JP4330411B2 - 回路装置 - Google Patents
回路装置 Download PDFInfo
- Publication number
- JP4330411B2 JP4330411B2 JP2003331636A JP2003331636A JP4330411B2 JP 4330411 B2 JP4330411 B2 JP 4330411B2 JP 2003331636 A JP2003331636 A JP 2003331636A JP 2003331636 A JP2003331636 A JP 2003331636A JP 4330411 B2 JP4330411 B2 JP 4330411B2
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- Prior art keywords
- conductive pattern
- guard
- circuit device
- conductive
- circuit
- Prior art date
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
12A 第1の導電パターン
12B 第2の導電パターン
12C ガード導電パターン
13 回路素子
13A 半導体素子
13B チップ素子
Claims (1)
- 半導体素子と導電パターンとが樹脂モールドされた回路装置に於いて、
前記導電パターンは、絶縁層を介して多層に形成され、
前記半導体素子の高インピーダンスの入力端子と接続された第1の導電パターンと、前記第1の導電パターンに近接されて設けた第2の導電パターンと、前記第1の導電パターンと前記第2の導電パターンとの間に延在されるガード導電パターンとを備え、
前記ガード導電パターンは、前記半導体素子が実装されるダイパッドから連続して延在され、
前記ダイパッドは、前記絶縁層を貫通して下層の前記導電パターンと接続されることを特徴とする回路装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003331636A JP4330411B2 (ja) | 2003-09-24 | 2003-09-24 | 回路装置 |
TW093124778A TWI244713B (en) | 2003-09-24 | 2004-08-18 | Electric circuit device |
KR1020040074494A KR100611298B1 (ko) | 2003-09-24 | 2004-09-17 | 회로 장치 |
US10/947,652 US20050092508A1 (en) | 2003-09-24 | 2004-09-22 | Circuit device |
CNB200410011913XA CN100417309C (zh) | 2003-09-24 | 2004-09-24 | 电路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003331636A JP4330411B2 (ja) | 2003-09-24 | 2003-09-24 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005101180A JP2005101180A (ja) | 2005-04-14 |
JP4330411B2 true JP4330411B2 (ja) | 2009-09-16 |
Family
ID=34460240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003331636A Expired - Fee Related JP4330411B2 (ja) | 2003-09-24 | 2003-09-24 | 回路装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050092508A1 (ja) |
JP (1) | JP4330411B2 (ja) |
KR (1) | KR100611298B1 (ja) |
CN (1) | CN100417309C (ja) |
TW (1) | TWI244713B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7545031B2 (en) * | 2005-04-11 | 2009-06-09 | Stats Chippac Ltd. | Multipackage module having stacked packages with asymmetrically arranged die and molding |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5552639A (en) * | 1980-09-01 | 1996-09-03 | Hitachi, Ltd. | Resin molded type semiconductor device having a conductor film |
JP3172549B2 (ja) * | 1991-09-11 | 2001-06-04 | キヤノン株式会社 | 高圧電源回路基板 |
JPH0766564A (ja) * | 1993-08-25 | 1995-03-10 | Advantest Corp | 多層プリント配線基板におけるガード電極の構造 |
JPH1098291A (ja) * | 1996-09-24 | 1998-04-14 | Minolta Co Ltd | 微小電流端子を有した集積回路の実装構造 |
US6420779B1 (en) * | 1999-09-14 | 2002-07-16 | St Assembly Test Services Ltd. | Leadframe based chip scale package and method of producing the same |
JP3822768B2 (ja) * | 1999-12-03 | 2006-09-20 | 株式会社ルネサステクノロジ | Icカードの製造方法 |
JP2001313363A (ja) * | 2000-05-01 | 2001-11-09 | Rohm Co Ltd | 樹脂封止型半導体装置 |
US6548757B1 (en) * | 2000-08-28 | 2003-04-15 | Micron Technology, Inc. | Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies |
US6768386B1 (en) * | 2003-04-22 | 2004-07-27 | Lsi Logic Corporation | Dual clock package option |
US6791177B1 (en) * | 2003-05-12 | 2004-09-14 | Lsi Logic Corporation | Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate |
-
2003
- 2003-09-24 JP JP2003331636A patent/JP4330411B2/ja not_active Expired - Fee Related
-
2004
- 2004-08-18 TW TW093124778A patent/TWI244713B/zh not_active IP Right Cessation
- 2004-09-17 KR KR1020040074494A patent/KR100611298B1/ko not_active IP Right Cessation
- 2004-09-22 US US10/947,652 patent/US20050092508A1/en not_active Abandoned
- 2004-09-24 CN CNB200410011913XA patent/CN100417309C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200512855A (en) | 2005-04-01 |
JP2005101180A (ja) | 2005-04-14 |
CN100417309C (zh) | 2008-09-03 |
US20050092508A1 (en) | 2005-05-05 |
TWI244713B (en) | 2005-12-01 |
KR100611298B1 (ko) | 2006-08-10 |
KR20050030113A (ko) | 2005-03-29 |
CN1602137A (zh) | 2005-03-30 |
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