JP4412675B2 - Static elimination transport apparatus and static elimination method during conveyance - Google Patents

Static elimination transport apparatus and static elimination method during conveyance Download PDF

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JP4412675B2
JP4412675B2 JP2007120828A JP2007120828A JP4412675B2 JP 4412675 B2 JP4412675 B2 JP 4412675B2 JP 2007120828 A JP2007120828 A JP 2007120828A JP 2007120828 A JP2007120828 A JP 2007120828A JP 4412675 B2 JP4412675 B2 JP 4412675B2
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glass substrate
soft
arm
static elimination
charged body
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JP2008277181A (en
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仁 稲葉
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Takasago Thermal Engineering Co Ltd
Future Vision Inc
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Takasago Thermal Engineering Co Ltd
Future Vision Inc
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Priority to JP2007120828A priority Critical patent/JP4412675B2/en
Priority to TW097110372A priority patent/TW200847853A/en
Priority to CNA200810095707XA priority patent/CN101299899A/en
Priority to KR1020080040283A priority patent/KR100980280B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames

Description

この発明は、帯電した製品などを搬送する際に除電を行う除電搬送装置および搬送時の除電方法に関する。   The present invention relates to a static elimination transport apparatus that performs static elimination when transporting a charged product or the like and a static elimination method during transport.

液晶パネルやプラズマディスプレイ、半導体基板などの電子デバイスは、クリーンルーム内で製造されるが、電子デバイスに静電気が帯電すると、電子デバイスを構成する絶縁体が電気的に破壊されたり、電子デバイスを構成する回路に微粒子が付着して短絡したりする静電気障害のリスクが生じる。このため、電子デバイスの製造工程において、軟Ｘ線式除電器や放電式イオナイザなどの除電器を用いて、電子デバイスに発生した静電気を除電する技術が知られている（例えば、特許文献１参照。）。   Electronic devices such as liquid crystal panels, plasma displays, and semiconductor substrates are manufactured in a clean room. When static electricity is charged in an electronic device, the insulator that constitutes the electronic device is electrically destroyed or the electronic device is configured. There is a risk of static electricity damage due to short-circuiting of fine particles on the circuit. For this reason, in the manufacturing process of an electronic device, the technique which neutralizes the static electricity which generate | occur | produced in the electronic device using static neutralizers, such as a soft X-ray-type static elimination device and a discharge type ionizer, is known (for example, refer patent document 1). .)

また、製造工程を経た電子デバイスをカセットに収納したり、次の工程に移送したりする搬送工程においても、電子デバイスに発生した静電気の除電が行われている。例えば、図１０、１１に示すように、製造設備１００の出口側に移載室１１０が設けられ、この移載室１１０の天井側には、清浄空気を流出するファン１２０が配設されている。さらに、ファン１２０による気流の上流側に放電式イオナイザ１３０が配設され、下流側には搬送ロボット１４０が配設されている。そして、放電式イオナイザ１３０によって空気イオンを発生させた状態で、搬送ロボット１４０によって製造設備１００側からガラス基板（電子デバイス）Ｍを保持し、ガラス基板Ｍをカセット１５０側に移送してカセット１５０に収納する。この移送中において、ガラス基板Ｍに発生した静電気が空気イオンによって中和され、除電されるものである。
特開２００６−２２１９９８号公報 In addition, static electricity generated in the electronic device is removed in a transporting process in which the electronic device that has undergone the manufacturing process is stored in a cassette or transferred to the next process. For example, as shown in FIGS. 10 and 11, a transfer chamber 110 is provided on the outlet side of the manufacturing facility 100, and a fan 120 for flowing clean air is disposed on the ceiling side of the transfer chamber 110. . Further, a discharge ionizer 130 is disposed on the upstream side of the airflow generated by the fan 120, and a transfer robot 140 is disposed on the downstream side. In a state where air ions are generated by the discharge ionizer 130, the transfer robot 140 holds the glass substrate (electronic device) M from the manufacturing equipment 100 side, and transfers the glass substrate M to the cassette 150 side to the cassette 150. Store. During this transfer, static electricity generated in the glass substrate M is neutralized by air ions and is neutralized.
JP 2006-221998 A

ところで、ガラス基板Ｍの帯電面近傍に空気イオンが存在している厚みである除電空間厚さがある程度厚い場合（例えば１０ｃｍ以上の場合）、除電器による除電効果（除電速度）は、帯電面近傍のイオン濃度と電界強度に大きく依存する。すなわち、イオン濃度が高く、電界強度が強いほど高い除電効果が得られる。これに対して、上記のような搬送工程における除電方法では、ガラス基板Ｍの周辺に存在する接地部材は、接地導体で構成された移載室１１０の天井や壁およびカセット１５０である。そして、移載室１１０の天井とガラス基板Ｍとの距離Ｄ１が大きい（例えば２ｍ以上）ため、帯電面近傍の電界強度は弱く、高い除電効果が得られない。また、ガラス基板Ｍを製造設備１００側から保持する際や、ガラス基板Ｍをカセット１５０に収納する際には、ガラス基板Ｍと壁との距離Ｄ２やガラス基板Ｍとカセット１５０との距離Ｄ３が狭まるが、非常に短時間であるためガラス基板Ｍを十分に除電することが困難である。さらに、ガラス基板Ｍの帯電面（水平面）に対して、移載室１１０の壁面は垂直に位置し、カセット１５０は横方向（同一水平面上）に位置し、対向していない。このため、ガラス基板Ｍを移載室１１０の壁やカセット１５０に長時間接近させたとしても、ガラス基板Ｍの帯電面の全面にわたって均一かつ強い電界を形成することができず、帯電面の全面を効果的に除電することは困難である。   By the way, when the static elimination space thickness, which is the thickness where air ions are present in the vicinity of the charged surface of the glass substrate M, is somewhat thick (for example, 10 cm or more), the static elimination effect (static elimination speed) by the static eliminator is near the charged surface. It greatly depends on the ion concentration and electric field strength. That is, the higher the ion concentration and the stronger the electric field strength, the higher the charge eliminating effect. On the other hand, in the static elimination method in the conveyance process as described above, the grounding member existing around the glass substrate M is the ceiling or wall of the transfer chamber 110 and the cassette 150 formed of a ground conductor. Since the distance D1 between the ceiling of the transfer chamber 110 and the glass substrate M is large (for example, 2 m or more), the electric field strength in the vicinity of the charging surface is weak, and a high charge removal effect cannot be obtained. Further, when the glass substrate M is held from the manufacturing equipment 100 side or when the glass substrate M is stored in the cassette 150, the distance D2 between the glass substrate M and the wall and the distance D3 between the glass substrate M and the cassette 150 are set. Although it is narrowed, it is difficult to sufficiently neutralize the glass substrate M because of a very short time. Furthermore, the wall surface of the transfer chamber 110 is positioned perpendicular to the charging surface (horizontal plane) of the glass substrate M, and the cassette 150 is positioned laterally (on the same horizontal plane) and is not opposed. For this reason, even if the glass substrate M is brought close to the wall of the transfer chamber 110 or the cassette 150 for a long time, a uniform and strong electric field cannot be formed over the entire charged surface of the glass substrate M, and the entire charged surface. It is difficult to remove the charge effectively.

図１２は、上記のような除電方法で除電した場合（変化曲線Ｌ１）と、除電を行わない場合（変化曲線Ｌ２）とにおけるガラス基板Ｍの電位の変化の一例を表したものである。図中符号Ｐ１は、製造設備１００においてガラス基板Ｍがリフトアップされる直前の時点を示し、符号Ｐ２はリフトアップされた時点を示し、符号Ｐ３は搬送中を示し、符号Ｐ４はガラス基板Ｍをカセット１５０に収納した時点（搬送ロボット１４０がガラス基板Ｍを離した時点）を示す。この図に示すように、上記のような除電方法では、ガラス基板Ｍの除電に長時間を要するとともに、完全には除電することができず、効果的（効率的）な除電ができないことがわかる。この結果、除電不足のままガラス基板Ｍを搬出などすると、静電気障害のリスクが高くなる。一方、十分な除電を行うために、除電器を多く設置すると設備コストの増大を招き、除電時間を長くすると生産性の低下を招くことになる。   FIG. 12 shows an example of changes in the potential of the glass substrate M when the charge is eliminated by the above-described charge elimination method (change curve L1) and when the charge is not eliminated (change curve L2). In the drawing, reference symbol P1 indicates a time point immediately before the glass substrate M is lifted up in the manufacturing facility 100, reference character P2 indicates a time point when the glass substrate M is lifted up, reference symbol P3 indicates that the glass substrate M is being conveyed, and reference symbol P4 indicates the glass substrate M. The time when it is stored in the cassette 150 (the time when the transfer robot 140 releases the glass substrate M) is shown. As shown in this figure, it can be understood that the above-described static elimination method requires a long time for static elimination of the glass substrate M, and cannot be completely eliminated, so that effective (effective) static elimination cannot be performed. . As a result, if the glass substrate M is carried out with insufficient charge removal, the risk of static electricity failure increases. On the other hand, if a large number of static eliminators are installed in order to perform sufficient static elimination, the equipment cost will increase, and if the static elimination time is lengthened, productivity will be reduced.

そこでこの発明は、帯電体を効果的に除電して搬送することが可能な除電搬送装置および搬送時の除電方法を提供することを目的とする。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a static elimination transport apparatus capable of effectively neutralizing and transporting a charged body and a static elimination method during transport.

上記目的を達成するために請求項１に記載の発明は、清浄空気が上方から下方に向けて垂直流で供給されるクリーンルーム内に設置され、帯電した帯電体を水平方向に間隔をおいて平行に配設された２つのアームよって水平に維持した状態で移送する搬送ロボットと、前記アームと相対位置関係が常に一定となるように前記搬送ロボットに配設され、前記帯電体に帯電した電気を空気イオンによって中和して除電する軟Ｘ線照射器と、前記アームの支持凸部に前記帯電体が載置された状態で、前記帯電体の下方に位置し、前記帯電体と上下方向に所定の距離を隔てて対向するように前記アームに配設され、所定の電位に制御された導電部材と、を備え、前記軟Ｘ線照射器の照射中心軸を前記帯電体の下面と前記導電部材との間に位置させたことを特徴とする。 In order to achieve the above object, the invention according to claim 1 is provided in a clean room in which clean air is supplied in a vertical flow from the top to the bottom, and the charged charged bodies are parallel to each other in the horizontal direction. A transfer robot that is transported in a state of being maintained horizontally by two arms disposed in the arm, and the transfer robot disposed so that the relative positional relationship with the arm is always constant, and the charged body is charged with electricity. A soft X-ray irradiator that neutralizes and neutralizes with air ions, and the charged body is placed on the support convex portion of the arm, and is positioned below the charged body and vertically with respect to the charged body. A conductive member that is disposed on the arm so as to be opposed to each other with a predetermined distance and is controlled to a predetermined potential, and the irradiation central axis of the soft X-ray irradiator is set to the lower surface of the charged body and the conductive member. This is located between the parts The features.

搬送ロボットのアームで帯電体を保持すると、帯電体に上下方向に所定の距離を隔てて導電部材が対向し、軟Ｘ線照射器による軟Ｘ線の照射によって帯電体と導電部材との間に空気イオンが位置される。 When the charged body is held by the arm of the transfer robot, the conductive member faces the charged body at a predetermined distance in the vertical direction, and the soft X-ray irradiator emits soft X-rays between the charged body and the conductive member. Air ions are located.

請求項２に記載の発明は、請求項１に記載の除電搬送装置において、前記導電部材の電位が接地電位に設定されていることを特徴とする。 According to a second aspect of the present invention, in the static elimination transport apparatus according to the first aspect, the potential of the conductive member is set to a ground potential.

請求項３に記載の発明は、請求項１に記載の除電搬送装置において、前記導電部材が、対向する前記帯電体の面と全面において均等に対向するように形成、配設されていることを特徴とする。 According to a third aspect of the present invention, in the static eliminating and conveying apparatus according to the first aspect, the conductive member is formed and arranged so as to be evenly opposed to the entire surface of the opposed charged body. Features.

請求項４に記載の発明は、清浄空気が上方から下方に向けて垂直流で供給されるクリーンルーム内に、帯電した帯電体を水平方向に間隔をおいて平行に配設された２つのアームよって水平に維持した状態で移送する搬送ロボットを設置し、前記帯電体に帯電した電気を空気イオンによって中和して除電する軟Ｘ線照射器を前記アームと相対位置関係が常に一定となるように前記搬送ロボットに配設し、前記アームの支持凸部に前記帯電体を載置した状態で、前記帯電体の下方に位置し所定の電位に制御された導電部材を、前記帯電体と上下方向に所定の距離を隔てて対向させ、前記軟Ｘ線照射器の照射中心軸を前記帯電体の下面と前記導電部材との間に位置させて軟Ｘ線を照射することを特徴とする。
According to the fourth aspect of the present invention, in a clean room in which clean air is supplied in a vertical flow from above to below, a charged charged body is provided by two arms disposed in parallel in the horizontal direction. Install a transfer robot that transports the charged body in a horizontal state, and the soft X-ray irradiator that neutralizes the electricity charged in the charged body with air ions and eliminates the charge so that the relative positional relationship with the arm is always constant. With the charged body placed on the support convex portion of the arm and placed on the support robot, the conductive member positioned below the charged body and controlled at a predetermined potential is placed in the vertical direction with the charged body. And a soft X-ray is irradiated with the irradiation center axis of the soft X-ray irradiator positioned between the lower surface of the charged body and the conductive member.

請求項１および４に記載の発明によれば、搬送ロボットの保持部で帯電体が保持された状態では、所定の距離を隔てて帯電体と導電部材とが対向し、その間に空気イオンが位置される。このため、帯電体が搬送ロボットで保持された状態では、強くかつ安定した電界が帯電体と導電部材と間に（帯電体の周辺に）形成され、このような良好な電界下において空気イオンによる除電が効果的かつ安定的に行われる。この結果、帯電体を効果的に除電して搬送することが可能となる。 According to the first and fourth aspects of the present invention, in a state where the charged body is held by the holding portion of the transfer robot, the charged body and the conductive member are opposed to each other with a predetermined distance therebetween, and air ions are positioned between them. Is done. For this reason, when the charged body is held by the transfer robot, a strong and stable electric field is formed between the charged body and the conductive member (around the charged body), and air ions are generated under such a good electric field. Static elimination is performed effectively and stably. As a result, the charged body can be effectively discharged and transported.

また、軟Ｘ線照射器をアームと相対位置関係が常に一定となるように搬送ロボットに配設し、軟Ｘ線照射器の照射中心軸を帯電体の下面と導電部材との間に位置させて軟Ｘ線を照射するようにしているので、帯電体と導電部材との間に空気イオンを常に良好かつ安定して位置させて、帯電体を効果的に除電することが可能となる。さらに、帯電体の搬送中に空気イオンを位置させて（形成、供給して）除電することで、搬送と除電とを同時に行うことが可能となる。つまり、時間的に効率的な搬送、除電が可能となる。 Also, the soft X-ray irradiator is arranged on the transfer robot so that the relative positional relationship with the arm is always constant, and the irradiation central axis of the soft X-ray irradiator is positioned between the lower surface of the charged body and the conductive member. Since soft X-rays are irradiated , air ions can be positioned between the charged body and the conductive member in a good and stable manner, and the charged body can be effectively discharged. Furthermore, it is possible to carry out and carry out discharging at the same time by eliminating (by forming and supplying) air ions during transfer of the charged body. In other words, it is possible to carry out transport and static elimination efficiently in time.

さらに、帯電体は水平方向に間隔をおいて平行に配設された２つのアームに形成された支持凸部によって保持されるので、導電部材が帯電体のほぼ全面と対向することになり、帯電体の除電効果を高めることが可能となる。Further, since the charged body is held by the support convex portions formed on the two arms arranged in parallel at a distance in the horizontal direction, the conductive member is opposed to almost the entire surface of the charged body. It becomes possible to enhance the effect of neutralizing the body.

請求項２に記載の発明によれば、導電部材の電位が接地電位に設定されているため、例えば、接地された搬送ロボットを介して導電部材を接地することで、導電部材の電位を容易かつ安定的に制御することが可能となる。 According to the second aspect of the present invention, since the potential of the conductive member is set to the ground potential, for example, by grounding the conductive member via the grounded transfer robot, the potential of the conductive member can be easily and It becomes possible to control stably.

請求項３に記載の発明によれば、導電部材が対向する帯電体の全面において均等に対向するように形成、配設されているため、帯電体の全面周辺において均等かつ安定した電界が形成され、帯電体の全面を均等かつ効果的に除電することが可能となる。 According to the third aspect of the present invention, since the conductive member is formed and disposed so as to be evenly opposed across the entire surface of the opposite charged body, an even and stable electric field is formed around the entire surface of the charged body. Thus, it is possible to remove the entire surface of the charged body uniformly and effectively.

以下、この発明を図示の実施の形態に基づいて説明する。   The present invention will be described below based on the illustrated embodiments.

（実施の形態１）
図１は、この実施の形態に係る除電搬送装置１を示す概略構成図である。この除電搬送装置１は、製造設備１００で製造されたフラットパネルディプレイ基板であるガラス基板（帯電体）Ｍを除電しながらカセット１５０側に移送（搬送）してカセット１５０に収納する装置であり、主として、搬送ロボット２と軟Ｘ線照射器（除電器）３とを備えている。ここで、上記の図１０、１１で説明した構成と同等の構成については、同一の符号を付して説明する。また、移載室１１０は、温度調整されたクリーンルーム内に設けられ、ファンフィルタユニット１２０からの清浄空気が垂直流で供給され、不図示のリターンチャンバまたはリターンダクトを経て循環されるようになっている。 (Embodiment 1)
FIG. 1 is a schematic configuration diagram showing a static elimination transfer device 1 according to this embodiment. The static elimination transport apparatus 1 is an apparatus that transfers (conveys) a glass substrate (charged body) M, which is a flat panel display substrate manufactured by the manufacturing facility 100, to the cassette 150 side while discharging, and stores it in the cassette 150. It mainly includes a transfer robot 2 and a soft X-ray irradiator (static eliminator) 3. Here, the same components as those described in FIGS. 10 and 11 will be described with the same reference numerals. In addition, the transfer chamber 110 is provided in a temperature-controlled clean room, and clean air from the fan filter unit 120 is supplied in a vertical flow and circulated through a return chamber or return duct (not shown). Yes.

搬送ロボット２は、帯電したガラス基板Ｍを保持して搬送するロボットであり、移載室１１０内の製造設備１００の出口側とカセット１５０との間に設置され、この実施の形態では、床面に接地、固定されている。この搬送ロボット２は、最下位に位置する基部２１と、基部２１の上位に位置する第１のリンク２２と、第１のリンク２２の上位に位置する第２のリンク２３と、最上位に位置する２つのアーム（保持部）２４とを備えている。第１のリンク２２は、基部２１に対して回動（垂直軸を中心とする回転）、揺動（水平軸を中心とする揺動）自在で、第２のリンク２３は、第１のリンク２２に対して揺動自在となっている。２つのアーム２４は、図２、３に示すように、平板棒状で平行に配設され、第２のリンク２３に対して揺動自在で、２つのアーム２４で形成される面、つまり２つのアーム２４を包含する平面が常に水平に位置するように制御されている。これにより、製造設備１００の出口側でリフトアップされたガラス基板Ｍをアーム２４で保持し、ガラス基板Ｍの板面を水平に維持した状態でカセット１５０側に移送して、カセット１５０に収納できるようになっている。   The transfer robot 2 is a robot that holds and transfers a charged glass substrate M, and is installed between the outlet side of the manufacturing equipment 100 in the transfer chamber 110 and the cassette 150. In this embodiment, the floor surface Grounded and fixed to. The transfer robot 2 includes a base 21 positioned at the lowest position, a first link 22 positioned higher than the base 21, a second link 23 positioned higher than the first link 22, and a highest position. And two arms (holding portions) 24 for performing the above operation. The first link 22 can freely rotate (rotate about the vertical axis) and swing (swing about the horizontal axis) relative to the base portion 21, and the second link 23 can be the first link. 22 can be swung freely. As shown in FIGS. 2 and 3, the two arms 24 are arranged in parallel in a flat bar shape, and are swingable with respect to the second link 23, that is, surfaces formed by the two arms 24, that is, two The plane including the arm 24 is controlled so as to be always positioned horizontally. As a result, the glass substrate M lifted up on the outlet side of the manufacturing facility 100 is held by the arm 24, and can be transferred to the cassette 150 side with the plate surface of the glass substrate M kept horizontal and stored in the cassette 150. It is like that.

アーム２４には、導電性の金網板（導電部材）４が配設されている。この金網板４は、金網状の平板で、２つのアーム２４で形成される面と平行に、２つのアーム２４を貫通するように配設されている。また、金網板４の板面の大きさ（面積）は、ガラス基板Ｍと同寸法に設定され、アーム２４でガラス基板Ｍを保持した状態で、対向するガラス基板Ｍの板面全面と対向するように配設されている。さらに、各アーム２４の上面側には、上方に突出した支持凸部２４ａが長手方向に沿って２つ形成され、ガラス基板Ｍを保持（載置）した状態でガラス基板Ｍと金網板４との距離（隙間）Ｈが３ｃｍになるように、支持凸部２４ａの高さが設定されている。これにより、ガラス基板Ｍを保持した状態で、金網板４がガラス基板Ｍの板面全面と対向し、かつその間隔が全面において均一となる。つまり、金網板４がガラス基板Ｍの板面全面において均等に対向する。   The arm 24 is provided with a conductive wire mesh plate (conductive member) 4. The wire mesh plate 4 is a wire mesh-like flat plate and is disposed so as to penetrate the two arms 24 in parallel with the surface formed by the two arms 24. In addition, the size (area) of the metal mesh plate 4 is set to the same size as the glass substrate M, and faces the entire plate surface of the opposing glass substrate M in a state where the glass substrate M is held by the arm 24. It is arranged like this. Further, on the upper surface side of each arm 24, two support protrusions 24 a protruding upward are formed along the longitudinal direction, and the glass substrate M and the metal mesh plate 4 are held with the glass substrate M held (mounted). The height of the support convex portion 24a is set so that the distance (gap) H is 3 cm. Thereby, in the state which hold | maintained the glass substrate M, the metal-mesh board 4 opposes the whole plate surface of the glass substrate M, and the space | interval becomes uniform in the whole surface. That is, the metal mesh plate 4 is evenly opposed on the entire surface of the glass substrate M.

ここで、ガラス基板Ｍと金網板４との距離Ｈが３ｃｍに設定されているが、これは除電効果およびガラス基板Ｍの収納性を考慮したものである。すなわち、カセット１５０内のガラス基板Ｍの収納間隔として許容される距離であって、後述する軟Ｘ線照射器３による空気イオンがガラス基板Ｍと金網板４との隙間全体に形成される距離として、１〜４ｃｍが適切と考えられ、この実施の形態では３ｃｍに設定している。このように、この実施の形態では、距離Ｈが３ｃｍに設定されているが、距離Ｈを１〜２０ｃｍとすると良好な除電効果が得られることが確認されており、この範囲において、ガラス基板Ｍの大きさや収納間隔などを考慮して距離Ｈを設定すればよい。   Here, the distance H between the glass substrate M and the metal mesh plate 4 is set to 3 cm, which takes into account the charge removal effect and the storage property of the glass substrate M. That is, it is a distance allowed as a storage interval of the glass substrate M in the cassette 150 and is a distance in which air ions by the soft X-ray irradiator 3 described later are formed in the entire gap between the glass substrate M and the metal mesh plate 4. 1 to 4 cm is considered appropriate, and is set to 3 cm in this embodiment. As described above, in this embodiment, the distance H is set to 3 cm, but it has been confirmed that when the distance H is set to 1 to 20 cm, a good static elimination effect can be obtained. In this range, the glass substrate M The distance H may be set in consideration of the size and the storage interval.

また、金網板４の電位は接地電位に設定（制御）されている。つまり、金網板４は搬送ロボット２を介して接地されている。このように、この実施の形態では、金網板４の電位を接地電位としているが、接地電位以外の電位、例えばガラス基板Ｍの電位と同等程度の電位に制御するようにしてもよい。つまり、後述するように、ガラス基板Ｍの周辺に強く安定した電界が形成されるように金網板４の電位が制御されていればよい。   Further, the potential of the metal mesh plate 4 is set (controlled) to the ground potential. That is, the wire mesh plate 4 is grounded via the transfer robot 2. As described above, in this embodiment, the potential of the metal mesh plate 4 is set to the ground potential. However, the potential may be controlled to a potential other than the ground potential, for example, approximately equal to the potential of the glass substrate M. That is, as will be described later, it is only necessary that the potential of the metal mesh plate 4 is controlled so that a strong and stable electric field is formed around the glass substrate M.

軟Ｘ線照射器３は、ガラス基板Ｍに帯電した静電気を空気イオンによって中和して除電する除電器である。すなわち、この実施の形態では、波長が０．５〜２Åの軟エックス線を空気中に照射することで、空気中の分子を電離して、空気イオンを発生させる。そして、ガラス基板Ｍに帯電した静電気の極性と反対極性の空気イオンが静電気と結びついて、静電気を中和、除電するものである。この軟Ｘ線照射器３は、搬送ロボット２の第２のリンク２３の上端部に配設され、搬送ロボット２のアーム２４に追従するようになっている。つまり、リンク２２、２３の回動、揺動によるアーム２４の移動に伴って、軟Ｘ線照射器３もリンク２２、２３に従って移動し、アーム２４と軟Ｘ線照射器３との相対位置関係が常に一定となる。   The soft X-ray irradiator 3 is a static eliminator that neutralizes static electricity charged on the glass substrate M with air ions and eliminates static electricity. That is, in this embodiment, air ions are generated by ionizing molecules in the air by irradiating the air with a soft X-ray having a wavelength of 0.5 to 2 mm. Then, air ions having a polarity opposite to the polarity of the static electricity charged on the glass substrate M are combined with the static electricity to neutralize and neutralize the static electricity. The soft X-ray irradiator 3 is disposed at the upper end portion of the second link 23 of the transfer robot 2 and follows the arm 24 of the transfer robot 2. That is, with the movement of the arm 24 due to the rotation and swing of the links 22 and 23, the soft X-ray irradiator 3 also moves according to the links 22 and 23, and the relative positional relationship between the arm 24 and the soft X-ray irradiator 3 is reached. Is always constant.

さらに、アーム２４で保持されたガラス基板Ｍの上面および下面の全面周辺に軟Ｘ線が照射されるように、軟Ｘ線照射器３が配設されている。つまり、ガラス基板Ｍの上面側およびガラス基板Ｍと金網板４との間に空気イオンが形成される（位置する）ように軟Ｘ線照射器３が配設されている。このように軟Ｘ線照射器３が配設されていることによって、アーム２４の移動中、つまりガラス基板Ｍの搬送中において常に、ガラス基板Ｍの上下面周辺に空気イオンが良好かつ安定して形成されるようになっている。ここで、軟Ｘ線照射器３の照射中心軸がガラス基板Ｍの下面と金網板４との間に位置するように、軟Ｘ線照射器３を配設するのが望ましい。これにより、最も除電効果が高いガラス基板Ｍと金網板４との間の全空間にわたって、より均等に空気イオンを形成することができるからである。   Further, the soft X-ray irradiator 3 is disposed so that the soft X-rays are irradiated around the entire upper and lower surfaces of the glass substrate M held by the arm 24. That is, the soft X-ray irradiator 3 is arranged so that air ions are formed (positioned) between the upper surface side of the glass substrate M and between the glass substrate M and the metal mesh plate 4. By providing the soft X-ray irradiator 3 in this way, air ions are always good and stable around the upper and lower surfaces of the glass substrate M during the movement of the arm 24, that is, during the conveyance of the glass substrate M. It is supposed to be formed. Here, it is desirable to dispose the soft X-ray irradiator 3 so that the irradiation central axis of the soft X-ray irradiator 3 is located between the lower surface of the glass substrate M and the wire mesh plate 4. This is because air ions can be formed more evenly over the entire space between the glass substrate M and the metal mesh plate 4 having the highest static elimination effect.

次に、このような構成の除電搬送装置１の動作および除電搬送装置１による搬送時の除電方法について説明する。ここで、ガラス基板Ｍを保持する前から軟Ｘ線照射器３を稼働して軟Ｘ線を照射し続けた場合（ケース１）と、ガラス基板Ｍを保持した直後に軟Ｘ線照射器３を稼働して軟Ｘ線を照射し続けた場合（ケース２）とについて説明する。また、ガラス基板Ｍは、製造設備１００内の製造工程（前工程）で処理され、搬送ローラ１０１によって製造設備１００の出口側に搬送され、リフトピン１０２によってリフトアップされるものとする。   Next, the operation of the static elimination transport apparatus 1 having such a configuration and the static elimination method during transport by the static elimination transport apparatus 1 will be described. Here, when the soft X-ray irradiator 3 is operated before the glass substrate M is held and the soft X-ray is continuously irradiated (case 1), immediately after the glass substrate M is held, the soft X-ray irradiator 3 is used. And the case of continuing to irradiate with soft X-rays (Case 2) will be described. Further, the glass substrate M is processed in a manufacturing process (previous process) in the manufacturing facility 100, transported to the outlet side of the manufacturing facility 100 by the transport roller 101, and lifted up by the lift pins 102.

ケース１では、まず、軟Ｘ線照射器３が稼働している状態で、リフトアップされたガラス基板Ｍを搬送ロボット２のアーム２４で保持する。次に、リンク２２、２３が駆動して、ガラス基板Ｍの板面を水平に維持した状態でガラス基板Ｍをカセット１５０側に移送する。続いて、ガラス基板Ｍをカセット１５０に収納して、アーム２４をガラス基板Ｍから離脱する。一方、この移送中において、軟Ｘ線照射器３で形成された空気イオンによって、ガラス基板Ｍに帯電した静電気が中和され、除電される。   In case 1, first, the glass substrate M that has been lifted up is held by the arm 24 of the transfer robot 2 while the soft X-ray irradiator 3 is operating. Next, the links 22 and 23 are driven to transfer the glass substrate M to the cassette 150 side while maintaining the plate surface of the glass substrate M horizontal. Subsequently, the glass substrate M is accommodated in the cassette 150, and the arm 24 is detached from the glass substrate M. On the other hand, during this transfer, static electricity charged on the glass substrate M is neutralized by the air ions formed by the soft X-ray irradiator 3, and the charge is eliminated.

ケース２では、まず、リフトアップされたガラス基板Ｍを搬送ロボット２のアーム２４で保持し、その直後、軟Ｘ線照射器３を稼働する。その後は、ケース１と同様に、ガラス基板Ｍをカセット１５０側に移送してカセット１５０に収納する。そして、軟Ｘ線照射器３の稼働後において、軟Ｘ線照射器３によってガラス基板Ｍが除電される。   In case 2, first, the glass substrate M that has been lifted up is held by the arm 24 of the transfer robot 2, and immediately thereafter, the soft X-ray irradiator 3 is operated. Thereafter, like the case 1, the glass substrate M is transferred to the cassette 150 side and stored in the cassette 150. Then, after the soft X-ray irradiator 3 is operated, the glass substrate M is neutralized by the soft X-ray irradiator 3.

以上のように、この除電搬送装置１および除電方法によれば、アーム２４でガラス基板Ｍを保持した状態では、接地電位に設定された金網板４とガラス基板Ｍとが対向し、その間に空気イオンが形成される。このため、ガラス基板Ｍと金網板４との間に（ガラス基板Ｍの周辺に）強くかつ安定した電界が形成され、このような良好な電界下において空気イオンによる除電が効果的かつ安定的に行われる。しかも、金網板４がガラス基板Ｍの板面全面において均等に対向するため、ガラス基板Ｍの全面周辺において均等かつ安定した電界が形成され、ガラス基板Ｍの全面を均等かつ効果的に除電することが可能となる。   As described above, according to the static elimination transport apparatus 1 and the static elimination method, in a state where the glass substrate M is held by the arm 24, the metal mesh plate 4 set to the ground potential and the glass substrate M face each other, and air is interposed therebetween. Ions are formed. For this reason, a strong and stable electric field is formed between the glass substrate M and the metal mesh plate 4 (around the glass substrate M), and neutralization by air ions is effectively and stably performed under such a good electric field. Done. In addition, since the metal mesh plate 4 is evenly opposed across the entire surface of the glass substrate M, a uniform and stable electric field is formed around the entire surface of the glass substrate M, and the entire surface of the glass substrate M is uniformly and effectively neutralized. Is possible.

さらに、上記のように、ガラス基板Ｍの搬送中において常に、ガラス基板Ｍの上下面周辺に空気イオンが良好かつ安定して形成されるため、ガラス基板Ｍを常に効果的に除電することが可能となる。また、上記のようにして搬送中に除電を行うことで、搬送と除電とを同時に行って、時間的に効率的な搬送、除電が可能となる。そして、これらの結果、製造工程を経たガラス基板Ｍを効果的、効率的に除電して搬送することが可能となる。   Further, as described above, since air ions are always formed well and stably around the upper and lower surfaces of the glass substrate M during the conveyance of the glass substrate M, the glass substrate M can always be effectively neutralized. It becomes. In addition, by performing static elimination during conveyance as described above, it is possible to perform conveyance and static elimination efficiently in time by performing conveyance and static elimination at the same time. As a result, the glass substrate M that has undergone the manufacturing process can be effectively and efficiently discharged and transported.

図４は、この除電搬送装置１で除電した場合のガラス基板Ｍの電位の変化の一例を表したものであり、図中曲線Ｌ３はケース１の場合を示し、曲線Ｌ４はケース２の場合を示し、曲線Ｌ２は除電を行わない場合を示している。また、符号Ｐ１は、ガラス基板Ｍがリフトアップされる直前の時点を示し、符号Ｐ２はリフトアップされた時点を示し、符号Ｐ３は搬送中を示し、符号Ｐ４はガラス基板Ｍをカセット１５０に収納した時点（アーム２４がガラス基板Ｍから離脱した時点）を示す。   FIG. 4 shows an example of a change in the potential of the glass substrate M when the charge is removed by the charge removal transport device 1. In the figure, the curve L3 shows the case 1 and the curve L4 shows the case 2. A curve L2 indicates a case where static elimination is not performed. Further, symbol P1 indicates a time point immediately before the glass substrate M is lifted up, symbol P2 indicates a point in time when the glass substrate M is lifted up, symbol P3 indicates that the glass substrate M is being transported, and symbol P4 indicates that the glass substrate M is stored in the cassette 150. The time when the arm 24 is detached from the glass substrate M is shown.

この図に示すように、ケース１および２のいずれの場合も、従来の除電方法（図１２の曲線Ｌ１）に比べて、ガラス基板Ｍが著しく効果的に除電されていることが認められる。すなわち、ケース１の場合（曲線Ｌ３）には、ガラス基板Ｍの最高電位が０．２〜０．３ｋＶ程度であり、保持から約２秒で完全に除電されている。また、ケース２の場合（曲線Ｌ４）には、ガラス基板Ｍの最高電位が１ｋＶ程度であり、保持から約３秒で完全に除電されている。また、アーム２４がガラス基板Ｍから離脱するＰ４時おいて、アーム２４とガラス基板Ｍの接触部（ハンドパット）との間で新たな帯電が生じるが、従来の除電方法では、この帯電を除電することができなかった。これに対し、ケース１および２ともに、このような帯電も完全に除電されていることが確認された。   As shown in this figure, in both cases 1 and 2, it can be seen that the glass substrate M has been discharged more effectively than the conventional charge removal method (curve L1 in FIG. 12). That is, in case 1 (curve L3), the maximum potential of the glass substrate M is about 0.2 to 0.3 kV, and the charge is completely removed in about 2 seconds from the holding. In the case 2 (curve L4), the maximum potential of the glass substrate M is about 1 kV, and the charge is completely removed in about 3 seconds from the holding. Further, at P4 when the arm 24 is detached from the glass substrate M, a new charge is generated between the arm 24 and the contact portion (hand pad) of the glass substrate M. In the conventional static elimination method, this charge is eliminated. I couldn't. On the other hand, in both cases 1 and 2, it was confirmed that such charge was completely discharged.

（実施の形態２）
図５は、この実施の形態に係る除電搬送装置１１を示す概略構成図である。この実施の形態では、軟Ｘ線照射器３の配設位置が実施の形態１と異なり、実施の形態１と同等の構成については、同一符号を付して説明する。 (Embodiment 2)
FIG. 5 is a schematic configuration diagram showing the static elimination transport apparatus 11 according to this embodiment. In this embodiment, the arrangement position of the soft X-ray irradiator 3 is different from that of the first embodiment, and the same components as those of the first embodiment are described with the same reference numerals.

軟Ｘ線照射器３は、製造設備１００の出口側と搬送ロボット２との間に設置、固定されている。すなわち、製造設備１００の出口側と搬送ロボット２との間に、垂直に延びる設置ポール５が設置され、この設置ポール５の上端部に、照射口が上方を向くように軟Ｘ線照射器３が取り付けられている。また、搬送ロボット２のアーム２４でガラス基板Ｍを移載室１１０内に搬入（移送）した状態で、図６に示すように、軟Ｘ線照射器３からの軟Ｘ線がガラス基板Ｍと金網板４の全面周辺に照射されるように、軟Ｘ線照射器３の設置高さおよび位置が設定されている。このような軟Ｘ線照射器３の設置によって、軟Ｘ線がガラス基板Ｍの板面に対して下方から垂直に照射され、金網板４の網目を介して、ガラス基板Ｍと金網板４との間に軟Ｘ線が照射されて、空気イオンが形成されるようになっている。   The soft X-ray irradiator 3 is installed and fixed between the exit side of the manufacturing facility 100 and the transfer robot 2. That is, a vertically extending installation pole 5 is installed between the exit side of the manufacturing facility 100 and the transfer robot 2, and the soft X-ray irradiator 3 is arranged at the upper end of the installation pole 5 so that the irradiation port faces upward. Is attached. Further, in a state where the glass substrate M is carried (transferred) into the transfer chamber 110 by the arm 24 of the transfer robot 2, as shown in FIG. The installation height and position of the soft X-ray irradiator 3 are set so that the entire periphery of the metal mesh plate 4 is irradiated. By installing the soft X-ray irradiator 3 as described above, soft X-rays are irradiated perpendicularly to the plate surface of the glass substrate M from below, and the glass substrate M, the metal mesh plate 4, and the like through the mesh of the metal mesh plate 4. During this period, soft X-rays are irradiated to form air ions.

次に、このような構成の除電搬送装置１１の動作および除電搬送装置１１による搬送時の除電方法について説明する。まず、軟Ｘ線照射器３が稼働している状態で、搬送ロボット２のアーム２４でガラス基板Ｍを保持して、ガラス基板Ｍを軟Ｘ線照射器３の直上まで移送する。そして、この位置状態を一定時間維持することでガラス基板Ｍを除電し、その後、ガラス基板Ｍをカセット１５０側に移送して、カセット１５０に収納する。   Next, the operation of the static elimination transport apparatus 11 having such a configuration and the static elimination method during transport by the static elimination transport apparatus 11 will be described. First, in a state where the soft X-ray irradiator 3 is operating, the glass substrate M is held by the arm 24 of the transfer robot 2, and the glass substrate M is transferred to a position directly above the soft X-ray irradiator 3. The glass substrate M is neutralized by maintaining this position for a certain period of time, and then the glass substrate M is transferred to the cassette 150 side and stored in the cassette 150.

この除電搬送装置１１および除電方法によれば、アーム２４でガラス基板Ｍを保持した状態では、金網板４とガラス基板Ｍとが対向しているため、実施の形態１と同様に、ガラス基板Ｍの全面を均等かつ効果的に除電することが可能となる。また、軟Ｘ線をガラス基板Ｍ（金網板４）の板面に対して垂直に照射するため、ガラス基板Ｍの全面周辺にわたってより均等に軟Ｘ線が照射されて、より均等に空気イオンが形成される。この結果、ガラス基板Ｍの板面積が大きい場合であっても、全面にわたって均等かつ効果的に除電することが可能となる。   According to this static elimination conveyance apparatus 11 and the static elimination method, in the state which hold | maintained the glass substrate M with the arm 24, since the metal-mesh board 4 and the glass substrate M have opposed, the glass substrate M similarly to Embodiment 1. FIG. It becomes possible to discharge the entire surface uniformly and effectively. Moreover, since soft X-rays are irradiated perpendicularly to the plate surface of the glass substrate M (metal mesh plate 4), soft X-rays are irradiated more uniformly around the entire surface of the glass substrate M, and air ions are more evenly distributed. It is formed. As a result, even when the plate area of the glass substrate M is large, it is possible to remove charges uniformly and effectively over the entire surface.

図７は、この除電搬送装置１１で除電した場合のガラス基板Ｍの電位の変化曲線Ｌ５の一例を表したものである。この図に示すように、ガラス基板Ｍが軟Ｘ線照射器３の直上に位置するまでは除電が行われないため、ガラス基板Ｍの電位が高いが、軟Ｘ線照射器３の直上に位置した直後から電位が急激に下がり、短時間で除電されていることが認められる。   FIG. 7 shows an example of a change curve L5 of the potential of the glass substrate M when the charge is removed by the charge removal transport device 11. As shown in FIG. As shown in this figure, since the static elimination is not performed until the glass substrate M is located immediately above the soft X-ray irradiator 3, the potential of the glass substrate M is high, but the position is directly above the soft X-ray irradiator 3. Immediately after this, the potential drops sharply, and it is recognized that the charge is removed in a short time.

以上、この発明の実施の形態について説明したが、具体的な構成は、上記の実施の形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計の変更等があっても、この発明に含まれる。例えば、実施の形態１では、ガラス基板Ｍの上面側およびガラス基板Ｍと金網板４との間に軟Ｘ線を照射して空気イオンを形成しているが、他の空間で形成した空気イオンをガラス基板Ｍの上面側およびガラス基板Ｍと金網板４との間に供給するようにしてもよい。さらに、上記の実施の形態では、除電器として軟Ｘ線照射器３を使用しているが、コロナ放電式のイオナイザなどその他の除電器であってもよい。   Although the embodiment of the present invention has been described above, the specific configuration is not limited to the above embodiment, and even if there is a design change or the like without departing from the gist of the present invention, Included in the invention. For example, in Embodiment 1, air ions are formed by irradiating soft X-rays between the upper surface side of the glass substrate M and between the glass substrate M and the metal mesh plate 4, but air ions formed in other spaces are used. May be supplied between the upper surface side of the glass substrate M and between the glass substrate M and the wire mesh plate 4. Furthermore, in the above embodiment, the soft X-ray irradiator 3 is used as a static eliminator, but other static eliminators such as a corona discharge ionizer may be used.

また、搬送ロボット２のアーム２４をスライド式にしてもよい。すなわち、図８、９に示すように、アーム２４を第１のアーム２４１と第２のアーム２４２とから構成し、第１のアーム２４１を第２のリンク２３に配設し、第２のアーム２４２を第１のアーム２４１に対してスライド自在に配設する。また、金網板４は第１のアーム２４１に配設する。そして、ガラス基板Ｍを保持してカセット１５０側に移送する間は、第２のアーム２４２を第１のアーム２４１に重ねた状態とする。一方、ガラス基板Ｍをカセット１５０に収納する際には、第２のアーム２４２を前方にスライドさせて、第２のアーム２４２とガラス基板Ｍのみをカセット１５０内に位置させる。これにより、ガラス基板Ｍの全面周辺にわたってより均等に軟Ｘ線が照射されるように、ガラス基板Ｍと金網板４との距離Ｈを広く確保しても、第１のアーム２４１はカセット１５０内に位置しないため、ガラス基板Ｍの収納間隔を許容範囲に抑えることが可能となる。つまり、高い除電効果を確保した上で、ガラス基板Ｍの収納間隔を狭くすることが可能となる。   Further, the arm 24 of the transfer robot 2 may be slidable. That is, as shown in FIGS. 8 and 9, the arm 24 includes a first arm 241 and a second arm 242, the first arm 241 is disposed on the second link 23, and the second arm 242 is slidably disposed with respect to the first arm 241. Further, the metal mesh plate 4 is disposed on the first arm 241. The second arm 242 is placed on the first arm 241 while the glass substrate M is held and transferred to the cassette 150 side. On the other hand, when the glass substrate M is stored in the cassette 150, the second arm 242 is slid forward, and only the second arm 242 and the glass substrate M are positioned in the cassette 150. As a result, even if the distance H between the glass substrate M and the metal mesh plate 4 is secured wide so that soft X-rays are irradiated more evenly around the entire surface of the glass substrate M, the first arm 241 remains in the cassette 150. Therefore, the storage interval of the glass substrates M can be kept within an allowable range. That is, it is possible to narrow the storage interval of the glass substrates M while ensuring a high charge removal effect.

さらに、搬送ロボット２のアーム２４にガラス基板Ｍを載置することでガラス基板Ｍを保持しているが、吸引などによってガラス基板Ｍを保持し、アーム２４の下方にガラス基板Ｍが位置するようにしてもよい。この際、実施の形態２において、軟Ｘ線照射器３をアーム２４の上方に設置して、ファンフィルタユニット１２０による気流に従って軟Ｘ線がガラス基板Ｍに向かうようにしてもよい。また、搬送ロボット２は走行可能なものであってもよく、ガラス基板Ｍ以外の電子デバイス（帯電体）、例えば半導体基板などの除電、搬送にも適用できることは勿論である。さらに、導電部材は、金網板４に限らず、帯電体の形状や除電器の種類などに応じて、棒体で構成されたものや、平板に複数のパンチ孔が形成されたもの、あるいは平板状や凹凸を有する変形板状のものなどであってもよい。なお、リフトピン１０２と金網板４とが干渉する場合には、製造設備１００側でガラス基板Ｍの端縁を保持してリフトアップしたり、干渉しないように金網板４を分割してもよい。   Further, the glass substrate M is held by placing the glass substrate M on the arm 24 of the transfer robot 2, but the glass substrate M is held by suction or the like so that the glass substrate M is positioned below the arm 24. It may be. At this time, in the second embodiment, the soft X-ray irradiator 3 may be installed above the arm 24 so that the soft X-rays are directed toward the glass substrate M according to the airflow generated by the fan filter unit 120. Of course, the transfer robot 2 may be capable of traveling, and can be applied to charge removal and transfer of electronic devices (charged bodies) other than the glass substrate M, such as a semiconductor substrate. Further, the conductive member is not limited to the metal mesh plate 4, but is constituted by a rod, a plate in which a plurality of punch holes are formed, or a flat plate according to the shape of the charged body or the type of static eliminator. It may be a deformed plate having a shape or irregularity. In the case where the lift pins 102 and the metal mesh plate 4 interfere with each other, the edge of the glass substrate M may be held on the manufacturing equipment 100 side, and the metal mesh plate 4 may be divided so as not to interfere.

以上のように、この発明に係る除電搬送装置および搬送時の除電方法は、帯電体を効果的に除電して搬送できる装置および方法として極めて有用である。   As described above, the static eliminating / conveying device and the neutralizing method during conveyance according to the present invention are extremely useful as an apparatus and method that can effectively neutralize and convey a charged body.

この発明の実施の形態１に係る除電搬送装置を示す概略構成図である。It is a schematic block diagram which shows the static elimination conveying apparatus which concerns on Embodiment 1 of this invention. 図１の除電搬送装置の搬送ロボットのアーム周辺を示す拡大平面図である。FIG. 2 is an enlarged plan view showing the periphery of an arm of a transfer robot of the static elimination transfer apparatus of FIG. 1. 図２のＹ−Ｙ断面図である。It is YY sectional drawing of FIG. 図１の除電搬送装置で除電した場合のガラス基板の電位の変化の一例を表した図である。It is the figure showing an example of the change of the electric potential of the glass substrate at the time of static elimination with the static elimination conveyance apparatus of FIG. この発明の実施の形態２に係る除電搬送装置を示す概略構成図である。It is a schematic block diagram which shows the static elimination conveying apparatus which concerns on Embodiment 2 of this invention. 図５のＺ−Ｚ方向から見た概略平面図である。It is the schematic plan view seen from the ZZ direction of FIG. 図５の除電搬送装置で除電した場合のガラス基板の電位の変化の一例を表した図である。It is the figure showing an example of the change of the electric potential of the glass substrate at the time of static elimination with the static elimination conveyance apparatus of FIG. この発明の実施の形態における搬送ロボットのアームの変形例を示す図である。It is a figure which shows the modification of the arm of the conveyance robot in embodiment of this invention. 図８のアームの第２のアームが前方にスライドした状態を示す図である。It is a figure which shows the state which the 2nd arm of the arm of FIG. 8 slid ahead. 従来の搬送時の除電方法を示す概略構成図である。It is a schematic block diagram which shows the static elimination method at the time of the conventional conveyance. 図１０のＸ−Ｘ方向から見た概略平面図である。It is the schematic plan view seen from the XX direction of FIG. 図１０の除電方法で除電した場合のガラス基板の電位の変化の一例を表した図である。It is the figure showing an example of the change of the electric potential of the glass substrate at the time of static elimination with the static elimination method of FIG.

１、１１ 除電搬送装置
２ 搬送ロボット
２４ アーム（保持部）
３ 軟Ｘ線照射器（除電器）
４ 金網板（導電部材）
５ 設置ポール
１００ 製造設備
１１０ 移載室
１２０ ファンフィルタユニット
１５０ カセット
Ｍ ガラス基板（帯電体） 1, 11 Static elimination transfer device 2 Transfer robot 24 Arm (holding part)
3 Soft X-ray irradiator (static eliminator)
4 Wire mesh plate (conductive member)
5 Installation pole 100 Manufacturing equipment 110 Transfer chamber 120 Fan filter unit 150 Cassette M Glass substrate (charged body)

Claims (4)

清浄空気が上方から下方に向けて垂直流で供給されるクリーンルーム内に設置され、帯電した帯電体を水平方向に間隔をおいて平行に配設された２つのアームよって水平に維持した状態で移送する搬送ロボットと、
前記アームと相対位置関係が常に一定となるように前記搬送ロボットに配設され、前記帯電体に帯電した電気を空気イオンによって中和して除電する軟Ｘ線照射器と、
前記アームの支持凸部に前記帯電体が載置された状態で、前記帯電体の下方に位置し、前記帯電体と上下方向に所定の距離を隔てて対向するように前記アームに配設され、所定の電位に制御された導電部材と、
を備え、
前記軟Ｘ線照射器の照射中心軸を前記帯電体の下面と前記導電部材との間に位置させたことを特徴とする除電搬送装置。 Installed in a clean room where clean air is supplied in a vertical flow from the top to the bottom, and the charged charged body is transported in a state where it is maintained horizontally by two arms arranged in parallel at intervals in the horizontal direction. A transfer robot
A soft X-ray irradiator that is disposed in the transfer robot so that the relative positional relationship with the arm is always constant, and neutralizes the electricity charged in the charged body with air ions to eliminate static electricity;
In a state where the charging member is placed on the support convex portion of the arm, the charging member is located below the charging member and is disposed on the arm so as to face the charging member in a vertical direction with a predetermined distance therebetween. A conductive member controlled to a predetermined potential;
With
A static elimination transport apparatus, wherein an irradiation central axis of the soft X-ray irradiator is positioned between a lower surface of the charged body and the conductive member. 前記導電部材の電位が接地電位に設定されていることを特徴とする請求項１に記載の除電搬送装置。   The static elimination conveyance apparatus according to claim 1, wherein a potential of the conductive member is set to a ground potential. 前記導電部材が、対向する前記帯電体の面と全面において均等に対向するように形成、配設されていることを特徴とする請求項１に記載の除電搬送装置。   2. The charge eliminating and conveying apparatus according to claim 1, wherein the conductive member is formed and disposed so as to be evenly opposed to the entire surface of the opposite charged body. 清浄空気が上方から下方に向けて垂直流で供給されるクリーンルーム内に、帯電した帯電体を水平方向に間隔をおいて平行に配設された２つのアームよって水平に維持した状態で移送する搬送ロボットを設置し、前記帯電体に帯電した電気を空気イオンによって中和して除電する軟Ｘ線照射器を前記アームと相対位置関係が常に一定となるように前記搬送ロボットに配設し、前記アームの支持凸部に前記帯電体を載置した状態で、前記帯電体の下方に位置し所定の電位に制御された導電部材を、前記帯電体と上下方向に所定の距離を隔てて対向させ、前記軟Ｘ線照射器の照射中心軸を前記帯電体の下面と前記導電部材との間に位置させて軟Ｘ線を照射することを特徴とする搬送時の除電方法。 Transporting a charged charged body in a clean room where clean air is supplied in a vertical flow from the top to the bottom in a state where it is maintained horizontally by two arms arranged in parallel at intervals in the horizontal direction. established a robot, charged electricity disposed in the transfer robot such that the arm and the relative positional relationship between the soft X-ray irradiator for discharge neutralized by air ions is always constant to the charging member, wherein With the charged body placed on the support convex part of the arm, a conductive member positioned below the charged body and controlled to a predetermined potential is opposed to the charged body in a vertical direction at a predetermined distance. A neutralizing method during transport, wherein the soft X-ray irradiator is irradiated with soft X-rays with an irradiation center axis of the soft X-ray irradiator positioned between the lower surface of the charged body and the conductive member.
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