JP4206334B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP4206334B2
JP4206334B2 JP2003429380A JP2003429380A JP4206334B2 JP 4206334 B2 JP4206334 B2 JP 4206334B2 JP 2003429380 A JP2003429380 A JP 2003429380A JP 2003429380 A JP2003429380 A JP 2003429380A JP 4206334 B2 JP4206334 B2 JP 4206334B2
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light
light emitting
emitting element
emitting device
hole
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JP2005191196A (en
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真吾 松浦
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

本発明は、発光素子から発光される光を蛍光体で波長変換し外部に発光する発光装置に関する。   The present invention relates to a light emitting device that converts the wavelength of light emitted from a light emitting element with a phosphor and emits light to the outside.

従来の発光ダイオード（ＬＥＤ）等の発光素子16から発光される近紫外光や青色光等の光を赤色，緑色，青色，黄色等の複数の蛍光体15で長波長変換して白色発光する発光装置11を図４に示す。図４において、発光装置11は、上面の中央部に発光素子16を載置するための載置部12ｂを有し、載置部12ｂおよびその周辺から発光装置11の内外を電気的に導通接続するリード端子やメタライズ配線等からなる配線導体12ａが形成された絶縁体からなる基体12と、基体12上面に接着固定され、上側開口が下側開口より大きい貫通孔が形成されているとともに、内周面が発光素子16から発光する光を反射する反射面とされている枠状の反射部材13と、反射部材13の内部に充填され発光素子16が発光する光を励起し長波長変換する蛍光体15を含有した透光性部材14と、載置部12ｂに載置固定された発光素子16とから主に構成されている。   Light emission that emits white light by converting long wavelengths of light such as near-ultraviolet light and blue light emitted from a light emitting element 16 such as a conventional light emitting diode (LED) into a long wavelength by a plurality of phosphors 15 such as red, green, blue, and yellow. The device 11 is shown in FIG. In FIG. 4, the light emitting device 11 has a mounting portion 12b for mounting the light emitting element 16 in the central portion of the upper surface, and electrically connects the inside and outside of the light emitting device 11 from the mounting portion 12b and its periphery. A base 12 made of an insulator on which a wiring conductor 12a made of a lead terminal, metallized wiring, etc. is formed, and a through hole that is bonded and fixed to the upper surface of the base 12 and whose upper opening is larger than the lower opening; A frame-like reflecting member 13 whose peripheral surface is a reflecting surface that reflects light emitted from the light emitting element 16, and fluorescence that excites the light emitted from the light emitting element 16 that is filled inside the reflecting member 13 and converts it to a long wavelength. It is mainly composed of a translucent member 14 containing the body 15 and a light emitting element 16 mounted and fixed on the mounting portion 12b.

基体12は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成る。基体12がセラミックスから成る場合、その上面に配線導体12ａがタングステン（Ｗ），モリブデン（Ｍｏ）−マンガン（Ｍｎ）等から成る金属ペーストを高温で焼成して形成される。また、基体12が樹脂から成る場合、銅（Ｃｕ）や鉄（Ｆｅ）−ニッケル（Ｎｉ）合金等から成るリード端子がモールド成型されて基体12の内部に設置固定される。   The substrate 12 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin. When the substrate 12 is made of ceramics, the wiring conductor 12a is formed on the upper surface of the substrate 12 by baking a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 12 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 12.

また、反射部材13は、上側開口が下側開口より大きい貫通孔が形成されるとともに内周面に光を反射する反射面が設けられる枠状となっている。具体的には、アルミニウム（Ａｌ）やＦｅ−Ｎｉ−コバルト（Ｃｏ）合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。   Further, the reflecting member 13 has a frame shape in which a through hole having an upper opening larger than the lower opening is formed and a reflecting surface for reflecting light is provided on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

さらに、反射部材13の反射面は、貫通孔の内周面を研磨して平坦化することにより、あるいは、貫通孔の内周面にＡｌ等の金属を蒸着法やメッキ法により被着することにより形成される。そして、反射部材13は、半田，銀（Ａｇ）ロウ等のロウ材または樹脂接着材等の接合材により、載置部12ｂを反射部材13の内周面で取り囲むように基体12の上面に接合される。   Further, the reflecting surface of the reflecting member 13 is made by polishing and flattening the inner peripheral surface of the through hole, or by depositing a metal such as Al on the inner peripheral surface of the through hole by vapor deposition or plating. It is formed by. Then, the reflecting member 13 is bonded to the upper surface of the base 12 so as to surround the mounting portion 12b with the inner peripheral surface of the reflecting member 13 by a bonding material such as solder, silver (Ag) brazing material or resin adhesive. Is done.

そして、載置部12ｂの周辺に配置した配線導体12ａと発光素子16とをボンディングワイヤ17を介して電気的に接続し、しかる後、蛍光体15を含有するエポキシ樹脂やシリコーン樹脂等の透光性部材14をディスペンサー等の注入機で発光素子16を覆うように反射部材13の内部に充填しオーブンで熱硬化させることで、発光素子16からの光を蛍光体15により長波長変換し所望の波長スペクトルを有する光を取り出せる発光装置11となし得る。
特開2003-37298号公報 Then, the wiring conductor 12a disposed around the mounting portion 12b and the light emitting element 16 are electrically connected via the bonding wire 17, and then light-transmitting material such as an epoxy resin or a silicone resin containing the phosphor 15 is used. The reflective member 13 is filled in the reflective member 13 so as to cover the light emitting element 16 with an injection machine such as a dispenser and thermally cured in an oven, and the light from the light emitting element 16 is converted into a long wavelength by the phosphor 15 to obtain a desired wavelength The light emitting device 11 can extract light having a wavelength spectrum.
Japanese Patent Laid-Open No. 2003-37298

近年、発光装置11の放射光強度をさらに高めることが望まれている。しかしながら、上記従来の発光装置11は、発光素子16が基体12に載置固定されているため、例えば、基体12がセラミックスや樹脂から成る場合、発光素子16または蛍光体15から発生した光が基体12を透過し、発光装置11の放射光強度が劣化するという問題点を有していた。   In recent years, it has been desired to further increase the emitted light intensity of the light-emitting device 11. However, in the conventional light emitting device 11, since the light emitting element 16 is mounted and fixed to the base 12, for example, when the base 12 is made of ceramics or resin, the light generated from the light emitting element 16 or the phosphor 15 is the base. 12 has a problem that the intensity of radiated light of the light emitting device 11 is deteriorated.

また、発光素子16または蛍光体15から発生した光が基体12と反射部材13との接合部においても吸収されやすく光損失が大きいという問題点を有していた。   In addition, the light generated from the light emitting element 16 or the phosphor 15 is easily absorbed even at the joint portion between the base 12 and the reflecting member 13, resulting in a large light loss.

また、反射部材13の内周面を発光素子16により近づけて発光素子16または蛍光体15から発生した光を反射部材13で反射させようとしても、基体12上には発光素子16が配線導体12ａにボンディングワイヤ17で接続されており、反射部材13の内周面を発光素子16に近づけるのは困難である。特に、反射部材13が金属から成る場合、載置部12ｂおよび配線導体12ａと反射部材13との絶縁性を十分に確保するために載置部12ｂおよび配線導体12ａと反射部材13との間隔を大きくする必要があり、発光装置11の小型化が困難になるという問題点があった。   Even when the inner peripheral surface of the reflecting member 13 is brought closer to the light emitting element 16 and light generated from the light emitting element 16 or the phosphor 15 is reflected by the reflecting member 13, the light emitting element 16 is disposed on the substrate 12 on the wiring conductor 12a. It is difficult to bring the inner peripheral surface of the reflecting member 13 close to the light emitting element 16 by the bonding wire 17. In particular, when the reflecting member 13 is made of metal, the spacing between the mounting portion 12b, the wiring conductor 12a, and the reflecting member 13 is set to ensure sufficient insulation between the mounting portion 12b and the wiring conductor 12a and the reflecting member 13. There is a problem in that it is necessary to increase the size and it is difficult to reduce the size of the light emitting device 11.

したがって、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、発光素子16から発生した光を効率よく蛍光体15により波長変換し、発光装置11の放射光強度を向上させるとともに小型化することにある。   Therefore, the present invention has been completed in view of the above-described conventional problems, and its purpose is to efficiently convert the wavelength of light generated from the light emitting element 16 by the phosphor 15 and to increase the emitted light intensity of the light emitting device 11. It is to improve and downsize.

本発明の一つの態様によれば、発光装置は、平板状の基体、配線導体および反射部材を有している。発光装置は、発光素子およびボンディングワイヤをさらに有している。配線導体は、基体に設けられており、基体の上面および外面に導出されている。反射部材は、反射面とされた内周面を含む側壁部を外周部に有しているとともに、側壁部の内側に設けられた貫通孔を有している。反射部材は、基体上に設けられている。発光素子は、側壁部の内側に配置されており、反射部材上に載置されている。ボンディングワイヤは、発光素子の電極および配線導体を電気的に接続しており、貫通孔内に配置されている。貫通孔の内周面は、上端から下端に向かうに伴って外側に広がるように傾斜している。発光装置は、前記貫通孔に充填された透明部材をさらに有している。透明部材は、絶縁性の光反射性粒子を含有している。 According to one aspect of the present invention, the light emitting device has a flat substrate, a wiring conductor, and a reflecting member. The light emitting device further includes a light emitting element and a bonding wire. The wiring conductor is provided on the base body and led out to the upper surface and the outer surface of the base body. The reflection member has a side wall portion including an inner peripheral surface as a reflection surface in the outer peripheral portion, and has a through hole provided inside the side wall portion. The reflecting member is provided on the base. The light emitting element is arrange | positioned inside the side wall part, and is mounted on the reflection member. The bonding wire electrically connects the electrode of the light emitting element and the wiring conductor, and is disposed in the through hole. The inner peripheral surface of the through hole is inclined so as to spread outward as it goes from the upper end to the lower end. The light emitting device further includes a transparent member filled in the through hole. The transparent member contains insulating light reflective particles.

本発明の他の態様によれば、発光装置は、平板状の基体、配線導体および反射部材を有している。発光装置は、発光素子およびボンディングワイヤをさらに有している。配線導体は、基体に設けられており、基体の上面および外面に導出されている。反射部材は、反射面とされた内周面を含む側壁部を外周部に有しているとともに、側壁部の内側に設けられた複数の貫通孔を有している。反射部材は、基体上に設けられている。発光素子は、側壁部の内側に配置されており、反射部材上に載置されている。発光素子は、四角形の平面視形状を有している。ボンディングワイヤは、発光素子の電極および配線導体を電気的に接続しており、複数の貫通孔内に配置されている。複数の貫通孔は、発光素子の対角線上に対向して配置されている。 According to another aspect of the present invention, the light emitting device includes a flat substrate, a wiring conductor, and a reflecting member. The light emitting device further includes a light emitting element and a bonding wire. The wiring conductor is provided on the base body and led out to the upper surface and the outer surface of the base body. The reflecting member has a side wall portion including an inner peripheral surface as a reflecting surface in the outer peripheral portion, and has a plurality of through holes provided inside the side wall portion. The reflecting member is provided on the base. The light emitting element is arrange | positioned inside the side wall part, and is mounted on the reflection member. The light emitting element has a quadrangular plan view shape. The bonding wire electrically connects the electrode of the light emitting element and the wiring conductor, and is disposed in the plurality of through holes. The plurality of through holes are arranged to face each other on the diagonal line of the light emitting element.

発光装置は、上記構成において、絶縁性の光反射性粒子を含有しており、貫通孔に充填された透明部材をさらに備えている。In the above configuration, the light-emitting device further includes a transparent member that contains insulating light-reflective particles and is filled in the through hole.

本発明の発光装置は、平板状の基体と、一端が基体の上面に形成されて他端が基体の外面に導出された配線導体と、基体の上面に接合され、上側主面の中央部に発光素子の載置部が形成されるとともに上側主面の外周部に内周面が発光素子が発光する光を反射する反射面とされた側壁部が載置部を囲繞するように形成された反射部材と、載置部に載置された発光素子と、側壁部の内側に発光素子を覆うように設けられ、発光素子が発光する光を波長変換する蛍光体を含有する透光性部材とを具備しており、反射部材は、載置部の周囲に上下主面間を貫通する貫通孔が形成されており、発光素子の電極と基体の上面の配線導体とが貫通孔を通してボンディングワイヤで電気的に接続されていることにより、発光素子または蛍光体から発生した光を、基体と反射部材との接合部や基体の露出部がなく、上側主面全面が連続した金属面となっている反射部材で効率よく反射させることができる。その結果、発光素子または蛍光体から発生した光が基体を透過したり吸収されたりすることを有効に防ぎ、発光装置の放射光強度を高めることができる。   The light-emitting device of the present invention includes a flat substrate, a wiring conductor having one end formed on the upper surface of the substrate and the other end led to the outer surface of the substrate, and joined to the upper surface of the substrate. A mounting portion for the light emitting element is formed, and a side wall portion whose inner peripheral surface is a reflecting surface for reflecting light emitted from the light emitting element is formed on the outer peripheral portion of the upper main surface so as to surround the mounting portion. A reflective member, a light-emitting element placed on the placement part, and a translucent member containing a phosphor that is provided inside the side wall so as to cover the light-emitting element and converts the wavelength of light emitted from the light-emitting element. The reflecting member is formed with a through-hole penetrating between the upper and lower main surfaces around the mounting portion, and the electrode of the light emitting element and the wiring conductor on the upper surface of the substrate are bonded with a bonding wire through the through-hole. Light generated from the light-emitting element or phosphor by being electrically connected , Can be efficiently reflected by the reflecting member has a substrate and reflecting no exposed portion of the joint portion and the base of the member, the metal surface an upper major surface entirely's. As a result, it is possible to effectively prevent light generated from the light emitting element or the phosphor from being transmitted through or absorbed by the substrate and to increase the emitted light intensity of the light emitting device.

さらに、発光素子の熱が反射部材全体に拡散されることから、熱は反射部材の下側主面より効率よく基体に伝達され、発光素子のチップ温度の上昇を抑制できる。その結果、発光素子の熱による発光効率の劣化や波長のズレを抑制することができる。さらにまた、反射部材と配線導体との電気的な絶縁性を確保するとともに発光装置を小型化にすることができる。   Further, since the heat of the light emitting element is diffused throughout the reflecting member, the heat is efficiently transmitted to the base body from the lower main surface of the reflecting member, and an increase in the chip temperature of the light emitting element can be suppressed. As a result, it is possible to suppress deterioration in light emission efficiency and wavelength shift due to heat of the light emitting element. Furthermore, it is possible to ensure electrical insulation between the reflecting member and the wiring conductor and to reduce the size of the light emitting device.

本発明の発光装置において、好ましくは、貫通孔は、その内周面が上端から下端に向かうに伴って外側に広がるように傾斜していることにより、基体の上面に対して斜めになった状態でボンディングワイヤを接合しても貫通孔の内周面はボンディングワイヤに対して平行となるように形成されているので、貫通孔の内周面をよりボンディングワイヤに近づけても絶縁性を十分維持することができ、その結果、貫通孔の開口径を小さくして、発光装置を小型化することが可能となる。さらに、このようにボンディングワイヤを基体の上面に対して斜めになった状態で接合した場合、ボンディングワイヤの長さを短くすることができる。即ち、ボンディングワイヤを基体に対して垂直に延ばした後に湾曲させて発光素子と接続させるよりも、ボンディングワイヤを基体の上面から発光素子に向かって斜め上に延ばして発光素子に接続させる方がより短い距離で発光素子と基体上面の配線導体とをボンディングワイヤで電気的に接続することができる。よって、発光素子や蛍光体から発せられる光がボンディングワイヤで吸収されるのをより有効に抑制できる。   In the light emitting device of the present invention, preferably, the through hole is inclined with respect to the upper surface of the base body by inclining so that the inner peripheral surface thereof spreads outward as it goes from the upper end to the lower end. Even if the bonding wire is joined, the inner peripheral surface of the through hole is formed so as to be parallel to the bonding wire, so that sufficient insulation is maintained even if the inner peripheral surface of the through hole is closer to the bonding wire. As a result, the opening diameter of the through hole can be reduced, and the light emitting device can be downsized. Furthermore, when the bonding wire is bonded in an oblique state with respect to the upper surface of the substrate, the length of the bonding wire can be shortened. That is, it is better to extend the bonding wire diagonally from the upper surface of the substrate toward the light emitting device and connect it to the light emitting device than to extend the bonding wire perpendicularly to the substrate and then bend it to connect to the light emitting device. The light emitting element and the wiring conductor on the upper surface of the substrate can be electrically connected with a bonding wire at a short distance. Therefore, it can suppress more effectively that the light emitted from a light emitting element or fluorescent substance is absorbed by a bonding wire.

さらに、基体の貫通孔の上側の開口径を小さくすることができるので、発光素子または蛍光体から発生した光が貫通孔内に進入することを抑制し、光損失が生じるのを有効に防止できる。その結果、発光装置の放射光強度を高めることができる。   Furthermore, since the opening diameter on the upper side of the through hole of the base can be reduced, it is possible to suppress the light generated from the light emitting element or the phosphor from entering the through hole and effectively prevent the occurrence of light loss. . As a result, the emitted light intensity of the light emitting device can be increased.

本発明の発光装置において、好ましくは、発光素子は平面視形状が四角形であり、貫通孔は発光素子の四角形の対角線上に対向して形成されていることから、光吸収が生じるボンディングワイヤ部分を互いに遠ざけて光吸収の相乗効果が生じないようにすることができ、ボンディングワイヤの光吸収によって生じる光の弱い部分が認識されるのを有効に防止して発光むらが生じるのを有効に抑制できる。   In the light-emitting device of the present invention, preferably, the light-emitting element has a quadrangular shape in plan view, and the through holes are formed opposite to the diagonal of the square of the light-emitting element. It can be kept away from each other so that the synergistic effect of light absorption does not occur, and it is possible to effectively prevent the occurrence of uneven light emission by effectively preventing the weak part of light caused by light absorption of the bonding wire from being recognized. .

本発明の発光装置において、好ましくは、貫通孔は、その内部に絶縁性の光反射性粒子を含有する透明部材が充填されていることにより、発光素子または蛍光体から発生した光が貫通孔の内部に進入することをきわめて有効に防ぎ、光損失が生じるのを有効に防止できる。その結果、発光装置の放射光強度をより高めることができる。   In the light-emitting device of the present invention, preferably, the through-hole is filled with a transparent member containing insulating light-reflecting particles, so that light generated from the light-emitting element or the phosphor is in the through-hole. It is possible to effectively prevent entry into the interior and effectively prevent light loss. As a result, the emitted light intensity of the light emitting device can be further increased.

本発明の発光装置について以下に詳細に説明する。図１は本発明の発光装置の実施の形態の一例を示す断面図である。この図において、２は基体、３は反射部材、４は蛍光体５を含有した透光性部材であり、主としてこれらで発光素子６の発光を方向性をもって外部に発光させ得る発光装置１が構成される。   The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 2 is a substrate, 3 is a reflecting member, 4 is a translucent member containing a phosphor 5, and the light-emitting device 1 that can emit light emitted from the light-emitting element 6 with directionality to the outside mainly comprises these components. Is done.

基体２は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成り、上側主面に発光素子６を載置する載置部３ｂを有する反射部材３を載置固定する機能を有する。また、基体２の上面には、反射部材３が半田，Ａｇロウ等のロウ材やエポキシ樹脂等の接着剤等の接合材により取着される。   The substrate 2 is made of an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, a ceramic such as glass ceramics, or a resin such as an epoxy resin. Has a function of mounting and fixing the reflecting member 3 having the mounting portion 3b. Further, the reflecting member 3 is attached to the upper surface of the base 2 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin.

また、本発明の反射部材３は、上側主面の中央部に発光素子６の載置部３ｂが形成されるとともに上側主面の外周部に内周面が発光素子６が発光する光を反射する反射面とされた側壁部が載置部３ｂを囲繞するように形成される。これにより、発光素子６からの光を蛍光体５で波長変換して外部へ直接放射させるだけでなく、発光素子６から横方向等に発光された光や蛍光体５から下側に放出された光を反射面で均一にむらなく反射させることができ、軸上光度および輝度さらには演色性等を効果的に向上させることができる。   Further, in the reflecting member 3 of the present invention, the mounting portion 3b of the light emitting element 6 is formed in the central portion of the upper main surface, and the inner peripheral surface reflects light emitted from the light emitting element 6 on the outer peripheral portion of the upper main surface. The side wall portion that is the reflecting surface is formed so as to surround the placement portion 3b. As a result, not only the light from the light emitting element 6 is wavelength-converted by the phosphor 5 but directly emitted to the outside, but also light emitted from the light emitting element 6 in the lateral direction or the like or emitted from the phosphor 5 downward. The light can be reflected uniformly and uniformly on the reflecting surface, and the axial luminous intensity, luminance, color rendering, etc. can be effectively improved.

また、反射部材３は、載置部３ｂの周囲に上下主面間を貫通する貫通孔３ａが形成されており、発光素子６の電極と基体２の上面の配線導体２ａとが貫通孔３ａを通してボンディングワイヤ７で電気的に接続されていることにより、反射部材３と配線導体２ａとの電気的な絶縁性を確保することができる。   In addition, the reflecting member 3 is formed with a through hole 3a penetrating between the upper and lower main surfaces around the mounting portion 3b, and the electrode of the light emitting element 6 and the wiring conductor 2a on the upper surface of the substrate 2 pass through the through hole 3a. By being electrically connected by the bonding wire 7, it is possible to ensure electrical insulation between the reflecting member 3 and the wiring conductor 2a.

また、反射部材３は、基体２上面に接着されていることにより、発光素子６の発する熱が反射部材３全体に拡散される。その結果、熱は反射部材３の下側主面より効率よく基体２に伝達され、発光素子６のチップ温度の上昇を抑制できる。従って、発光素子６の熱による発光効率の劣化や波長のズレを抑制し、発光素子６の作動性を良好とし得る。   Further, since the reflecting member 3 is bonded to the upper surface of the base 2, the heat generated by the light emitting element 6 is diffused throughout the reflecting member 3. As a result, heat is efficiently transmitted to the base 2 from the lower main surface of the reflecting member 3, and an increase in the chip temperature of the light emitting element 6 can be suppressed. Therefore, deterioration of the light emission efficiency and wavelength shift due to heat of the light emitting element 6 can be suppressed, and the operability of the light emitting element 6 can be improved.

さらに、発光素子６または蛍光体５から発生した光がそのまま基体２を透過することを有効に防ぎ、発光装置１の放射強度を高めて、軸上光度や輝度，演色性等の光特性を良好なものとし得る。   Further, it is possible to effectively prevent light generated from the light emitting element 6 or the phosphor 5 from being transmitted through the substrate 2 as it is, to increase the radiation intensity of the light emitting device 1 and to improve the light characteristics such as on-axis luminous intensity, luminance, and color rendering. Can be.

また、貫通孔３ａは、その形状が反射部材３の上側主面から下側主面に向かうに伴って外側に広がるように傾斜しているのがよい。これにより、基体２の上面に対して斜めになった状態でボンディングワイヤ７を接合しても貫通孔３ａの内周面はボンディングワイヤ７に対して平行となるように形成されているので、貫通孔３ａの内周面をよりボンディングワイヤ７に近づけても絶縁性を十分維持することができ、その結果、貫通孔３ａの開口径を小さくして、発光装置１を小型化することが可能となる。さらに、このようにボンディングワイヤ７を基体２の上面に対して斜めになった状態で接合した場合、ボンディングワイヤ７の長さを短くすることができる。即ち、ボンディングワイヤ７を基体２に対して垂直に延ばした後に湾曲させて発光素子６と接続させるよりも、ボンディングワイヤ７を基体２の上面から発光素子６に向かって斜め上に延ばして発光素子６に接続させる方がより短い距離で発光素子６と基体２上面の配線導体２ａとをボンディングワイヤ７で電気的に接続することができる。よって、発光素子６や蛍光体５から発せられる光がボンディングワイヤ７で吸収されるのをより有効に抑制できる。   Moreover, the through-hole 3a is good to incline so that the shape may spread outside as the shape goes to the lower main surface from the upper main surface of the reflection member 3. As a result, even if the bonding wire 7 is joined in an inclined state with respect to the upper surface of the substrate 2, the inner peripheral surface of the through hole 3 a is formed to be parallel to the bonding wire 7. Even if the inner peripheral surface of the hole 3a is closer to the bonding wire 7, the insulation can be sufficiently maintained. As a result, the opening diameter of the through hole 3a can be reduced and the light emitting device 1 can be downsized. Become. Furthermore, when the bonding wire 7 is bonded in an inclined state with respect to the upper surface of the base 2 in this way, the length of the bonding wire 7 can be shortened. That is, the bonding wire 7 extends obliquely upward from the upper surface of the substrate 2 toward the light emitting element 6 rather than being bent and connected to the light emitting element 6 after extending the bonding wire 7 perpendicularly to the substrate 2. The light emitting element 6 and the wiring conductor 2 a on the upper surface of the base 2 can be electrically connected by the bonding wire 7 at a shorter distance when connected to the wiring 6. Therefore, it is possible to more effectively suppress the light emitted from the light emitting element 6 and the phosphor 5 from being absorbed by the bonding wire 7.

さらに、基体２の貫通孔３ａの上側の開口径を小さくすることができるので、発光素子６または蛍光体５から発生した光が貫通孔３ａ内に進入することを抑制し、光損失が生じるのを有効に防止できる。その結果、発光装置１の放射光強度を高めることができる。   Furthermore, since the opening diameter on the upper side of the through hole 3a of the substrate 2 can be reduced, the light generated from the light emitting element 6 or the phosphor 5 is prevented from entering the through hole 3a, and light loss occurs. Can be effectively prevented. As a result, the emitted light intensity of the light emitting device 1 can be increased.

さらに、貫通孔３ａは、図２に示す透光性部材４を充填していない状態の発光装置１の平面図のように、平面視形状が四角形である発光素子６に対して、その四角形の対角線上に対向するように成形するのがよい。これにより、光吸収が生じるボンディングワイヤ７部分を互いに遠ざけて光吸収の相乗効果が生じないようにすることができ、ボンディングワイヤ７の光吸収によって生じる光の弱い部分が認識されるのを有効に防止して発光むらが生じるのを有効に抑制できる。従って、発光装置１の放射強度を高めて、軸上光度や輝度，演色性等の光特性を良好なものとし得る。   Further, as shown in the plan view of the light-emitting device 1 in a state where the through-hole 3a is not filled with the translucent member 4 shown in FIG. It is good to shape | mold so that it may oppose on a diagonal line. As a result, the bonding wire 7 portions where the light absorption occurs can be moved away from each other so that the synergistic effect of the light absorption does not occur, and it is effective that the light weak portion generated by the light absorption of the bonding wire 7 is recognized. This can effectively prevent the occurrence of uneven light emission. Therefore, the radiation intensity of the light emitting device 1 can be increased to improve the light characteristics such as the axial luminous intensity, luminance, and color rendering.

また、貫通孔３ａは図３に示すように、その内部に絶縁性の光反射性粒子を含有する透明部材３ｃが充填されているのがよい。これにより、発光素子６または蛍光体５から発生した光が貫通孔３ａの内部に進入することをきわめて有効に防ぎ、光損失が生じるのを有効に防止できる。その結果、発光装置１の放射光強度をより高めることができる。   Further, as shown in FIG. 3, the through hole 3a is preferably filled with a transparent member 3c containing insulating light-reflective particles. Thereby, the light generated from the light emitting element 6 or the phosphor 5 can be extremely effectively prevented from entering the inside of the through hole 3a, and the occurrence of light loss can be effectively prevented. As a result, the emitted light intensity of the light emitting device 1 can be further increased.

このような光反射粒子は、発光素子６や蛍光体５から発生される光に対する光反射率が80％以上の絶縁性のものであり、例えば、硫酸バリウムや炭酸カルシウム，アルミナ，シリカ等の組成に、カルシウム（Ｃａ），チタン（Ｔｉ），バリウム（Ｂａ），Ａｌ，ケイ素（Ｓｉ），マグネシウム（Ｍｇ），カリウム（Ｋ），酸素（Ｏ）等を含む無機材料が挙げられる。また、透明部材３ｃは、シリコーン樹脂やエポキシ樹脂等の透明樹脂、または、ゾルゲルガラス等のガラス部材等の発光素子６や蛍光体５から発生される光を透過するものが挙げられる。   Such light reflecting particles are insulative having a light reflectance of 80% or more with respect to the light generated from the light emitting element 6 or the phosphor 5, and are composed of, for example, barium sulfate, calcium carbonate, alumina, silica, or the like. In addition, inorganic materials containing calcium (Ca), titanium (Ti), barium (Ba), Al, silicon (Si), magnesium (Mg), potassium (K), oxygen (O), and the like can be given. In addition, the transparent member 3c may be one that transmits light generated from the light emitting element 6 or the phosphor 5 such as a transparent resin such as a silicone resin or an epoxy resin, or a glass member such as sol-gel glass.

ここで、反射部材３は、金属部材や絶縁部材を切削加工や金型成形等を行うことにより形成される。また、反射部材３は、その内周面や上側主面に、例えば、メッキや蒸着等によりＡｌ，Ａｇ，金（Ａｕ），白金（Ｐｔ），Ｔｉ，クロム（Ｃｒ），Ｃｕ等の高反射率の金属薄膜を形成することにより反射面を形成してもよい。なお、反射面がＡｇやＣｕ等の酸化により変色し易い金属からなる場合には、その表面に、例えば厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのが良い。これにより反射面の耐腐食性が向上する。   Here, the reflecting member 3 is formed by cutting a metal member or an insulating member, molding, or the like. The reflecting member 3 is highly reflective on the inner peripheral surface and upper main surface thereof, such as Al, Ag, gold (Au), platinum (Pt), Ti, chromium (Cr), Cu, etc. by plating or vapor deposition. The reflective surface may be formed by forming a metal thin film with a ratio. When the reflecting surface is made of a metal that is easily discolored by oxidation such as Ag or Cu, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. It is preferable that the electrodes are sequentially deposited by electrolytic plating or electroless plating. This improves the corrosion resistance of the reflective surface.

また、反射部材３は、その内周面の算術平均粗さＲａは、0.004〜４μｍであるのが良く、これにより、反射面が発光素子６や蛍光体５の光を良好に反射し得る。Ｒａが４μｍを超えると、発光素子６の光を均一に反射させ得ず、発光装置１の内部で乱反射する。一方、0.004μｍ未満では、そのような面を安定かつ効率良く形成することが困難となる傾向にある。   In addition, the reflective member 3 may have an arithmetic average roughness Ra of the inner peripheral surface of 0.004 to 4 μm, whereby the reflective surface can reflect light of the light emitting element 6 and the phosphor 5 well. When Ra exceeds 4 μm, the light from the light emitting element 6 cannot be reflected uniformly and diffusely reflected inside the light emitting device 1. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

なお、反射部材３の側壁部は、例えば、縦断面形状が、上側に向かうにともなって外側に広がった図１に示すような直線状の傾斜面、上側に向かうにともなって外側に広がった円弧状等の曲面、あるいは矩形状の面等の形状が挙げられる。また、円弧状とする場合、発光素子６の光を万遍なく反射させて指向性の高い光を外部に均一に放射することができる。   In addition, the side wall part of the reflecting member 3 has, for example, a linear inclined surface as shown in FIG. 1 whose longitudinal cross-sectional shape spreads outward as it goes upward, and a circle that spreads outward as it goes upward Examples of the shape include a curved surface such as an arc or a rectangular surface. Moreover, when it is set as circular arc shape, the light of the light emitting element 6 can be reflected uniformly, and a highly directional light can be uniformly radiated | emitted outside.

また、透光性部材４は、発光素子６からの光を波長変換することのできる蛍光体５を含有しており、例えば、エポキシ樹脂やシリコーン樹脂等の透明材料から成る。透光性部材４は、ディスペンサー等の注入機で発光素子６を覆うように反射部材３の内部に充填され、オーブン等で熱硬化されることで、発光素子６からの光を蛍光体５により波長変換し所望の波長スペクトルを有する光を取り出すことができる。   Moreover, the translucent member 4 contains the fluorescent substance 5 which can convert the wavelength of the light from the light emitting element 6, for example, consists of transparent materials, such as an epoxy resin and a silicone resin. The translucent member 4 is filled in the reflecting member 3 so as to cover the light emitting element 6 with an injection machine such as a dispenser, and is thermally cured in an oven or the like, so that light from the light emitting element 6 is transmitted by the phosphor 5. Wavelength conversion can be performed to extract light having a desired wavelength spectrum.

発光素子６は、発光する光のエネルギーのピーク波長が紫外線域から赤外線域までのいずれのものでもよいが、白色光や種々の色の光を視感性よく放出させるという観点から300乃至500nmの近紫外系から青色系で発光する素子であるのがよい。例えば、サファイア基板上にバッファ層，ｎ型層，発光層およびｐ型層を順次積層した、ＧａＮ，ＧａＡｌＮ，ＩｎＧａＮまたはＩｎＧａＡｌＮ等の窒化ガリウム系化合物半導体、あるいはシリコンカーバイド系化合物半導体やＺｎＳｅ（セレン化亜鉛）等で発光層が形成されたものが挙げられる。   The light emitting element 6 may have any peak wavelength of energy of emitted light from the ultraviolet region to the infrared region. However, from the viewpoint of emitting white light and various colors of light with good visibility, the light emitting element 6 has a wavelength of about 300 to 500 nm. It is preferable that the element emits light from ultraviolet to blue. For example, a gallium nitride compound semiconductor such as GaN, GaAlN, InGaN, or InGaAlN, or a silicon carbide compound semiconductor or ZnSe (selenide), in which a buffer layer, an n-type layer, a light-emitting layer, and a p-type layer are sequentially stacked on a sapphire substrate. Zinc) or the like in which the light emitting layer is formed.

かくして、本発明の発光素子収納用パッケージおよび発光装置１は、反射部材３の載置部３ｂに発光素子６を搭載するとともに、発光素子６の電極をボンディングワイヤ７により配線導体２ａに電気的に接続し、この配線導体２ａを介して外部電気回路基板に電気的に導通させ得るものとし、しかる後、反射部材３の内側で発光素子６の周囲や表面に蛍光体５もしくは蛍光体５を混入した透光性部材４を充填し熱硬化させることにより、発光素子６の光を蛍光体５により波長変換し所望の波長スペクトルを有する光を取り出すことができる発光装置１となる。   Thus, in the light emitting element storage package and the light emitting device 1 of the present invention, the light emitting element 6 is mounted on the mounting portion 3b of the reflecting member 3, and the electrode of the light emitting element 6 is electrically connected to the wiring conductor 2a by the bonding wire 7. It can be connected and electrically connected to the external electric circuit board through the wiring conductor 2a, and then the phosphor 5 or the phosphor 5 is mixed around the light emitting element 6 or on the surface inside the reflecting member 3. By filling the light-transmitting member 4 and thermosetting it, the light-emitting device 1 is capable of taking out light having a desired wavelength spectrum by converting the wavelength of the light of the light-emitting element 6 by the phosphor 5.

本発明の発光装置１について図１にもとづき以下に実施例を示す。   Examples of the light emitting device 1 of the present invention will be described below based on FIG.

まず、基体２として、６×６ｍｍで厚さ0.5ｍｍの四角状の板からなるアルミナセラミックス基板を準備した。また、反射部材３として、Ａｌからなるとともに断面視形状が凹状であり、外壁部の内周面（算術平均粗さＲａは0.1μｍ）は基体２上面に対して60°に形成され、上側主面の中央部に載置部３ｂを有したものを準備した。ここで、反射部材３の上側主面の内径を0.75ｍｍとし、反射部材３の載置部３ｂと側壁部との間には、発光素子６と基体２上面の配線導体２ａとを電気的に接続するボンディングワイヤ７を挿通するための貫通孔３ａを、平面視形状が四角形である発光素子６の対角線上に対して２箇所設けた。ここで、反射部材３底部の厚さを0.2ｍｍ、貫通孔３ａ上端部の直径0.52mm、下端部の直径0.7mm、反射部材３の厚さを2.5ｍｍ、外形を直径６ｍｍとした。   First, an alumina ceramic substrate made of a square plate having a thickness of 6 × 6 mm and a thickness of 0.5 mm was prepared as the substrate 2. The reflecting member 3 is made of Al and has a concave cross-sectional shape. The inner peripheral surface of the outer wall portion (arithmetic mean roughness Ra is 0.1 μm) is formed at 60 ° with respect to the upper surface of the base 2 and What provided the mounting part 3b in the center part of the surface was prepared. Here, the inner diameter of the upper main surface of the reflecting member 3 is set to 0.75 mm, and the light emitting element 6 and the wiring conductor 2a on the upper surface of the base 2 are electrically connected between the mounting portion 3b and the side wall portion of the reflecting member 3. Two through-holes 3a for inserting the bonding wires 7 to be connected were provided on the diagonal line of the light-emitting element 6 having a square shape in plan view. Here, the thickness of the bottom of the reflecting member 3 was 0.2 mm, the diameter of the upper end of the through-hole 3a was 0.52 mm, the diameter of the lower end was 0.7 mm, the thickness of the reflecting member 3 was 2.5 mm, and the outer diameter was 6 mm.

また、貫通孔３ａ底面（基体２上面）に、発光素子６と外部電気回路基板とを基体２の内部に形成した内部配線を介して電気的に接続するための配線導体２ａを形成した。配線導体２ａは、Ｍｏ−Ｍｎ粉末からなるメタライズ層により直径が0.6ｍｍの円形パッドに成形されており、その表面に厚さ３μｍのＮｉメッキ層と厚さ２μｍのＡｕメッキ層とが順次被着された。また、基体２内部の内部配線は、貫通導体からなる電気接続部、いわゆるスルーホールによって形成された。このスルーホールについても配線導体２ａと同様にＭｏ−Ｍｎ粉末からなるメタライズ導体で成形された。   In addition, a wiring conductor 2a for electrically connecting the light emitting element 6 and the external electric circuit board via an internal wiring formed inside the base body 2 was formed on the bottom surface of the through hole 3a (upper surface of the base body 2). The wiring conductor 2a is formed into a circular pad having a diameter of 0.6 mm by a metallized layer made of Mo-Mn powder, and a Ni plating layer having a thickness of 3 μm and an Au plating layer having a thickness of 2 μm are sequentially deposited on the surface thereof. It was done. Further, the internal wiring inside the base body 2 was formed by an electrical connection portion made of a through conductor, a so-called through hole. This through hole was also formed of a metallized conductor made of Mo-Mn powder in the same manner as the wiring conductor 2a.

さらに、基体２上面の貫通孔３ａに相当する周辺部以外の全面に、Ａｇペーストを塗布し基体２と反射部材３とを接合した。   Further, Ag paste was applied to the entire surface other than the peripheral portion corresponding to the through hole 3 a on the upper surface of the base 2 to join the base 2 and the reflecting member 3 together.

次に、近紫外光を発する厚さ0.08ｍｍの発光素子６をＡｇペーストで載置部３ｂに接合するとともに、発光素子６と貫通孔３ａ底面に形成された配線導体２ａとをボンディングワイヤ７にてワイヤボンディングし電気的に接続した。   Next, the 0.08 mm-thick light emitting element 6 that emits near-ultraviolet light is joined to the mounting portion 3b with Ag paste, and the light emitting element 6 and the wiring conductor 2a formed on the bottom surface of the through hole 3a are bonded to the bonding wire 7. Then, wire bonding and electrical connection were made.

次に、赤色発光，緑色発光，青色発光を行なう３種類の蛍光体５を含有するシリコーン樹脂（透光性部材４）をディスペンサーにて基体２と反射部材３に囲まれた領域の反射部材３の内周面の最上端まで充填することにより、サンプルとしての発光装置１を作製した。   Next, the reflecting member 3 in a region surrounded by the base 2 and the reflecting member 3 is dispensed with a silicone resin (translucent member 4) containing three kinds of phosphors 5 that emit red light, green light, and blue light. The light emitting device 1 as a sample was manufactured by filling up to the uppermost end of the inner peripheral surface.

また、比較例として、反射部材３を中央部に発光素子６を収納するための貫通孔が形成された枠状のものを用いること以外は上記サンプルと同様に比較用の発光装置１を作製した。   In addition, as a comparative example, a comparative light emitting device 1 was produced in the same manner as the above sample, except that a frame-shaped member having a through hole for accommodating the light emitting element 6 in the central portion of the reflecting member 3 was used. .

ここで、上記サンプルと比較例としての発光装置とをそれぞれ２０ｍＡの電流を印加し、点灯させて全光束量を測定した。その結果、本発明の発光装置１であるサンプルは９ｌｍ／Ｗ、従来のパッケージから成る発光装置は３ｌｍ／Ｗと、全光束量において３倍もの効果が得られることが判明した。   Here, a current of 20 mA was applied to each of the sample and the light-emitting device as a comparative example, and the total luminous flux was measured. As a result, it was found that the sample which is the light-emitting device 1 of the present invention is 9 lm / W, and the light-emitting device having the conventional package is 3 lm / W, which is three times as much as the total luminous flux.

なお、本発明は以上の実施の形態の例および実施例に限定されず、本発明の要旨を逸脱しない範囲内であれば種々の変更を行なうことは何等支障ない。   It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

例えば、反射部材３の上面に発光素子６より出射される光を任意に集光したり拡散させる光学レンズや平板状の透光性の蓋体を半田や接着剤等で接合することにより、所望とする放射角度で光を取り出すことができるとともに発光装置１の内部への耐浸水性が改善され長期信頼性が向上する。また、反射部材３の側壁部の内周面は、その断面形状が平坦（直線状）であってもよく、また、円弧状（曲線状）であってもよい。円弧状とする場合、発光素子６の光を万遍なく反射させて指向性の高い光を外部に均一に放射することができる。   For example, an optical lens for arbitrarily condensing or diffusing light emitted from the light emitting element 6 or a flat light-transmitting lid body is joined to the upper surface of the reflecting member 3 with solder, an adhesive, or the like. The light can be extracted at the radiation angle as described above, and the water resistance to the inside of the light emitting device 1 is improved, and the long-term reliability is improved. Further, the inner peripheral surface of the side wall portion of the reflecting member 3 may have a flat (straight) cross-sectional shape or an arc (curved) shape. In the case of the circular arc shape, the light from the light emitting element 6 can be uniformly reflected, and highly directional light can be uniformly emitted to the outside.

本発明の発光装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. 図１の発光装置の透光性樹脂を設けていない状態の平面図である。It is a top view of the state which has not provided the translucent resin of the light-emitting device of FIG. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 従来の発光装置を示す断面図である。It is sectional drawing which shows the conventional light-emitting device.

符号の説明Explanation of symbols

１：発光装置
２：基体
２ａ：配線導体
３：反射部材
３ａ：貫通孔
３ｂ：載置部
３ｃ：透明部材
４：透光性部材
５：蛍光体
６：発光素子
７：ボンディングワイヤ 1: Light emitting device 2: Base 2a: Wiring conductor 3: Reflecting member 3a: Through hole 3b: Placement portion 3c: Transparent member 4: Translucent member 5: Phosphor 6: Light emitting element 7: Bonding wire

Claims (3)

平板状の基体と、
前記基体に設けられており、前記基体の上面および外面に導出された配線導体と、
反射面とされた内周面を含む側壁部を外周部に有しているとともに、前記側壁部の内側に設けられた貫通孔を有しており、前記基体上に設けられた反射部材と、
前記側壁部の内側に配置されており、前記反射部材上に載置された発光素子と、
前記貫通孔内に配置されており、前記発光素子の電極および前記配線導体を電気的に接続しているボンディングワイヤと、
絶縁性の光反射性粒子を含有しており、前記貫通孔に充填された透明部材と、
を備えており、
前記貫通孔の内周面が、上端から下端に向かうに伴って外側に広がるように傾斜していることを特徴とする発光装置。 A flat substrate;
A wiring conductor provided on the base body and led out to an upper surface and an outer surface of the base body;
While having a side wall portion including an inner peripheral surface as a reflection surface in the outer peripheral portion, and having a through hole provided inside the side wall portion, a reflection member provided on the base,
A light emitting element disposed on the inside of the side wall, and placed on the reflecting member;
A bonding wire that is disposed in the through hole and electrically connects the electrode of the light emitting element and the wiring conductor;
A transparent member containing insulating light-reflective particles, filled in the through-hole,
With
The light emitting device, wherein the inner peripheral surface of the through hole is inclined so as to spread outward as it goes from the upper end to the lower end. 平板状の基体と、
前記基体に設けられており、前記基体の上面および外面に導出された配線導体と、
反射面とされた内周面を含む側壁部を外周部に有しているとともに、前記側壁部の内側に設けられた複数の貫通孔を有しており、前記基体上に設けられた反射部材と、
四角形の平面視形状を有しており、前記側壁部の内側に配置されており、前記反射部材上に載置された発光素子と、
前記複数の貫通孔内に配置されており、前記発光素子の電極および前記配線導体を電気的に接続しているボンディングワイヤと、
を備えており、
前記複数の貫通孔が、前記発光素子の対角線上に対向して配置されていることを特徴とする発光装置。 A flat substrate;
A wiring conductor provided on the base body and led out to an upper surface and an outer surface of the base body;
A reflection member provided on the base body, having a side wall portion including an inner peripheral surface as a reflection surface in the outer peripheral portion, and having a plurality of through holes provided inside the side wall portion. When,
A light-emitting element having a quadrangular plan view shape, disposed inside the side wall, and placed on the reflecting member;
A bonding wire that is disposed in the plurality of through holes and electrically connects the electrode of the light emitting element and the wiring conductor;
With
The light-emitting device, wherein the plurality of through holes are arranged opposite to each other on a diagonal line of the light-emitting element. 絶縁性の光反射性粒子を含有しており、前記複数の貫通孔に充填された透明部材をさらに備えたことを特徴とする請求項２記載の発光装置。 The light-emitting device according to claim 2 , further comprising a transparent member containing insulating light-reflecting particles and filled in the plurality of through holes.
JP2003429380A 2003-12-25 2003-12-25 Light emitting device Expired - Fee Related JP4206334B2 (en)

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