JP4556214B2 - 表面実装用ラグ端子のプリント基板への取り付け構造及びその取り付け方法 - Google Patents
表面実装用ラグ端子のプリント基板への取り付け構造及びその取り付け方法 Download PDFInfo
- Publication number
- JP4556214B2 JP4556214B2 JP2006187320A JP2006187320A JP4556214B2 JP 4556214 B2 JP4556214 B2 JP 4556214B2 JP 2006187320 A JP2006187320 A JP 2006187320A JP 2006187320 A JP2006187320 A JP 2006187320A JP 4556214 B2 JP4556214 B2 JP 4556214B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lug terminal
- metal plate
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
前記各位置決め用突起は、前記金属板に設けられたネジ通し孔の内周から前記金属板の裏面に突設され、前記プリント基板の各位置決め用凹部は、該プリント基板に設けたネジ通し孔の内周面を凹ませた状態に該ネジ通し孔と一体に設けたことを特徴とする。
2 金属板
3 ランドパターン逃げ孔
4 リード部
5 幅方向の中心線
6 半田溜まり凹部
7 ネジ通し孔
8 位置決め用突起
9 プリント基板
10 ランドパターン
11 ネジ通し孔
12 位置決め用凹部
13 クリーム半田
13′ 半田
14 筐体
15 ネジ孔
16 ネジ
Claims (4)
- 金属板にリフロー半田付け用のリード部が一体に設けられ、該金属板の裏面に複数の位置決め用突起が突設され、該位置決め用突起がプリント基板の複数の位置決め凹部に嵌め合わされるとともに、前記リード部が前記プリント基板のランドパターン上に半田付け接続されている表面実装用ラグ端子のプリント基板への取り付け構造において、
前記各位置決め用突起は、前記金属板に設けられたネジ通し孔の内周から前記金属板の裏面に突設され、前記プリント基板の各位置決め用凹部は、該プリント基板に設けたネジ通し孔の内周面を凹ませた状態に該ネジ通し孔と一体に設けたことを特徴とする表面実装用ラグ端子のプリント基板への取り付け構造。 - 前記リード部は前記金属板に設けられたランドパターン逃げ孔の内周から該ランドパターン逃げ孔内に突設されていることを特徴とする請求項1に記載の表面実装用ラグ端子のプリント基板への取り付け構造。
- 前記リード部の基部の前記金属板の裏面には、半田溜まり凹部が設けられていることを特徴とする請求項2に記載の表面実装用ラグ端子のプリント基板への取り付け構造。
- 金属板にリフロー半田付け用のリード部が一体に設けられ、該金属板の裏面に複数の位置決め用突起が突設され、該位置決め用突起がプリント基板の複数の位置決め凹部に嵌め合わされるとともに、前記リード部が前記プリント基板のランドパターン上に半田付け接続させる表面実装用ラグ端子の取り付け方法において、
前記各位置決め用突起は、前記金属板に設けられたネジ通し孔の内周から前記金属板の裏面に突設され、前記プリント基板の各位置決め用凹部は、該プリント基板に設けたネジ通し孔の内周面を凹ませた状態に該ネジ通し孔と一体に設け、
プリント基板のランドパターン上にクリーム半田を載せ、表面実装用ラグ端子に設けられているリード部を前記クリーム半田上に載せると共に前記表面実装用ラグ端子の裏面に突設されている複数の位置決め用突起を前記プリント基板の複数の位置決め凹部に嵌めて前記表面実装用ラグ端子を前記プリント基板に対して位置決めし、前記表面実装用ラグ端子を載せて位置決めした前記プリント基板をリフロー炉内で加熱して前記クリーム半田を溶融することにより前記リード部を前記ランドパターン上に半田付け接続することを特徴とする表面実装用ラグ端子の取り付け方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006187320A JP4556214B2 (ja) | 2006-07-07 | 2006-07-07 | 表面実装用ラグ端子のプリント基板への取り付け構造及びその取り付け方法 |
KR1020070067504A KR20080005103A (ko) | 2006-07-07 | 2007-07-05 | 표면실장용 러그 단자 및 그 장착 방법 |
US11/822,418 US7661965B2 (en) | 2006-07-07 | 2007-07-05 | Surface mounting lug terminal and method for mounting the same |
CN2007101279905A CN101102014B (zh) | 2006-07-07 | 2007-07-06 | 表面安装接线端子及用于安装其的方法 |
US12/654,566 US7819674B2 (en) | 2006-07-07 | 2009-12-23 | Surface mounting lug terminal and method for mounting the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006187320A JP4556214B2 (ja) | 2006-07-07 | 2006-07-07 | 表面実装用ラグ端子のプリント基板への取り付け構造及びその取り付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008016359A JP2008016359A (ja) | 2008-01-24 |
JP4556214B2 true JP4556214B2 (ja) | 2010-10-06 |
Family
ID=38949801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006187320A Expired - Fee Related JP4556214B2 (ja) | 2006-07-07 | 2006-07-07 | 表面実装用ラグ端子のプリント基板への取り付け構造及びその取り付け方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7661965B2 (ja) |
JP (1) | JP4556214B2 (ja) |
KR (1) | KR20080005103A (ja) |
CN (1) | CN101102014B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4854471B2 (ja) * | 2006-10-27 | 2012-01-18 | 京セラ株式会社 | ラグ端子及び回路基板並びに電子モジュール |
CN201270622Y (zh) * | 2008-09-24 | 2009-07-08 | 比亚迪股份有限公司 | 一种线路板 |
TW201227212A (en) * | 2010-12-17 | 2012-07-01 | Hon Hai Prec Ind Co Ltd | Chassis |
CN102044360B (zh) * | 2010-12-28 | 2012-11-21 | 鸿富锦精密工业(深圳)有限公司 | 按键定位结构及具有该按键定位结构的电子装置 |
CN102858085B (zh) * | 2011-06-30 | 2016-01-20 | 昆山华扬电子有限公司 | 厚薄交叉型半蚀刻印制板的制作方法 |
KR101255953B1 (ko) | 2011-09-27 | 2013-04-23 | 삼성전기주식회사 | 적층형 공진 코일의 제조 방법 |
KR102411371B1 (ko) * | 2015-12-10 | 2022-06-22 | 삼성전자주식회사 | 기판 고정 장치 및 그것이 적용된 전자 장치 |
JP6906906B2 (ja) | 2016-06-30 | 2021-07-21 | キヤノン株式会社 | 回路基板及び画像形成装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63101467U (ja) * | 1986-12-20 | 1988-07-01 | ||
US4842529A (en) * | 1988-03-31 | 1989-06-27 | Amp Incorporated | Connector with two-piece ground strap |
JPH0582999A (ja) | 1991-09-24 | 1993-04-02 | Nec Corp | 表面実装部品の実装方法および表面実装部品 |
JPH0682999A (ja) | 1992-09-02 | 1994-03-25 | Konica Corp | ハロゲン化銀カラー写真感光材料 |
US6024586A (en) * | 1993-11-25 | 2000-02-15 | Kyoshin Kogyo Co., Ltd. | Ground terminal |
JP2863981B2 (ja) | 1993-12-13 | 1999-03-03 | 松下電器産業株式会社 | ラグ端子およびその取り付け方法 |
US5906496A (en) * | 1996-12-23 | 1999-05-25 | Thomas & Betts International, Inc. | Miniature card edge clip |
JP3729606B2 (ja) | 1997-07-01 | 2005-12-21 | 協伸工業株式会社 | アース端子 |
JP3925147B2 (ja) * | 2001-10-16 | 2007-06-06 | モレックス インコーポレーテッド | 回路基板間の接続装置 |
US6695629B1 (en) * | 2002-10-25 | 2004-02-24 | Hewlett-Packard Development Company, L.P. | Low-profile mounting and connecting scheme for circuit boards |
JP2004319382A (ja) * | 2003-04-18 | 2004-11-11 | Kyoshin Kogyo Co Ltd | アース端子 |
JP2004319381A (ja) * | 2003-04-18 | 2004-11-11 | Kyoshin Kogyo Co Ltd | アース端子 |
KR100625971B1 (ko) * | 2003-10-10 | 2006-09-20 | 삼성에스디아이 주식회사 | 회로기판의 결합구조 및 접지구조가 개선된 플라즈마디스플레이 장치 |
JP4015641B2 (ja) | 2004-05-26 | 2007-11-28 | 北川工業株式会社 | ラグ端子 |
KR100684721B1 (ko) * | 2005-01-12 | 2007-02-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP2007172922A (ja) | 2005-12-20 | 2007-07-05 | Kyoshin Kogyo Co Ltd | アース端子 |
JP4524291B2 (ja) * | 2006-02-20 | 2010-08-11 | 協伸工業株式会社 | 平型アース端子およびその表面実装方法 |
JP4822936B2 (ja) | 2006-05-29 | 2011-11-24 | 京セラ株式会社 | ラグ端子及び回路基板並びに電子モジュール |
TWI358175B (en) * | 2008-01-16 | 2012-02-11 | Delta Electronics Inc | Ground terminal |
-
2006
- 2006-07-07 JP JP2006187320A patent/JP4556214B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-05 KR KR1020070067504A patent/KR20080005103A/ko not_active Application Discontinuation
- 2007-07-05 US US11/822,418 patent/US7661965B2/en active Active
- 2007-07-06 CN CN2007101279905A patent/CN101102014B/zh not_active Expired - Fee Related
-
2009
- 2009-12-23 US US12/654,566 patent/US7819674B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008016359A (ja) | 2008-01-24 |
US20100157556A1 (en) | 2010-06-24 |
US20080014769A1 (en) | 2008-01-17 |
KR20080005103A (ko) | 2008-01-10 |
US7661965B2 (en) | 2010-02-16 |
CN101102014B (zh) | 2012-02-15 |
CN101102014A (zh) | 2008-01-09 |
US7819674B2 (en) | 2010-10-26 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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