子设备散热结构及电子设备 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8682020B2 (en) * | 2011-10-05 | 2014-03-25 | Apple Inc. | Speaker magnet thermal management |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019711A (ja) * | 2003-06-26 | 2005-01-20 | Mitsubishi Electric Corp | 電子機器筺体 |
JP4363205B2 (ja) * | 2004-02-05 | 2009-11-11 | 株式会社日立製作所 | 携帯端末装置 |
-
2008
- 2008-03-19 JP JP2008071574A patent/JP5028650B2/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018059464A1 (zh) * | 2016-09-28 | 2018-04-05 | 华为技术有限公司 | 电子设备散热结构及电子设备 |
US10729036B2 (en) | 2016-09-28 | 2020-07-28 | Huawei Technologies Co., Ltd. | Heat dissipation structure for electronic device and electronic device |
US11122710B2 (en) | 2016-09-28 | 2021-09-14 | Huawei Technologies Co., Ltd. | Heat dissipation structure for electronic device and electronic device |
Also Published As
Publication number | Publication date |
---|---|
JP2009231907A (ja) | 2009-10-08 |
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