JP4315455B2 - 露光装置及びデバイス製造方法 - Google Patents
露光装置及びデバイス製造方法 Download PDFInfo
- Publication number
- JP4315455B2 JP4315455B2 JP2006103627A JP2006103627A JP4315455B2 JP 4315455 B2 JP4315455 B2 JP 4315455B2 JP 2006103627 A JP2006103627 A JP 2006103627A JP 2006103627 A JP2006103627 A JP 2006103627A JP 4315455 B2 JP4315455 B2 JP 4315455B2
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- Prior art keywords
- substrate
- measurement
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- exposure
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
前記現像された基板を処理する処理工程とを含む。
K=INT((L−M)/P)
である。なお、INT( )は、小数点以下を切り捨てる演算記号とする。
D=Ypitch−K×P
である。
ΔT=T2−T1=(D−P)/S
となる。つまり、ショット領域内の最後の計測点を計測してから次のショット領域の最初の計測点を計測するまでに、ショット内計測時間隔T1にΔTを加えた時間を待つことになる。
2 原版
3 原版ステージ機構
4 基板
5 基板チャック
6 露光ステージ機構
7 定盤
8 照明光学系
9 基準面
10 光源
11 コリメータレンズ
12 スリット部材
13、16 光学系
14、15 ミラー
17 ストッパー絞り
18 補正光学系群
19 光電センサ
20 XYバーミラー
21 干渉計
22 計測ステージ機構
23 合焦用マーク
24 ハーフミラー
25 集光レンズ
26 検出器
27a、27b ステージバーミラー
28a、28b 干渉計
50 第1面位置検出ユニット
100 第2面位置検出ユニット
110 メイン制御部
120a、120b ドライバ
130 メモリ
Claims (2)
- 感光剤が塗布された基板の複数のショット領域を投影光学系を介して順に露光する露光装置であって、
基板が走査駆動された状態で、連続する複数のショット領域内に定義された計測点の面位置を計測する計測器と、
前記計測器による計測結果に基づいて、基板の被露光領域が前記投影光学系の像面に一致するように基板の面位置を制御する制御部と、
基板を保持し、かつ基板を露光するための露光ステーションと前記計測器による計測を実施するための計測ステーションとの間を移動する複数の基板ステージとを備え、
ショット領域の端から当該ショット領域内の計測点までの距離が複数のショット領域において共通し、ショット領域内の隣接する計測点の間隔が共通の第1距離になり、ショット領域内の最後の計測点と次のショット内の最初の計測点との間隔が第2距離となるように、複数のショット領域のそれぞれについて複数の計測点が定義され、
前記計測器は、ショット領域毎に加速および減速がされることなく基板が等速度で走査駆動された状態で、走査駆動方向に沿って連続して配列された少なくとも2つのショット領域内の計測点の面位置を計測し、
前記露光ステーションでの基板の露光処理と、前記計測ステーションでの基板の計測処理とが並列に実施される、
ことを特徴とする露光装置。 - デバイス製造方法であって、
請求項1に記載の露光装置を用いて基板を露光する露光工程と、前記露光された基板を現像する現像工程と、
前記現像された基板を処理する処理工程と、
を含むことを特徴とするデバイス製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006103627A JP4315455B2 (ja) | 2006-04-04 | 2006-04-04 | 露光装置及びデバイス製造方法 |
US11/692,471 US7423726B2 (en) | 2006-04-04 | 2007-03-28 | Exposure apparatus and device manufacturing method |
EP07105473A EP1843209A3 (en) | 2006-04-04 | 2007-04-02 | Exposure apparatus and device manufacturing method |
TW096111915A TWI397778B (zh) | 2006-04-04 | 2007-04-03 | 曝光設備和製造裝置的方法 |
KR1020070032613A KR100875008B1 (ko) | 2006-04-04 | 2007-04-03 | 노광장치 및 디바이스 제조방법 |
US12/198,179 US8107052B2 (en) | 2006-04-04 | 2008-08-26 | Exposure apparatus and device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006103627A JP4315455B2 (ja) | 2006-04-04 | 2006-04-04 | 露光装置及びデバイス製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009051286A Division JP5137879B2 (ja) | 2009-03-04 | 2009-03-04 | 露光装置及びデバイス製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007281097A JP2007281097A (ja) | 2007-10-25 |
JP4315455B2 true JP4315455B2 (ja) | 2009-08-19 |
Family
ID=38239897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006103627A Expired - Fee Related JP4315455B2 (ja) | 2006-04-04 | 2006-04-04 | 露光装置及びデバイス製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7423726B2 (ja) |
EP (1) | EP1843209A3 (ja) |
JP (1) | JP4315455B2 (ja) |
KR (1) | KR100875008B1 (ja) |
TW (1) | TWI397778B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4418699B2 (ja) * | 2004-03-24 | 2010-02-17 | キヤノン株式会社 | 露光装置 |
JP4315455B2 (ja) * | 2006-04-04 | 2009-08-19 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
JP2009117419A (ja) * | 2007-11-01 | 2009-05-28 | Canon Inc | 露光装置及びデバイス製造方法 |
NL1036557A1 (nl) | 2008-03-11 | 2009-09-14 | Asml Netherlands Bv | Method and lithographic apparatus for measuring and acquiring height data relating to a substrate surface. |
JP2009295932A (ja) * | 2008-06-09 | 2009-12-17 | Canon Inc | 露光装置及びデバイス製造方法 |
JP5335380B2 (ja) * | 2008-11-14 | 2013-11-06 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
EP2228685B1 (en) * | 2009-03-13 | 2018-06-27 | ASML Netherlands B.V. | Level sensor arrangement for lithographic apparatus and device manufacturing method |
US8675210B2 (en) | 2009-03-13 | 2014-03-18 | Asml Netherlands B.V. | Level sensor, lithographic apparatus, and substrate surface positioning method |
US8488107B2 (en) | 2009-03-13 | 2013-07-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a level sensor having multiple projection units and detection units |
JP2011035333A (ja) * | 2009-08-05 | 2011-02-17 | Renesas Electronics Corp | 走査型露光装置、走査型露光方法、半導体装置の製造方法およびプログラム |
US20110174086A1 (en) * | 2010-01-19 | 2011-07-21 | Divyasimha Harish | Capacitive sensor based structure and method with tilt compensation capability |
NL2006129A (en) * | 2010-03-12 | 2011-09-13 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
CN102866587B (zh) * | 2011-07-08 | 2014-12-17 | 上海微电子装备有限公司 | 工件台 |
JP6066610B2 (ja) * | 2012-07-31 | 2017-01-25 | キヤノン株式会社 | 露光方法、露光装置及びデバイス製造方法 |
US11885738B1 (en) | 2013-01-22 | 2024-01-30 | J.A. Woollam Co., Inc. | Reflectometer, spectrophotometer, ellipsometer or polarimeter system including sample imaging system that simultaneously meet the scheimpflug condition and overcomes keystone error |
CN104111596A (zh) * | 2013-04-16 | 2014-10-22 | 上海微电子装备有限公司 | 用于光刻设备的全局调平的装置和方法 |
JP6299111B2 (ja) * | 2013-08-28 | 2018-03-28 | オムロン株式会社 | レーザ加工装置 |
US11061338B2 (en) | 2014-04-17 | 2021-07-13 | Nikon Corporation | High-resolution position encoder with image sensor and encoded target pattern |
US10812695B2 (en) * | 2015-09-14 | 2020-10-20 | Nikon Corporation | Three-dimensional positioning system using surface pattern recognition and interpolation |
US9726987B2 (en) | 2014-04-17 | 2017-08-08 | Nikon Corporation | Positioning system using surface pattern recognition and interpolation |
JP6748461B2 (ja) * | 2016-03-22 | 2020-09-02 | キヤノン株式会社 | インプリント装置、インプリント装置の動作方法および物品製造方法 |
JP7287304B2 (ja) * | 2020-02-10 | 2023-06-06 | 株式会社デンソー | ワイドバンドギャップ半導体装置の製造方法 |
CN114184621A (zh) * | 2020-09-14 | 2022-03-15 | 临颍县爬杆机器人有限公司 | 曲面零件外观缺陷检测方法及实施该方法的装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3269343B2 (ja) | 1995-07-26 | 2002-03-25 | キヤノン株式会社 | ベストフォーカス決定方法及びそれを用いた露光条件決定方法 |
US6559465B1 (en) | 1996-08-02 | 2003-05-06 | Canon Kabushiki Kaisha | Surface position detecting method having a detection timing determination |
JP3335126B2 (ja) | 1998-07-06 | 2002-10-15 | キヤノン株式会社 | 面位置検出装置及びそれを用いた走査型投影露光装置 |
JP3913079B2 (ja) | 2002-02-28 | 2007-05-09 | キヤノン株式会社 | 面位置検出装置及び方法並びに露光装置と該露光装置を用いたデバイスの製造方法 |
KR100888472B1 (ko) | 2002-07-06 | 2009-03-12 | 삼성전자주식회사 | 이중키를 이용한 암호화방법 및 이를 위한 무선 랜 시스템 |
JP2004071851A (ja) | 2002-08-07 | 2004-03-04 | Canon Inc | 半導体露光方法及び露光装置 |
JP2004266342A (ja) | 2003-02-03 | 2004-09-24 | Sony Corp | 無線アドホック通信システム、端末、その端末における復号方法、暗号化方法及びブロードキャスト暗号鍵配布方法並びにそれらの方法を端末に実行させるためのプログラム |
JP4652667B2 (ja) | 2003-02-13 | 2011-03-16 | キヤノン株式会社 | 面位置計測方法及び走査型露光装置 |
JP4315420B2 (ja) | 2003-04-18 | 2009-08-19 | キヤノン株式会社 | 露光装置及び露光方法 |
JP2005129674A (ja) | 2003-10-23 | 2005-05-19 | Canon Inc | 走査露光装置およびデバイス製造方法 |
US7061579B2 (en) * | 2003-11-13 | 2006-06-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4418699B2 (ja) | 2004-03-24 | 2010-02-17 | キヤノン株式会社 | 露光装置 |
JP4315455B2 (ja) | 2006-04-04 | 2009-08-19 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
-
2006
- 2006-04-04 JP JP2006103627A patent/JP4315455B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-28 US US11/692,471 patent/US7423726B2/en not_active Expired - Fee Related
- 2007-04-02 EP EP07105473A patent/EP1843209A3/en not_active Withdrawn
- 2007-04-03 KR KR1020070032613A patent/KR100875008B1/ko active IP Right Grant
- 2007-04-03 TW TW096111915A patent/TWI397778B/zh not_active IP Right Cessation
-
2008
- 2008-08-26 US US12/198,179 patent/US8107052B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1843209A3 (en) | 2007-12-05 |
US7423726B2 (en) | 2008-09-09 |
US8107052B2 (en) | 2012-01-31 |
US20070229788A1 (en) | 2007-10-04 |
KR100875008B1 (ko) | 2008-12-19 |
TWI397778B (zh) | 2013-06-01 |
US20080316450A1 (en) | 2008-12-25 |
TW200807164A (en) | 2008-02-01 |
EP1843209A2 (en) | 2007-10-10 |
KR20070099464A (ko) | 2007-10-09 |
JP2007281097A (ja) | 2007-10-25 |
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