JP4352463B2 - Work chamfering machine - Google Patents

Work chamfering machine Download PDF

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JP4352463B2
JP4352463B2 JP2005017390A JP2005017390A JP4352463B2 JP 4352463 B2 JP4352463 B2 JP 4352463B2 JP 2005017390 A JP2005017390 A JP 2005017390A JP 2005017390 A JP2005017390 A JP 2005017390A JP 4352463 B2 JP4352463 B2 JP 4352463B2
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workpiece
chamfering
peripheral edge
outer peripheral
grindstone
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JP2006205276A (en
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孝雄 飯濱
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TAIYO.CO.,LTD
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Description

本発明は、液晶パネルなどの基板等の平板状ワークの外周縁部を面取り加工するワークの面取り加工装置に関するものである。   The present invention relates to a workpiece chamfering apparatus for chamfering an outer peripheral edge portion of a flat workpiece such as a substrate such as a liquid crystal panel.

従来、液晶パネルなどの基板等の平板状ワークの外周縁部を面取り加工するワークの面取り加工方法、あるいはワークの面取り加工装置として、特開平１０−１１８９０７号公報、特許第３４７００５７号公報、特開２００１−１３８１９５号公報、特開２００３−１８１７５１号公報などに記載されたものがあり、それらの主要部の概略構成は、図４に図示したものである。   Conventionally, as a work chamfering method or a work chamfering processing apparatus for chamfering the outer peripheral edge of a flat work such as a substrate such as a liquid crystal panel, Japanese Patent Application Laid-Open No. 10-118907, Japanese Patent No. 3470057, and There are what was described in 2001-138195 gazette, Unexamined-Japanese-Patent No. 2003-181751, etc., and the schematic structure of those principal parts is what was illustrated in FIG.

そして、ワーク１の面取り加工を行う際、ワーク１を載置台４に載置して、ワーク１を吸引方式などにより支持している。   When the chamfering process is performed on the workpiece 1, the workpiece 1 is mounted on the mounting table 4, and the workpiece 1 is supported by a suction method or the like.

しかしながら、従来のワーク１を載置台４に載置して、ワーク１を吸引方式などにより支持する方法では、ワーク１の外周縁部１１の平坦度が悪く、外周縁部１１を面取り加工した際の面取り加工精度も悪い状態であり、所望の面取り加工寸法に面取り加工することが難しい状況であった。   However, in the method of placing the conventional workpiece 1 on the mounting table 4 and supporting the workpiece 1 by a suction method or the like, the flatness of the outer peripheral edge 11 of the work 1 is poor, and the outer peripheral edge 11 is chamfered. The chamfering accuracy was also poor, and it was difficult to chamfer to the desired chamfering dimensions.

この問題を解決するために、従来、例えば、特開２００１−１３８１９５号公報に開示されているような、ワーク１を垂直に保持した状態でワーク１の外周縁部１１を面取り加工するような方法も提案されているが、この場合においても所望の面取り加工精度を達成することが難しいと共に、加工方法が複雑になり実用的ではない。
特開平１０−１１８９０７号公報 特許第３４７００５７号公報 特開２００１−１３８１９５号公報 特開２００３−１８１７５１号公報 In order to solve this problem, conventionally, for example, a method of chamfering the outer peripheral edge portion 11 of the workpiece 1 with the workpiece 1 held vertically as disclosed in Japanese Patent Laid-Open No. 2001-138195. However, even in this case, it is difficult to achieve a desired chamfering accuracy, and the processing method becomes complicated, which is not practical.
JP-A-10-118907 Japanese Patent No. 3470057 JP 2001-138195 A JP 2003-181751 A

解決しようとする問題点は、ワークの外周縁部の平坦度が悪く、外周縁部を面取り加工した際の面取り加工精度も悪い状態であり、所望の面取り加工寸法に面取り加工することが難しいという点である。   The problem to be solved is that the flatness of the outer peripheral edge of the work is poor, the chamfering accuracy when the outer peripheral edge is chamfered is also poor, and it is difficult to chamfer to the desired chamfering dimensions. Is a point.

本発明は、液晶パネルなどの基板等の平板状ワークの外周縁部を面取り加工するワークの面取りし、左側の砥石を前記ワークの左側外周縁部の上面側に当接し、右側の砥石を前記ワークの右側外周縁部の下面側に当接して面取りし、次に、前記左側の砥石を前記ワークの左側外周縁部の下面側に当接し、前記右側の砥石をワークの右側外周縁部の上面側に当接して面取り加工を行う加工装置であって、前記ワークを載置する載置台は前後方向に移動可能に構成すると共に水平方向に回転可能に構成し、前記載置台に載置された前記ワークの外周縁部に砥石を当接して前記ワークの外周縁部を面取り加工できるように構成し、前記砥石を前記ワークの外周縁部に当接して面取り加工を行う際、前記砥石が当接する前記ワークの上面および下面の近傍に押圧部材を当接できるように構成し、前記押圧部材をワークの移動に伴い回転自在のローラ構造を有する構成にしたことを特徴とするワークの面取り加工装置ものである。 The present invention chamfers a workpiece for chamfering the outer peripheral edge of a flat workpiece such as a substrate such as a liquid crystal panel , the left grindstone is brought into contact with the upper surface side of the left outer peripheral edge of the workpiece, and the right grindstone is Chamfering by contacting the lower surface side of the right outer peripheral edge of the workpiece, and then contacting the left grindstone to the lower surface side of the left outer peripheral edge of the workpiece, A processing apparatus that performs chamfering by contacting the upper surface side, and the mounting table on which the workpiece is mounted is configured to be movable in the front-rear direction and configured to be rotatable in the horizontal direction, and is mounted on the mounting table. Further, the grindstone is brought into contact with the outer peripheral edge of the workpiece so that the outer peripheral edge of the workpiece can be chamfered, and when the grindstone is brought into contact with the outer peripheral edge of the workpiece to perform chamfering, Of the upper and lower surfaces of the workpiece in contact A pressing member near configured to be contact, those chamfering device of a work, characterized in that a configuration having a rotatable roller structure with the pressing member to move the workpiece.

本発明は、ワークの外周縁部を面取り加工する際、ワークの外周縁部の平坦度を良好に維持することができ、安定した状態で面取り加工を行うことができ、ワークの外周縁部を面取り加工した際の面取り加工精度を良好にすることができ、従って、所望の面取り加工寸法に面取り加工することができる。   In the present invention, when chamfering the outer peripheral edge of the workpiece, the flatness of the outer peripheral edge of the workpiece can be maintained well, the chamfering can be performed in a stable state, and the outer peripheral edge of the workpiece is The chamfering accuracy when chamfering can be improved, and therefore the chamfering can be performed to a desired chamfering dimension.

本発明のワークの面取り加工装置は、液晶パネルなどの基板等の平板状ワークの外周縁部を面取り加工するワークの面取り加工装置であって、前記ワークを載置する載置台は前後方向に移動可能に構成すると共に水平方向に回転可能に構成し、前記載置台に載置された前記ワークの外周縁部に砥石を当接して前記ワークの外周縁部を面取り加工できるように構成し、前記砥石を前記ワークの外周縁部に当接して面取り加工を行う際、前記砥石が当接する前記ワークの上面および下面の近傍に押圧部材を当接できるように構成したようにしたものである。このように構成することにより、ワークの外周縁部を面取り加工する際、ワークの外周縁部の平坦度を良好に維持することができ、安定した状態で面取り加工を行うことができ、ワークの外周縁部を面取り加工した際の面取り加工精度を良好にすることができ、従って、所望の面取り加工寸法に面取り加工することができる。   The workpiece chamfering device of the present invention is a workpiece chamfering device that chamfers the outer peripheral edge of a flat plate workpiece such as a substrate such as a liquid crystal panel, and the mounting table on which the workpiece is placed moves in the front-rear direction. It is configured to be possible and configured to be rotatable in the horizontal direction, and configured to be able to chamfer the outer peripheral edge of the work by contacting a grindstone with the outer peripheral edge of the work placed on the mounting table, When chamfering is performed by bringing a grindstone into contact with the outer peripheral edge of the workpiece, the pressing member can be brought into contact with the vicinity of the upper surface and the lower surface of the workpiece with which the grindstone abuts. By configuring in this way, when chamfering the outer peripheral edge of the workpiece, the flatness of the outer peripheral edge of the workpiece can be maintained well, and the chamfering can be performed in a stable state. The chamfering accuracy when chamfering the outer peripheral edge can be improved, and therefore, the chamfering can be performed to a desired chamfering dimension.

図１は、本発明の一実施例の主要部概要構成を示す正面図である。   FIG. 1 is a front view showing a schematic configuration of main parts of one embodiment of the present invention.

図２は、本発明の一実施例の主要部概要構成を示す上面図である。   FIG. 2 is a top view showing a schematic configuration of the main part of one embodiment of the present invention.

図３は、本発明の一実施例の主要部概要構成を示す左側面図である。   FIG. 3 is a left side view showing the schematic configuration of the main part of one embodiment of the present invention.

本発明のワークの面取り加工装置は、液晶パネルなどの基板等の平板状ワーク１の外周縁部１１を面取り加工するワークの面取り加工装置であって、ワーク１を載置する載置台４は前後方向に移動可能に構成すると共に水平方向に回転可能に構成し、載置台４に載置されたワーク１の外周縁部１１に砥石２を当接してワーク１の外周縁部１１を面取り加工できるように構成し、砥石２をワーク１の外周縁部１１に当接して面取り加工を行う際、砥石２が当接するワーク１の上面１２および下面１３の近傍に押圧部材３を当接できるように構成したものである。   The workpiece chamfering apparatus of the present invention is a workpiece chamfering apparatus for chamfering the outer peripheral edge portion 11 of a flat workpiece 1 such as a substrate such as a liquid crystal panel, and the mounting table 4 on which the workpiece 1 is placed is front and rear. The outer peripheral edge 11 of the workpiece 1 can be chamfered by contacting the grindstone 2 with the outer peripheral edge 11 of the work 1 placed on the mounting table 4. When the chamfering process is performed by bringing the grindstone 2 into contact with the outer peripheral edge portion 11 of the work 1 so that the pressing member 3 can be brought into contact with the vicinity of the upper surface 12 and the lower surface 13 of the work 1 with which the grindstone 2 comes into contact. It is composed.

また、このワークの面取り加工装置において、押圧部材３は、ワーク１の移動に伴い回転自在のローラ構造を有する構成にしたものである。   In this workpiece chamfering apparatus, the pressing member 3 has a roller structure that is rotatable with the movement of the workpiece 1.

ワーク１を載置台４に載置し、ワーク１の外周縁部１１を面取り加工するワークの面取り加工装置について、以下に、より具体的に説明する。   A workpiece chamfering apparatus that places the workpiece 1 on the mounting table 4 and chamfers the outer peripheral edge 11 of the workpiece 1 will be described in more detail below.

ワークの面取り加工装置は、ワーク１を載置台４に搬入して位置決め固定を行う搬入工程と、載置台４に固定されたワーク１の位置寸法を測定してワーク１の外周縁部１１を面取り加工する加工条件を設定する測定工程と、ワーク１の外周縁部１１を面取り加工する加工工程と、外周縁部１１を面取り加工したワーク１を搬出する搬出工程とを有している。   The workpiece chamfering processing apparatus carries in the workpiece 1 to the mounting table 4 to perform positioning and fixing, and measures the position dimension of the workpiece 1 fixed to the mounting table 4 to chamfer the outer peripheral edge 11 of the workpiece 1. It has a measurement process for setting processing conditions for processing, a processing process for chamfering the outer peripheral edge 11 of the work 1, and an unloading process for unloading the work 1 with the outer peripheral edge 11 chamfered.

そして、搬入工程で載置台４に位置決め固定されたワーク１を、載置台４と共に測定工程に移動させ、その後、載置台４を加工工程に移動させワーク１の外周縁部１１を面取り加工した後、ワーク１を載置した載置台４を搬出工程に移動させるように構成しており、搬入工程、測定工程、加工工程、搬出工程とは、載置台４が移動できるように、例えば、載置台４の下面に載置台４を移動させるためのレールなどを設け、このレールに沿って載置台４が移動できるように構成している。   After the workpiece 1 positioned and fixed on the mounting table 4 in the carry-in process is moved to the measurement process together with the mounting table 4, and then the mounting table 4 is moved to the machining process and the outer peripheral edge 11 of the workpiece 1 is chamfered. The loading table 4 on which the workpiece 1 is loaded is moved to the carry-out process, and the loading process, the measurement process, the processing process, and the carry-out process are performed, for example, so that the loading table 4 can move. A rail or the like for moving the mounting table 4 is provided on the lower surface of 4, and the mounting table 4 can be moved along the rail.

搬入工程で、ワーク１を載置台４に位置決め固定する場合には、ワーク１を吸引方式などにより載置台４に位置決め固定する。   When the work 1 is positioned and fixed on the mounting table 4 in the carrying-in process, the work 1 is positioned and fixed on the mounting table 4 by a suction method or the like.

測定工程では、載置台４に載置されたワーク１の外形寸法を測定し、所望の面取り加工寸法にワーク１の外周縁部１１を面取り加工できるように、載置台４に固定されたワーク１の位置寸法を測定してワーク１の外周縁部１１を面取り加工する加工条件を設定する。   In the measurement process, the outer dimensions of the workpiece 1 placed on the placement table 4 are measured, and the workpiece 1 fixed to the placement table 4 so that the outer peripheral edge 11 of the workpiece 1 can be chamfered to a desired chamfering dimension. The processing conditions for chamfering the outer peripheral edge portion 11 of the workpiece 1 are set by measuring the position dimension of the workpiece 1.

加工工程では、載置台４に載置されたワーク１の外周縁部１１に砥石２を当接してワーク１の外周縁部１１を面取り加工できるように構成し、砥石２をワーク１の外周縁部１１に当接して面取り加工を行う際、砥石２が当接するワーク１の上面１２および下面１３の近傍に押圧部材３を当接できるように構成している。押圧部材３は、ワーク１の移動に伴い回転自在のローラ構造を有する構成にしたものである。また、押圧部材３は、砥石２が当接するワーク１の上面１１および下面１３の砥石２の当接部分近傍に、個数および位置を適宜設定することができる。   In the processing step, the grindstone 2 is brought into contact with the outer peripheral edge 11 of the work 1 placed on the mounting table 4 so that the outer peripheral edge 11 of the work 1 can be chamfered. When chamfering is performed by contacting the part 11, the pressing member 3 can be contacted in the vicinity of the upper surface 12 and the lower surface 13 of the work 1 with which the grindstone 2 contacts. The pressing member 3 is configured to have a roller structure that can rotate as the work 1 moves. Further, the number and position of the pressing members 3 can be appropriately set in the vicinity of the contact portions of the upper surface 11 and the lower surface 13 of the work 1 with which the grindstone 2 comes into contact.

ワーク１の外周縁部１１を面取り加工する場合の一例としては、まず、ワーク１の両側面の外周縁部１１に砥石２を当接して、具体的には、図１に図示したように、左側の砥石２をワーク１の左側外周縁部１１の上面１２側に当接し、右側の砥石２をワーク１の右側外周縁部１１の下面１３側に当接して各々面取り加工を行い、次に、左側の砥石２をワーク１の左側外周縁部１１の下面１３側に当接し、右側の砥石２をワーク１の右側外周縁部１１の上面１２側に当接して各々面取り加工を行う。なお、ワーク１の左右の外周縁部１１の上面１２及び下面１３に各々砥石２を当接して、同時に面取り加工を行うように設定することもできる。面取り加工を行う際には、砥石２は駆動軸２１を回転中心にして回転し、載置台４に載置されたワーク１は前後方向に載置台４が移動することによりワーク１の左右の外周縁部１１を面取り加工することができる。   As an example in the case of chamfering the outer peripheral edge 11 of the work 1, first, the grindstone 2 is brought into contact with the outer peripheral edge 11 on both side faces of the work 1, and specifically, as illustrated in FIG. The left grindstone 2 is brought into contact with the upper surface 12 side of the left outer peripheral edge portion 11 of the workpiece 1 and the right grindstone 2 is brought into contact with the lower surface 13 side of the right outer peripheral edge portion 11 of the workpiece 1 to perform chamfering, respectively. The left grindstone 2 is brought into contact with the lower surface 13 side of the left outer peripheral edge 11 of the workpiece 1 and the right grindstone 2 is brought into contact with the upper surface 12 side of the right outer circumferential edge 11 of the workpiece 1 to perform chamfering. Note that the grindstone 2 may be brought into contact with the upper surface 12 and the lower surface 13 of the left and right outer peripheral edge portions 11 of the workpiece 1 so as to perform chamfering at the same time. When chamfering is performed, the grindstone 2 rotates around the drive shaft 21, and the workpiece 1 placed on the placement table 4 moves outside the left and right sides of the workpiece 1 by moving the placement table 4 in the front-rear direction. The peripheral edge portion 11 can be chamfered.

次に、ワーク１の前後方向の外周縁部１１に砥石２を当接して面取り加工を行うが、この際には、両側面の外周縁部１１を面取り加工したワーク１を載置した載置台４を９０度回転させた後、ワーク１の前後方向の外周縁部１１に砥石２を当接して面取り加工を行う。   Next, the grindstone 2 is brought into contact with the outer peripheral edge portion 11 in the front-rear direction of the work 1 to perform chamfering. In this case, the mounting table on which the work 1 having the chamfered outer peripheral edge portions 11 on both sides is placed. After rotating 4 by 90 degrees, the grindstone 2 is brought into contact with the outer peripheral edge 11 in the front-rear direction of the workpiece 1 to perform chamfering.

また、ワーク１の四箇所のコーナー部分の外周縁部１１に砥石２を当接して面取り加工を行う場合は、例えば、図１に図示した状態のワーク１を載置した載置台４を水平方向に右回り及び左周りに各々４５度程度回転させた状態でコーナー部分の外周縁部１１に砥石２を当接して面取り加工を行う。なお、コーナー部分の外周縁部１１の面取り加工は、例えば、図２に図示した状態で、四箇所のコーナー部分の外周縁部１１に適宜砥石２を当接すると共に、適宜押圧部材３を設定して面取り加工を行うことができる。   When chamfering is performed by contacting the grindstone 2 with the outer peripheral edge 11 of the four corners of the workpiece 1, for example, the mounting table 4 on which the workpiece 1 in the state illustrated in FIG. Then, the grindstone 2 is brought into contact with the outer peripheral edge 11 of the corner portion in a state of being rotated about 45 degrees clockwise and counterclockwise, and chamfering is performed. The chamfering of the outer peripheral edge portion 11 of the corner portion is performed by, for example, appropriately contacting the grindstone 2 with the outer peripheral edge portions 11 of the four corner portions and setting the pressing member 3 appropriately in the state illustrated in FIG. Can be chamfered.

以上のように、ワーク１の両側面と前後方向および四箇所のコーナー部分の上面１２及び下面１３の外周縁部１１に砥石２を当接して面取り加工を行うことができるが、面取り加工のやり方は、砥石２および押圧部材３を適宜設定することにより、種々のやり方を行うことができる。   As described above, the chamfering process can be performed by bringing the grindstone 2 into contact with the both side surfaces of the work 1, the front and rear direction, and the outer peripheral edge portions 11 of the upper surface 12 and the lower surface 13 of the four corner portions. Various methods can be performed by appropriately setting the grindstone 2 and the pressing member 3.

また、本発明の面取り加工装置は、ワーク１の形状や大きさに合わせて加工条件を適宜設定できるように構成してあるので、多種のワーク１の面取り加工を行うことが出来る。   In addition, the chamfering apparatus of the present invention is configured so that the machining conditions can be appropriately set in accordance with the shape and size of the workpiece 1, so that various types of chamfering of the workpiece 1 can be performed.

以上のように、本発明のワークの面取り加工装置は、液晶パネルなどの基板等の平板状ワーク１の外周縁部１１を面取り加工するワークの面取り加工装置であって、ワーク１を載置する載置台４は前後方向に移動可能に構成すると共に水平方向に回転可能に構成し、載置台４に載置されたワーク１の外周縁部１１に砥石２を当接してワーク１の外周縁部１１を面取り加工できるように構成し、砥石２をワーク１の外周縁部１１に当接して面取り加工を行う際、砥石２が当接するワーク１の上面１２および下面１３の近傍に押圧部材３を当接できるように構成したので、ワーク１の両側面と前後方向および四箇所のコーナー部分の上面１２及び下面１３の外周縁部１１を面取り加工する際、ワーク１の外周縁部１１の平坦度を良好に維持することができ、安定した状態で面取り加工を行うことができ、ワーク１の外周縁部１１を面取り加工した際の面取り加工精度を良好にすることができ、従って、所望の面取り加工寸法に精度良く面取り加工することができる。   As described above, the workpiece chamfering apparatus of the present invention is a workpiece chamfering apparatus for chamfering the outer peripheral edge 11 of the flat workpiece 1 such as a substrate such as a liquid crystal panel, and the workpiece 1 is placed thereon. The mounting table 4 is configured to be movable in the front-rear direction and is configured to be rotatable in the horizontal direction, and the grindstone 2 is brought into contact with the outer peripheral edge 11 of the work 1 mounted on the mounting table 4, so that the outer peripheral edge of the work 1 11 is configured to be chamfered, and when the grindstone 2 is in contact with the outer peripheral edge portion 11 of the workpiece 1 and chamfering is performed, the pressing member 3 is disposed in the vicinity of the upper surface 12 and the lower surface 13 of the workpiece 1 with which the grindstone 2 abuts. Since it comprised so that it could contact | abut, when chamfering the outer peripheral edge part 11 of the upper surface 12 and the lower surface 13 of the both sides | surfaces of the workpiece | work 1 and the front-back direction and four corner parts, the flatness of the outer peripheral edge part 11 of the workpiece | work 1 Keep good The chamfering can be performed in a stable state, and the chamfering accuracy when the outer peripheral edge 11 of the workpiece 1 is chamfered can be improved. Therefore, the desired chamfering dimension can be accurately chamfered. Can be processed.

また、このワークの面取り加工装置において、押圧部材３を、ワーク１の移動に伴い回転自在のローラ構造を有する構成にしたので、面取り加工時、砥石２が当接しているワーク１が前後方向等に移動する際、押圧部材３が安定した状態で回転してワーク１を良好な平坦度に維持した状態で安定した状態に保持することができる。従って、ワーク１の両側面と前後方向および四箇所のコーナー部分の上面１２及び下面１３の外周縁部１１を面取り加工する際、ワーク１の外周縁部１１の平坦度を良好に維持することができ、安定した状態で面取り加工を行うことができ、ワーク１の外周縁部１１を面取り加工した際の面取り加工精度を良好にすることができ、従って、所望の面取り加工寸法に精度良く面取り加工することができる。   Further, in this workpiece chamfering apparatus, the pressing member 3 is configured to have a roller structure that is rotatable as the workpiece 1 moves. When moving, the pressing member 3 can rotate in a stable state to hold the workpiece 1 in a stable state while maintaining a good flatness. Therefore, when chamfering both the side surfaces of the workpiece 1 and the outer peripheral edge portions 11 of the upper surface 12 and the lower surface 13 of the four corner portions, the flatness of the outer peripheral edge portion 11 of the workpiece 1 can be maintained well. The chamfering can be performed in a stable state, and the chamfering accuracy when the outer peripheral edge 11 of the workpiece 1 is chamfered can be improved. Therefore, the desired chamfering dimension is accurately obtained. can do.

本発明の一実施例の主要部概要構成を示す正面図である。It is a front view which shows the principal part outline structure of one Example of this invention. 本発明の一実施例の主要部概要構成を示す上面図である。It is a top view which shows the principal part outline structure of one Example of this invention. 本発明の一実施例の主要部概要構成を示す左側面図である。It is a left view which shows the principal part schematic structure of one Example of this invention. 従来のワークの面取り加工方法の主要部概要構成を示す正面図である。It is a front view which shows the principal part outline structure of the conventional chamfering processing method of a workpiece | work.

１ ワーク
２ 砥石
３ 押圧部材
４ 載置台
１１ 外周縁部
１２ 上面
１３ 下面
DESCRIPTION OF SYMBOLS 1 Work 2 Grinding stone 3 Pressing member 4 Mounting stand 11 Outer peripheral edge part 12 Upper surface 13 Lower surface

Claims (1)

液晶パネルなどの基板等の平板状ワークの外周縁部を面取り加工するワークの面取りし、左側の砥石を前記ワークの左側外周縁部の上面側に当接し、右側の砥石を前記ワークの右側外周縁部の下面側に当接して面取りし、次に、前記左側の砥石を前記ワークの左側外周縁部の下面側に当接し、前記右側の砥石をワークの右側外周縁部の上面側に当接して面取り加工を行う加工装置であって、前記ワークを載置する載置台は前後方向に移動可能に構成すると共に水平方向に回転可能に構成し、前記載置台に載置された前記ワークの外周縁部に砥石を当接して前記ワークの外周縁部を面取り加工できるように構成し、前記砥石を前記ワークの外周縁部に当接して面取り加工を行う際、前記砥石が当接する前記ワークの上面および下面の近傍に押圧部材を当接できるように構成し、前記押圧部材をワークの移動に伴い回転自在のローラ構造を有する構成にしたことを特徴とするワークの面取り加工装置。 Chamfering the outer peripheral edge of a flat work such as a substrate such as a liquid crystal panel, chamfering the workpiece, contacting the left grindstone with the upper surface of the left outer circumferential edge of the workpiece, and the right grindstone outside the right side of the workpiece Chamfering by contacting the lower surface side of the peripheral edge, and then contacting the left grindstone to the lower surface side of the left outer peripheral edge of the workpiece and applying the right grindstone to the upper surface side of the right outer peripheral edge of the workpiece. A processing apparatus that performs chamfering in contact with the mounting table on which the workpiece is placed, configured to be movable in the front-rear direction and configured to be rotatable in the horizontal direction, and the workpiece placed on the mounting table. The workpiece is configured such that the outer peripheral edge of the workpiece can be chamfered by abutting a grindstone on the outer peripheral edge, and the grindstone abuts when the chamfering is performed by abutting the grindstone on the outer peripheral edge of the workpiece. Press near the top and bottom surfaces of the Configure wood to allow contact, chamfering device of a work, characterized in that a configuration having a rotatable roller structure with the pressing member to move the workpiece.
JP2005017390A 2005-01-25 2005-01-25 Work chamfering machine Expired - Fee Related JP4352463B2 (en)

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