JP4279391B2 - Light emitting display panel and manufacturing method thereof - Google Patents

Light emitting display panel and manufacturing method thereof Download PDF

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Publication number
JP4279391B2
JP4279391B2 JP03769399A JP3769399A JP4279391B2 JP 4279391 B2 JP4279391 B2 JP 4279391B2 JP 03769399 A JP03769399 A JP 03769399A JP 3769399 A JP3769399 A JP 3769399A JP 4279391 B2 JP4279391 B2 JP 4279391B2
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cathode
forming step
electrode lead
display panel
light emitting
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JP2000243558A (en
JP2000243558A5 (en
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健一 永山
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Tohoku Pioneer Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は発光ディスプレイパネル及びその製造方法、特に、表示装置として用いられる有機ＥＬ（エレクトロルミネッセンス）ディスプレイパネル及びその製造方法に関する。
【０００２】
【従来の技術】
有機ＥＬ（エレクトロルミネッセンス）素子は、電流注入型の素子であり、低駆動電圧化、低消費電流化には電極の低抵抗化が必須である。従来の有機ＥＬディスプレイパネルの構造の１例を図１に示す。
図１における有機ＥＬディスプレイパネルは、ガラス基板３上に、透明導電体（ＩＴＯ：インジウム・スズ酸化物）からなる複数の陽極５、有機ＥＬ（エレクトロルミネッセンス）材料からなる発光層７、及びＡｌなどの金属材料からなり陽極５に対向する複数の陰極９を順次形成して構成されている。また、陰極９の各々の端部には陰極引出し部１１が、引出し接続部１３において接続されている。発光層７（有機ＥＬ層）のうち、陽極５（透明電極）及び陰極９（金属電極）の交差する領域が発光領域となる。１４は発光領域を封入する封止缶の接着領域である。
【０００３】
図１に示すような線順次駆動を行うドットマトリクスパネルの場合、特に大きな電流が流れる走査電極ラインの低抵抗化が重要である。この走査電極ラインとしては、ＩＴＯ等から構成される抵抗の高い陽極ではなく、抵抗の低い陰極（Ａｌ等の金属電極）を選ぶのが一般的である。また、陰極引出し部も陰極同様に大電流が流れるため低抵抗化は重要である。以上のことから、陰極及び陰極引出し部は低抵抗の金属材料によって一体に形成されていた。
【０００４】
【発明が解決しようとする課題】
ところが、陰極引出し部１１の一部は外部の駆動回路との接続端子を兼ねるため、図１に示すように封止缶の封止領域からはずれ外部に露出している。そのため、外気にさらされることによる腐食や、装置の組み立て時等に損傷を受け断線する、といった問題があった。
【０００５】
本発明はかかる点に鑑みてなされたものであり、その目的とするところは、耐久性が高く寿命の長い発光ディスプレイパネルを提供することにある。
【０００６】
【課題を解決するための手段】
本発明によれば、基板上に、少なくとも複数の透明電極、発光層、複数の金属電極が積層され、前記透明電極と前記金属電極が交差する領域が発光領域となる発光ディスプレイパネルであって、前記基板上には、各々が前記複数の金属電極の端部に接続される複数の電極引出し部が形成され、前記電極引出し部は前記金属電極と比べて耐食性の高い高耐食性金属部を有することを特徴としている。
【０００７】
【発明の実施の形態】
以下に本発明の実施例を図面を参照しつつ詳細に説明する。
図２は本発明の第１の実施例である有機ＥＬディスプレイパネルの構成を概略的に示している。図１に示した従来技術と異なる点は、陰極引出し部１１を金属電極９とは異なる材料で形成した点にあり、陰極引出し部１１はその一部が封止缶領域の外部に位置し、ドライブ回路への接続端子を兼用する。また、金属電極９はすべて封止缶領域内に封入される。他の構成は図１と同一である。図３は陰極引出し部１１と金属電極９の断面構造を示している。図示されるように陰極引出し部１１は、ガラス基板３上にＩＴＯ層１５及び耐食性に優れた高融点（高仕事関数）金属層１６が順次積層された２層構造となっているが、高融点金属層の１層構造としても良い。また、金属電極９の端部は、高融点金属層１６の端部の上面に乗り上げて形成されており、これにより、金属電極９と高融点金属層１６の接続がなされている。
【０００８】
陰極引出し部１１は、金属電極と同様に低抵抗であることが望ましい。また、封止領域外に位置するため耐環境性（腐食しにくいこと、傷付きにくいこと）に優れていることが望まれる。一方、金属電極９は外部より封止されているため低抵抗であれば良い。本発明ではこれらの条件を満たすように、陰極引出し部１１を金属電極９とは異なる材料で形成する。
【０００９】
腐食しにくい材料とは一般に仕事関数の高い材料であり、傷付きにく材料とは一般に融点が高い材料であるので、陰極引出し部１１は、金属電極の材料に比べて高仕事関数で且つ高融点の材料により形成すればよい。例えば、金属電極を低抵抗で安価なＡｌ、または、Ｍｇで形成した場合は、陰極引出し部１１は、Ｍｏ、Ｎｉ、W、Ｃｒ、Ａｕ、Ｐｄ、Ｐｔの単体またはこれらを含む合金として形成すれば良い。これにより、陰極ラインの高抵抗化、高コスト化を極力抑えつつ、従来問題とされた耐久性の問題を解消することができる。
【００１０】
なお、ＩＴＯは高抵抗ではあるが、耐環境性においては格段に優れているので、図２に示したように、他の高融点金属との２層構造で用いるのが良い。
また、陰極ラインの抵抗をできるだけ低くするためには、陰極引出し部１１と金属電極９との接続部分（引出し接続部１３）をできるだけ封止領域の端側にすることが望ましい。
【００１１】
図６及び図７は、本発明の第２の実施例である有機ＥＬディスプレイパネルの構成を概略的に示している。図６は有機ＥＬディスプレイパネルの上面図であり、図７（ａ），（ｂ）はそれぞれ、図６における引出し接続部１３の上面図及び線Ａ−Ａに関する断面図である。この第２実施例は、第１実施例の欠点を改良した例であるので、第２実施例の説明の前に、第１実施例の欠点について図３〜図５をもとに説明する。陰極ラインの低抵抗化を考えると、陰極引出し部１１は金属電極９よりも厚くなり、図３に示すような段差構造となる。一方、陰極９は蒸着法により形成されるが、蒸着流の回り込みが小さい（ステップカバレッジが悪い）と段差部の陰極膜厚が薄くなる。従って、陰極−陰極引出し部の接続が不十分となり、最悪の場合断線するという問題があった。
【００１２】
更に、図４に示すように、基板内の位置によって陰極材料の蒸着流の方向が異なるため、陰極引出し部１１の接続端部での陰極膜厚にばらつきが生じ、その結果、引出し接続部１３の接続抵抗がばらついて表示品位を落とすという問題が生じていた。
また、陰極引出し部１１をＩＴＯ層１５及び高融点金属１６の２層構造とした場合、陰極引出し部１１のＩＴＯ層１５及び高融点金属１６のパターンにずれがあると、接続部の端部において両者が接触し、局部電池の形成によって腐食が生じ、断線する危険性があった。
【００１３】
第２実施例においては、これら第１実施例の問題を解消し、より優れた発光デイスプレイとなっている。
図６及び図７に示すように、この有機ＥＬディスプレイパネルは、ガラス基板３上に、ＩＴＯからなる複数の透明電極（陽極）５、有機ＥＬ発光層７を成膜後、Ａｌからなり陽極５に直交する複数の金属電極（陰極）９を蒸着法により形成して構成されている。また、透明電極５と発光層７との間には透明電極５の縁部にかかる絶縁層（図示していない）が形成されている。これによりクロストーク発光の防止がなされている。更に、陰極９の各々の端部には、ＩＴＯ層１５及び耐食性の金属（Ｃｒ）層１６の２層構造を有する陰極引出し部１１が形成されている。陰極引出し部１１は絶縁体１９を挟んで金属電極９に結合され、金属電極９は絶縁体１９に乗り上げて形成されるとともに、その端部において金属（Ｃｒ）層１６の上面のみに一部が接続されている。絶縁体１９は、非感光性ポリイミド前駆体溶液をスピンコートして成膜され、金属電極９との接触面がなだらかな傾斜面となるように形成されている。これにより、引出し接続部１３の金属電極９の膜厚は蒸着方向によらず均一化し、安定で低抵抗の接続部が形成される。
【００１４】
また、ＩＴＯ層１５と高融点金属層１６にパターンずれがあっても、そのずれ部分は絶縁体１９に覆われるため、局部電池の問題も解消される。
上記した有機ＥＬディスプレイパネルの製造工程において、陰極引出し部１１は、金属電極９が形成される前に形成され、また、陰極引出し部１１のＩＴＯ層１５は、透明電極（ＩＴＯ）５と同一の工程で形成される。また、引出し接続部１３の絶縁体１９は、前述した透明電極５と発光層７との間の絶縁層と同一の工程で形成される。
【００１５】
発光層７（有機ＥＬ層）のうち、陽極５（透明電極）及び陰極９（金属電極）の交差する領域が発光領域となり、マトリクス状の発光部（表示部）を形成している。このようにして形成された有機ＥＬ発光素子は、陽極５及び陰極引出し部１１の端部の一部を除いて封止缶により封止される。
本発明による有機ＥＬディスプレイパネルは上述した如く形成されており、耐食性金属部を含む陰極引出し部１１を有し、更に、ＩＴＯ層１５及び金属層１６の接触による局部電池の形成を避けることができるため、耐久性に優れた電極を実現できる。また、引出し接続部１３の金属電極９は、なだらかな傾斜面の絶縁体１９上に形成されるため、膜厚や接続抵抗のばらつきのない低抵抗の電極を形成することができる。
【００１６】
図８及び図９は、本発明の第３の実施例である有機ＥＬディスプレイパネルの構成を概略的に示している。図８は有機ＥＬディスプレイパネルの上面図であり、図９（ａ），（ｂ）はそれぞれ、図８における引出し接続部１３の上面図及び線Ａ−Ａに関する断面図である。
図８及び図９に示すように、この有機ＥＬディスプレイパネルが第１の実施例と異なるのは、引出し接続部１３上の絶縁体１９にスルーホール２１を設けて金属部１６に金属電極９が接続されるようにしている点である。このスルーホール２１の形成により、あらゆる方向からの陰極金属の蒸着流に対して確実に接続を行うことができる。
【００１７】
上記したように、本発明によれば、耐久性に優れ、低抵抗の電極を有し、かつ安定な生産が可能な発光ディスプレイパネルを実現できる。
尚、上記実施例においては、耐食性の金属としてＣｒを用いた場合について説明したが、他の耐食性金属、例えばモリブデン（Ｍｏ）、タンタル（Ｔａ）、チタン（Ｔｉ）、ニッケル（Ｎｉ）等を用いる構成としてもよい。また、金属電極としてＡｌを用いた場合について説明したが、銅（Ｃｕ）、金（Ａｕ）等の金属を用いてもよい。
【００１８】
また、陰極引出し部１１には、外部端子としてドライブ外部回路に接続するためにＦＰＣ、ＴＡＢなどの接続ラインがＡＣＦ（異方導電性フィルム）を介して圧着接続されるが、ＡＣＦは接続される外部端子との相性によって適宜選択されるため、陰極の引出し部を陰極引出し部１１と同材料で形成すると、１種類のＡＣＦでこと足り、製造コストを低減させることができる。
【００１９】
また、上記実施例においては、有機ＥＬディスプレイパネルを例に説明したが、他の発光材料を用いた発光ディスプレイパネル、又は他の発光原理を利用した発光ディスプレイパネルについても適用可能である。
【００２０】
【発明の効果】
以上詳細に説明したように、本発明によれば、耐久性に優れた電極引出し部を実現でき、長寿命で表示品位が高く、安定な生産が可能な発光ディスプレイパネルを実現できる。
【図面の簡単な説明】
【図１】従来の有機ＥＬディスプレイパネルの構造の１例を概略的に示す図である。
【図２】本発明の第１実施例である有機ＥＬディスプレイパネルの構成を概略的に示す図である。
【図３】図２における従来の引出し接続部の構造を概略的に示す断面図である。
【図４】蒸着流の方向による接続端部での陰極膜厚のばらつきを説明する断面図である。
【図５】第１の実施例の２層構造の引出し接続部における接触腐食を説明する断面図である。
【図６】本発明の第２の実施例である有機ＥＬディスプレイパネルの構成を概略的に示す上面図である。
【図７】図６における引出し接続部の上面図及び線Ａ−Ａに関する断面図である。
【図８】本発明の第３の実施例である有機ＥＬディスプレイパネルの構成を概略的に示す上面図である。
【図９】図８における引出し接続部の上面図及び線Ａ−Ａに関する断面図である。
【主要部分の符号の説明】
３ ガラス基板
５ 透明電極
７ 発光層
９ 金属電極
１１ 陰極引出し部
１３ 引出し接続部
１５ ＩＴＯ層
１６ 高融点金属層
１９ 絶縁体
２１ スルーホール[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting display panel and a manufacturing method thereof, and more particularly to an organic EL (electroluminescence) display panel used as a display device and a manufacturing method thereof.
[0002]
[Prior art]
An organic EL (electroluminescence) element is a current injection type element, and it is essential to reduce the resistance of an electrode in order to reduce driving voltage and current consumption. An example of the structure of a conventional organic EL display panel is shown in FIG.
The organic EL display panel in FIG. 1 includes a plurality of anodes 5 made of a transparent conductor (ITO: indium tin oxide), a light emitting layer 7 made of an organic EL (electroluminescence) material, Al, and the like on a glass substrate 3. A plurality of cathodes 9 made of the above metal material and opposed to the anode 5 are sequentially formed. Further, a cathode lead portion 11 is connected to each end portion of the cathode 9 at a lead connection portion 13. In the light emitting layer 7 (organic EL layer), a region where the anode 5 (transparent electrode) and the cathode 9 (metal electrode) intersect is a light emitting region. Reference numeral 14 denotes an adhesive region of the sealing can that encloses the light emitting region.
[0003]
In the case of a dot matrix panel that performs line-sequential driving as shown in FIG. 1, it is particularly important to reduce the resistance of scanning electrode lines through which a large current flows. As the scan electrode line, a cathode having a low resistance (a metal electrode such as Al) is generally selected instead of a high resistance anode made of ITO or the like. Further, since a large current flows through the cathode lead-out portion as well as the cathode, it is important to reduce the resistance. From the above, the cathode and the cathode lead-out part are integrally formed of a low-resistance metal material.
[0004]
[Problems to be solved by the invention]
However, since a part of the cathode lead-out portion 11 also serves as a connection terminal with an external drive circuit, the cathode lead-out portion 11 is exposed to the outside of the sealing region of the sealing can as shown in FIG. For this reason, there have been problems such as corrosion due to exposure to the outside air and damage and disconnection during assembly of the apparatus.
[0005]
The present invention has been made in view of such points, and an object of the present invention is to provide a light-emitting display panel having high durability and a long lifetime.
[0006]
[Means for Solving the Problems]
According to the present invention, there is provided a light emitting display panel in which at least a plurality of transparent electrodes, a light emitting layer, and a plurality of metal electrodes are stacked on a substrate, and a region where the transparent electrodes and the metal electrodes intersect is a light emitting region, A plurality of electrode lead portions are formed on the substrate, each of which is connected to an end portion of the plurality of metal electrodes, and the electrode lead portions have a high corrosion resistance metal portion having higher corrosion resistance than the metal electrodes. It is characterized by.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings.
FIG. 2 schematically shows the configuration of an organic EL display panel according to the first embodiment of the present invention. The difference from the prior art shown in FIG. 1 is that the cathode lead portion 11 is formed of a material different from that of the metal electrode 9, and a portion of the cathode lead portion 11 is located outside the sealing can region, Also serves as a connection terminal to the drive circuit. Moreover, all the metal electrodes 9 are enclosed in the sealing can region. Other configurations are the same as those in FIG. FIG. 3 shows a cross-sectional structure of the cathode lead portion 11 and the metal electrode 9. As shown in the figure, the cathode lead portion 11 has a two-layer structure in which an ITO layer 15 and a high melting point (high work function) metal layer 16 excellent in corrosion resistance are sequentially laminated on a glass substrate 3. A single-layer structure of a metal layer may be used. Further, the end portion of the metal electrode 9 is formed so as to run on the upper surface of the end portion of the refractory metal layer 16, whereby the metal electrode 9 and the refractory metal layer 16 are connected.
[0008]
The cathode lead portion 11 desirably has a low resistance like the metal electrode. Moreover, since it is located outside the sealing region, it is desired that it is excellent in environmental resistance (not easily corroded or scratched). On the other hand, since the metal electrode 9 is sealed from the outside, it may be low resistance. In the present invention, the cathode lead portion 11 is formed of a material different from that of the metal electrode 9 so as to satisfy these conditions.
[0009]
The material that does not easily corrode is generally a material having a high work function, and the material that is not easily scratched is generally a material having a high melting point. Therefore, the cathode lead portion 11 has a high work function and a high value compared to the material of the metal electrode. What is necessary is just to form with the material of melting | fusing point. For example, when the metal electrode is formed of low resistance and inexpensive Al or Mg, the cathode lead-out portion 11 is formed as a simple substance of Mo, Ni, W, Cr, Au, Pd, or Pt or an alloy containing these. It ’s fine. As a result, it is possible to eliminate the durability problem, which has been a conventional problem, while suppressing the increase in resistance and cost of the cathode line as much as possible.
[0010]
In addition, although ITO has a high resistance, it is remarkably excellent in environmental resistance, so it is preferable to use a two-layer structure with another refractory metal as shown in FIG.
Further, in order to make the resistance of the cathode line as low as possible, it is desirable that the connection portion (drawer connection portion 13) between the cathode lead portion 11 and the metal electrode 9 be as close to the end of the sealing region as possible.
[0011]
6 and 7 schematically show the configuration of an organic EL display panel according to a second embodiment of the present invention. 6 is a top view of the organic EL display panel, and FIGS. 7A and 7B are a top view of the drawer connecting portion 13 in FIG. 6 and a cross-sectional view taken along line AA. Since the second embodiment is an example in which the drawbacks of the first embodiment are improved, the disadvantages of the first embodiment will be described with reference to FIGS. 3 to 5 before the description of the second embodiment. Considering the reduction in resistance of the cathode line, the cathode lead-out portion 11 is thicker than the metal electrode 9 and has a step structure as shown in FIG. On the other hand, the cathode 9 is formed by a vapor deposition method, but if the flow of the vapor deposition flow is small (poor step coverage), the thickness of the cathode at the stepped portion becomes thin. Therefore, there is a problem that the connection between the cathode and the cathode lead-out portion becomes insufficient and the wire is broken in the worst case.
[0012]
Further, as shown in FIG. 4, since the direction of the vapor deposition flow of the cathode material differs depending on the position in the substrate, the cathode film thickness at the connection end of the cathode lead-out portion 11 varies, and as a result, the lead-out connection portion 13 As a result, there is a problem that the display resistance is degraded due to variations in the connection resistance.
Further, in the case where the cathode lead portion 11 has a two-layer structure of the ITO layer 15 and the refractory metal 16, if there is a shift in the pattern of the ITO layer 15 and the refractory metal 16 of the cathode lead portion 11, There was a risk of contact between the two and corrosion due to the formation of the local battery, resulting in disconnection.
[0013]
In the second embodiment, the problem of the first embodiment is solved, and the light emitting display is more excellent.
As shown in FIGS. 6 and 7, this organic EL display panel has a plurality of transparent electrodes (anodes) 5 made of ITO and an organic EL light emitting layer 7 formed on a glass substrate 3, and then made of Al and made of an anode 5. A plurality of metal electrodes (cathodes) 9 that are orthogonal to each other are formed by vapor deposition. In addition, an insulating layer (not shown) is formed between the transparent electrode 5 and the light emitting layer 7 on the edge of the transparent electrode 5. This prevents crosstalk light emission. Further, a cathode lead portion 11 having a two-layer structure of an ITO layer 15 and a corrosion-resistant metal (Cr) layer 16 is formed at each end portion of the cathode 9. The cathode lead portion 11 is coupled to the metal electrode 9 with the insulator 19 interposed therebetween, and the metal electrode 9 is formed on the insulator 19 and a part thereof is only on the upper surface of the metal (Cr) layer 16 at the end portion. It is connected. The insulator 19 is formed by spin-coating a non-photosensitive polyimide precursor solution, and is formed so that the contact surface with the metal electrode 9 becomes a gentle inclined surface. Thereby, the film thickness of the metal electrode 9 of the drawer | drawing-out connection part 13 is equalized irrespective of a vapor deposition direction, and a stable and low-resistance connection part is formed.
[0014]
Even if there is a pattern shift between the ITO layer 15 and the refractory metal layer 16, the shift portion is covered with the insulator 19, so that the problem of the local battery is also eliminated.
In the manufacturing process of the organic EL display panel described above, the cathode lead portion 11 is formed before the metal electrode 9 is formed, and the ITO layer 15 of the cathode lead portion 11 is the same as the transparent electrode (ITO) 5. Formed in the process. Further, the insulator 19 of the drawer connecting portion 13 is formed in the same process as the insulating layer between the transparent electrode 5 and the light emitting layer 7 described above.
[0015]
In the light emitting layer 7 (organic EL layer), a region where the anode 5 (transparent electrode) and the cathode 9 (metal electrode) intersect serves as a light emitting region, forming a matrix light emitting portion (display portion). The organic EL light-emitting element formed in this manner is sealed with a sealing can except for a part of the end portions of the anode 5 and the cathode lead-out portion 11.
The organic EL display panel according to the present invention is formed as described above, has a cathode lead portion 11 including a corrosion-resistant metal portion, and can avoid formation of a local battery due to contact between the ITO layer 15 and the metal layer 16. Therefore, an electrode having excellent durability can be realized. In addition, since the metal electrode 9 of the lead connection portion 13 is formed on the insulator 19 having a gently sloping surface, it is possible to form a low-resistance electrode without variations in film thickness and connection resistance.
[0016]
8 and 9 schematically show the configuration of an organic EL display panel according to a third embodiment of the present invention. FIG. 8 is a top view of the organic EL display panel, and FIGS. 9A and 9B are a top view of the drawer connecting portion 13 in FIG. 8 and a cross-sectional view taken along line AA.
As shown in FIGS. 8 and 9, the organic EL display panel is different from the first embodiment in that a through hole 21 is provided in the insulator 19 on the drawer connecting portion 13 and the metal electrode 9 is provided in the metal portion 16. The point is that they are connected. By forming the through hole 21, it is possible to reliably connect the cathode metal deposition flow from any direction.
[0017]
As described above, according to the present invention, it is possible to realize a light-emitting display panel that has excellent durability, has a low-resistance electrode, and can be stably produced.
In the above embodiment, the case where Cr is used as the corrosion-resistant metal has been described. However, other corrosion-resistant metals such as molybdenum (Mo), tantalum (Ta), titanium (Ti), nickel (Ni), etc. are used. It is good also as a structure. Moreover, although the case where Al was used as a metal electrode was demonstrated, you may use metals, such as copper (Cu) and gold (Au).
[0018]
In addition, connection lines such as FPC and TAB are connected to the cathode lead portion 11 via an ACF (anisotropic conductive film) to connect to the drive external circuit as an external terminal, but the ACF is connected. Since the cathode lead portion is made of the same material as the cathode lead portion 11 because it is appropriately selected depending on the compatibility with the external terminal, one type of ACF is sufficient, and the manufacturing cost can be reduced.
[0019]
Moreover, in the said Example, although the organic electroluminescent display panel was demonstrated to the example, it is applicable also to the light emission display panel using another light emitting material, or the light emission display panel using another light emission principle.
[0020]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to realize an electrode lead portion having excellent durability, and to realize a light emitting display panel that has a long life, high display quality, and stable production.
[Brief description of the drawings]
FIG. 1 is a diagram schematically showing an example of the structure of a conventional organic EL display panel.
FIG. 2 is a diagram schematically showing a configuration of an organic EL display panel according to a first embodiment of the present invention.
3 is a cross-sectional view schematically showing a structure of a conventional drawer connecting portion in FIG. 2. FIG.
FIG. 4 is a cross-sectional view for explaining the variation of the cathode film thickness at the connection end depending on the direction of vapor deposition.
FIG. 5 is a cross-sectional view for explaining contact corrosion in the drawer connecting portion of the two-layer structure of the first embodiment.
FIG. 6 is a top view schematically showing a configuration of an organic EL display panel according to a second embodiment of the present invention.
7 is a top view of the drawer connecting portion in FIG. 6 and a sectional view taken along line AA. FIG.
FIG. 8 is a top view schematically showing a configuration of an organic EL display panel according to a third embodiment of the present invention.
9 is a top view of the drawer connecting portion in FIG. 8 and a sectional view taken along line AA. FIG.
[Explanation of main part codes]
3 Glass substrate 5 Transparent electrode 7 Light emitting layer 9 Metal electrode 11 Cathode lead part 13 Lead connection part 15 ITO layer 16 refractory metal layer 19 Insulator 21 Through hole

Claims (9)

基板上に、少なくとも陽極、発光層及びアルミニウム（Ａｌ）を含む陰極がこの順で積層され、前記陽極と前記陰極が交差する発光領域を封入する封入手段を有する発光ディスプレイであって、
前記基板上には、前記陰極の各端部に接続される電極引出し部が形成され、前記電極引出し部はＩＴＯ層である透明導電体部と前記透明導電体部上に積層され、かつ前記陰極と比べて耐食性の高い高耐食性金属部とからなり、
前記電極引出し部の接続側端部には、これを被覆する絶縁体層が形成され、前記陰極は、前記絶縁体層上に乗り上げるように形成されるとともに、その端部が前記電極引出し部の前記絶縁体層に被覆されない部分に接続され、
前記陰極は前記高耐食性金属部の上面のみにおいて前記電極引出し部に接続され、少なくとも前記高耐食性金属部の一部は前記封入手段の外部に露出されていることを特徴とする発光ディスプレイパネル。A light-emitting display having a sealing means for sealing a light-emitting region where at least an anode, a light-emitting layer, and aluminum (Al) are stacked in this order on a substrate, and the anode and the cathode intersect with each other,
An electrode lead portion connected to each end portion of the cathode is formed on the substrate, and the electrode lead portion is laminated on the transparent conductor portion which is an ITO layer and the transparent conductor portion, and the cathode It consists of a highly corrosion-resistant metal part with higher corrosion resistance than
An insulating layer is formed on the connection-side end of the electrode lead-out portion, and the cathode is formed so as to run on the insulator layer. Connected to a portion not covered by the insulator layer;
The light emitting display panel according to claim 1, wherein the cathode is connected to the electrode lead-out portion only on the upper surface of the high corrosion resistance metal portion, and at least a part of the high corrosion resistance metal portion is exposed to the outside of the enclosing means. 基板上に、少なくとも陽極、発光層及びアルミニウム（Ａｌ）を含む陰極がこの順で積層され、前記陽極と前記陰極が交差する発光領域を封入する封入手段を有する発光ディスプレイであって、
前記基板上には、前記陰極の各端部に接続される電極引出し部が形成され、前記電極引出し部はＩＴＯ層である透明導電体部と前記透明導電体部上に積層され、かつ前記陰極と比べて耐食性の高い高耐食性金属部とからなり、
前記電極引出し部の接続側端部には、これを被覆するとともに前記電極引出し部の一部分を露出するスルーホールを有する絶縁体層が形成され、前記陰極は、前記絶縁体層上に乗り上げるように形成されるとともに、前記スルーホールを通じて前記電極引出し部と接続され、前記陰極は前記高耐食性金属部の上面のみにおいて前記電極引出し部に接続され、少なくとも前記高耐食性金属部の一部は前記封入手段の外部に露出されていることを特徴とする発光ディスプレイパネル。A light-emitting display having a sealing means for sealing a light-emitting region where at least an anode, a light-emitting layer, and aluminum (Al) are stacked in this order on a substrate, and the anode and the cathode intersect with each other,
An electrode lead portion connected to each end portion of the cathode is formed on the substrate, and the electrode lead portion is laminated on the transparent conductor portion which is an ITO layer and the transparent conductor portion, and the cathode It consists of a highly corrosion-resistant metal part with higher corrosion resistance than
An insulating layer having a through hole that covers and covers a portion of the electrode lead-out portion is formed at the connection-side end of the electrode lead-out portion, and the cathode runs on the insulator layer. Formed and connected to the electrode lead-out part through the through hole, the cathode is connected to the electrode lead-out part only on the upper surface of the high corrosion-resistant metal part, and at least a part of the high corrosion-resistant metal part is the sealing means A light-emitting display panel characterized by being exposed outside. 前記絶縁体層の前記陰極が乗り上げる部分は、傾斜面であることを特徴とする請求項１又は２記載の発光ディスプレイパネル。 The light emitting display panel according to claim 1 or 2, wherein a portion of the insulator layer on which the cathode rides is an inclined surface. 前記陰極は、蒸着法により形成されることを特徴とする請求項１ないし３のいずれか１に記載の発光ディスプレイパネル。 The light emitting display panel according to claim 1, wherein the cathode is formed by a vapor deposition method. 前記発光層は、有機ＥＬ（エレクトロルミネッセンス）材料からなることを特徴とする請求項１ないし４のいずれか１に記載の発光ディスプレイパネル。 The light emitting display panel according to claim 1, wherein the light emitting layer is made of an organic EL (electroluminescence) material. 互いに対向する陽極及びアルミニウム（Ａｌ）を含む陰極と、前記陽極及び陰極の間に形成される発光層と、を有し、前記陽極と前記陰極が交差する領域が発光領域となる発光ディスプレイパネルの製造方法であって、
基板上に、前記陽極を形成する陽極形成ステップと、前記発光層を形成する発光層形成ステップと、前記陰極を形成する陰極形成ステップと、をこの順で行って、
ＩＴＯ層である透明導電体部と前記透明導電体部上に積層され、かつ前記陰極と比べて耐食性の高い高耐食性金属部とからなり、各々が前記陰極の端部に接続される電極引出し部を形成する電極引出し部形成ステップを有し、前記電極引出し部形成ステップは前記陰極形成ステップの前に実行され、前記陰極は前記高耐食性金属部の上面のみにおいて前記電極引出し部に接続され、
前記陽極形成ステップと前記発光層形成ステップとの間に、前記陽極の縁部を覆う絶縁体層を形成する第１絶縁体層形成ステップを有し、前記電極引出し部形成ステップと前記陰極形成ステップとの間に、前記電極引出し部の前記陰極が接続される側の端部に第２絶縁体層を形成する第２絶縁体層形成ステップを有し、前記陰極は、前記第２絶縁体層上に乗り上げるように形成されるとともに、その端部が前記電極引出し部の前記第２絶縁体層に被覆されない部分に接続されることを特徴とする発光ディスプレイパネルの製造方法。A light emitting display panel, comprising: an anode and a cathode containing aluminum (Al) facing each other; and a light emitting layer formed between the anode and the cathode, wherein a region where the anode and the cathode intersect is a light emitting region. A manufacturing method comprising:
An anode forming step for forming the anode on the substrate, a light emitting layer forming step for forming the light emitting layer, and a cathode forming step for forming the cathode are performed in this order,
An electrode lead portion composed of a transparent conductor portion that is an ITO layer and a highly corrosion-resistant metal portion that is laminated on the transparent conductor portion and has a higher corrosion resistance than the cathode, each connected to an end portion of the cathode Forming an electrode lead portion forming step, wherein the electrode lead portion forming step is performed before the cathode forming step, and the cathode is connected to the electrode lead portion only on the top surface of the highly corrosion-resistant metal portion,
Between the anode forming step and the light emitting layer forming step, there is a first insulator layer forming step for forming an insulator layer covering an edge of the anode, and the electrode lead portion forming step and the cathode forming step between, it has a second insulator layer forming step of forming a second insulator layer on the end portion on the side where the cathode of the electrode lead-out portion is connected, the cathode, the second insulator layer A method of manufacturing a light-emitting display panel, wherein the light-emitting display panel is formed so as to run over, and an end portion of the electrode lead-out portion is connected to a portion not covered with the second insulator layer . 前記電極引出し部形成ステップは、前記陽極と同材料からなる第１引出し部を形成する第１引出し部形成ステップと、前記第１引出し部上に前記高耐食性金属部からなる第２引出し部を形成する第２引出し部形成ステップと、を含むことを特徴とする請求項６記載の発光ディスプレイパネルの製造方法。 The electrode lead portion forming step includes a first lead portion forming step for forming a first lead portion made of the same material as the anode, and a second lead portion made of the highly corrosion-resistant metal portion on the first lead portion. The manufacturing method of the light emission display panel of Claim 6 including the 2nd drawer | drawing-out part formation step to do. 前記第１引出し部形成ステップは前記陽極形成ステップと並行して実行されることを特徴とする請求項７記載の発光ディスプレイパネルの製造方法。 8. The method of manufacturing a light emitting display panel according to claim 7, wherein the first lead portion forming step is executed in parallel with the anode forming step. 前記第１絶縁体層形成ステップ及び前記第２絶縁体層形成ステップを並行して実行することを特徴とする請求項６記載の発光ディスプレイパネルの製造方法。 7. The method of manufacturing a light emitting display panel according to claim 6, wherein the first insulator layer forming step and the second insulator layer forming step are executed in parallel.
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