JP4445436B2 - Led光源ユニット - Google Patents
Led光源ユニット Download PDFInfo
- Publication number
- JP4445436B2 JP4445436B2 JP2005171698A JP2005171698A JP4445436B2 JP 4445436 B2 JP4445436 B2 JP 4445436B2 JP 2005171698 A JP2005171698 A JP 2005171698A JP 2005171698 A JP2005171698 A JP 2005171698A JP 4445436 B2 JP4445436 B2 JP 4445436B2
- Authority
- JP
- Japan
- Prior art keywords
- light source
- led
- source unit
- base
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
3 基台
4 プリント基板
4b、4c配線パターン
5 LED素子
8 透光性樹脂
Claims (5)
- 熱伝導性の高い金属から成る略直方体形状の基台と、この基台の上面に実装した複数のLED素子と、この基台の上面に配設したプリント基板とから成り、前記LED素子の各電極と前記プリント基板の配線パターンを介して電気的に接続した2つの端子電極を有し、この端子電極部を除く前記基台の上面を透光性樹脂によって封止したLED光源ユニットにおいて、前記LED素子の側面を前記基台の長手方向に平行に配設し、隣接する前記LED素子同士を交互に前記基台の短手方向に千鳥足状にずらしてそのズレ量を前記LED素子の電極の幅分以上としたことを特徴とするLED光源ユニット。
- 前記LED素子のズレ量を前記LED素子の幅以上としたことを特徴とする請求項1に記載のLED光源ユニット。
- 熱伝導性の高い金属から成る略直方体形状の基台と、この基台の上面に実装した複数のLED素子と、この基台の上面に配設したプリント基板とから成り、前記LED素子の各電極と前記プリント基板の配線パターンを介して電気的に接続した2つの端子電極を有し、この端子電極部を除く前記基台の上面を透光性樹脂によって封止したLED光源ユニットにおいて、前記LED素子の電極が存在する対角線を前記基台の短手方向に平行に配設したことを特徴とするLED光源ユニット。
- 隣接する前記LED素子同士を交互に前記基台の短手方向に千鳥足状にずらして、隣接する前記LED素子の対向する側面同士の重なり量が電極面の幅分以上になるようにしたことを特徴とする請求項3に記載のLED光源ユニット。
- 隣接する前記LED素子の対向する側面同士の重なり量が前記LED素子の幅以上であることを特徴とする請求項3記載のLED光源ユニット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005171698A JP4445436B2 (ja) | 2005-06-10 | 2005-06-10 | Led光源ユニット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005171698A JP4445436B2 (ja) | 2005-06-10 | 2005-06-10 | Led光源ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006344564A JP2006344564A (ja) | 2006-12-21 |
JP4445436B2 true JP4445436B2 (ja) | 2010-04-07 |
Family
ID=37641357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005171698A Active JP4445436B2 (ja) | 2005-06-10 | 2005-06-10 | Led光源ユニット |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4445436B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009004625A (ja) * | 2007-06-22 | 2009-01-08 | Sanken Electric Co Ltd | 半導体発光装置 |
US8668357B2 (en) | 2010-03-15 | 2014-03-11 | Luxintec, S.L. | Luminaire with LED technology and method for obtaining said luminaire |
US9755126B2 (en) * | 2012-07-30 | 2017-09-05 | Ushio Denki Kabushiki Kaisha | Light source unit |
CN103730559B (zh) * | 2012-10-10 | 2016-08-17 | 香港理工大学 | 一种led阵列的排布方法及排布在pcb板上的led阵列 |
JP6336787B2 (ja) * | 2014-03-12 | 2018-06-06 | シチズン電子株式会社 | 光源ユニット |
JP6447580B2 (ja) * | 2016-06-15 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置 |
CN106369292B (zh) * | 2016-07-01 | 2019-10-18 | 深圳市长运通半导体技术有限公司 | 基于芯片级封装的led光源模组及led灯具 |
JP2019184741A (ja) * | 2018-04-05 | 2019-10-24 | 株式会社Reiz | Led複数列式ledテープ |
JP6809522B2 (ja) * | 2018-11-29 | 2021-01-06 | 日亜化学工業株式会社 | 発光装置 |
-
2005
- 2005-06-10 JP JP2005171698A patent/JP4445436B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2006344564A (ja) | 2006-12-21 |
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