JP4530975B2 - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
- Publication number
- JP4530975B2 JP4530975B2 JP2005328291A JP2005328291A JP4530975B2 JP 4530975 B2 JP4530975 B2 JP 4530975B2 JP 2005328291 A JP2005328291 A JP 2005328291A JP 2005328291 A JP2005328291 A JP 2005328291A JP 4530975 B2 JP4530975 B2 JP 4530975B2
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- wire
- capillary
- bond point
- external lead
- clamper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Description
B 第2ボンド点
1 外部リード
2 リードフレーム
3 電極パッド
4 ダイ
5 キャピラリ
6 クランパ
10 ワイヤ
11 圧着ボール
12 ワイヤボンディング部
15 垂れ下がり部
16 薄肉部
17 跳ね上がり部
18 直線状ワイヤ部
19 端部
20 ワイヤ先端部
25 テール部
26 ボール
27 圧着ボール
Claims (2)
- ワイヤが挿通されたキャピラリと、ワイヤをクランプするクランパとを備え、キャピラリに挿通されたワイヤをキャピラリで第1ボンド点である電極パッドと第2ボンド点である外部リードとの間を接続するワイヤボンディング方法において、電極パッドにボンディング後、クランパが開状態でキャピラリを外部リードの上方より下降させてワイヤが完全に外部リードに接続させない程度にワイヤを押し潰して薄肉部を形成し、次にクランパを閉じてキャピラリを第1ボンド点とほぼ同じ高さに上昇させて前記薄肉部をキャピラリと共に上昇させ、続いてキャピラリを第1ボンド点から離れる方向に移動させて第1ボンド点にボンディングさせたワイヤを引っ張って該ワイヤを直線状ワイヤ部とすると共に前記薄肉部より切断させ、次にキャピラリで前記直線状ワイヤ部の端部を押圧して外部リードにボンディングすると共に、キャピラリ下端のワイヤ先端を外部リードにボンディングし、次にクランパが開いてキャピラリを上昇させる上昇途中にクランパを閉じて前記キャピラリ下端のワイヤ先端を外部リードより剥がしてキャピラリ下端より延在したテール部を形成することを特徴とするワイヤボンディング方法。
- ワイヤが挿通されたキャピラリと、ワイヤをクランプするクランパとを備え、キャピラリに挿通されたワイヤをキャピラリで第1ボンド点である電極パッドと第2ボンド点である外部リードとの間を接続するワイヤボンディング方法において、電極パッドにボンディング後、クランパが開状態でキャピラリを外部リードの上方より下降させてワイヤが完全に外部リードに接続させない程度にワイヤを押し潰して薄肉部を形成し、次にクランパを閉じてキャピラリを第1ボンド点とほぼ同じ高さに上昇させて前記薄肉部をキャピラリと共に上昇させ、続いてキャピラリを第1ボンド点から離れる方向に移動させて第1ボンド点にボンディングさせたワイヤを引っ張って該ワイヤを直線状ワイヤ部とすると共に前記薄肉部より切断させ、次にキャピラリを下降させてキャピラリ下端のワイヤ先端を外部リードにボンディングし、次にクランパが開いてキャピラリを上昇させる上昇途中にクランパを閉じて前記キャピラリ下端のワイヤ先端を外部リードより剥がしてキャピラリの下端より延在したテール部を形成し、このテール部にボールを形成した後、このボールを前記直線状ワイヤ部の端部に押し付けて該直線状ワイヤ部の端部と共にボールを外部リードにボンディングしてボールを圧着ボールに形成し、続いてキャピラリを上昇させる上昇途中にクランパを閉じて圧着ボールよりワイヤを切断してキャピラリ下端より延在したテール部を形成することを特徴とするワイヤボンディング方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005328291A JP4530975B2 (ja) | 2005-11-14 | 2005-11-14 | ワイヤボンディング方法 |
TW095133139A TW200735243A (en) | 2005-11-14 | 2006-09-08 | Method for wire bonding |
KR1020060088860A KR100790372B1 (ko) | 2005-11-14 | 2006-09-14 | 와이어 본딩 방법 |
US11/598,970 US7621436B2 (en) | 2005-11-14 | 2006-11-14 | Wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005328291A JP4530975B2 (ja) | 2005-11-14 | 2005-11-14 | ワイヤボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007134611A JP2007134611A (ja) | 2007-05-31 |
JP4530975B2 true JP4530975B2 (ja) | 2010-08-25 |
Family
ID=38039725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005328291A Expired - Fee Related JP4530975B2 (ja) | 2005-11-14 | 2005-11-14 | ワイヤボンディング方法 |
Country Status (4)
Country | Link |
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US (1) | US7621436B2 (ja) |
JP (1) | JP4530975B2 (ja) |
KR (1) | KR100790372B1 (ja) |
TW (1) | TW200735243A (ja) |
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US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
CN101053079A (zh) | 2004-11-03 | 2007-10-10 | 德塞拉股份有限公司 | 堆叠式封装的改进 |
US8058101B2 (en) | 2005-12-23 | 2011-11-15 | Tessera, Inc. | Microelectronic packages and methods therefor |
JP4625858B2 (ja) * | 2008-09-10 | 2011-02-02 | 株式会社カイジョー | ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
US9159708B2 (en) | 2010-07-19 | 2015-10-13 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
KR101075241B1 (ko) | 2010-11-15 | 2011-11-01 | 테세라, 인코포레이티드 | 유전체 부재에 단자를 구비하는 마이크로전자 패키지 |
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US8836136B2 (en) | 2011-10-17 | 2014-09-16 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8946757B2 (en) | 2012-02-17 | 2015-02-03 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
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JP6297553B2 (ja) * | 2012-07-17 | 2018-03-20 | クリック アンド ソッファ インダストリーズ、インク. | ワイヤ配線構造を形成する方法 |
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US8975738B2 (en) | 2012-11-12 | 2015-03-10 | Invensas Corporation | Structure for microelectronic packaging with terminals on dielectric mass |
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US9136254B2 (en) | 2013-02-01 | 2015-09-15 | Invensas Corporation | Microelectronic package having wire bond vias and stiffening layer |
JP2014207430A (ja) | 2013-03-21 | 2014-10-30 | ローム株式会社 | 半導体装置 |
US8883563B1 (en) | 2013-07-15 | 2014-11-11 | Invensas Corporation | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
US9023691B2 (en) | 2013-07-15 | 2015-05-05 | Invensas Corporation | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
US9034696B2 (en) | 2013-07-15 | 2015-05-19 | Invensas Corporation | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation |
US9093515B2 (en) * | 2013-07-17 | 2015-07-28 | Freescale Semiconductor, Inc. | Wire bonding capillary with working tip protrusion |
US9167710B2 (en) | 2013-08-07 | 2015-10-20 | Invensas Corporation | Embedded packaging with preformed vias |
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