JP4270455B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP4270455B2 JP4270455B2 JP2004093630A JP2004093630A JP4270455B2 JP 4270455 B2 JP4270455 B2 JP 4270455B2 JP 2004093630 A JP2004093630 A JP 2004093630A JP 2004093630 A JP2004093630 A JP 2004093630A JP 4270455 B2 JP4270455 B2 JP 4270455B2
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- imaging device
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- 238000003384 imaging method Methods 0.000 title claims description 91
- 239000000758 substrate Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 4
- 239000006059 cover glass Substances 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Solid State Image Pick-Up Elements (AREA)
Description
25 固体撮像装置
27 撮像素子チップ
28 回路基板
29 電磁波吸収部材
32 ベアチップ
34 カバーガラス
34a 段差
36 第1接続端子
38 第2接続端子
39 GND線
43 ボンディングワイヤ
47 開口
Claims (3)
- 複数の受光素子が配列されているとともに、前記受光素子に電気的に接続されている第1の電極が1つ以上形成されているベアチップと、前記第1の電極と電気的に接続される第2の電極が形成され、前記ベアチップが実装される実装用基板と、前記第1の電極と前記第2の電極とを接続するボンディングワイヤとを備えた固体撮像装置において、
金属材料で形成されており、前記ベアチップの前記第1電極と、前記実装用基板の前記第2の電極と、前記ボンディングワイヤとを前記受光素子に入射する光を遮らないように覆うとともに、電磁波を吸収する電磁波吸収部材と、
前記ベアチップ及び前記実装用基板の少なくともどちらか一方に形成され、電磁波吸収部材が接続する接地部とを備えることを特徴とする固体撮像装置。 - 前記受光素子の受光面と対面する位置に、前記受光素子を保護する透過性の保護部材を設けるとともに、前記保護部材を露呈させる開口を前記電磁波吸収部材に形成したことを特徴とする請求項1記載の固体撮像装置。
- 前記保護部材の前記電磁波吸収部材に接する部分に、段差を形成するとともに、前記開口は、前記段差により形成された前記保護部材の凸部に嵌合可能な形状に形成されていることを特徴とする請求項2記載の固体撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004093630A JP4270455B2 (ja) | 2004-03-26 | 2004-03-26 | 固体撮像装置 |
US11/090,794 US7391002B2 (en) | 2004-03-26 | 2005-03-25 | Solid state imaging device having electromagnetic wave absorber attached to a mounting board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004093630A JP4270455B2 (ja) | 2004-03-26 | 2004-03-26 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
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JP2005286420A JP2005286420A (ja) | 2005-10-13 |
JP4270455B2 true JP4270455B2 (ja) | 2009-06-03 |
Family
ID=34988662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004093630A Expired - Fee Related JP4270455B2 (ja) | 2004-03-26 | 2004-03-26 | 固体撮像装置 |
Country Status (2)
Country | Link |
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US (1) | US7391002B2 (ja) |
JP (1) | JP4270455B2 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4332130B2 (ja) * | 2005-04-26 | 2009-09-16 | 新光電気工業株式会社 | カメラモジュール |
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JPH08236739A (ja) | 1995-02-28 | 1996-09-13 | Nippon Chemicon Corp | Ccdモジュールの封止構造 |
US5962854A (en) * | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
US6428650B1 (en) * | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
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JP3946051B2 (ja) | 2002-01-29 | 2007-07-18 | 三菱電機株式会社 | 高周波回路パッケージ |
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