JP4484499B2

JP4484499B2 - Light emitting device

Info

Publication number: JP4484499B2
Application number: JP2003396423A
Authority: JP
Inventors: 大輔作本; 信之竹橋
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2003-11-26
Filing date: 2003-11-26
Publication date: 2010-06-16
Anticipated expiration: 2023-11-26
Also published as: JP2005159059A

Description

本発明は、発光素子から発光される光を蛍光体で波長変換し外部に発光する発光装置に関する。 The present invention relates to a light emitting device that converts the wavelength of light emitted from a light emitting element with a phosphor and emits light to the outside.

従来の発光ダイオード（ＬＥＤ）等の発光素子15から発光される近紫外線光や青色光等の光を赤色，緑色，青色，黄色等の複数の蛍光体で長波長変換して白色発光する発光装置を図３に示す。図３において、発光装置は、上側主面の中央部に発光素子15を載置するための載置部11ａを有し、載置部11ａやその周辺から発光装置の内外を電気的に導通接続するリード端子やメタライズ配線等からなる配線導体（図示せず）が形成された絶縁体からなる基体11と、基体11上面に接着固定され、上側開口が下側開口より大きい貫通孔12ａが形成されているとともに、内周面が発光素子15が発光する光を反射する反射面12ｂとされている枠状の反射部材12と、反射部材12の内側に充填され発光素子15が発光する光を励起し長波長変換する蛍光体を含有した透明樹脂13と、載置部11ａに載置固定された発光素子15とから主に構成されている。 A light emitting device that emits white light by converting long wavelengths of light such as near-ultraviolet light and blue light emitted from a light emitting element 15 such as a conventional light emitting diode (LED) with a plurality of phosphors such as red, green, blue, and yellow. Is shown in FIG. In FIG. 3, the light-emitting device has a mounting portion 11a for mounting the light-emitting element 15 at the center of the upper main surface, and electrically connects the inside and outside of the light-emitting device from the mounting portion 11a and its periphery. A base 11 made of an insulator on which a wiring conductor (not shown) made of lead terminals, metallized wiring, etc. is formed, and a through hole 12a that is bonded and fixed to the upper surface of the base 11 and whose upper opening is larger than the lower opening. In addition, a frame-like reflecting member 12 whose inner peripheral surface is a reflecting surface 12b that reflects light emitted from the light emitting element 15, and excitation of light emitted from the light emitting element 15 filled inside the reflecting member 12 It is mainly composed of a transparent resin 13 containing a phosphor for long wavelength conversion and a light emitting element 15 mounted and fixed on the mounting portion 11a.

基体11は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成る。基体11がセラミックスから成る場合、その上面に配線導体がタングステン（Ｗ），モリブデン（Ｍｏ）−マンガン（Ｍｎ）等から成る金属ペーストを高温で焼成して形成される。また、基体11が樹脂から成る場合、銅（Ｃｕ）や鉄（Ｆｅ）−ニッケル（Ｎｉ）合金等から成るリード端子がモールド成型されて基体11の内部に設置固定される。 The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramic, the wiring conductor is formed on its upper surface by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), etc. at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

また、反射部材12は、上側開口が下側開口より大きい貫通孔12ａが形成されるとともに内周面に光を反射する反射面12ｂが設けられた枠状となっている。具体的には、アルミニウム（Ａｌ）やＦｅ−Ｎｉ−コバルト（Ｃｏ）合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。 The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than the lower opening is formed and a reflecting surface 12b for reflecting light is provided on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

さらに、反射部材12の反射面12ｂは、貫通孔12ａの内周面を研磨して平坦化することにより、あるいは、貫通孔12ａの内周面にＡｌ等の金属を蒸着法やメッキ法により被着することにより形成される。そして、反射部材12は、半田，銀（Ａｇ）ロウ等のロウ材または樹脂接着材等の接合材により、載置部11ａを反射部材12の内周面で取り囲むように基体11の上面に接合される。 Further, the reflecting surface 12b of the reflecting member 12 is coated by polishing or flattening the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. It is formed by wearing. The reflecting member 12 is bonded to the upper surface of the base 11 by a soldering material such as solder, silver (Ag) solder, or a bonding material such as a resin adhesive so as to surround the mounting portion 11a with the inner peripheral surface of the reflecting member 12. Is done.

そして、載置部11ａの周辺に配置した配線導体と発光素子15とをボンディングワイヤや金属ボール等の電気接続手段16を介して電気的に接続し、しかる後、蛍光体を含有するエポキシ樹脂やシリコーン樹脂等の透明樹脂13をディスペンサー等の注入機で発光素子15を覆うように反射部材12の内部に充填しオーブンで熱硬化させることで、発光素子15からの光を蛍光体により長波長変換し所望の波長スペクトルを有する光を取り出せる発光装置となし得る。
特開2003-37298号公報 Then, the wiring conductor arranged around the mounting portion 11a and the light emitting element 15 are electrically connected through the electrical connection means 16 such as a bonding wire or a metal ball, and then an epoxy resin containing a phosphor or Transparent light 13 such as silicone resin is filled in the reflective member 12 so as to cover the light emitting element 15 with an injection machine such as a dispenser, and is thermally cured in an oven, so that the light from the light emitting element 15 is converted into a long wavelength by a phosphor. Thus, a light emitting device capable of extracting light having a desired wavelength spectrum can be obtained.
Japanese Patent Laid-Open No. 2003-37298

近年、発光装置の放射強度をさらに高めることが望まれている。しかしながら、上記従来の発光装置においては、放射強度を高めるために発光素子15に入力する電流値をより大きくすると、発光素子15の発光強度が限界に近づいてばらつき易くなり、安定した放射強度が得られないという問題点を有していた。 In recent years, it has been desired to further increase the radiation intensity of the light emitting device. However, in the above conventional light emitting device, if the current value input to the light emitting element 15 is increased to increase the radiation intensity, the light emission intensity of the light emitting element 15 tends to vary near the limit, and a stable radiation intensity can be obtained. It had the problem that it was not possible.

また、発光素子15から下方に発光する光は反射部材12に良好に照射されず、光反射率の比較的低い基体11の上面や基体11と反射部材12との接合部に照射されるため、これらの部位で光が吸収されて発光素子15から発光する光の全てを高い反射率で反射させることができず、発光装置からの放射強度や軸上光度、輝度、演色性が低下しやすいという問題点を有していた。 Further, the light emitted downward from the light emitting element 15 is not irradiated well on the reflecting member 12, and is irradiated on the upper surface of the base 11 having a relatively low light reflectivity and the junction between the base 11 and the reflecting member 12, All of the light emitted from the light-emitting element 15 is absorbed by these parts and cannot be reflected with high reflectivity, and the radiation intensity, axial luminous intensity, luminance, and color rendering properties from the light-emitting device are likely to decrease. Had problems.

さらに、発光素子15から発生した熱は基体11を伝達して外部へ放散されるが、近時では発光素子15の高出力化により発光素子15から発生する熱量が大きくなってきており、発光素子15から発生した熱を基体11を介して完全に外部へ放散させるのが困難となってきた。その結果、発光素子15の温度が上昇して、発光素子15の出力が低下し、安定した放射強度が得られないという問題点も有していた。 Furthermore, although the heat generated from the light emitting element 15 is transmitted to the outside through the base 11, the amount of heat generated from the light emitting element 15 has recently increased due to the increase in the output of the light emitting element 15. It has been difficult to completely dissipate the heat generated from 15 through the substrate 11 to the outside. As a result, the temperature of the light emitting element 15 is increased, the output of the light emitting element 15 is decreased, and a stable radiation intensity cannot be obtained.

したがって、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、発光素子の発光する光の放射強度を高くするとともに、軸上光度や輝度，演色性等の光特性を向上させることである。 Accordingly, the present invention has been completed in view of the above-described conventional problems, and its purpose is to increase the light emission intensity of light emitted from the light-emitting element and to achieve optical characteristics such as on-axis luminous intensity, luminance, and color rendering. It is to improve.

本発明の発光装置は、上側主面から突出した発光素子の載置部を有する基体と、前記載置部上に載置された発光素子と、該基体の上側主面に前記載置部を囲繞するように接合さ
れた、内周面が前記発光素子が発光する光を反射する反射面とされている枠状の反射部材と、該反射部材の内側に前記発光素子を覆うように設けられた透光性部材とを具備しており、前記発光素子は、その発光部が前記反射面の下端よりも上側に位置しており、前記透光性部材は、前記載置部の上面よりも上側に位置し、前記発光素子の上面を被覆する上層部と前記載置部の上面よりも下側に位置する下層部との二層から成り、前記下層部が金属粒子を含有しているとともに前記上層部が前記発光素子が発光する光を波長変換する蛍光体を含有していることを特徴とする。 The light-emitting device of the present invention includes a base having a mounting portion for a light-emitting element protruding from the upper main surface, a light-emitting element mounted on the mounting portion, and the mounting portion on the upper main surface of the base. A frame-shaped reflecting member that is joined so as to surround and has an inner peripheral surface that is a reflecting surface that reflects light emitted from the light emitting element, and is provided inside the reflecting member so as to cover the light emitting element. The light emitting element has a light emitting portion located above the lower end of the reflecting surface, and the light transmitting member is located above the upper surface of the mounting portion. positioned above, it consists of two layers of a lower layer portion positioned below the upper surface of the upper portion and the mounting section you covering an upper surface of the light emitting element, wherein the lower portion contains the metal particles And the upper layer portion contains a phosphor that converts the wavelength of light emitted from the light emitting element. That.

本発明の発光装置は、上側主面から突出した発光素子の載置部を有する基体と、基体の上側主面に載置部を囲繞するように接合された、内周面が発光素子が発光する光を反射する反射面とされている枠状の反射部材と、反射部材の内側に発光素子を覆うように設けられた透光性部材とを具備しており、発光素子は、その発光部が反射面の下端よりも上側に位置しており、透光性部材は、載置部の上面よりも上側に位置する上層部と載置部の上面よりも下側に位置する下層部との二層から成り、下層部が金属粒子を含有しているとともに上層部が発光素子が発光する光を波長変換する蛍光体を含有していることから、発光素子から下方に発光する光を反射部材および金属粒子表面で反射させ、発光素子から発光する光の全てを高い反射率で反射させることができる。 In the light emitting device of the present invention, the light emitting element emits light on the inner peripheral surface joined to the base having the mounting portion of the light emitting element protruding from the upper main surface and the upper main surface of the base so as to surround the mounting portion. A frame-like reflecting member that is a reflecting surface for reflecting light, and a translucent member provided so as to cover the light emitting element inside the reflecting member. Is located above the lower end of the reflecting surface, and the translucent member includes an upper layer portion located above the upper surface of the placement portion and a lower layer portion located below the upper surface of the placement portion. It consists of two layers, and the lower layer contains metal particles and the upper layer contains a phosphor that converts the wavelength of light emitted by the light emitting element, so that the light emitted downward from the light emitting element is reflected by the reflecting member. Reflects on the surface of metal particles and reflects all light emitted from the light emitting element with high reflectivity It can be.

また、発光素子からの光を透光性部材の下層部の金属粒子で乱反射させることによって、上層部の蛍光体に万遍なく光を照射することができ、より多くの蛍光体で波長変換することによって波長変換効率が極めて高くなり、放射強度や軸上光度、輝度、演色性をより高めることができる。 Moreover, by irregularly reflecting the light from the light emitting element with the metal particles in the lower layer part of the translucent member, the phosphors in the upper layer part can be uniformly irradiated with light, and the wavelength conversion is performed with more phosphors. As a result, the wavelength conversion efficiency becomes extremely high, and the radiation intensity, axial luminous intensity, luminance, and color rendering can be further increased.

さらに、透光性部材の上層部においては金属粒子を含有しないことによって、透光性部材の表面付近で光が乱反射するのを有効に防止して所望の放射角度で光を出射させることができ、発光装置からの放射強度を極めて高いものとすることができるとともに指向性の高いものとすることができる。 Furthermore, by not containing metal particles in the upper layer portion of the translucent member, it is possible to effectively prevent light from being irregularly reflected near the surface of the translucent member and to emit light at a desired radiation angle. The radiation intensity from the light emitting device can be made extremely high and the directivity can be made high.

また、発光素子から発生した熱が基体に伝わっても、突出した載置部から金属粒子を介して良好に反射部材へ熱を伝達することができ、基体からだけではなく、透光性部材中の金属粒子および反射部材を介しても発光素子から発生する熱を効率よく外部に放散させることができるようになる。その結果、発光素子から発生する熱量が大きくなっても発光素子から発生した熱を完全に外部へ放散させるのができ、その結果、発光素子の温度の上昇を防止し、安定した放射強度が得られるようになる。 Further, even when heat generated from the light emitting element is transmitted to the base, the heat can be transferred from the protruding mounting portion to the reflecting member through the metal particles, and not only from the base but also in the translucent member. Even through the metal particles and the reflecting member, the heat generated from the light emitting element can be efficiently dissipated to the outside. As a result, even if the amount of heat generated from the light-emitting element increases, the heat generated from the light-emitting element can be completely dissipated to the outside, and as a result, the temperature of the light-emitting element is prevented from rising and stable radiation intensity is obtained. Be able to.

さらに、発光装置を外部電気回路基板へ実装する際の熱や発光素子の熱などによって反射部材と基体との間に熱膨張差による応力が生じても、金属粒子を含むことによって適度に硬いとともに適度に変形しやすい透光性部材の下層部が、反射部材や基体の熱膨張に応じて変形したり、反射部材や基体を拘束したりすることによって反射部材や基体の熱膨張による応力を有効に吸収することができる。その結果、基体や反射部材にクラックなどが生じるのを有効に抑制することができる。 Furthermore, even if stress due to a difference in thermal expansion occurs between the reflecting member and the substrate due to heat when the light emitting device is mounted on the external electric circuit board or heat of the light emitting element, it is moderately hard due to including metal particles. The lower layer part of the translucent member that is easily deformable is deformed according to the thermal expansion of the reflective member or the base, or restrains the reflective member or the base to effectively stress the thermal expansion of the reflective member or the base. Can be absorbed into. As a result, it is possible to effectively suppress the occurrence of cracks and the like in the base body and the reflecting member.

以上の結果、軸上光度や輝度，演色性等の光特性を良好なものとし得る。 As a result, the light characteristics such as on-axis luminous intensity, luminance, and color rendering can be improved.

本発明の発光装置について以下に詳細に説明する。図１は本発明の発光装置の実施の形態の一例を示す断面図である。この図において、１は基体、２は反射部材、３は透光性部材、４は金属粒子であり、主としてこれらで発光素子５の発光を方向性をもって外部に発光させ得る発光装置が構成される。 The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 1 is a substrate, 2 is a reflecting member, 3 is a translucent member, and 4 is a metal particle, and these mainly constitute a light emitting device that can emit light emitted from the light emitting element 5 to the outside with directionality. .

本発明の発光装置は、上側主面から突出した発光素子５の載置部１ａを有する基体１と、この基体１の上側主面に載置部１ａを囲繞するように接合された、内周面が発光素子５が発光する光を反射する反射面２ｂとされている枠状の反射部材２と、反射部材２の内側に発光素子５を覆うように設けられた透光性部材３とを具備しており、発光素子５は、その発光部が反射面２ｂの下端よりも上側に位置しており、透光性部材３は、載置部１ａの上面よりも上側に位置する上層部３ａと載置部１ａの上面よりも下側に位置する下層部３ｂとの二層から成り、下層部３ｂが金属粒子４を含有しているとともに上層部３ａが発光素子５が発光する光を波長変換する蛍光体を含有している。 The light emitting device according to the present invention includes a base 1 having a mounting portion 1a for the light emitting element 5 protruding from the upper main surface, and an inner circumference joined to the upper main surface of the base 1 so as to surround the mounting portion 1a. A frame-shaped reflecting member 2 whose surface is a reflecting surface 2 b that reflects light emitted from the light emitting element 5, and a translucent member 3 provided inside the reflecting member 2 so as to cover the light emitting element 5. The light emitting element 5 has a light emitting portion located above the lower end of the reflecting surface 2b, and the translucent member 3 is an upper layer portion 3a located above the upper surface of the mounting portion 1a. And the lower layer portion 3b positioned below the upper surface of the mounting portion 1a. The lower layer portion 3b contains the metal particles 4, and the upper layer portion 3a emits light emitted from the light emitting element 5. Contains the phosphor to be converted.

本発明における基体１は、アルミナセラミックスや窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、または、エポキシ樹脂等の樹脂から成る。また、基体１は、上側主面に、発光素子５を載置する、上側主面から突出した載置部１ａを有している。 The substrate 1 in the present invention is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, or resin such as epoxy resin. Moreover, the base body 1 has a mounting portion 1a that protrudes from the upper main surface, on which the light emitting element 5 is mounted, on the upper main surface.

このような載置部１ａは、基体１の上側主面に、アルミナセラミックスや窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、Ｆｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ等の金属、または、エポキシ樹脂等の樹脂から成る凸部１ｂを基体１の上面にロウ材や接着剤等の接合材により取着することによって、または、基体１の上面に凸部１ｂを基体１と一体として形成しておいてもよい。さらには基体１の中央部に設けた貫通孔に、上記のセラミックス，金属または樹脂から成る凸部１ｂをその上側が基体１の上面から突出するように嵌着して取着することによって設けてもよい。 Such a mounting portion 1a is formed on the upper main surface of the substrate 1 with ceramics such as alumina ceramics, aluminum nitride sintered body, mullite sintered body, glass ceramics, Fe-Ni-Co alloy, Cu-W, or the like. The protrusion 1b made of a metal or epoxy resin is attached to the upper surface of the substrate 1 with a bonding material such as a brazing material or an adhesive, or the protrusion 1b is mounted on the upper surface of the substrate 1. And may be formed as one piece. Further, the protrusion 1b made of the above-mentioned ceramic, metal or resin is provided in the through-hole provided in the central portion of the base 1 by fitting it so that its upper side protrudes from the upper surface of the base 1. Also good.

好ましくは、凸部１ｂと基体１とを同じ材質にするのがよい。これにより、載置部1ａと基体1との熱膨張差を小さくすることができ、載置部１ａに歪みが生じて発光素子５の位置がずれ、発光効率が低下するのを有効に抑制できる。 Preferably, the protrusion 1b and the base 1 are made of the same material. Thereby, the difference in thermal expansion between the mounting portion 1a and the base 1 can be reduced, and it is possible to effectively suppress the occurrence of distortion in the mounting portion 1a, the displacement of the light emitting element 5 and the reduction in light emission efficiency. .

また、凸部１ｂが基体１と一体となっている場合、例えば、凸部１ｂや基体１と成るセラミックグリーンシートを積層して同時焼成することによって、切削加工等の金属加工方法によって、または、射出成型等で樹脂をモールド成型することによって作製することができる。 Further, when the convex portion 1b is integrated with the base body 1, for example, by laminating ceramic green sheets to be the convex portion 1b and the base body 1 and firing them simultaneously, by a metal processing method such as cutting, or It can be produced by molding a resin by injection molding or the like.

載置部１ａには、発光素子５が電気的に接続されるための電気接続用パターン（図示せず）が形成されている。この電気接続用パターンが基体１内部に形成された配線層（図示せず）を介して発光装置の外表面に導出されて外部電気回路基板に接続されることにより、発光素子５と外部電気回路とが電気的に接続されることとなる。 On the mounting portion 1a, an electrical connection pattern (not shown) for electrically connecting the light emitting element 5 is formed. The electrical connection pattern is led out to the outer surface of the light emitting device through a wiring layer (not shown) formed inside the base 1 and connected to the external electrical circuit board, whereby the light emitting element 5 and the external electrical circuit are connected. Are electrically connected to each other.

発光素子５を電気接続用パターンに接続する方法としては、ワイヤボンディングを介して接続する方法、または、発光素子５の下面で半田バンプ等の電気接続手段６により接続するフリップチップボンディング方式を用いた方法等が用いられる。好ましくは、フリップチップボンディング方式により接続するのがよい。これにより、電気接続用パターンを発光素子５の直下に設けることができるため、発光素子５の周辺の基体１の上面に電気接続用パターンを設けるためのスペースを設ける必要がなくなる。よって、発光素子５から発光された光がこの基体１の電気接続用パターン用のスペースで吸収されて軸上光度が低下するのを有効に抑制することができる。 As a method of connecting the light emitting element 5 to the electrical connection pattern, a method of connecting through wire bonding or a flip chip bonding method in which the lower surface of the light emitting element 5 is connected by electrical connection means 6 such as a solder bump is used. A method or the like is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the electrical connection pattern can be provided immediately below the light emitting element 5, it is not necessary to provide a space for providing the electrical connection pattern on the upper surface of the base 1 around the light emitting element 5. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 5 from being absorbed in the space for the electrical connection pattern of the substrate 1 and the on-axis luminous intensity being lowered.

この電気接続用パターンは、例えば、Ｗ，Ｍｏ，Ｃｕ，Ａｇ等の金属粉末のメタライズ層を基体１の表面や内部に形成することによって、Ｆｅ−Ｎｉ−Ｃｏ合金等のリード端子を基体１に埋設することによって、または、配線導体が形成された絶縁体から成る入出力端子を基体１に設けた貫通孔に嵌着接合させることによって設けられる。 The electrical connection pattern is formed, for example, by forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag on the surface or inside of the base 1 so that lead terminals such as Fe-Ni-Co alloy are formed on the base 1. It is provided by embedding or by fitting and joining an input / output terminal made of an insulator on which a wiring conductor is formed in a through hole provided in the base 1.

なお、電気接続用パターンの露出する表面には、Ｎｉや金（Ａｕ）等の耐食性に優れる金属を１〜20μｍ程度の厚さで被着させておくのが良く、電気接続用パターンの酸化腐食を有効に防止し得るともに、発光素子５と電気接続用パターンとの接続を強固にし得る。したがって、電気接続用パターンの露出表面には、例えば、厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのがより好ましい。 The exposed surface of the electrical connection pattern should be coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. Can be effectively prevented, and the connection between the light emitting element 5 and the electrical connection pattern can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

また、基体１の上面には、反射部材２が半田，Ａｇロウ等のロウ材やエポキシ樹脂等の接着剤等の接合材により取着される。反射部材２は、中央部に貫通孔２ａが形成されているとともに内周面が発光素子５が発光する光を反射する反射面２ｂとされている。 Further, the reflecting member 2 is attached to the upper surface of the substrate 1 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The reflection member 2 has a through hole 2a formed at the center and an inner peripheral surface that is a reflection surface 2b that reflects light emitted from the light emitting element 5.

反射部材２は、反射部材２に対して切削加工や金型成形等を行うことにより形成される。あるいは、貫通孔２ａの内周面に、例えば、メッキや蒸着等によりＡｌ，Ａｇ，Ａｕ，白金（Ｐｔ），チタン（Ｔｉ），クロム（Ｃｒ），Ｃｕ等の高反射率の金属薄膜を形成することにより反射面２ｂを形成してもよい。なお、反射面２ｂがＡｇやＣｕ等の酸化により変色し易い金属からなる場合には、その表面に、例えば厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのが良い。これにより反射面２ｂの耐腐食性が向上する。 The reflecting member 2 is formed by performing cutting or molding on the reflecting member 2. Alternatively, a highly reflective metal thin film such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), or Cu is formed on the inner peripheral surface of the through hole 2a by, for example, plating or vapor deposition. By doing so, the reflective surface 2b may be formed. When the reflecting surface 2b is made of a metal that is easily discolored by oxidation such as Ag or Cu, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. Is preferably deposited sequentially by electrolytic plating or electroless plating. Thereby, the corrosion resistance of the reflective surface 2b improves.

また、反射面２ｂ表面の算術平均粗さＲａは、0.004〜４μｍであるのが良く、これにより、反射面２ｂが発光素子５や蛍光体の光を良好に反射し得る。Ｒａが４μｍを超えると、発光素子５の光を均一に反射させ得ず、発光装置の内部で乱反射する。一方、0.004μｍ未満では、そのような面を安定かつ効率良く形成することが困難となる傾向にある。 Further, the arithmetic average roughness Ra on the surface of the reflecting surface 2b is preferably 0.004 to 4 μm, whereby the reflecting surface 2b can favorably reflect the light of the light emitting element 5 and the phosphor. When Ra exceeds 4 μm, the light of the light emitting element 5 cannot be reflected uniformly, and is irregularly reflected inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

反射面２ｂは、例えば、縦断面形状が、上側に向かうにともなって外側に広がった図１，２に示すような直線状の傾斜面、上側に向かうにともなって外側に広がった曲面状の傾斜面、あるいは矩形状の面等の形状が挙げられる。 The reflecting surface 2b has, for example, a linear inclined surface as shown in FIGS. 1 and 2 whose longitudinal cross-sectional shape spreads outward as it goes upward, and a curved slope that spreads outward as it goes upward Examples of the shape include a surface and a rectangular surface.

反射部材２は、基体１の上面の凸部１ｂ以外のいかなる部位に取着されてもよいが、発光素子５の周囲に所望の面精度、例えば、発光装置の縦断面において、発光素子５を間に挟んで発光素子５の両側に設けられた反射面２ｂが対称になっている状態で反射面２ｂが設けられるように取着されるのがよい。これにより、発光素子５からの光を蛍光体で波長変換して外部へ直接放射させるだけでなく、発光素子５から横方向等に発光された光や蛍光体から下側に放出された光を反射面２ｂで均一にむらなく反射させることができ、軸上光度および輝度さらには演色性等を効果的に向上させることができる。 The reflecting member 2 may be attached to any part other than the convex portion 1b on the upper surface of the substrate 1, but the light emitting element 5 is disposed around the light emitting element 5 with a desired surface accuracy, for example, in the longitudinal section of the light emitting device. It is preferable that the reflective surface 2b is provided so as to be provided in a state where the reflective surfaces 2b provided on both sides of the light emitting element 5 are symmetrically sandwiched therebetween. Thereby, not only the light from the light emitting element 5 is wavelength-converted by the phosphor and directly radiated to the outside, but also the light emitted from the light emitting element 5 in the lateral direction or the light emitted downward from the phosphor. The reflecting surface 2b can be uniformly reflected, and the axial luminous intensity, luminance, color rendering properties, and the like can be effectively improved.

特に図２に示すように、反射部材２が凸部１ｂに近接しているほど上記の効果が顕著に現れる。これにより、載置部１ａを有する凸部１ｂの周囲を反射部材２で取り囲むことによって、より多くの光を反射させることができ、より高い軸上光度を得ることが可能となる。 In particular, as shown in FIG. 2, the above-described effect appears more prominently as the reflecting member 2 is closer to the convex portion 1 b. Thereby, by enclosing the circumference | surroundings of the convex part 1b which has the mounting part 1a with the reflection member 2, more light can be reflected and it becomes possible to obtain a higher on-axis luminous intensity.

また、載置部１ａに搭載された発光素子５の発光部は、反射面２ｂの下端２ｃよりも高い位置になるように設けられている。すなわち、発光素子５の発光部の基体１の上側主面からの高さは、貫通孔２ａの下側開口部の周囲の反射部材２の厚さＬよりも大きい。これにより、発光素子５が発光した光が、反射部材２の加工時に反射面２ｂの下端２ｃに発生したバリ等や反射部材２を基体１に接合する際にはみ出したロウ材によって、乱反射したり吸収されたりするのを有効に防止できるとともに、発光素子５が発光する光を透光性部材３の表面近傍の多量の蛍光体に照射することができ、波長変換効率を非常に良好なものとし得る。 Moreover, the light emission part of the light emitting element 5 mounted on the mounting part 1a is provided so that it may become a position higher than the lower end 2c of the reflective surface 2b. That is, the height of the light emitting portion of the light emitting element 5 from the upper main surface of the base 1 is larger than the thickness L of the reflecting member 2 around the lower opening of the through hole 2a. Thereby, the light emitted from the light emitting element 5 is diffusely reflected by burrs generated at the lower end 2c of the reflecting surface 2b during the processing of the reflecting member 2 or by the brazing material protruding when the reflecting member 2 is joined to the base 1. In addition to being able to effectively prevent absorption, it is possible to irradiate a large amount of phosphor near the surface of the translucent member 3 with light emitted from the light emitting element 5, and to achieve very good wavelength conversion efficiency. obtain.

本発明の透光性部材３は、エポキシ樹脂やシリコーン樹脂等の透明樹脂から成る。透光性部材３は、ディスペンサー等の注入機で発光素子５を覆うように反射部材２の内部に充填され、オーブン等で熱硬化されることで、発光素子５からの光を蛍光体により波長変換し所望の波長スペクトルを有する光を取り出すことができる。 The translucent member 3 of the present invention is made of a transparent resin such as an epoxy resin or a silicone resin. The translucent member 3 is filled in the reflecting member 2 so as to cover the light emitting element 5 with an injection machine such as a dispenser, and is thermally cured in an oven or the like, so that the light from the light emitting element 5 is converted into a wavelength by a phosphor. It is possible to extract light having a desired wavelength spectrum after conversion.

ここで、透光性部材３は、載置部１ａの上面よりも上側に位置する上層部３ａと載置部１ａの上面よりも下側に位置する下層部３ｂとの二層から成り、下層部３ｂが金属粒子４を含有しているとともに上層部３ａが発光素子５が発光する光を波長変換する蛍光体を含有していることから、発光素子から下方に発光する光を反射部材２および金属粒子４表面で反射させ、発光素子５から発光する光の全てを高い反射率で反射させることができる。 Here, the translucent member 3 is composed of two layers of an upper layer portion 3a located above the upper surface of the placement portion 1a and a lower layer portion 3b located below the upper surface of the placement portion 1a. Since the part 3b contains the metal particles 4 and the upper layer part 3a contains a phosphor that converts the wavelength of light emitted from the light emitting element 5, the light emitted downward from the light emitting element is reflected by the reflecting member 2 and It is possible to reflect all of the light emitted from the light emitting element 5 with a high reflectance by reflecting on the surface of the metal particles 4.

また、発光素子５からの光を透光性部材３の下層部３ｂの金属粒子４で乱反射させることによって、上層部３ａの蛍光体に万遍なく光を照射することができ、より多くの蛍光体で波長変換することによって波長変換効率が極めて高くなり、放射強度や軸上光度、輝度、演色性をより高めることができる。 Moreover, by irregularly reflecting the light from the light emitting element 5 with the metal particles 4 in the lower layer portion 3b of the translucent member 3, it is possible to uniformly irradiate the phosphor of the upper layer portion 3a with more fluorescence. By converting the wavelength with the body, the wavelength conversion efficiency becomes extremely high, and the radiation intensity, the on-axis luminous intensity, the luminance, and the color rendering can be further increased.

さらに、透光性部材３の上層部３ａにおいては金属粒子４を含有しないことによって、透光性部材３の表面付近で光が乱反射するのを有効に防止して所望の放射角度で光を出射させることができ、発光装置からの放射強度を極めて高いものとすることができるとともに指向性の高いものとすることができる。 Further, by not containing the metal particles 4 in the upper layer portion 3a of the translucent member 3, it is possible to effectively prevent light from being diffusely reflected near the surface of the translucent member 3, and to emit light at a desired radiation angle. The intensity of radiation from the light emitting device can be made extremely high and the directivity can be made high.

また、発光素子５から発生した熱が基体１に伝わっても、突出した載置部１ａから金属粒子４を介して良好に反射部材２へ熱を伝達することができ、基体１からだけではなく、透光性部材３中の金属粒子４および反射部材２を介しても発光素子５から発生する熱を効率よく外部に放散させることができるようになる。その結果、発光素子５から発生する熱量が大きくなっても発光素子５から発生した熱を完全に外部へ放散させるのができ、その結果、発光素子５の温度の上昇を防止し、安定した放射強度が得られるようになる。 Further, even if the heat generated from the light emitting element 5 is transmitted to the base body 1, the heat can be satisfactorily transmitted from the protruding mounting portion 1 a to the reflecting member 2 through the metal particles 4, and not only from the base body 1. The heat generated from the light emitting element 5 can be efficiently dissipated to the outside even through the metal particles 4 and the reflecting member 2 in the translucent member 3. As a result, even if the amount of heat generated from the light emitting element 5 increases, the heat generated from the light emitting element 5 can be completely dissipated to the outside. As a result, the temperature of the light emitting element 5 is prevented from rising and stable radiation is achieved. Strength can be obtained.

さらに、発光装置を外部電気回路基板へ実装する際の熱や発光素子５の熱などによって反射部材２と基体１との間に熱膨張差による応力が生じても、金属粒子４を含むことによって適度に硬いとともに適度に変形しやすい透光性部材３の下層部３ｂが、反射部材２や基体１の熱膨張に応じて変形したり、反射部材２や基体１を拘束したりすることによって反射部材２や基体１の熱膨張による応力を有効に吸収することができる。その結果、基体１や反射部材２にクラックなどが生じるのを有効に抑制することができる。 Furthermore, even if a stress due to a difference in thermal expansion occurs between the reflecting member 2 and the substrate 1 due to heat when the light emitting device is mounted on the external electric circuit board or heat of the light emitting element 5, the metal particles 4 are included. The lower layer portion 3b of the translucent member 3 that is moderately hard and easily deformed is deformed according to the thermal expansion of the reflecting member 2 and the base 1, or is reflected by restraining the reflecting member 2 and the base 1 The stress due to the thermal expansion of the member 2 and the substrate 1 can be effectively absorbed. As a result, it is possible to effectively suppress the occurrence of cracks or the like in the substrate 1 and the reflecting member 2.

金属粒子４は、Ａｇ，Ａｌ等の熱伝導率が高くかつ光の反射率の高い金属から成るのがよく、これにより、発光装置からの放射強度をより高く安定なものとすることができる。 The metal particles 4 are preferably made of a metal having a high thermal conductivity such as Ag or Al and a high light reflectivity, whereby the radiation intensity from the light emitting device can be made higher and more stable.

また、金属粒子４の粒径は１〜５μｍであるのがよく、これにより、発光素子５から発光する光を金属粒子４の表面で高い反射率で反射させることができるとともに、透光性部材３の内部に透光性部材３を破損させることなく金属粒子４を確実に埋め込むことができる。粒径が１μｍ未満であると、粒径が小さくなりすぎて金属粒子４の表面で発光素子５から発光する光を高い反射率で反射させるのが困難となる。粒径が５μｍを超えて大きくなると、発光素子５の作動時に熱が発生すると透光性部材３と金属粒子４との間に大きく熱膨張差が発生して、透光性部材３にクラック等の破損を生じやすくなり、この破損により透光性部材３内で光が乱反射して発光装置からの放射強度が低下しする場合がある。 In addition, the particle size of the metal particles 4 is preferably 1 to 5 μm, whereby the light emitted from the light emitting element 5 can be reflected on the surface of the metal particles 4 with a high reflectance, and the translucent member. The metal particles 4 can be reliably embedded without damaging the translucent member 3 in the interior of 3. When the particle size is less than 1 μm, the particle size becomes too small to make it difficult to reflect light emitted from the light emitting element 5 on the surface of the metal particle 4 with high reflectivity. When the particle size becomes larger than 5 μm, if heat is generated during the operation of the light emitting element 5, a large thermal expansion difference is generated between the translucent member 3 and the metal particles 4, and cracks or the like occur in the translucent member 3. In some cases, the light is irregularly reflected in the translucent member 3 and the radiation intensity from the light emitting device is lowered.

また、透光性部材３の上面は図１，２に示すように上に凸の形状になっているのがよい。これにより、これにより、発光素子５から種々の方向に発光された光が透光性部材３を透過する行路長を近時させることができ、放射強度のむらが生じるのを有効に抑制できる。 The upper surface of the translucent member 3 is preferably convex upward as shown in FIGS. Thereby, the path length which the light radiated | emitted from the light emitting element 5 in the various directions permeate | transmits the translucent member 3 can be made near now, and it can suppress effectively that the nonuniformity of radiation intensity arises.

なお、本発明は以上の実施の形態の例に限定されず、本発明の要旨を逸脱しない範囲内であれば種々の変更を行なうことは何等支障ない。 In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

例えば、放射強度の向上のために基体１に発光素子５を複数設けてしても良い。また反射面２ｂの角度や、反射面２ｂ上端から透光性部材３の上面までの距離を任意に調整することも可能であり、これにより、補色域を設けることによりさらに良好な演色性を得ることができる。 For example, a plurality of light emitting elements 5 may be provided on the substrate 1 in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angle of the reflecting surface 2b and the distance from the upper end of the reflecting surface 2b to the upper surface of the translucent member 3, thereby obtaining a better color rendering by providing a complementary color gamut. be able to.

本発明の発光装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 従来の発光装置を示す断面図である。It is sectional drawing which shows the conventional light-emitting device.

符号の説明Explanation of symbols

１：基体
１ａ：載置部
２：反射部材
３：透光性部材
３ａ：上層部
３ｂ：下層部
４：金属粒子
５：発光素子 1: Base 1a: Placement part 2: Reflecting member 3: Translucent member 3a: Upper layer part 3b: Lower layer part 4: Metal particle 5: Light emitting element

Claims

上側主面から突出した発光素子の載置部を有する基体と、
前記載置部上に載置された発光素子と、
該基体の上側主面に前記載置部を囲繞するように接合された、内周面が前記発光素子が発光する光を反射する反射面とされている枠状の反射部材と、
該反射部材の内側に前記発光素子を覆うように設けられた透光性部材とを具備しており、
前記発光素子は、その発光部が前記反射面の下端よりも上側に位置しており、前記透光性部材は、前記載置部の上面よりも上側に位置し、前記発光素子の上面を被覆する上層部と前記載置部の上面よりも下側に位置する下層部との二層から成り、
前記下層部が金属粒子を含有しているとともに前記上層部が前記発光素子が発光する光を波長変換する蛍光体を含有していることを特徴とする発光装置。 A base body having a mounting portion for the light emitting element protruding from the upper main surface;
A light emitting device placed on the placement portion, and
A frame-like reflecting member that is joined to the upper main surface of the base so as to surround the mounting portion, and whose inner peripheral surface is a reflecting surface that reflects light emitted from the light-emitting element;
A translucent member provided so as to cover the light emitting element inside the reflective member;
The light emitting element has a light emitting portion located above the lower end of the reflecting surface, and the translucent member is located above the upper surface of the mounting portion and covers the upper surface of the light emitting element. consists two layers of a lower layer portion positioned below the upper surface of the upper portion and the mounting section that overturn,
The light emitting device characterized in that the lower layer portion contains metal particles and the upper layer portion contains a phosphor that converts the wavelength of light emitted from the light emitting element.