JP4530688B2 - 半導体接合方法及び接合装置 - Google Patents
半導体接合方法及び接合装置 Download PDFInfo
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Description
[第1の実施形態]
図1は、本発明の第1の実施形態に係る半導体接合装置の構成図である。図1において、本半導体接合装置の基台となるベース1上にはイケール2が設置されており、イケール2上にはZ軸方向(図中上下方向)に移動可能なZステージ3が設置されている。ここで、Zステージ3は、ガイド4、ボールネジ5、及びモータ6で構成されている。即ち、Zステージ3では、モータ6の回転運動がボールネジ5により直線運動に変換され、ボールネジ5に取り付けられたガイド4もZ軸方向に直線移動されるようになっている。また、モータ6には制御部としてのコントローラ7が電気的に接続されており、Zステージ3を任意の速度で任意の位置に駆動可能に構成されている。
本発明の第2の実施形態について説明する。本発明の第2の実施形態はオフセット量ΔDの算出手法の第1の変形例である。ここで、第2の実施形態の構成は、第1の実施形態と同様であるので同一の参照符号を用いることで説明を省略し、部品接合時の処理についてのみ説明する。図5は、第2の実施形態における部品接合時の処理について示すフローチャートである。なお、図5以前の処理、即ち1回目の接合時の処理については図2と同様であるので説明を省略する。
本発明の第3の実施形態について説明する。本発明の第3の実施形態はオフセット量ΔDの算出手法の第2の変形例である。ここで、第3の実施形態の構成は、第1の実施形態と同様であるので同一の参照符号を用いることで説明を省略し、部品接合時の処理についてのみ説明する。図6は、第3の実施形態の部品接合時の処理について示すフローチャートである。なお、図6以前の処理、即ち1回目の接合時の処理については図2と同様であるので説明を省略する。
Claims (12)
- 半導体チップと基板との間にスペーサ及び接合材を介在させた状態で前記半導体チップと前記基板とを接合する半導体接合方法であって、
前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量に関する情報を求め、予め求められた前記接合材の硬化収縮情報に基づいて、前記半導体チップと前記基板との間隔をオフセットして接合時の間隔を制御することを特徴とする半導体接合方法。 - 前記予め求められた接合材の硬化収縮情報は、所定の記憶部に記憶された情報であることを特徴とする請求項1に記載の半導体接合方法。
- ツールが保持する半導体チップとステージが保持する基板との間にスペーサ及び接合材を介在させた状態で、前記ツールにより前記半導体チップを前記基板に押圧する第1の押圧工程と、
前記第1の押圧工程において介在させた接合材を硬化させる第1の硬化工程と、
前記第1の硬化工程における前記ツールの前記押圧方向への変位量を測定する測定工程と、
前記測定工程において測定された前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量を記憶する記憶工程と、
前記第1の押圧工程、前記第1の硬化工程、前記測定工程、前記記憶工程を少なくとも1回実行した後に行われる工程であって、半導体チップと基板との間にスペーサ及び接合材を介在させた状態で前記半導体チップを前記基板に押圧する際に、前記記憶工程において記憶した前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量に基づいて前記半導体チップと前記基板との間隔をオフセットして前記半導体チップを前記基板に押圧する第2の押圧工程と、
前記第2の押圧工程において介在させた接合材を硬化させる第2の硬化工程と、
を備えることを特徴とする半導体接合方法。 - 前記第1の押圧工程、前記第1の硬化工程、前記測定工程、前記記憶工程、前記第2の押圧工程、及び前記第2の硬化工程からなる工程を少なくとも1回実行した後は、前記第2の押圧工程と前記第2の硬化工程を繰り返し実行して接合を行うことを特徴とする請求項3に記載の半導体接合方法。
- 前記第1の押圧工程、前記第1の硬化工程、前記測定工程、前記記憶工程、前記第2の押圧工程、及び前記第2の硬化工程からなる工程を少なくとも1回実行した後は、前記測定工程、前記記憶工程、前記第2の押圧工程、及び前記第2の硬化工程を繰り返し実行して接合を行うことを特徴とする請求項3に記載の半導体接合方法。
- 前記第2の押圧工程において、前記記憶工程の複数回の実行により得られた複数の前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量の平均値に基づいて前記半導体チップと前記基板との間隔をオフセットすることを特徴とする請求項3乃至5の何れかに記載の半導体接合方法。
- 半導体チップと基板との間にスペーサ及び接合材を介在させた状態で前記半導体チップと前記基板とを接合する半導体接合装置であって、
前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量に関する情報を求め、予め求められた前記接合材の硬化収縮情報に基づいて、前記半導体チップと前記基板との間隔をオフセットして接合時の間隔を制御する制御部を具備することを特徴とする半導体接合装置。 - 前記予め求められた接合材の硬化収縮情報を記憶する記憶部を更に具備することを特徴とする請求項7に記載の半導体接合装置。
- 半導体チップと基板との間にスペーサ及び接合材を介在させた状態で、前記半導体チップと前記基板とを接合する半導体接合装置であって、
前記半導体チップを保持するツールと、
前記基板を保持するステージと、
前記ツールの推力を調整することで前記半導体チップを前記基板に押圧する押圧部と、
前記ツールの押圧方向への変位量を測定する変位センサと、
前記変位センサの前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量を記憶する記憶部と、
前記記憶部に記憶された前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量に基づいて前記ツールの押圧方向への位置制御を行う制御部とを具備し、
前記制御部は、前記変位センサの前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量に応じたオフセット量をもって前記半導体チップと前記基板との間隔をオフセットするように前記押圧部を制御することを特徴とする半導体接合装置。 - 前記記憶部には、前記変位センサの複数の前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量が記憶されることを特徴とする請求項9に記載の半導体接合装置。
- 前記制御部は、前記記憶部に記憶された前記複数の前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量のうち、最新の前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量に基づいて前記ツールの押圧方向への位置制御を行うことを特徴とする請求項10に記載の半導体接合装置。
- 前記制御部は、前記記憶部に記憶された前記複数の前記接合材の硬化収縮に伴う前記半導体チップと前記基板との間隔の変位量の平均値に基づいて前記ツールの押圧方向への位置制御を行うことを特徴とする請求項10に記載の半導体接合装置。
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US9929121B2 (en) * | 2015-08-31 | 2018-03-27 | Kulicke And Soffa Industries, Inc. | Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines |
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