JP4189808B2 - フレックスリジット配線板の配設方法 - Google Patents
フレックスリジット配線板の配設方法 Download PDFInfo
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- JP4189808B2 JP4189808B2 JP2003274469A JP2003274469A JP4189808B2 JP 4189808 B2 JP4189808 B2 JP 4189808B2 JP 2003274469 A JP2003274469 A JP 2003274469A JP 2003274469 A JP2003274469 A JP 2003274469A JP 4189808 B2 JP4189808 B2 JP 4189808B2
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- Japan
- Prior art keywords
- wiring board
- flex
- rigid wiring
- flexible
- flexible wiring
- Prior art date
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- Structure Of Printed Boards (AREA)
Description
1 フレキシブル配線板
11 絶縁フィルム
12 導電路
4,5 リジット配線板
41,51 第1の硬質基板(一方の硬質基板)
42,52 第2の硬質基板(他方の硬質基板)
3 接着剤
3a 余剰接着剤
41a,51a 端部
51a,52a 端部
Claims (1)
- 可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を2枚の硬質基板間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板の配設方法であって、
一方の硬質基板の端部を、他方の硬質基板の端部から奥まった状態にすることで段差部を構成し、前記段差部から前記フレキシブル配線板を引き出すとともに、奥まった状態にない突出端部を有する硬質基板の配設方向に向けて前記フレキシブル配線板を折り曲げて配設してなることを特徴とするフレックスリジット配線板の配設方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003274469A JP4189808B2 (ja) | 2003-07-15 | 2003-07-15 | フレックスリジット配線板の配設方法 |
Applications Claiming Priority (1)
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JP2003274469A JP4189808B2 (ja) | 2003-07-15 | 2003-07-15 | フレックスリジット配線板の配設方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005039052A JP2005039052A (ja) | 2005-02-10 |
JP4189808B2 true JP4189808B2 (ja) | 2008-12-03 |
Family
ID=34211413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003274469A Expired - Fee Related JP4189808B2 (ja) | 2003-07-15 | 2003-07-15 | フレックスリジット配線板の配設方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4189808B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009290193A (ja) * | 2008-04-28 | 2009-12-10 | Cmk Corp | リジッドフレックス多層プリント配線板とその製造方法 |
JP7311985B2 (ja) * | 2019-03-11 | 2023-07-20 | 日本シイエムケイ株式会社 | リジッド・フレックス多層プリント配線板 |
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2003
- 2003-07-15 JP JP2003274469A patent/JP4189808B2/ja not_active Expired - Fee Related
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JP2005039052A (ja) | 2005-02-10 |
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