JP4370993B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4370993B2 JP4370993B2 JP2004216533A JP2004216533A JP4370993B2 JP 4370993 B2 JP4370993 B2 JP 4370993B2 JP 2004216533 A JP2004216533 A JP 2004216533A JP 2004216533 A JP2004216533 A JP 2004216533A JP 4370993 B2 JP4370993 B2 JP 4370993B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Semiconductor Integrated Circuits (AREA)
Description
まず、特許文献2記載の従来の半導体装置120では、図12に示すように、ノイズ除去用の容量素子124が半導体チップ122の外周領域の配線基板121a上に実装されているので、パッケージとなる封止樹脂125のサイズが容量素子124を封止する分だけ大きくなって、結果的に半導体装置120のサイズが大きくなるため、前述したようなBGA方式の樹脂封止型半導体装置の特徴である小型化に適した利点が生かせなくなる。
この例の半導体装置10は、図1及び図2に示すように、複数の内部接続用端子1が形成された半導体チップ搭載用基板2の上面に、各内部接続用端子1に対応する複数の電極パッド3が形成された半導体チップ4が搭載され、各内部接続用端子1と対応する各電極パッド3との間はそれぞれ複数のボンディングワイヤ5により接続されている。各内部接続用端子1は、搭載用基板2に形成された内部配線(図示せず)により、搭載用基板2の下面に形成された対応する複数の外部接続用ボール電極(外部接続用電極)6にそれぞれ接続されている。
まず、図6(a)に示すように、複数の内部接続用端子1及びこの周囲に枠状のグランド用配線層7が形成された半導体チップ搭載用基板2を用意する。搭載用基板2には、後述するように、搭載用基板2の下面に複数の外部接続用ボール電極(外部接続用電極)6が形成されたときに、各内部接続用端子1が対応する複数の外部接続用ボール電極6にそれぞれ接続されるように内部配線(図示せず)が形成されている。
次に、搭載用基板2の下面に外部接続用ボール電極6を設けた後、半導体チップ4、容量チップ11及び各ボンディングワイヤ5、13等を含む搭載用基板2の上面にパッケージとなる封止樹脂21を形成することにより、図1及び図2に示したような半導体装置10を完成させる。
したがって、パッケージの小型化を生かしたままで、配線インダクタンスの影響を受けることなく容量素子のノイズ除去能力の低下を防止することができる。
この例の半導体装置22は、図7及び図8に示すように、実施例1における容量チップ11を第1の容量チップとして用いて半導体チップ4の下部に積層するとともに、第2の容量チップとして新たな容量チップ23を用いて、半導体チップ4の上部に積層している。
これ以外は、上述した実施例1の構成と略同様であるので、図7において、図1の構成部分と対応する各部には同一の番号を付してその説明を省略する。
1G グランド用端子
2 半導体チップ搭載用基板
3 電極パッド
3G グランド用パッド
4 半導体チップ
5、13、26 ボンディングワイヤ
5G、13G、26G グランド用ワイヤ
6 外部接続用ボール電極(外部接続用電極)
7 グランド用配線層
8 内部配線
9、24 スペーサ
10、22 半導体装置
11、23 容量チップ
12、25 外部接続用パッド
12G グランド用パッド
14 支持板
15 下部電極
16 誘電体層
17 上部電極
18 内部配線
19 スルーホール配線
20 絶縁性保護膜
21 封止樹脂
Claims (6)
- 絶縁基板の上面に複数の電極が形成された半導体チップが搭載されるとともに、前記絶縁基板の下面に前記複数の電極と対応するもの同士が電気的に接続された複数の外部接続用電極が形成されて成る半導体装置であって、
前記半導体チップに、該半導体チップの前記複数の電極と対応する複数の電極がそれぞれ形成された複数の容量チップが積層され、前記半導体チップと前記複数の容量チップとの対応する電極同士が、前記絶縁基板に形成された複数の内部接続用端子を介して電気的に接続されていることを特徴とする半導体装置。 - 絶縁基板の上面に複数の電極が形成された半導体チップが搭載されるとともに、前記絶縁基板の下面に前記複数の電極と対応するもの同士が電気的に接続された複数の外部接続用電極が形成されて成る半導体装置であって、
前記半導体チップに、該半導体チップの前記複数の電極と対応する複数の電極が一方の面に、共通電極が他方の面に形成された容量チップが積層され、前記半導体チップと前記容量チップとの対応する電極同士が、前記絶縁基板に形成された複数の内部接続用端子を介して電気的に接続されていると共に、
前記絶縁基板の前記複数の内部接続用端子のうちの少なくとも一つ、前記半導体チップの前記複数の電極のうちの少なくとも一つ、及び前記容量チップの前記複数の電極のうちの少なくとも一つがグランド用端子として、前記共通電極に電気的に接続されていることを特徴とする半導体装置。 - 前記半導体チップと前記容量チップとの対応する電極同士が、それぞれボンディングワイヤを介して前記内部接続用端子に電気的に接続されていることを特徴とする請求項1又は2記載の半導体装置。
- 前記容量チップに複数の容量素子が形成されていて、前記前記容量チップの一方の面に、前記容量素子の一方の電極が互いに分離する態様で複数個形成されていて、前記各容量素子の他方の電極が、前記容量チップの前記共通電極として形成されていることを特徴とする請求項2記載の半導体装置。
- 前記容量素子の前記複数の一方の電極と、前記容量チップの前記複数の電極との対応する電極同士が、それぞれ電気的に接続されていることを特徴とする請求項4記載の半導体装置。
- 前記絶縁基板の前記内部接続用端子の周囲にグランド用配線層が形成され、該グランド用配線層が前記共通電極に電気的に接続されていることを特徴とする請求項2又は4記載の半導体装置。
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JP2004216533A JP4370993B2 (ja) | 2004-07-23 | 2004-07-23 | 半導体装置 |
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JP2004216533A JP4370993B2 (ja) | 2004-07-23 | 2004-07-23 | 半導体装置 |
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JP2006041061A JP2006041061A (ja) | 2006-02-09 |
JP4370993B2 true JP4370993B2 (ja) | 2009-11-25 |
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JP2004216533A Expired - Fee Related JP4370993B2 (ja) | 2004-07-23 | 2004-07-23 | 半導体装置 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4714049B2 (ja) * | 2006-03-15 | 2011-06-29 | Okiセミコンダクタ株式会社 | 半導体装置及び半導体装置の製造方法 |
KR100828499B1 (ko) | 2006-11-15 | 2008-05-13 | 한국과학기술원 | 와이어 본딩 인덕턴스를 감소시키는 반도체 칩 패키지 |
JP5536707B2 (ja) * | 2011-04-04 | 2014-07-02 | 日本電信電話株式会社 | 半導体装置およびその製造方法 |
CN114664771A (zh) * | 2022-02-14 | 2022-06-24 | 致瞻科技(上海)有限公司 | 新型半导体电容封装结构及其封装方法 |
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