JP4409136B2

JP4409136B2 - Electronic component mounting apparatus and electronic component mounting method

Info

Publication number: JP4409136B2
Application number: JP2001384338A
Authority: JP
Inventors: 宏土師; 渡秀瀬
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2001-12-18
Filing date: 2001-12-18
Publication date: 2010-02-03
Anticipated expiration: 2021-12-18
Also published as: JP2003188194A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を基板に搭載する電子部品搭載装置および電子部品搭載方法に関するものである。
【０００２】
【従来の技術】
電子機器に用いられる電子部品のうち、半導体チップなど粘着シートに貼着された状態で供給されるものは、従来より専用の取出し装置を備えた搭載装置によってリードフレームなどの基板に実装されている。この取出し装置では、電子部品供給部に保持された粘着シートに平面格子状に貼着されたチップを精度よく吸着ノズルによってピックアップする必要があることから、粘着シート上におけるチップの位置を認識するための部品撮像カメラが必要とされる。
【０００３】
また、チップが実装される基板は基板保持部に載置され位置決めされるが、このチップの良好な実装品質を確保するため、基板保持部における基板の位置認識や、チップ接着用の接着剤の塗布状態検査、チップ搭載後の搭載状態確認のための撮像を行う基板撮像カメラが必要とされる。すなわち、このような電子部品搭載装置では、電子部品供給部と基板保持部の２つのエリアを移動対象として、搭載ヘッド、部品撮像カメラ、基板撮像カメラの３要素を相互に協調させながら相対移動させることにより、搭載動作が行われる。
【０００４】
【発明が解決しようとする課題】
しかしながら、従来の電子部品搭載装置では、電子部品供給部と基板保持部における搭載ヘッド、部品撮像カメラ、基板撮像カメラの動作は、いずれも同一サイクル内でシリーズに構成される場合が多く、電子部品供給部や基板保持部において何ら作業が行われないロスタイムの発生が避けられなかった。このため電子部品搭載動作のタクトタイムが遅延し、作業効率の向上には限界があった。
【０００５】
そこで本発明は、タクトタイムを短縮して作業効率を向上させることができる電子部品搭載装置および電子部品搭載方法を提供することを目的とする。
【０００６】
請求項１記載の電子部品搭載装置は、基板の電子部品搭載位置に電子部品を搭載する電子部品搭載装置であって、電子部品を平面状に複数個並べて供給する電子部品供給部と、前記電子部品供給部から第１方向へ離れた位置に配置された基板保持部と、１個の電子部品を保持するノズルを複数備え、この複数のノズルで前記電子部品供給部の電子部品を複数ピックアップして保持し、保持した複数の電子部品を前記基板保持部に保持された基板の複数の電子部品搭載位置に搭載する搭載ヘッドと、前記基板保持部に保持された基板を撮像する第１のカメラと、前記第１のカメラを少なくとも前記基板保持部の上方で移動させる第１のカメラ移動機構と、前記第１のカメラで撮像した画像を処理して前記基板保持部に保持された基板の複数の電子部品搭載位置の位置を求める第１の認識処理部と、前記電子部品供給部の複数の電子部品を撮像する第２のカメラと、前記第２のカメラを少なくとも前記電子部品供給部の上方で移動させる第２のカメラ移動機構と、前記第２のカメラで撮像した画像を処理して前記電子部品供給部の複数の電子部品の位置を求める第２の認識処理部と、平面視して前記第１のカメラ移動機構と前記第２のカメラ移動機構とに挟まれた位置に配置され、前記搭載ヘッドを前記電子部品供給部と前記基板保持部との間で移動させる搭載ヘッド移動機構と、前記搭載ヘッド移動機構を制御して、（１）前記電子部品供給部から電子部品を複数ピックアップする際の前記搭載ヘッドの位置決め動作を前記第２の認識処理部で求めた複数の電子部品の位置に基づいて行わせ（２）前記基板保持部の基板に複数の電子部品を搭載する際の搭載ヘッドの位置決め動作を前記第１の認識処理部で求めた複数の電子部品搭載位置の位置に基づいて行わせる搭載ヘッド移動制御手段と、前記第１のカメラ移動機構を制御して、（１）前記基板保持部に保持された基板を撮像する際の前記第１のカメラの位置決め動作と（２）前記搭載ヘッドによる電子部品の搭載を妨げない位置に前記第１のカメラを移動する退避動作とを行わせる第１のカメラ移動制御手段と、前記第２のカメラ移動機構を制御して、（１）前記電子部品供給部の複数の電子部品を撮像する際の前記第２のカメラの位置決め動作と（２）前記搭載ヘッドによる電子部品のピックアップを妨げない位置に前記第２のカメラを移動する退避動作とを行わせる第２のカメラ移動制御手段とを備え、前記第１のカメラによる基板の複数の電子部品搭載位置の撮像を前記搭載ヘッドによる複数の電子部品のピックアップと並行して行ない、前記搭載ヘッドが電子部品を基板の複数の電子部品搭載位置に搭載しているときに前記第２のカメラによる複数の電子部品の撮像を行なう。
【０００７】
請求項２記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記搭載ヘッド移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記搭載ヘッドを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えたセンタービーム部材と、前記センタービーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記搭載ヘッドを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有する。
【０００８】
請求項３記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記第１のカメラ移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記第１のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第１ビーム部材と、前記第１ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第１のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有する。
【０００９】
請求項４記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記第２のカメラ移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記第２のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第２ビーム部材と、前記第２ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第２のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有する。
【００１０】
請求項５記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記搭載ヘッド移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記搭載ヘッドを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えたセンタービーム部材と、前記センタービーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記搭載ヘッドを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有し、前記第１のカメラ移動機構は、前記第１方向ガイドに両端を支持され且つ前記第１のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第１ビーム部材と、前記第１ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第１のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有し、前記第２のカメラ移動機構は、前記第１方向ガイドに両端を支持され且つ前記第２のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第２ビーム部材と、前記第２ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第２のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有し、前記センタービーム部材は前記第１ビーム部材と前記第２ビーム部材の間に位置する。
【００１１】
請求項６記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記電子部品供給部と前記基板保持部の間に、前記搭載ヘッドに保持された複数の電子部品を撮像する第３のカメラと、前記第３のカメラで撮像した画像を処理して前記搭載ヘッドに保持された複数の電子部品の位置を求める第３の認識処理部を備え、前記搭載ヘッド移動制御手段は、前記搭載ヘッド移動機構を制御して、（１）前記電子部品供給部から複数の電子部品をピックアップする際の前記搭載ヘッドの位置決め動作を前記第２の認識処理部で求めた複数の電子部品の位置に基づいて行わせ（２）前記基板保持部の基板に複数の電子部品を搭載する際の前記搭載ヘッドの位置決め動作を前記第１の認識処理部で求めた複数の電子部品搭載位置の位置と前記第３の認識処理部で求めた複数の電子部品の位置に基づいて行わせる。
【００１２】
請求項７記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記基板保持部が基板を保持する基板保持機構を複数備えている。
【００１３】
請求項８記載の電子部品搭載装置は、請求項７記載の電子部品搭載装置であって、基板を電子部品搭載装置に搬入する基板搬入コンベアと、電子部品搭載装置から電子部品が搭載された基板を搬出する基板搬出コンベアと、基板を前記基板搬入コンベアから受け取って前記複数の基板保持機構に一枚ずつ振り分けて搬送する基板振分部と、電子部品が搭載された基板を前記複数の基板保持機構から受け取って前記基板搬出コンベアに受け渡す基板受渡部を備えた。
【００１４】
請求項９記載の電子部品搭載装置は、請求項１記載の電子部品搭載装置であって、前記電子部品供給部が、複数の電子部品を貼り付けた粘着シートを有する治具を着脱自在に保持する治具保持部を備えている。
【００１５】
請求項１０記載の電子部品搭載装置は、請求項９記載の電子部品搭載装置であって、前記粘着シートの下方に、前記搭載ヘッドによってピックアップされる電子部品を前記粘着シートから剥離する粘着シート剥離機構を備えている。
【００１８】
請求項１１記載の電子部品搭載方法は、１個の電子部品を保持するノズルを複数備え、この複数のノズルで電子部品供給部の電子部品をピックアップして保持し、保持した電子部品を基板保持部に保持された基板の電子部品搭載位置に搭載する搭載ヘッドと、前記基板保持部に保持された基板を撮像する第１のカメラと、前記第１のカメラを少なくとも前記基板保持部の上方で移動させる第１のカメラ移動機構と、前記第１のカメラで撮像した画像を処理して前記複数の電子部品搭載位置の位置を求める第１の認識処理部と、前記電子部品供給部の複数の電子部品を撮像する第２のカメラと、前記第２のカメラを少なくとも前記電子部品供給部の上方で移動させる第２のカメラ移動機構と、前記第２のカメラで撮像した画像を処理して前記複数の電子部品の位置を求める第２の認識処理部と、平面視して前記第１のカメラ移動機構と前記第２のカメラ移動機構とに挟まれた位置に配置され、前記搭載ヘッドを前記電子部品供給部と前記基板保持部との間で移動させる搭載ヘッド移動機構とを備えた電子部品搭載装置による電子部品搭載方法であって、前記第２のカメラ移動機構により前記第２のカメラを前記電子部品供給部に移動させて電子部品を撮像し、その後第２のカメラをこの電子部品の上方から退避させるステップと、前記第２のカメラで撮像した画像を前記第２の認識処理部で処理して前記電子部品の位置を求めるステップと、前記第２の認識処理部で求めた電子部品の位置に基づいて前記搭載ヘッドをこの電子部品に位置決めする位置決め動作を前記搭載ヘッド移動機構に行わせながら前記搭載ヘッドの複数のノズルで前記電子部品をピックアップするステップと、前記第１のカメラ移動機構により前記第１のカメラを前記基板保持部に保持された基板上に移動させてこの基板を撮像し、その後第１のカメラをこの基板の上方から退避させるステップと、前記第１のカメラで撮像した画像を前記第１の認識処理部で処理して前記基板の電子部品搭載位置の位置を求めるステップと、前記第１の認識処理部で求めた電子部品搭載位置の位置に基づいて前記搭載ヘッドをこの電子部品搭載位置に位置決めする位置決め動作を前記搭載ヘッド移動機構に行わせながら前記搭載ヘッドの複数のノズルに保持されている複数の電子部品をこの複数の電子部品搭載位置に搭載するステップを含み、前記複数の電子部品のピックアップと並行して前記第１のカメラによる基板の複数の電子部品搭載位置を撮像し、前記搭載ヘッドの複数のノズルに保持された複数の電子部品の搭載中に前記第２のカメラを再び電子部品供給部の上方に移動させて前記第２のカメラによって次にピックアップされる電子部品を撮像する。
【００１９】
本発明によれば、電子部品を移送搭載する搭載ヘッドを電子部品供給部と基板保持部との間で移動させる搭載ヘッド移動機構と、基板保持部において基板を撮像する第１のカメラを少なくとも基板保持部の上方で移動させる第１のカメラ移動機構と、電子部品供給部の電子部品を撮像する第２のカメラを少なくとも電子部品供給部の上方で移動させる第２のカメラ移動機構とを備え、電子部品供給部と基板保持部とを移動対象範囲として搭載ヘッド、第１のカメラ、第２のカメラを相互に協調して相対移動させることにより、電子部品供給部および基板保持部における無駄時間の発生を排しタクトタイムを短縮して、作業効率を向上させることができる。
【００２０】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品搭載装置の平面図、図２は本発明の一実施の形態の電子部品搭載装置の側断面図、図３は本発明の一実施の形態の電子部品搭載装置の平断面図、図４は本発明の一実施の形態の電子部品搭載装置の制御系の構成を示すブロック図、図５は本発明の一実施の形態の電子部品搭載装置の処理機能を示す機能ブロック図、図６、図７、図８、図９は本発明の一実施の形態の電子部品搭載方法の工程説明図、図１０は本発明の一実施の形態の電子部品搭載対象となる基板の平面図である。
【００２１】
まず図１、図２、図３を参照して電子部品搭載装置の全体構造について説明する。図２は図１におけるＡ−Ａ矢視を、また図３は図２におけるＢ−Ｂ矢視をそれぞれ示している。図１において、基台１上には電子部品供給部２が配設されている。図２、図３に示すように、電子部品供給部２は治具ホルダ（治具保持部）３を備えており、治具ホルダ３は、粘着シート５が装着された治具４を着脱自在に保持する。粘着シート５には、電子部品である半導体チップ６（以下、単に「チップ６」と略記。）が個片に分離された状態で貼着されており、治具ホルダ３に治具４が保持された状態では、電子部品供給部２はチップ６を平面状に複数個並べて供給する。
【００２２】
図２に示すように、治具ホルダ３に保持された粘着シート５の下方には、エジェクタ８がエジェクタＸＹテーブル７によって水平移動可能に配設されている。エジェクタ８はチップ突き上げ用のエジェクタピン（図示省略）を昇降させるピン昇降機構を備えており、後述する搭載ヘッドによって粘着シート５からチップ６をピックアップする際には、エジェクタピンによって粘着シート５の下方からチップ６を突き上げることにより、チップ６は粘着シート５から剥離される。エジェクタ８は、チップ６を粘着シート５から剥離する粘着シート剥離機構となっている。
【００２３】
図３に示すように、基台１の上面の電子部品供給部２からＹ方向（第１方向）へ離れた位置には、基板保持部１０が配置されている。基板保持部１０の上流側、下流側にはそれぞれ基板搬入コンベア１２、基板振分部１１、基板保持部１０、基板受渡部１３および基板搬出コンベア１４がＸ方向に直列に配列されている。基板搬入コンベア１２は、基台１と連結されたサブ基台１ａ上に跨って配置されており、サブ基台１ａ上には接着剤塗布装置９が配設されている。接着剤塗布装置９は、上流側から基板搬入コンベア１２に搬入された基板１６に対して、塗布ヘッド９ａによってチップ接着用の接着剤１７（図１０参照）を塗布する。
【００２４】
接着剤塗布後の基板１６は、基板振分部１１に渡される。基板振分部１１は、振分コンベア１１ａをスライド機構１１ｂによってＹ方向にスライド可能に配設した構成となっており、基板搬入コンベア１２から受け取った基板１６を以下に説明する基板保持部１０の２つの基板保持機構に選択的に振り分ける。基板保持部１０は、第１基板保持機構１０Ａ、第２基板保持機構１０Ｂを備えており、基板振分部１１によって振り分けられた基板１６を保持して実装位置に位置決めする。
【００２５】
基板受渡部１３は、基板振分部１１と同様に受渡コンベア１３ａをスライド機構１３ｂによってＹ方向にスライド可能に配設した構成となっており、受渡コンベア１３ａを第１基板保持機構１０Ａ、第２基板保持機構１０Ｂと選択的に接続することにより実装済みの基板１６を受け取り、基板搬出コンベア１４に渡す。基板搬出コンベア１４は、渡された実装済みの基板１６を下流側に搬出する。
【００２６】
図１において、基台１の上面の両端部には、第１のＹ軸ベース２０Ａ，第２のＹ軸ベース２０Ｂが基板搬送方向（Ｘ方向）と直交するＹ方向（第１方向）に長手方向を向けて配設されている。第１のＹ軸ベース２０Ａ，第２のＹ軸ベース２０Ｂの上面には、長手方向（Ｙ方向）に略全長にわたって第１方向ガイド２１が配設されており、１対の第１方向ガイド２１を平行に且つ電子部品供給部２及び基板保持部１０を挟むように配設した形態となっている。
【００２７】
これらの１対の第１方向ガイド２１には、第１ビーム部材３１，センタービーム部材３０および第２ビーム部材３２の３つのビーム部材が、それぞれ両端部を第１方向ガイド２１によって支持されてＹ方向にスライド自在に架設されている。図１に示すように、センタービーム部材３０は第１ビーム部材３１と第２ビーム部材３２の間に位置している。
【００２８】
センタービーム部材３０の右側の側端部にはナット部材２３ｂが突設されており、ナット部材２３ｂに螺合した送りねじ２３ａは、第１のＹ軸ベース２０Ａ上に水平方向で配設されたＹ軸モータ２２によって回転駆動される。Ｙ軸モータ２２を駆動することにより、センタービーム部材３０は第１方向ガイド２１に沿ってＹ方向に水平移動する。
【００２９】
また、第１ビーム部材３１，第２ビーム部材３２の左側の側端部にはそれぞれナット部材２５ｂ，２７ｂが突設されており、ナット部材２５ｂ，２７ｂに螺合した送りねじ２５ａ，２７ａは、それぞれ第２のＹ軸ベース２０Ｂ上に水平方向で配設されたＹ軸モータ２４，２６によって回転駆動される。Ｙ軸モータ２４，２６を駆動することにより、第１ビーム部材３１，第２ビーム部材３２は第１方向ガイド２１に沿ってＹ方向に水平移動する。
【００３０】
センタービーム部材３０には、搭載ヘッド３３が装着されており、搭載ヘッド３３に結合されたナット部材４１ｂに螺合した送りねじ４１ａは、Ｘ軸モータ４０によって回転駆動される。Ｘ軸モータ４０を駆動することにより、搭載ヘッド３３はセンタービーム部材３０の側面にＸ方向（第２方向）に設けられた第２方向ガイド４２（図２参照）に案内されてＸ方向に移動する。
【００３１】
搭載ヘッド３３は、１個のチップ６を保持するノズル３３ａを複数（ここでは４つ）備え、各ノズル３３ａにそれぞれチップ６を吸着して複数のチップ６を保持した状態で移動可能となっている。Ｙ軸モータ２２およびＸ軸モータ４０を駆動することにより、搭載ヘッド３３はＸ方向、Ｙ方向に水平移動し、電子部品供給部２のチップ６をピックアップして保持し、保持したチップ６を基板保持部１０に保持された基板１６の電子部品搭載位置１６ａに搭載する。
【００３２】
１対の第１方向ガイド２１，センタービーム部材３０，センタービーム部材３０を第１方向ガイド２１に沿って移動させる第１方向駆動機構（Ｙ軸モータ２２，送りねじ２３ａおよびナット部材２３ｂ）と、搭載ヘッド３３を第２方向ガイド４２に沿って移動させる第２方向駆動機構（Ｘ軸モータ４０，送りねじ４１ａおよびナット部材４１ｂ）とは、搭載ヘッド３３を電子部品供給部２と基板保持部１０との間で移動させる搭載ヘッド移動機構を構成する。
【００３３】
第１ビーム部材３１には、第１のカメラ３４が装着されており、第１のカメラ３４を保持するブラケット３４ａにはナット部材４４ｂが結合されている。ナット部材４４ｂに螺合した送りねじ４４ａは、Ｘ軸モータ４３によって回転駆動され、Ｘ軸モータ４３を駆動することにより、第１のカメラ３４は第１ビーム部材３１の側面に設けられた第２方向ガイド４５（図２参照）に案内されてＸ方向に移動する。
【００３４】
Ｙ軸モータ２４およびＸ軸モータ４３を駆動することにより、第１のカメラ３４はＸ方向、Ｙ方向に水平移動する。これにより、第１のカメラ３４は基板保持部１０の第１基板保持機構１０Ａ、第２基板保持機構１０Ｂに保持された基板１６を撮像するための基板保持部１０の上方での移動と、基板保持部１０上からの退避のための移動とを行うことができる。
【００３５】
１対の第１方向ガイド２１，第１ビーム部材３１，第１ビーム部材３１を第１方向ガイド２１に沿って移動させる第１方向駆動機構（Ｙ軸モータ２４，送りねじ２５ａおよびナット部材２５ｂ）と、第１のカメラ３４を第２方向ガイド４５に沿って移動させる第２方向駆動機構（Ｘ軸モータ４３，送りねじ４４ａおよびナット部材４４ｂ）とは、第１のカメラ３４を少なくとも基板保持部１０の上方で移動させる第１のカメラ移動機構を構成する。
【００３６】
第２ビーム部材３２には、第２のカメラ３５が装着されており、第２のカメラ３５を保持するブラケット３５ａには、ナット部材４７ｂが結合されている。ナット部材４７ｂに螺合した送りねじ４７ａは、Ｘ軸モータ４６によって回転駆動され、Ｘ軸モータ４６を駆動することにより、第２のカメラ３５は第２ビーム部材３２の側面に設けられた第２方向ガイド４８（図２参照）に案内されてＸ方向に移動する。
【００３７】
Ｙ軸モータ２６およびＸ軸モータ４６を駆動することにより、第２のカメラ３５はＸ方向、Ｙ方向に水平移動する。これにより、第２のカメラ３５は電子部品供給部２に保持されたチップ６の撮像のための電子部品供給部２の上方での移動と、電子部品供給部２上からの退避のための移動とを行うことができる。
【００３８】
１対の第１方向ガイド２１，第２ビーム部材３２，第２ビーム部材３２を第１方向ガイド２１に沿って移動させる第１方向駆動機構（Ｙ軸モータ２６，送りねじ２７ａおよびナット部材２７ｂ）と、第２のカメラ３５を第２方向ガイド４８に沿って移動させる第２方向駆動機構（Ｘ軸モータ４６，送りねじ４７ａおよびナット部材４７ｂ）とは、第２のカメラ３５を少なくとも電子部品供給部２の上方で移動させる第２のカメラ移動機構を構成する。
【００３９】
図３に示すように、電子部品供給部２と基板保持部１０との間には、第３のカメラ１５が配設されている。電子部品供給部２においてチップ６をピックアップした搭載ヘッド３３が第３のカメラ１５の上方をＸ方向に移動することにより、第３のカメラ１５は搭載ヘッド３３に保持されたチップ６を撮像する。
【００４０】
次に図４を参照して、電子部品搭載装置の制御系の構成について説明する。図４において、機構駆動部５０は、以下に示す各機構のモータを電気的に駆動するモータドライバや、各機構のエアシリンダに対して供給される空圧を制御する制御機器などより成り、制御部５４によって機構駆動部５０を制御することにより、以下の各駆動要素が駆動される。
【００４１】
Ｘ軸モータ４０，Ｙ軸モータ２２は、搭載ヘッド３３を移動させる搭載ヘッド移動機構を駆動する。Ｘ軸モータ４３，Ｙ軸モータ２４は、第１のカメラ３４を移動させる第１のカメラ移動機構を、Ｘ軸モータ４６，Ｙ軸モータ２６は、第２のカメラ３５を移動させる第２のカメラ移動機構をそれぞれ駆動する。
【００４２】
また機構駆動部５０は、搭載ヘッド３３の昇降機構、ノズル３３ａ（図２参照）による部品吸着機構を駆動し、エジェクタ８の昇降シリンダおよびエジェクタＸＹテーブル７の駆動モータを駆動する。さらに機構駆動部５０は、基板搬入コンベア１２，基板搬出コンベア１４，基板振分部１１，基板受渡部１３，第１基板保持機構１０Ａ，第２基板保持機構１０Ｂを駆動する。
【００４３】
第１の認識処理部５５は、第１のカメラ３４で撮像した画像を処理して基板保持部１０に保持された基板１６の電子部品搭載位置１６ａ（図１０参照）の位置を求める。電子部品搭載位置１６ａは、基板１６におけるチップ６の実装位置を示すものであり、画像認識により位置検出が可能となっている。また第１の認識処理部５５は、後述するように第１のカメラ３４で撮像した画像を処理して電子部品搭載位置１６ａに塗布された接着剤１７の塗布状態を検査し、さらに接着剤１７上に搭載されたチップ６の搭載状態を検査する。
【００４４】
第２の認識処理部５６は、第２のカメラ３５で撮像した画像を処理して電子部品供給部２のチップ６の位置を求める。第３の認識処理部５７は、第３のカメラ１５で撮像した画像を処理して搭載ヘッド３３に保持されたチップ６の位置を求める。
【００４５】
第１の認識処理部５５、第２の認識処理部５６、第３の認識処理部５７による認識結果は、制御部５４に送られる。データ記憶部５３は、後述する接着剤１７の塗布状態検査やチップ６の搭載状態検査の検査結果など、各種のデータを記憶する。操作部５１は、キーボードやマウスなどの入力装置であり、データ入力や制御コマンドの入力を行う。表示部５２は、第１のカメラ３４、第２のカメラ３５、第３のカメラ１５による撮像画面の表示や、操作部５１による入力時の案内画面の表示を行う。
【００４６】
次に図５を参照して、電子部品実装装置の処理機能について説明する。図５において、破線枠５４は図４に示す制御部５４による処理機能を示している。ここで第１のカメラ移動処理部５４ａ、第２のカメラ移動処理部５４ｂ、搭載ヘッド移動処理部５４ｃによって実行される処理機能は、それぞれ第１のカメラ移動制御手段、第２のカメラ移動制御手段、搭載ヘッド移動制御手段を構成している。
【００４７】
第１のカメラ移動処理部５４ａは、第１のカメラ移動機構を制御して、基板保持部１０に保持された基板１６を撮像する際の第１のカメラ３４の位置決め動作と、搭載ヘッド３３によるチップ６の搭載を妨げない位置に第１のカメラ３４を移動する退避動作とを行わせる。ここで基板１６の撮像は、チップ６が搭載される前の電子部品搭載位置１６ａの撮像、同じくチップ６が搭載される前の電子部品搭載位置１６ａ内の接着剤１７の撮像、およびチップ６が搭載された後の電子部品搭載位置１６ａの撮像、の３種類を対象として行われる。
【００４８】
第２のカメラ移動処理部５４ｂは、第２のカメラ移動機構を制御して、電子部品供給部２のチップ６を撮像する時の第２のカメラ３５の位置決め動作と、搭載ヘッド３３による電子部品のピックアップを妨げない位置に第２のカメラ３５を移動する退避動作とを行わせる。
【００４９】
搭載ヘッド移動処理部５４ｃは、ピックアップ動作処理部５４ｄとマウント動作処理部５４ｅの２つの処理機能を備えている。ピックアップ動作処理部５４ｄは、搭載ヘッド移動機構を制御して、電子部品供給部２からチップ６をピックアップする際の搭載ヘッド３３の位置決め動作を、第２の認識処理部５６で求めたチップ６の位置に基づいて行わせる。マウント動作処理部５４ｅは、搭載ヘッド移動機構を制御して、基板保持部１０の基板１６にチップ６を搭載する際の搭載ヘッド３３の位置決め動作を、第１の認識処理部５５の電子部品搭載位置検出処理部５５ａで求めた電子部品搭載位置１６ａの位置および第３の認識処理部５７で求めたチップ６の位置に基づいて行わせる。
【００５０】
第１の認識処理部５５は、電子部品搭載位置検出処理部５５ａ以外に、塗布状態検査処理部５５ｂ、搭載状態検査処理部５５ｃを有している。マウント動作処理部５４ｅによる搭載動作においては、塗布状態検査処理部５５ｂによって検出されたチップ６の接着剤塗布検査結果が参照され、塗布状態が合格と判定された電子部品搭載位置に対してのみ、チップ６の搭載が実行される。
【００５１】
検査結果記録処理部５４ｆは、塗布状態検査処理部５５ｂによる前述の接着剤塗布状態検査結果、搭載状態検査処理部５５ｃによるチップ６の搭載状態検査結果を記憶するための処理を行う。これらの検査結果は、検査結果記録処理部５４ｆに送られてデータ処理が行われ、データ記憶部５３に設けられた検査結果記憶部５３ａに記憶される。
【００５２】
この電子部品搭載装置は上記のように構成されており、以下電子部品実装方法について図６〜図１０を参照して説明する。図６において、電子部品供給部２に保持された治具４の粘着シート５には、多数のチップ６が貼着されている。また基板保持部１０では、第１基板保持機構１０Ａ、第２基板保持機構１０Ｂにそれぞれ基板１６が位置決めされている。ここで示す電子部品実装においては、複数（ここでは４個）のチップ６を搭載ヘッド３３に備えられた４つの吸着ノズル３３ａによって順次吸着保持し、１実装ターンにおいてこれらの４個のチップ６を基板１６の複数の電子部品搭載位置１６ａに順次搭載する。
【００５３】
まず、図６（ａ）に示すように第２のカメラ３５を第２のカメラ移動機構により電子部品供給部２の上方に移動させ、ピックアップしようとする複数（４個）のチップ６を第２のカメラ３５によって撮像する。その後、図６（ｂ）に示すように第２のカメラ３５をこれらのチップ６の上方から退避させる。そして第２のカメラ３５で撮像した画像を第２の認識処理部５６で処理して複数のチップ６の位置を求める。
【００５４】
次いで搭載ヘッド３３を電子部品供給部２の上方に移動させる。そして求めた複数のチップ６の位置に基づいて搭載ヘッド３３をこれらのチップ６に順次位置決めする位置決め動作を搭載ヘッド移動機構に行わせながら、搭載ヘッド３３の４つの吸着ノズル３３ａによって、複数のチップ６を順次ピックアップする。
【００５５】
このピックアップ動作と並行して、第１のカメラ移動機構により第１のカメラ３４を基板保持部１０の第１基板保持機構１０Ａに保持された基板１６上に移動させる。そして図１０（ａ）に示すように、基板１６に設定された８つの電子部品搭載位置１６ａのうち、左側の４つの電子部品搭載位置１６ａを画像取り込み範囲１８が順次囲むように第１のカメラ３４を順次移動させて、複数の電子部品搭載位置１６ａとこの内部に塗布された接着剤１７を撮像して画像を取り込み、その後第１のカメラ３４をこの基板１６の上方から退避させる。
【００５６】
そして第１のカメラ３４で撮像した画像取り込み範囲１８の画像を第１の認識処理部５５で処理して、基板１６の電子部品搭載位置１６ａ（図１０（ａ）参照）の位置を求める。この基板１６の認識においては、電子部品搭載位置１６ａの位置検出とともに、チップ６が搭載される前の複数の電子部品搭載位置１６ａ内に塗布された接着剤１７を撮像し、各電子部品搭載位置１６ａに塗布されている接着剤１７の塗布状態を検査する。すなわち、接着剤１７が正常な塗布位置に適正な塗布量で塗布されているか否かを画像に基づいて判定する。
【００５７】
次いで図７（ａ）に示すように、各吸着ノズル３３ａに４つのチップを保持した搭載ヘッド３３は、第３のカメラ１５の上方を移動するスキャン動作を行う。これにより、各吸着ノズル３３ａに保持されたチップ６の画像が第３のカメラ１５に取り込まれ、この画像を第３の認識処理部５７で認識処理することにより、チップ６の位置が検出される。
【００５８】
次いで搭載動作に移行する。このとき、第１の認識処理部５５で塗布状態が合格と判定された電子部品搭載位置１６ａのみを対象として、チップ６の搭載が行われる。搭載ヘッド３３は、図７（ｂ）に示すように基板保持部１０の上方に移動する。そしてここで第１の認識処理部５５で求めた電子部品搭載位置１６ａの位置、第３の認識処理部５７で求めたチップ６の位置および塗布状態の検査による判定結果に基づいて搭載動作を行う。
【００５９】
すなわち、第１基板保持機構１０Ａに位置決めされた基板１６の複数の電子部品搭載位置１６ａのうち、塗布状態が合格と判定された電子部品搭載位置１６ａに搭載ヘッド３３の吸着ノズル３３ａに保持されたチップ６を順次位置決めする位置決め動作を搭載ヘッド移動機構に行わせながら、搭載ヘッド３３に保持されているチップ６をこの電子部品搭載位置１６ａ内に塗布された接着剤１７に１個づつ搭載する。
【００６０】
そして搭載ヘッド３３がチップ６を搭載している時に、第２のカメラ３５を電子部品供給部２において次にピックアップされる複数のチップ６の上方に移動させ、複数のチップ６を第２のカメラ３５で撮像する。そして図８（ａ）に示すように第２のカメラ３５をこのチップ６の上方から退避させ、次いで搭載ヘッド３３を電子部品供給部２の上方に移動させる。そして第２の認識処理部５６で求めたチップ６の位置に基づいて、搭載ヘッド３３をこのチップ６に位置決めする位置決め動作を搭載ヘッド移動機構に行わせながら、搭載ヘッド３３の４つの吸着ノズル３３ａによって複数のチップ６を順次ピックアップする。
【００６１】
そして、電子部品供給部２におけるチップ６のピックアップ中に、第１のカメラ３４を基板保持部１０の第１基板保持機構１０Ａ上に移動させて基板１６の撮像を行う。ここでは、基板１６に搭載されたチップ６の搭載状態の検査と、次の実装ターンでチップ６が搭載される複数の電子部品搭載位置１６ａの位置検出およびこれらの電子部品搭載位置１６ａに塗布された接着剤１７の塗布状態の検査が行われる。
【００６２】
すなわちこの撮像では、図１０（ｃ）に示すように、基板１６に設定された８つの電子部品搭載位置１６ａを画像取り込み範囲１８が順次囲むように、第１のカメラ３４を順次移動させて画像を取り込み、その後第１のカメラ３４をこの基板１６の上方から退避させる。そして第１のカメラ３４で撮像した画像を第１の認識処理部５５で処理して、次の検査処理が行われる。
【００６３】
まず左側の４つの画像取り込み範囲１８の画像については、チップ６の搭載状態の検査、すなわちチップ６の位置・姿勢のずれや接着剤１７のはみ出し状態が正常であるか否かが検査される。そして右側の４つの画像取り込み範囲１８については、基板１６の電子部品搭載位置１６ａの位置検出とともに、チップ６が搭載される前の電子部品搭載位置１６ａ内に塗布された接着剤１７の塗布状態の検査が行われる。
【００６４】
次いで図８（ｂ）に示すように、各吸着ノズル３３ａに４つのチップ６を保持した搭載ヘッド３３は、第３のカメラ１５の上方を移動するスキャン動作を行う。これにより、各吸着ノズル３３ａに保持されたチップ６の画像が第３のカメラに取り込まれ、この画像を第３の認識処理部５７で処理することにより、チップ６の位置が検出される。
【００６５】
この後搭載ヘッド３３は、図９（ａ）に示すように基板保持部１０の第１の基板保持機構１０Ａの上方に移動する。次いで図７（ｂ）と同様に、搭載ヘッド３３に保持されているチップ６を基板１６の未搭載状態の４つの電子部品搭載位置１６ａに搭載する。これにより、図１０（ｄ）に示すように、基板１６の８つの電子部品搭載位置１６ａへのチップ６の搭載が完了する。そしてこの搭載ヘッド３３によるチップ６の搭載動作中に、第２のカメラ３５を再び電子部品供給部２のチップ６上に移動させ、第２のカメラ３５によって次にピックアップされるチップ６を撮像する。
【００６６】
そして図９（ｂ）に示すように第２のカメラ３５をこのチップ６の上方から退避させたならば、搭載ヘッド３３を電子部品供給部２の上方に移動させ、第２の認識処理部５６で求めたチップ６の位置に基づいて、搭載ヘッド３３の４つの吸着ノズル３３ａによってチップ６を順次ピックアップする。
【００６７】
この動作と並行して、第１のカメラ移動機構により第１のカメラ３４を基板保持部１０の第１基板保持機構１０Ａに保持された基板１６上に移動させる。そして基板１６に設定された８つの電子部品搭載位置１６ａのうち、右側の４つの電子部品搭載位置１６ａを画像取り込み範囲１８が順次囲むように、第１のカメラ３４を順次移動させて画像を取り込む。
【００６８】
そして第１のカメラ３４で撮像した画像取り込み範囲１８の画像を第１の認識処理部５５で処理して、基板１６の電子部品搭載位置１６ａにおけるチップ６の搭載状態が検査される。この搭載状態検査の後、基板１６は第１基板保持機構１０Ａから基板受渡部１３に搬出され、第１基板保持機構１０Ａには新たな基板１６が搬入される。
【００６９】
また、第１基板保持機構１０Ａでの撮像を終えた第１のカメラ３４は、第２基板保持機構１０Ｂに保持された未搭載の基板１６上に移動し、ここで次にチップ６を搭載する予定の電子部品搭載位置１６ａを撮像し、電子部品搭載位置１６ａの位置検出と接着剤１７の塗布状態検査が行われる。
【００７０】
そしてこれ以降、同様の動作が継続して反復される。すなわち、上記電子部品実装方法においては、基板保持部１０には、基板１６の撮像を行う第１のカメラ３４とチップ６の搭載を行う搭載ヘッド３３が交互にアクセスし、電子部品供給部２にはチップ６の撮像を行う第２のカメラ３５とチップ６のピックアップを行う搭載ヘッド３３が交互にアクセスする。これにより、基板保持部１０および電子部品供給部２において何ら作業が行われない実装動作上のロスタイムの発生を排除することができる。
【００７１】
本実施の形態の電子部品搭載装置では、搭載ヘッド３３がピックアップ動作を行っている時間を利用して第１のカメラ３４で基板保持部１０の基板を撮像して第１の認識処理部５５で各種検査や検出処理を行い、搭載ヘッド３３が搭載動作を行う時間を利用して第２のカメラ３５で電子部品供給部２のチップ６を撮像して第２の認識処理部５６でチップ６の位置を検出するようにしているが、搭載ヘッド３３がピックアップ動作及びスキャン動作を行っている時間を利用して第１のカメラ３４で基板保持部１０の基板を撮像して第１の認識処理部５５で各種検査や検出処理を行い、搭載ヘッド３３がスキャン動作及び搭載動作を行う時間を利用して第２のカメラ３５で電子部品供給部２のチップ６を撮像して第２の認識処理部５６でチップ６の位置を検出するようにしてもよい。このようにすることで第１のカメラ３４や第２のカメラ３５での撮像に時間的な余裕ができるので、安定した装置の動作を保つことができる。
【００７２】
さらに、１回の実装ターンで複数のチップ６をピックアップして搭載するようにしたので各ビーム部材の総移動距離が短縮され、この結果作業効率が高くなる。
【００７３】
なお、本実施の形態の電子部品搭載装置では塗布状態検査と搭載状態検査を行うようにしているが、いずれか一方もしくは両方の検査を省略して実施してもよい。
【００７４】
【発明の効果】
本発明によれば、電子部品を移送搭載する搭載ヘッドを電子部品供給部と基板保持部との間で移動させる搭載ヘッド移動機構と、基板保持部において基板を撮像する第１のカメラを少なくとも基板保持部の上方で移動させる第１のカメラ移動機構と、電子部品供給部の電子部品を撮像する第２のカメラを少なくとも電子部品供給部の上方で移動させる第２のカメラ移動機構とを備え、電子部品供給部と基板保持部とを移動対象範囲として搭載ヘッド、第１のカメラ、第２のカメラを相互に協調して相対移動させるようにしたので、電子部品供給部および基板保持部におけるロスタイムを排し、タクトタイムを短縮して作業効率を向上させることができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品搭載装置の平面図
【図２】本発明の一実施の形態の電子部品搭載装置の側断面図
【図３】本発明の一実施の形態の電子部品搭載装置の平断面図
【図４】本発明の一実施の形態の電子部品搭載装置の制御系の構成を示すブロック図
【図５】本発明の一実施の形態の電子部品搭載装置の処理機能を示す機能ブロック図
【図６】本発明の一実施の形態の電子部品搭載方法の工程説明図
【図７】本発明の一実施の形態の電子部品搭載方法の工程説明図
【図８】本発明の一実施の形態の電子部品搭載方法の工程説明図
【図９】本発明の一実施の形態の電子部品搭載方法の工程説明図
【図１０】本発明の一実施の形態の電子部品搭載対象となる基板の平面図
【符号の説明】
２電子部品供給部
３治具ホルダ
４治具
５粘着シート
６チップ
８エジェクタ
１０基板保持部
１０Ａ第１基板保持機構
１０Ｂ第２基板保持機構
１５第３のカメラ
１６基板
１６ａ電子部品搭載位置
１７接着剤
３０センタービーム部材
３１第１ビーム部材
３２第２ビーム部材
３３搭載ヘッド
３４第１のカメラ
３５第２のカメラ
５５第１の認識処理部
５６第２の認識処理部
５７第３の認識処理部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
Among electronic components used in electronic devices, those supplied in a state of being adhered to an adhesive sheet such as a semiconductor chip are mounted on a substrate such as a lead frame by a mounting device that is conventionally equipped with a dedicated take-out device. . In this take-out device, since it is necessary to accurately pick up the chips attached to the pressure-sensitive adhesive sheet held in the electronic component supply unit with a suction nozzle, the chip position on the pressure-sensitive adhesive sheet is recognized. Parts imaging camera is required.
[0003]
In addition, the substrate on which the chip is mounted is placed and positioned on the substrate holding unit. In order to ensure good mounting quality of this chip, the position of the substrate in the substrate holding unit and the adhesive for chip bonding are used. There is a need for a substrate imaging camera that performs imaging for coating state inspection and mounting state confirmation after chip mounting. That is, in such an electronic component mounting apparatus, the three areas of the mounting head, the component imaging camera, and the board imaging camera are moved relative to each other with the two areas of the electronic component supply unit and the board holding unit as movement targets. Thus, the mounting operation is performed.
[0004]
[Problems to be solved by the invention]
However, in the conventional electronic component mounting apparatus, the operations of the mounting head, the component imaging camera, and the substrate imaging camera in the electronic component supply unit and the substrate holding unit are often configured in series within the same cycle. The generation of a loss time in which no work is performed in the supply unit and the substrate holding unit is inevitable. For this reason, the tact time of the electronic component mounting operation is delayed, and there is a limit to improving the working efficiency.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can shorten the tact time and improve the working efficiency.
[0006]
  The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus for mounting an electronic component at an electronic component mounting position on a substrate, the electronic component supplying unit supplying a plurality of electronic components arranged in a plane, and the electronic A board holding unit disposed at a position away from the component supply unit in the first direction;There are multiple nozzles that hold one electronic component.The electronic component of the electronic component supply unitMultiplePicked up and held, heldpluralOf the substrate held by the substrate holderpluralA mounting head mounted at an electronic component mounting position; a first camera that captures an image of the substrate held by the substrate holding unit; and a first camera movement that moves the first camera at least above the substrate holding unit. A mechanism and a substrate held by the substrate holder by processing an image captured by the first camera.pluralA first recognition processing unit for obtaining a position of an electronic component mounting position; andpluralA second camera that images the electronic component, a second camera moving mechanism that moves the second camera at least above the electronic component supply unit, and an image captured by the second camera to process the image Electronic component supplypluralA second recognition processing unit that obtains the position of the electronic component; and the second recognition processing unit that is sandwiched between the first camera moving mechanism and the second camera moving mechanism in a plan view; A mounting head moving mechanism that moves between the supply unit and the substrate holding unit; and the mounting head moving mechanism is controlled to: (1) remove an electronic component from the electronic component supply unitMultipleThe positioning operation of the mounting head when picking up was obtained by the second recognition processing unit.plural(2) on the substrate of the substrate holderpluralThe first recognition processing unit obtained the positioning operation of the mounting head when mounting the electronic component.pluralBy controlling the mounting head movement control means to be performed based on the position of the electronic component mounting position and the first camera movement mechanism, (1) the first when imaging the substrate held by the substrate holding unit A first camera movement control means for performing a positioning operation of the camera and (2) a retraction operation of moving the first camera to a position not hindering mounting of the electronic component by the mounting head; and the second camera Controlling the moving mechanism, (1) of the electronic component supply unitpluralA second camera that performs a positioning operation of the second camera when imaging the electronic component and (2) a retraction operation of moving the second camera to a position that does not interfere with the pickup of the electronic component by the mounting head. With movement control meansThe imaging of the plurality of electronic component mounting positions on the substrate by the first camera is performed in parallel with the pickup of the plurality of electronic components by the mounting head, and the mounting head places the electronic components on the plurality of electronic component mounting positions on the substrate. When mounted, the plurality of electronic components are imaged by the second camera..
[0007]
  The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein the mounting head moving mechanism is parallel to the first direction and sandwiches the electronic component supply unit and the substrate holding unit. A pair of first direction guides, and a second direction guide supported at both ends by the first direction guide and guiding the mounting head in a second direction perpendicular to the first direction.CenterA beam member;CenterA first direction drive mechanism that moves the beam member along the first direction guide; and a second direction drive mechanism that moves the mounting head along the second direction guide.
[0008]
  The electronic component mounting apparatus according to claim 3 is the electronic component mounting apparatus according to claim 1, wherein the first camera moving mechanism is parallel to the first direction and the electronic component supply unit and the substrate holding unit. A pair of first direction guides disposed so as to sandwich the first direction guide, and a second direction guide supported at both ends by the first direction guide and guiding the first camera in a second direction orthogonal to the first direction. PreparedFirstA beam member;FirstA first direction drive mechanism that moves the beam member along the first direction guide; and a second direction drive mechanism that moves the first camera along the second direction guide.
[0009]
  The electronic component mounting apparatus according to claim 4 is the electronic component mounting apparatus according to claim 1, wherein the second camera moving mechanism is parallel to the first direction and the electronic component supply unit and the substrate holding unit. A pair of first direction guides arranged so as to sandwich the first direction guide, and a second direction guide supported at both ends by the first direction guide and guiding the second camera in a second direction perpendicular to the first direction. PreparedSecondA beam member;SecondA first direction driving mechanism that moves the beam member along the first direction guide; and a second direction driving mechanism that moves the second camera along the second direction guide.
[0010]
  The electronic component mounting apparatus according to claim 5 is the electronic component mounting apparatus according to claim 1, wherein the mounting head moving mechanism is parallel to the first direction and sandwiches the electronic component supply unit and the substrate holding unit. A center beam having a pair of first direction guides and a second direction guide supported at both ends by the first direction guide and guiding the mounting head in a second direction orthogonal to the first direction. A first direction drive mechanism for moving the member, the center beam member along the first direction guide, and a second direction drive mechanism for moving the mounting head along the second direction guide, The first camera moving mechanism includes a first beam member including a second direction guide supported at both ends by the first direction guide and guiding the first camera in a second direction orthogonal to the first direction. ,in front A first direction drive mechanism that moves the first beam member along the first direction guide; and a second direction drive mechanism that moves the first camera along the second direction guide. A second beam member provided with a second direction guide that is supported at both ends by the first direction guide and guides the second camera in a second direction orthogonal to the first direction; A first direction drive mechanism for moving the second beam member along the first direction guide; and a second direction drive mechanism for moving the second camera along the second direction guide.The center beam member is positioned between the first beam member and the second beam member.To do.
[0011]
  The electronic component mounting apparatus according to claim 6 is the electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is held by the mounting head between the electronic component supply unit and the substrate holding unit.pluralA third camera that images the electronic component, and an image captured by the third camera is processed and held by the mounting headpluralA third recognition processing unit that obtains the position of the electronic component; and the mounting head movement control means controls the mounting head movement mechanism to: (1) from the electronic component supply unitpluralThe positioning operation of the mounting head when picking up an electronic component was obtained by the second recognition processing unit.plural(2) on the substrate of the substrate holderpluralThe first recognition processing unit obtains the positioning operation of the mounting head when mounting the electronic component.pluralObtained by the position of the electronic component mounting position and the third recognition processing unitpluralBased on the position of the electronic component.
[0012]
An electronic component mounting apparatus according to a seventh aspect is the electronic component mounting apparatus according to the first aspect, wherein the substrate holding section includes a plurality of substrate holding mechanisms for holding the substrate.
[0013]
An electronic component mounting apparatus according to claim 8 is the electronic component mounting apparatus according to claim 7, wherein a substrate carrying conveyor for loading a substrate into the electronic component mounting device, and a substrate on which the electronic component is mounted from the electronic component mounting device. A substrate carry-out conveyor that unloads the substrate, a substrate sorting unit that receives the substrate from the substrate carry-in conveyor, and distributes and transports the substrates one by one to the plurality of substrate holding mechanisms, and holds the plurality of substrates on which electronic components are mounted. A substrate delivery unit that receives the mechanism and delivers it to the substrate carry-out conveyor is provided.
[0014]
The electronic component mounting apparatus according to claim 9 is the electronic component mounting apparatus according to claim 1, wherein the electronic component supply unit detachably holds a jig having an adhesive sheet on which a plurality of electronic components are attached. A jig holding part is provided.
[0015]
The electronic component mounting apparatus according to claim 10 is the electronic component mounting apparatus according to claim 9, wherein the electronic sheet picked up by the mounting head is separated from the adhesive sheet below the adhesive sheet. It has a mechanism.
[0018]
  The electronic component mounting method according to claim 11 includes a plurality of nozzles for holding one electronic component, picks up and holds the electronic component of the electronic component supply unit with the plurality of nozzles, and holds the held electronic component on the substrate. A mounting head mounted on the electronic component mounting position of the board held by the board, a first camera that images the board held by the board holding section, and at least a front of the first camera.RegisterA first camera moving mechanism that moves above the plate holding unit; a first recognition processing unit that obtains positions of the plurality of electronic component mounting positions by processing an image captured by the first camera; A second camera that images a plurality of electronic components of the component supply unit, a second camera moving mechanism that moves the second camera at least above the electronic component supply unit, and an image captured by the second camera A second recognition processing unit that processes an image to obtain the positions of the plurality of electronic components, and is disposed at a position sandwiched between the first camera moving mechanism and the second camera moving mechanism in plan view. An electronic component mounting method using an electronic component mounting apparatus comprising a mounting head moving mechanism for moving the mounting head between the electronic component supply unit and the substrate holding unit, wherein the second camera moving mechanism The second turtle Moving the electronic component to the electronic component supply unit to image the electronic component, and then retracting the second camera from above the electronic component; and an image captured by the second camera to the second recognition processing unit And a step of determining the position of the electronic component by processing in step (b), and a positioning operation for positioning the mounting head on the electronic component based on the position of the electronic component determined by the second recognition processing unit. A step of picking up the electronic component with a plurality of nozzles of the mounting head, and a step of moving the first camera onto a substrate held by the substrate holding unit by the first camera moving mechanism; And then retracting the first camera from above the substrate, and processing the image captured by the first camera with the first recognition processing unit before A step of determining the position of the electronic component mounting position on the substrate, and a positioning operation for positioning the mounting head at the electronic component mounting position based on the position of the electronic component mounting position determined by the first recognition processing unit. A step of mounting a plurality of electronic components held by the plurality of nozzles of the mounting head at the plurality of electronic component mounting positions while performing the movement mechanism, and in parallel with the pickup of the plurality of electronic components A plurality of electronic component mounting positions on the substrate are imaged by one camera, and the second camera is again moved above the electronic component supply unit while mounting the plurality of electronic components held by the plurality of nozzles of the mounting head. Then, the next electronic component picked up by the second camera is imaged.
[0019]
According to the present invention, at least a mounting head moving mechanism for moving a mounting head for transporting and mounting an electronic component between the electronic component supply unit and the substrate holding unit, and a first camera for imaging the substrate in the substrate holding unit A first camera moving mechanism that moves above the holding unit; and a second camera moving mechanism that moves at least the second camera that images the electronic component of the electronic component supply unit above the electronic component supply unit; By moving the mounting head, the first camera, and the second camera relative to each other with the electronic component supply unit and the substrate holding unit as movement target ranges, the dead time in the electronic component supply unit and the substrate holding unit can be reduced. Occurrence can be eliminated, the tact time can be shortened, and work efficiency can be improved.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a block diagram of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6, FIG. 7, FIG. 8, and FIG. 9 are process explanatory views of the electronic component mounting method according to the embodiment of the present invention, and FIG. 10 is the electronic component according to the embodiment of the present invention. It is a top view of the board | substrate used as mounting object.
[0021]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. 2 shows an AA arrow view in FIG. 1, and FIG. 3 shows a BB arrow view in FIG. In FIG. 1, an electronic component supply unit 2 is disposed on a base 1. As shown in FIGS. 2 and 3, the electronic component supply unit 2 includes a jig holder (jig holding unit) 3, and the jig holder 3 is detachable from the jig 4 on which the adhesive sheet 5 is attached. Hold on. A semiconductor chip 6 (hereinafter simply abbreviated as “chip 6”), which is an electronic component, is attached to the adhesive sheet 5 in a state of being separated into pieces, and the jig 4 is held by the jig holder 3. In this state, the electronic component supply unit 2 supplies a plurality of chips 6 arranged in a plane.
[0022]
As shown in FIG. 2, an ejector 8 is disposed below the adhesive sheet 5 held by the jig holder 3 so as to be horizontally movable by an ejector XY table 7. The ejector 8 is provided with a pin lifting mechanism that lifts and lowers an ejector pin (not shown) for pushing up the chip. The chip 6 is peeled off from the adhesive sheet 5 by pushing up the chip 6 from above. The ejector 8 is an adhesive sheet peeling mechanism that peels the chip 6 from the adhesive sheet 5.
[0023]
As shown in FIG. 3, the substrate holding unit 10 is arranged at a position away from the electronic component supply unit 2 on the upper surface of the base 1 in the Y direction (first direction). A substrate carry-in conveyor 12, a substrate sorting unit 11, a substrate holding unit 10, a substrate delivery unit 13 and a substrate carry-out conveyor 14 are arranged in series in the X direction on the upstream side and the downstream side of the substrate holding unit 10, respectively. The substrate carry-in conveyor 12 is disposed over the sub-base 1a connected to the base 1, and an adhesive application device 9 is provided on the sub-base 1a. The adhesive application device 9 applies the chip bonding adhesive 17 (see FIG. 10) to the substrate 16 carried into the substrate carry-in conveyor 12 from the upstream side by the application head 9a.
[0024]
The substrate 16 after application of the adhesive is transferred to the substrate distribution unit 11. The substrate distribution unit 11 has a configuration in which a distribution conveyor 11a is slidable in the Y direction by a slide mechanism 11b, and the substrate 16 received from the substrate carry-in conveyor 12 is included in the substrate holding unit 10 described below. It selectively distributes to two substrate holding mechanisms. The substrate holding unit 10 includes a first substrate holding mechanism 10A and a second substrate holding mechanism 10B, and holds the substrate 16 distributed by the substrate distribution unit 11 and positions it at the mounting position.
[0025]
Similarly to the substrate distribution unit 11, the substrate delivery unit 13 has a configuration in which a delivery conveyor 13a is slidable in the Y direction by a slide mechanism 13b. The delivery conveyor 13a includes the first substrate holding mechanism 10A and the second substrate holding mechanism 10A. By selectively connecting to the substrate holding mechanism 10 </ b> B, the mounted substrate 16 is received and transferred to the substrate carry-out conveyor 14. The board carry-out conveyor 14 carries the delivered mounted board 16 downstream.
[0026]
In FIG. 1, the first Y-axis base 20A and the second Y-axis base 20B are elongated in the Y direction (first direction) perpendicular to the substrate transport direction (X direction) at both ends of the upper surface of the base 1. It is arranged in a direction. On the upper surfaces of the first Y-axis base 20A and the second Y-axis base 20B, a first direction guide 21 is disposed over substantially the entire length in the longitudinal direction (Y direction), and a pair of first direction guides 21. Are arranged so as to sandwich the electronic component supply unit 2 and the substrate holding unit 10 in parallel.
[0027]
  The pair of first direction guides 21 includes three beam members, a first beam member 31, a center beam member 30 and a second beam member 32, both ends of which are supported by the first direction guide 21. It is slidable in the direction.As shown in FIG. 1, the center beam member 30 is located between the first beam member 31 and the second beam member 32.
[0028]
A nut member 23b protrudes from the right side end of the center beam member 30, and a feed screw 23a screwed into the nut member 23b is disposed in the horizontal direction on the first Y-axis base 20A. It is rotationally driven by the Y-axis motor 22. By driving the Y-axis motor 22, the center beam member 30 moves horizontally in the Y direction along the first direction guide 21.
[0029]
Further, nut members 25b and 27b project from the left side end portions of the first beam member 31 and the second beam member 32, respectively. Feed screws 25a and 27a screwed into the nut members 25b and 27b are respectively Each of them is rotationally driven by Y-axis motors 24 and 26 disposed horizontally on the second Y-axis base 20B. By driving the Y-axis motors 24 and 26, the first beam member 31 and the second beam member 32 move horizontally in the Y direction along the first direction guide 21.
[0030]
A mounting head 33 is mounted on the center beam member 30, and a feed screw 41 a screwed into a nut member 41 b coupled to the mounting head 33 is rotationally driven by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 is guided by a second direction guide 42 (see FIG. 2) provided in the X direction (second direction) on the side surface of the center beam member 30 and moves in the X direction. To do.
[0031]
The mounting head 33 includes a plurality (four in this case) of nozzles 33 a that hold one chip 6, and can move while the plurality of chips 6 are held by adsorbing the chips 6 to the nozzles 33 a. Yes. By driving the Y-axis motor 22 and the X-axis motor 40, the mounting head 33 moves horizontally in the X direction and the Y direction, picks up and holds the chip 6 of the electronic component supply unit 2, and holds the held chip 6 on the substrate. It is mounted on the electronic component mounting position 16 a of the substrate 16 held by the holding unit 10.
[0032]
A pair of first direction guides 21, a center beam member 30, a first direction drive mechanism (Y-axis motor 22, feed screw 23a and nut member 23b) for moving the center beam member 30 along the first direction guide 21, The second direction drive mechanism (X-axis motor 40, feed screw 41a, and nut member 41b) that moves the mounting head 33 along the second direction guide 42 means that the mounting head 33 is moved to the electronic component supply unit 2 and the substrate holding unit 10. The mounting head moving mechanism is configured to move between the two.
[0033]
A first camera 34 is attached to the first beam member 31, and a nut member 44 b is coupled to a bracket 34 a that holds the first camera 34. The feed screw 44 a screwed into the nut member 44 b is rotationally driven by the X-axis motor 43. By driving the X-axis motor 43, the first camera 34 is provided on the side surface of the first beam member 31. It is guided by a direction guide 45 (see FIG. 2) and moves in the X direction.
[0034]
By driving the Y-axis motor 24 and the X-axis motor 43, the first camera 34 moves horizontally in the X direction and the Y direction. Thus, the first camera 34 moves the substrate holding unit 10 above the substrate holding unit 10 for imaging the substrate 16 held by the first substrate holding mechanism 10A and the second substrate holding mechanism 10B of the substrate holding unit 10, and the substrate. Movement for evacuation from the holding unit 10 can be performed.
[0035]
A first direction drive mechanism (Y-axis motor 24, feed screw 25a and nut member 25b) that moves the pair of first direction guide 21, first beam member 31, and first beam member 31 along the first direction guide 21 And the second direction drive mechanism (the X-axis motor 43, the feed screw 44a, and the nut member 44b) that moves the first camera 34 along the second direction guide 45 includes at least the substrate holding unit. A first camera moving mechanism for moving above 10 is configured.
[0036]
A second camera 35 is attached to the second beam member 32, and a nut member 47 b is coupled to a bracket 35 a that holds the second camera 35. The feed screw 47a screwed to the nut member 47b is rotationally driven by the X-axis motor 46. By driving the X-axis motor 46, the second camera 35 is provided on the side surface of the second beam member 32. It is guided by a direction guide 48 (see FIG. 2) and moves in the X direction.
[0037]
By driving the Y-axis motor 26 and the X-axis motor 46, the second camera 35 moves horizontally in the X direction and the Y direction. Accordingly, the second camera 35 moves above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2 and moves to retreat from the electronic component supply unit 2. And can be done.
[0038]
First direction drive mechanism (Y-axis motor 26, feed screw 27a and nut member 27b) that moves the pair of first direction guide 21, second beam member 32, and second beam member 32 along the first direction guide 21 The second direction driving mechanism (the X-axis motor 46, the feed screw 47a, and the nut member 47b) that moves the second camera 35 along the second direction guide 48 supplies at least the second camera 35 with electronic components. A second camera moving mechanism that moves above the unit 2 is configured.
[0039]
As shown in FIG. 3, a third camera 15 is disposed between the electronic component supply unit 2 and the substrate holding unit 10. When the mounting head 33 picking up the chip 6 in the electronic component supply unit 2 moves in the X direction above the third camera 15, the third camera 15 images the chip 6 held by the mounting head 33.
[0040]
Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 4, the mechanism drive unit 50 includes a motor driver that electrically drives a motor of each mechanism shown below, a control device that controls air pressure supplied to an air cylinder of each mechanism, and the like. By controlling the mechanism drive unit 50 by the unit 54, the following drive elements are driven.
[0041]
The X-axis motor 40 and the Y-axis motor 22 drive a mounting head moving mechanism that moves the mounting head 33. The X-axis motor 43 and the Y-axis motor 24 are a first camera moving mechanism for moving the first camera 34, and the X-axis motor 46 and the Y-axis motor 26 are a second camera for moving the second camera 35. Each moving mechanism is driven.
[0042]
The mechanism driving unit 50 drives a lifting mechanism of the mounting head 33 and a component suction mechanism by the nozzle 33a (see FIG. 2), and drives a lifting cylinder of the ejector 8 and a driving motor of the ejector XY table 7. Further, the mechanism driving unit 50 drives the substrate carry-in conveyor 12, the substrate carry-out conveyor 14, the substrate sorting unit 11, the substrate delivery unit 13, the first substrate holding mechanism 10A, and the second substrate holding mechanism 10B.
[0043]
The first recognition processing unit 55 processes the image captured by the first camera 34 to obtain the position of the electronic component mounting position 16a (see FIG. 10) of the substrate 16 held by the substrate holding unit 10. The electronic component mounting position 16a indicates the mounting position of the chip 6 on the substrate 16, and the position can be detected by image recognition. Further, the first recognition processing unit 55 processes an image picked up by the first camera 34 as described later to inspect the application state of the adhesive 17 applied to the electronic component mounting position 16a, and further, the adhesive 17 The mounting state of the chip 6 mounted thereon is inspected.
[0044]
The second recognition processing unit 56 processes the image captured by the second camera 35 to obtain the position of the chip 6 of the electronic component supply unit 2. The third recognition processing unit 57 processes the image captured by the third camera 15 and obtains the position of the chip 6 held by the mounting head 33.
[0045]
The recognition results obtained by the first recognition processing unit 55, the second recognition processing unit 56, and the third recognition processing unit 57 are sent to the control unit 54. The data storage unit 53 stores various data such as an inspection result of an application state inspection of the adhesive 17 and a mounting state inspection of the chip 6 which will be described later. The operation unit 51 is an input device such as a keyboard or a mouse, and inputs data and control commands. The display unit 52 displays an imaging screen by the first camera 34, the second camera 35, and the third camera 15 and displays a guidance screen at the time of input by the operation unit 51.
[0046]
Next, processing functions of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 5, a broken line frame 54 indicates a processing function by the control unit 54 shown in FIG. Here, the processing functions executed by the first camera movement processing unit 54a, the second camera movement processing unit 54b, and the mounting head movement processing unit 54c are the first camera movement control unit and the second camera movement control unit, respectively. The mounting head movement control means is configured.
[0047]
The first camera movement processing unit 54 a controls the first camera moving mechanism to position the first camera 34 when imaging the substrate 16 held by the substrate holding unit 10, and the mounting head 33. The retraction operation of moving the first camera 34 to a position that does not hinder the mounting of the chip 6 is performed. Here, the imaging of the substrate 16 includes imaging of the electronic component mounting position 16a before the chip 6 is mounted, imaging of the adhesive 17 in the electronic component mounting position 16a before the chip 6 is mounted, and the chip 6 Three types of imaging of the electronic component mounting position 16a after being mounted are performed.
[0048]
The second camera movement processing unit 54 b controls the second camera moving mechanism to position the second camera 35 when the chip 6 of the electronic component supply unit 2 is imaged, and the electronic component by the mounting head 33. The retraction operation of moving the second camera 35 to a position that does not interfere with the pickup is performed.
[0049]
The mounting head movement processing unit 54c has two processing functions of a pickup operation processing unit 54d and a mount operation processing unit 54e. The pick-up operation processing unit 54d controls the mounting head moving mechanism to determine the positioning operation of the mounting head 33 when the chip 6 is picked up from the electronic component supply unit 2 by the second recognition processing unit 56. Let it be done based on location. The mounting operation processing unit 54e controls the mounting head moving mechanism to determine the positioning operation of the mounting head 33 when the chip 6 is mounted on the substrate 16 of the substrate holding unit 10, and the electronic component mounting of the first recognition processing unit 55. This is performed based on the position of the electronic component mounting position 16a obtained by the position detection processing unit 55a and the position of the chip 6 obtained by the third recognition processing unit 57.
[0050]
In addition to the electronic component mounting position detection processing unit 55a, the first recognition processing unit 55 includes an application state inspection processing unit 55b and a mounting state inspection processing unit 55c. In the mounting operation by the mount operation processing unit 54e, the adhesive application inspection result of the chip 6 detected by the application state inspection processing unit 55b is referred to only for the electronic component mounting position where the application state is determined to be acceptable. Mounting of the chip 6 is executed.
[0051]
The inspection result recording processing unit 54f performs processing for storing the above-described adhesive application state inspection result by the application state inspection processing unit 55b and the mounting state inspection result of the chip 6 by the mounting state inspection processing unit 55c. These inspection results are sent to the inspection result recording processing unit 54 f for data processing and stored in the inspection result storage unit 53 a provided in the data storage unit 53.
[0052]
This electronic component mounting apparatus is configured as described above. Hereinafter, an electronic component mounting method will be described with reference to FIGS. In FIG. 6, a large number of chips 6 are adhered to the adhesive sheet 5 of the jig 4 held by the electronic component supply unit 2. In the substrate holding unit 10, the substrate 16 is positioned on each of the first substrate holding mechanism 10A and the second substrate holding mechanism 10B. In the electronic component mounting shown here, a plurality (four in this case) of chips 6 are sequentially sucked and held by the four suction nozzles 33a provided in the mounting head 33, and these four chips 6 are held in one mounting turn. The plurality of electronic component mounting positions 16a of the substrate 16 are sequentially mounted.
[0053]
First, as shown in FIG. 6A, the second camera 35 is moved above the electronic component supply unit 2 by the second camera moving mechanism, and a plurality of (four) chips 6 to be picked up are secondly picked up. The camera 35 takes an image. Thereafter, as shown in FIG. 6B, the second camera 35 is retracted from above the chips 6. Then, the image captured by the second camera 35 is processed by the second recognition processing unit 56 to obtain the positions of the plurality of chips 6.
[0054]
Next, the mounting head 33 is moved above the electronic component supply unit 2. Then, while the mounting head moving mechanism performs a positioning operation for sequentially positioning the mounting heads 33 on these chips 6 based on the obtained positions of the plurality of chips 6, the four suction nozzles 33 a of the mounting head 33 perform a plurality of chips. Pick up 6 sequentially.
[0055]
In parallel with this pickup operation, the first camera 34 is moved onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10 by the first camera moving mechanism. Then, as shown in FIG. 10A, among the eight electronic component mounting positions 16a set on the substrate 16, the first camera so that the image capturing range 18 sequentially surrounds the left four electronic component mounting positions 16a. 34 are sequentially moved to pick up an image by capturing images of the plurality of electronic component mounting positions 16a and the adhesive 17 applied therein, and then the first camera 34 is retracted from above the substrate 16.
[0056]
Then, the image of the image capturing range 18 captured by the first camera 34 is processed by the first recognition processing unit 55 to obtain the position of the electronic component mounting position 16a (see FIG. 10A) of the substrate 16. In recognition of this board | substrate 16, while detecting the position of the electronic component mounting position 16a, the adhesive agent 17 apply | coated in the some electronic component mounting position 16a before chip | tip 6 is mounted is imaged, and each electronic component mounting position is imaged. The application state of the adhesive 17 applied to 16a is inspected. That is, it is determined based on the image whether or not the adhesive 17 is applied at a normal application position with an appropriate application amount.
[0057]
Next, as shown in FIG. 7A, the mounting head 33 holding the four chips on each suction nozzle 33 a performs a scanning operation that moves above the third camera 15. As a result, the image of the chip 6 held by each suction nozzle 33 a is captured by the third camera 15, and the position of the chip 6 is detected by performing recognition processing on this image by the third recognition processing unit 57. .
[0058]
Next, the operation moves to the mounting operation. At this time, the chip 6 is mounted only for the electronic component mounting position 16a in which the application state is determined to be acceptable by the first recognition processing unit 55. The mounting head 33 moves above the substrate holding unit 10 as shown in FIG. Here, the mounting operation is performed based on the position of the electronic component mounting position 16a obtained by the first recognition processing unit 55, the position of the chip 6 obtained by the third recognition processing unit 57, and the determination result by inspection of the application state. .
[0059]
That is, among the plurality of electronic component mounting positions 16a of the substrate 16 positioned on the first substrate holding mechanism 10A, the electronic component mounting position 16a in which the application state is determined to be passed is held by the suction nozzle 33a of the mounting head 33. While causing the mounting head moving mechanism to perform positioning operations for sequentially positioning the chips 6, the chips 6 held by the mounting head 33 are mounted one by one on the adhesive 17 applied in the electronic component mounting position 16a.
[0060]
When the mounting head 33 mounts the chip 6, the second camera 35 is moved above the plurality of chips 6 to be picked up next in the electronic component supply unit 2, and the plurality of chips 6 are moved to the second camera. 35. Then, as shown in FIG. 8A, the second camera 35 is retracted from above the chip 6, and then the mounting head 33 is moved above the electronic component supply unit 2. Then, based on the position of the chip 6 obtained by the second recognition processing unit 56, the four suction nozzles 33 a of the mounting head 33 are performed while the mounting head moving mechanism performs a positioning operation for positioning the mounting head 33 on the chip 6. A plurality of chips 6 are picked up sequentially.
[0061]
Then, during the pickup of the chip 6 in the electronic component supply unit 2, the first camera 34 is moved onto the first substrate holding mechanism 10 </ b> A of the substrate holding unit 10 to image the substrate 16. Here, the inspection of the mounting state of the chip 6 mounted on the substrate 16, the position detection of a plurality of electronic component mounting positions 16a on which the chip 6 is mounted in the next mounting turn, and application to these electronic component mounting positions 16a are performed. The application state of the adhesive 17 is inspected.
[0062]
That is, in this imaging, as shown in FIG. 10C, the first camera 34 is sequentially moved so that the image capturing range 18 sequentially surrounds the eight electronic component mounting positions 16a set on the substrate 16. Then, the first camera 34 is retracted from above the substrate 16. Then, the image captured by the first camera 34 is processed by the first recognition processing unit 55, and the next inspection process is performed.
[0063]
First, for the images in the four image capturing ranges 18 on the left side, an inspection of the mounting state of the chip 6, that is, whether or not the position / posture deviation of the chip 6 and the protruding state of the adhesive 17 are normal is inspected. For the four image capturing ranges 18 on the right side, the position of the electronic component mounting position 16a of the substrate 16 is detected, and the application state of the adhesive 17 applied in the electronic component mounting position 16a before the chip 6 is mounted. Inspection is performed.
[0064]
Next, as shown in FIG. 8B, the mounting head 33 holding the four chips 6 in each suction nozzle 33 a performs a scanning operation that moves above the third camera 15. Thereby, the image of the chip 6 held by each suction nozzle 33a is captured by the third camera, and the position of the chip 6 is detected by processing the image by the third recognition processing unit 57.
[0065]
Thereafter, the mounting head 33 moves above the first substrate holding mechanism 10A of the substrate holding unit 10 as shown in FIG. Next, as in FIG. 7B, the chip 6 held by the mounting head 33 is mounted on the four electronic component mounting positions 16 a that are not mounted on the substrate 16. Thereby, as shown in FIG. 10D, the mounting of the chip 6 on the eight electronic component mounting positions 16a of the substrate 16 is completed. During the mounting operation of the chip 6 by the mounting head 33, the second camera 35 is moved again onto the chip 6 of the electronic component supply unit 2, and the next chip 6 picked up by the second camera 35 is imaged. .
[0066]
When the second camera 35 is retracted from above the chip 6 as shown in FIG. 9B, the mounting head 33 is moved above the electronic component supply unit 2 and the second recognition processing unit 56 is moved. Based on the position of the chip 6 obtained in the above, the chips 6 are sequentially picked up by the four suction nozzles 33a of the mounting head 33.
[0067]
In parallel with this operation, the first camera 34 is moved onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10 by the first camera moving mechanism. Then, among the eight electronic component mounting positions 16 a set on the substrate 16, the first camera 34 is sequentially moved so as to capture the image so that the image capturing range 18 sequentially surrounds the right four electronic component mounting positions 16 a. .
[0068]
Then, the image of the image capturing range 18 captured by the first camera 34 is processed by the first recognition processing unit 55, and the mounting state of the chip 6 at the electronic component mounting position 16a of the substrate 16 is inspected. After this mounting state inspection, the substrate 16 is carried out from the first substrate holding mechanism 10A to the substrate delivery unit 13, and a new substrate 16 is carried into the first substrate holding mechanism 10A.
[0069]
In addition, the first camera 34 that has finished imaging with the first substrate holding mechanism 10A moves onto the non-mounted substrate 16 held by the second substrate holding mechanism 10B, where the chip 6 is mounted next. The planned electronic component mounting position 16a is imaged, and the position detection of the electronic component mounting position 16a and the application state inspection of the adhesive 17 are performed.
[0070]
Thereafter, the same operation is continuously repeated. That is, in the electronic component mounting method, the first camera 34 that captures an image of the substrate 16 and the mounting head 33 that mounts the chip 6 alternately access the substrate holding unit 10, and the electronic component supply unit 2 is accessed. Are alternately accessed by the second camera 35 that picks up the chip 6 and the mounting head 33 that picks up the chip 6. Thereby, it is possible to eliminate the occurrence of a loss time in the mounting operation in which no work is performed in the substrate holding unit 10 and the electronic component supply unit 2.
[0071]
In the electronic component mounting apparatus according to the present embodiment, the first camera 34 captures an image of the substrate of the substrate holding unit 10 using the time during which the mounting head 33 performs the pickup operation, and the first recognition processing unit 55 performs the imaging. Various inspections and detection processes are performed, and the chip 6 of the electronic component supply unit 2 is imaged by the second camera 35 using the time during which the mounting head 33 performs the mounting operation, and the chip 6 of the chip 6 is detected by the second recognition processing unit 56. The position is detected, but the first camera 34 images the substrate of the substrate holding unit 10 using the time during which the mounting head 33 performs the pickup operation and the scanning operation, and the first recognition processing unit 55, various inspections and detection processes are performed, and the second camera 35 takes an image of the chip 6 of the electronic component supply unit 2 using the time during which the mounting head 33 performs the scanning operation and the mounting operation. 56 for chip 6 Position may be detected. In this way, time can be taken for imaging with the first camera 34 and the second camera 35, so that stable operation of the apparatus can be maintained.
[0072]
Further, since the plurality of chips 6 are picked up and mounted in one mounting turn, the total moving distance of each beam member is shortened, resulting in higher working efficiency.
[0073]
In the electronic component mounting apparatus of the present embodiment, the coating state inspection and the mounting state inspection are performed, but one or both of the inspections may be omitted.
[0074]
【The invention's effect】
According to the present invention, at least a mounting head moving mechanism for moving a mounting head for transporting and mounting an electronic component between the electronic component supply unit and the substrate holding unit, and a first camera for imaging the substrate in the substrate holding unit A first camera moving mechanism that moves above the holding unit; and a second camera moving mechanism that moves at least the second camera that images the electronic component of the electronic component supply unit above the electronic component supply unit; Since the mounting head, the first camera, and the second camera are coordinated and moved relative to each other with the electronic component supply unit and the substrate holding unit as the movement target range, the loss time in the electronic component supply unit and the substrate holding unit The work efficiency can be improved by reducing the tact time.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a side sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 3 is a plan sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 4 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 5 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 6 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 7 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 8 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 9 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 10 is a plan view of a substrate to be mounted with an electronic component according to an embodiment of the present invention.
[Explanation of symbols]
2 Electronic parts supply department
3 Jig holder
4 Jig
5 Adhesive sheet
6 chips
8 Ejector
10 Substrate holder
10A First substrate holding mechanism
10B Second substrate holding mechanism
15 Third camera
16 substrates
16a Electronic component mounting position
17 Adhesive
30 Center beam member
31 First beam member
32 Second beam member
33 Mounted head
34 First camera
35 Second camera
55 1st recognition process part
56 Second recognition processing unit
57 Third recognition processing unit

Claims

基板の電子部品搭載位置に電子部品を搭載する電子部品搭載装置であって、電子部品を平面状に複数個並べて供給する電子部品供給部と、前記電子部品供給部から第１方向へ離れた位置に配置された基板保持部と、１個の電子部品を保持するノズルを複数備え、この複数のノズルで前記電子部品供給部の電子部品を複数ピックアップして保持し、保持した複数の電子部品を前記基板保持部に保持された基板の複数の電子部品搭載位置に搭載する搭載ヘッドと、前記基板保持部に保持された基板を撮像する第１のカメラと、前記第１のカメラを少なくとも前記基板保持部の上方で移動させる第１のカメラ移動機構と、前記第１のカメラで撮像した画像を処理して前記基板保持部に保持された基板の複数の電子部品搭載位置の位置を求める第１の認識処理部と、前記電子部品供給部の複数の電子部品を撮像する第２のカメラと、前記第２のカメラを少なくとも前記電子部品供給部の上方で移動させる第２のカメラ移動機構と、前記第２のカメラで撮像した画像を処理して前記電子部品供給部の複数の電子部品の位置を求める第２の認識処理部と、平面視して前記第１のカメラ移動機構と前記第２のカメラ移動機構とに挟まれた位置に配置され、前記搭載ヘッドを前記電子部品供給部と前記基板保持部との間で移動させる搭載ヘッド移動機構と、前記搭載ヘッド移動機構を制御して、（１）前記電子部品供給部から電子部品を複数ピックアップする際の前記搭載ヘッドの位置決め動作を前記第２の認識処理部で求めた複数の電子部品の位置に基づいて行わせ（２）前記基板保持部の基板に複数の電子部品を搭載する際の搭載ヘッドの位置決め動作を前記第１の認識処理部で求めた複数の電子部品搭載位置の位置に基づいて行わせる搭載ヘッド移動制御手段と、前記第１のカメラ移動機構を制御して、（１）前記基板保持部に保持された基板を撮像する際の前記第１のカメラの位置決め動作と（２）前記搭載ヘッドによる電子部品の搭載を妨げない位置に前記第１のカメラを移動する退避動作とを行わせる第１のカメラ移動制御手段と、前記第２のカメラ移動機構を制御して、（１）前記電子部品供給部の複数の電子部品を撮像する際の前記第２のカメラの位置決め動作と（２）前記搭載ヘッドによる電子部品のピックアップを妨げない位置に前記第２のカメラを移動する退避動作とを行わせる第２のカメラ移動制御手段とを備え、前記第１のカメラによる基板の複数の電子部品搭載位置の撮像を前記搭載ヘッドによる複数の電子部品のピックアップと並行して行ない、前記搭載ヘッドが電子部品を基板の複数の電子部品搭載位置に搭載しているときに前記第２のカメラによる複数の電子部品の撮像を行なうことを特徴とする電子部品搭載装置。An electronic component mounting apparatus for mounting an electronic component at an electronic component mounting position on a substrate, the electronic component supplying unit supplying a plurality of electronic components in a plane, and a position away from the electronic component supplying unit in a first direction A plurality of nozzles for holding a single electronic component, a plurality of nozzles for picking up and holding a plurality of electronic components in the electronic component supply unit, and holding the plurality of electronic components A mounting head mounted at a plurality of electronic component mounting positions of the substrate held by the substrate holding unit; a first camera that images the substrate held by the substrate holding unit; and at least the first camera as the substrate A first camera moving mechanism that moves above the holding unit; and a first camera that obtains positions of a plurality of electronic component mounting positions on the substrate held by the substrate holding unit by processing an image captured by the first camera. of An image processing unit, a second camera that images a plurality of electronic components of the electronic component supply unit, a second camera moving mechanism that moves the second camera at least above the electronic component supply unit, A second recognition processing unit that processes an image captured by a second camera to obtain positions of a plurality of electronic components of the electronic component supply unit; and the first camera moving mechanism and the second in a plan view A mounting head moving mechanism that is disposed between the camera moving mechanism and moves the mounting head between the electronic component supply unit and the substrate holding unit; and controls the mounting head moving mechanism, 1) The positioning operation of the mounting head when picking up a plurality of electronic components from the electronic component supply unit is performed based on the positions of the plurality of electronic components obtained by the second recognition processing unit. (2) Holding the substrate On the board Mounting head movement control means for performing positioning operation of the mounting head when mounting a plurality of electronic components based on the positions of a plurality of electronic component mounting positions obtained by the first recognition processing unit, and the first camera The moving mechanism is controlled so that (1) the positioning operation of the first camera when imaging the substrate held by the substrate holding portion, and (2) the position where the mounting of the electronic component by the mounting head is not hindered. (1) imaging a plurality of electronic components of the electronic component supply unit by controlling a first camera movement control means for performing a retreat operation for moving the first camera and the second camera movement mechanism. And (2) second camera movement control means for performing a retreating operation for moving the second camera to a position that does not interfere with the pickup of the electronic component by the mounting head. Prepared, Imaging of a plurality of electronic component mounting positions on the substrate by the first camera is performed in parallel with pickup of the plurality of electronic components by the mounting head, and the mounting head mounts the electronic components on the plurality of electronic component mounting positions on the substrate. An electronic component mounting apparatus, wherein a plurality of electronic components are imaged by the second camera when the second camera is in operation.

前記搭載ヘッド移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記搭載ヘッドを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えたセンタービーム部材と、前記センタービーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記搭載ヘッドを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有することを特徴とする請求項１記載の電子部品搭載装置。The mounting head moving mechanism includes a pair of first direction guides arranged to be parallel to the first direction and sandwiching the electronic component supply unit and the substrate holding unit, and both ends supported by the first direction guide; A center beam member provided with a second direction guide for guiding the mounting head in a second direction orthogonal to the first direction, and a first direction drive mechanism for moving the center beam member along the first direction guide; The electronic component mounting apparatus according to claim 1, further comprising: a second direction driving mechanism that moves the mounting head along the second direction guide.

前記第１のカメラ移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記第１のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第１ビーム部材と、前記第１ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第１のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有することを特徴とする請求項１記載の電子部品搭載装置。The first camera moving mechanism includes a pair of first direction guides arranged so as to be parallel to the first direction and sandwiching the electronic component supply unit and the substrate holding unit, and both ends supported by the first direction guide. And a first beam member having a second direction guide for guiding the first camera in a second direction orthogonal to the first direction, and moving the first beam member along the first direction guide. The electronic component mounting apparatus according to claim 1, further comprising: a first direction driving mechanism; and a second direction driving mechanism that moves the first camera along the second direction guide.

前記第２のカメラ移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記第２のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第２ビーム部材と、前記第２ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第２のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有することを特徴とする請求項１記載の電子部品搭載装置。The second camera moving mechanism includes a pair of first direction guides arranged to be parallel to the first direction and sandwiching the electronic component supply unit and the substrate holding unit, and both ends supported by the first direction guide And a second beam member having a second direction guide for guiding the second camera in a second direction orthogonal to the first direction, and moving the second beam member along the first direction guide. 2. The electronic component mounting apparatus according to claim 1, further comprising: a first direction driving mechanism; and a second direction driving mechanism that moves the second camera along the second direction guide.

前記搭載ヘッド移動機構は、前記第１方向に平行且つ前記電子部品供給部及び前記基板保持部を挟むように配置された一対の第１方向ガイドと、前記第１方向ガイドに両端を支持され且つ前記搭載ヘッドを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えたセンタービーム部材と、前記センタービーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記搭載ヘッドを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有し、前記第１のカメラ移動機構は、前記第１方向ガイドに両端を支持され且つ前記第１のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第１ビーム部材と、前記第１ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第１のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有し、前記第２のカメラ移動機構は、前記第１方向ガイド部材に両端を支持され且つ前記第２のカメラを前記第１方向に直交する第２方向に案内する第２方向ガイドを備えた第２ビーム部材と、前記第２ビーム部材を前記第１方向ガイドに沿って移動させる第１方向駆動機構と、前記第２のカメラを前記第２方向ガイドに沿って移動させる第２方向駆動機構とを有し、前記センタービーム部材は前記第１ビーム部材と前記第２ビーム部材の間に位置することを特徴とする請求項１記載の電子部品搭載装置。The mounting head moving mechanism includes a pair of first direction guides arranged to be parallel to the first direction and sandwiching the electronic component supply unit and the substrate holding unit, and both ends supported by the first direction guide; A center beam member provided with a second direction guide for guiding the mounting head in a second direction orthogonal to the first direction, and a first direction drive mechanism for moving the center beam member along the first direction guide; And a second direction driving mechanism for moving the mounting head along the second direction guide, the first camera moving mechanism being supported at both ends by the first direction guide and the first camera. A first beam member provided with a second direction guide for guiding the first beam member in a second direction orthogonal to the first direction, a first direction drive mechanism for moving the first beam member along the first direction guide, A second direction drive mechanism for moving the first camera along the second direction guide, the second camera movement mechanism being supported at both ends by the first direction guide member and the second direction. A second beam member having a second direction guide for guiding the camera in a second direction orthogonal to the first direction, and a first direction drive mechanism for moving the second beam member along the first direction guide And a second direction drive mechanism for moving the second camera along the second direction guide, and the center beam member is located between the first beam member and the second beam member. The electronic component mounting apparatus according to claim 1.

前記電子部品供給部と前記基板保持部の間に、前記搭載ヘッドに保持された複数の電子部品を撮像する第３のカメラと、前記第３のカメラで撮像した画像を処理して前記搭載ヘッドに保持された複数の電子部品の位置を求める第３の認識処理部を備え、前記搭載ヘッド移動制御手段は、前記搭載ヘッド移動機構を制御して、（１）前記電子部品供給部から複数の電子部品をピックアップする際の前記搭載ヘッドの位置決め動作を前記第２の認識処理部で求めた複数の電子部品の位置に基づいて行わせ（２）前記基板保持部の基板に複数の電子部品を搭載する際の前記搭載ヘッドの位置決め動作を前記第１の認識処理部で求めた複数の電子部品搭載位置の位置と前記第３の認識処理部で求めた複数の電子部品の位置に基づいて行わせることを特徴とする請求項１記載の電子部品搭載装置。A third camera for imaging a plurality of electronic components held by the mounting head between the electronic component supply unit and the substrate holding unit, and an image captured by the third camera for processing the mounting head A third recognition processing unit for obtaining the positions of the plurality of electronic components held by the mounting head movement control means, wherein the mounting head movement control means controls the mounting head moving mechanism to: (1) a plurality of electronic component supply units from the electronic component supply unit; The positioning operation of the mounting head when picking up the electronic component is performed based on the positions of the plurality of electronic components obtained by the second recognition processing unit. (2) The plurality of electronic components are placed on the substrate of the substrate holding unit. The positioning operation of the mounting head during mounting is performed based on the positions of the plurality of electronic component mounting positions obtained by the first recognition processing unit and the positions of the plurality of electronic components obtained by the third recognition processing unit. Specially The electronic component mounting apparatus of claim 1 wherein.

前記基板保持部が基板を保持する基板保持機構を複数備えていることを特徴とする請求項１記載の電子部品搭載装置。The electronic component mounting apparatus according to claim 1, wherein the substrate holding unit includes a plurality of substrate holding mechanisms for holding the substrate.

基板を電子部品搭載装置に搬入する基板搬入コンベアと、電子部品搭載装置から電子部品が搭載された基板を搬出する基板搬出コンベアと、基板を前記基板搬入コンベアから受け取って前記複数の基板保持機構に一枚ずつ振り分けて搬送する基板振分部と、電子部品が搭載された基板を前記複数の基板保持機構から受け取って前記基板搬出コンベアに受け渡す基板受渡部を備えたことを特徴とする請求項７記載の電子部品搭載装置。A substrate carry-in conveyor for carrying a substrate into the electronic component mounting device, a substrate carry-out conveyor for carrying out a substrate loaded with electronic components from the electronic component loading device, and a substrate received from the substrate carry-in conveyor to the plurality of substrate holding mechanisms The board distribution part which sorts and conveys one sheet at a time, and the board delivery part which receives the board in which electronic parts were loaded from the plurality of board holding mechanisms, and delivers it to the board carry-out conveyor. 7. The electronic component mounting apparatus according to 7.

前記電子部品供給部が、複数の電子部品を貼り付けた粘着シートを有する治具を着脱自在に保持する治具保持部を備えていることを特徴とする請求項１記載の電子部品搭載装置。The electronic component mounting apparatus according to claim 1, wherein the electronic component supply unit includes a jig holding unit that detachably holds a jig having an adhesive sheet on which a plurality of electronic components are attached.

前記粘着シートの下方に、前記搭載ヘッドによってピックアップされる電子部品を前記粘着シートから剥離する粘着シート剥離機構を備えていることを特徴とする請求項９記載の電子部品搭載装置。The electronic component mounting apparatus according to claim 9, further comprising an adhesive sheet peeling mechanism that peels an electronic component picked up by the mounting head from the adhesive sheet below the adhesive sheet.

１個の電子部品を保持するノズルを複数備え、この複数のノズルで電子部品供給部の複数の電子部品をピックアップして保持し、保持した複数の電子部品を基板保持部に保持された基板の複数の電子部品搭載位置に搭載する搭載ヘッドと、前記基板保持部に保持された基板を撮像する第１のカメラと、前記第１のカメラを少なくとも前記基板保持部の上方で移動させる第１のカメラ移動機構と、前記第１のカメラで撮像した画像を処理して前記複数の電子部品搭載位置の位置を求める第１の認識処理部と、前記電子部品供給部の複数の電子部品を撮像する第２のカメラと、前記第２のカメラを少なくとも前記電子部品供給部の上方で移動させる第２のカメラ移動機構と、前記第２のカメラで撮像した画像を処理して前記複数の電子部品の位置を求める第２の認識処理部と、平面視して前記第１のカメラ移動機構と前記第２のカメラ移動機構とに挟まれた位置に配置され、前記搭載ヘッドを前記電子部品供給部と前記基板保持部との間で移動させる搭載ヘッド移動機構とを備えた電子部品搭載装置による電子部品搭載方法であって、前記第２のカメラ移動機構により前記第２のカメラを前記電子部品供給部に移動させて複数の電子部品を撮像し、その後第２のカメラをこの複数の電子部品の上方から退避させるステップと、前記第２のカメラで撮像した画像を前記第２の認識処理部で処理して前記複数の電子部品の位置を求めるステップと、前記第２の認識処理部で求めた複数の電子部品の位置に基づいて前記搭載ヘッドをこの複数の電子部品に順次位置決めする位置決め動作を前記搭載ヘッド移動機構に行わせながら前記搭載ヘッドの複数のノズルで複数の電子部品を順次ピックアップするステップと、前記第１のカメラ移動機構により前記第１のカメラを前記基板保持部に保持された基板上に移動させてこの基板を撮像し、その後第１のカメラをこの基板の上方から退避させるステップと、前記第１のカメラで撮像した画像を前記第１の認識処理部で処理して前記基板の複数の電子部品搭載位置の位置を求めるステップと、前記第１の認識処理部で求めた複数の電子部品搭載位置の位置に基づいて前記搭載ヘッドをこの複数の電子部品搭載位置に順次位置決めする位置決め動作を前記搭載ヘッド移動機構に行わせながら前記搭載ヘッドの複数のノズルに保持されている複数の電子部品をこの複数の電子部品搭載位置に順次搭載するステップを含み、前記複数の電子部品のピックアップと並行して前記第１のカメラによる基板の複数の電子部品搭載位置を撮像し、前記搭載ヘッドの複数のノズルに保持された複数の電子部品の搭載中に前記第２のカメラを再び電子部品供給部の上方に移動させて前記第２のカメラによって次にピックアップされる複数の電子部品を撮像することを特徴とする電子部品搭載方法。A plurality of nozzles for holding one electronic component are provided, and the plurality of nozzles pick up and hold a plurality of electronic components in the electronic component supply unit, and the plurality of held electronic components are held on the substrate holding unit. a mounting head for mounting a plurality of electronic component mounting position, the moving the a first camera that captures a substrate held on a substrate holding unit, the first camera above the at least before Kimoto plate holder A first camera moving mechanism, a first recognition processing unit that obtains positions of the plurality of electronic component mounting positions by processing an image captured by the first camera, and a plurality of electronic components of the electronic component supply unit. A second camera that captures an image; a second camera moving mechanism that moves the second camera at least above the electronic component supply unit; and an image captured by the second camera to process the plurality of electronic devices Part location A second recognition processing unit to be obtained; and the second recognition processing unit to be sandwiched between the first camera moving mechanism and the second camera moving mechanism in plan view, and the mounting head is disposed between the electronic component supply unit and the substrate. An electronic component mounting method using an electronic component mounting apparatus including a mounting head moving mechanism that moves between a holding unit and the second camera moving mechanism to move the second camera to the electronic component supply unit. Imaging a plurality of electronic components, and then retracting the second camera from above the plurality of electronic components, and processing the image captured by the second camera with the second recognition processing unit. Determining the positions of the plurality of electronic components; and positioning operation for sequentially positioning the mounting head on the plurality of electronic components based on the positions of the plurality of electronic components determined by the second recognition processing unit. A step of sequentially picking up a plurality of electronic components with a plurality of nozzles of the mounting head while causing the mounting head moving mechanism to perform; and a substrate in which the first camera is held by the substrate holding unit by the first camera moving mechanism Moving up and imaging the substrate, and then retracting the first camera from above the substrate; and processing the image captured by the first camera by the first recognition processing unit and the substrate Determining the positions of the plurality of electronic component mounting positions, and sequentially positioning the mounting heads at the plurality of electronic component mounting positions based on the positions of the plurality of electronic component mounting positions determined by the first recognition processing unit. The plurality of electronic components held by the plurality of nozzles of the mounting head are sequentially moved to the plurality of electronic component mounting positions while causing the mounting head moving mechanism to perform positioning operation. A plurality of electronic components which are mounted on the plurality of nozzles of the mounting head, and include a step of mounting, imaging a plurality of electronic component mounting positions of the substrate by the first camera in parallel with pickup of the plurality of electronic components; A method of mounting an electronic component, wherein the second camera is moved again above the electronic component supply unit while the electronic component is mounted, and a plurality of electronic components picked up next by the second camera are imaged.