JP4175343B2 - 半導体ペレット及び半導体装置 - Google Patents
半導体ペレット及び半導体装置 Download PDFInfo
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- JP4175343B2 JP4175343B2 JP2005180213A JP2005180213A JP4175343B2 JP 4175343 B2 JP4175343 B2 JP 4175343B2 JP 2005180213 A JP2005180213 A JP 2005180213A JP 2005180213 A JP2005180213 A JP 2005180213A JP 4175343 B2 JP4175343 B2 JP 4175343B2
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Description
なお、2列に電極パッドを配置した従来技術としては、例えば、下記の特許文献に示されるようなものがある。
tanθ=C/(P/2−S1/2)
∴θ= tan-1(2C/(P−S1)
以上説明したように第2の実施例の半導体ペレットでは第1の実施例で得た効果に加えて、ワイヤボンディングされた金属球が受けるストレスは低減されるという効果がある。
この第2の実施例の変形例では、第2の実施例で得た効果に加えて、金属層が蒸着またはめっきという手段で設けられているため生産が短時間で容易にできるという効果がある。
第3の実施例の変形例の半導体ペレットでは、図12(A)に示すように、第1の電極パッド2の内側に第2のダミー電極パッド70を設けている。第2のダミー電極パッド70は配線4によって第1の電極パッド2と電気的に接続されている。第2のダミー電極パッド70上にはダミー電極パッド40と同様に金属層71が設けられている。金属層71の厚さ及び形成方法は金属層51と同様であるのでその説明は省略する。
第3の実施例の変形例では、第3の実施例の効果に加えて、第1の電極パッド2の電気動作試験においても第2の電極パッドの電気動作試験と同様な効果が得られるという効果がある。
第4の実施例の半導体ペレットでは、図14(A)に示すように、第1の電極パッド2の内側に第3の電極パッド80が設けている。第3の電極パッド80は配線4によって第2の電極パッド3と電気的に接続されている。その他の点については第1の実施例の半導体ペレットと同様であるのでその説明は省略する。
2・・・第1の電極パッド
3・・・第2の電極パッド
4・・・配線
Claims (5)
- 中央部に集積回路が形成され、周辺部に複数の第1の電極パッドが列状に配置され、複数の第2の電極パッドが前記第1の電極パッドより外側で前記第1の電極パッドの列と並行に列状に配置される半導体ペレットにおいて、
前記半導体ペレットの辺に沿った前記第2の電極パッドの辺の長さは、前記半導体ペレットの辺に沿った前記第1の電極パッドの辺の長さよりも長く、
複数の前記第1の電極パッドの各々は隣り合う他の第1の電極パッドと所定の間隔離間されて配置され、
複数の前記第2の電極パッドには、その中心が第1の電極パッド間の中央に位置するように配置されたもの、第1の電極パッド間の中央から前記半導体ペレットの角部よりにずれて位置するよう配置されたものとを含み、
複数の前記第2の電極パッドの各々は対応する第1の電極パッド間に設けられる配線によって前記集積回路と電気的に接続されること、
を特徴とする半導体ペレット。 - 前記第1の電極パッドの各々は所定の長さの辺からなる略正方形状であり、前記第2の電極パッドの各々は短辺の長さが前記所定の長さである長方形状であることを特徴とする請求項1記載の半導体ペレット。
- 請求項1または請求項2記載の前記半導体ペレットと外部端子とを有し、前記第1及び前記第2の電極パッドは該外部端子とワイヤボンディングにて電気的に接続されてなることを特徴とする半導体装置。
- 請求項1または請求項2記載の前記半導体ペレットと基板とを有し、前記第1及び前記第2の電極パッドは該基板とワイヤボンディングにて電気的に接続されてなることを特徴とする半導体装置。
- 請求項3または請求項4記載の半導体装置において、前記第1の電極パッドにワイヤボンディングにて接続される金属細線の軌道の高さは前記第2の電極パッドにワイヤボンディングにて接続される金属細線の軌道の高さと異なることを特徴とする半導体装置。
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Application Number | Priority Date | Filing Date | Title |
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JP2005180213A JP4175343B2 (ja) | 2005-06-21 | 2005-06-21 | 半導体ペレット及び半導体装置 |
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JP2005180213A JP4175343B2 (ja) | 2005-06-21 | 2005-06-21 | 半導体ペレット及び半導体装置 |
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JP2003365824A Division JP3706379B2 (ja) | 2003-10-27 | 2003-10-27 | 半導体ペレット |
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JP2006013497A JP2006013497A (ja) | 2006-01-12 |
JP4175343B2 true JP4175343B2 (ja) | 2008-11-05 |
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