JP4100315B2 - 電気光学装置の製造方法 - Google Patents
電気光学装置の製造方法 Download PDFInfo
- Publication number
- JP4100315B2 JP4100315B2 JP2003337820A JP2003337820A JP4100315B2 JP 4100315 B2 JP4100315 B2 JP 4100315B2 JP 2003337820 A JP2003337820 A JP 2003337820A JP 2003337820 A JP2003337820 A JP 2003337820A JP 4100315 B2 JP4100315 B2 JP 4100315B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive particles
- substrate
- semiconductor device
- electro
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
また、前記接着材には導電性粒子が含有されていないことを特徴とする。
また、前記接着する工程において、前記半導体装置の前記第1の基板と対向する面及び前記半導体装置の側面の一部が、前記接着材に覆われることを特徴とする。
Claims (5)
- 第1の基板と、該第1の基板にシール材を介して対向配置される第2の基板とを備え、前記第1の基板が前記第2の基板から張り出した張り出し部分に設けられる実装領域に、前記シール材の内側から外側に導電パターンが引き出されてなる複数の第1の配線部分と、フレキシブル配線基板と電気的に接続する複数の第2の配線部分とが形成されており、前記第1及び第2の配線部分と半導体装置の複数の第1及び第2の電極端子とをそれぞれ導通させて実装する電気光学装置の製造方法であって、
弾性を有する樹脂ボールの表面を導電材料で被覆し、該導電材料を覆うように樹脂層を形成し導電性粒子を形成する工程と、
前記複数の第1及び第2の電極端子のバンプ上に前記導電性粒子を散布して前記導電性粒子を前記バンプの表面に埋め込む工程と、
前記バンプ間に散布された前記導電性粒子を除去する工程と、
前記実装領域に接着材を配置する工程と、
前記半導体装置のバンプと前記接着材とを対向させた状態で前記半導体装置と前記第1の基板とを位置合わせして加熱または紫外線照射しながら圧接し、前記半導体装置を前記第1の基板に接着する工程とを有し、
前記接着する工程において、前記半導体装置を前記第1の基板に圧接することにより、前記導電性粒子を弾性変形させ、前記樹脂層から前記導電材料を露出させることにより、前記複数の第1の配線部分と前記複数の第1の電極端子とをそれぞれ導通させると共に、前記複数の第2の配線部分と前記複数の第2の電極端子とをそれぞれ導通させることを特徴とする電気光学装置の製造方法。 - 前記接着材には導電性粒子が含有されていないことを特徴とする請求項1に記載の電気光学装置の製造方法。
- 前記接着する工程において、前記半導体装置の前記第1の基板と対向する面及び前記半導体装置の側面の一部が、前記接着材に覆われることを特徴とする請求項1に記載の電気光学装置の製造方法。
- 前記バンプを金(Au)により構成することを特徴とする請求項1〜3のいずれかに記載の電気光学装置の製造方法。
- 前記バンプ上の導電性粒子を押圧して前記バンプ内に押し込む工程を有することを特徴とする請求項1〜3のいずれかに記載の電気光学装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003337820A JP4100315B2 (ja) | 2003-09-29 | 2003-09-29 | 電気光学装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003337820A JP4100315B2 (ja) | 2003-09-29 | 2003-09-29 | 電気光学装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005108992A JP2005108992A (ja) | 2005-04-21 |
JP2005108992A5 JP2005108992A5 (ja) | 2006-04-13 |
JP4100315B2 true JP4100315B2 (ja) | 2008-06-11 |
Family
ID=34533529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003337820A Expired - Fee Related JP4100315B2 (ja) | 2003-09-29 | 2003-09-29 | 電気光学装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4100315B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101309319B1 (ko) | 2006-11-22 | 2013-09-13 | 삼성디스플레이 주식회사 | 액정표시장치 구동회로 및 그의 제조방법과 액정표시장치구동회로가 실장 된 액정표시장치 |
-
2003
- 2003-09-29 JP JP2003337820A patent/JP4100315B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005108992A (ja) | 2005-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100516597B1 (ko) | 반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기 | |
US7940366B2 (en) | Display device including substrates bonded together through an adhesive | |
US7164460B2 (en) | Mounting structure for semiconductor device, electro-optical device, and electronic apparatus | |
US7470986B2 (en) | Mounting structure, electro-optical device, and electronic apparatus | |
JP3284262B2 (ja) | 液晶表示装置及びそれを用いた電子機器 | |
KR20180070783A (ko) | 표시 장치 및 이의 제조 방법 | |
JP2001230511A (ja) | 接続構造、電気光学装置および電子機器 | |
US7253808B2 (en) | Touch screen system and display device using the same | |
KR20160089014A (ko) | 가요성 표시 장치 | |
JP3025256B1 (ja) | 表示パネルへのtcpフィルムの実装方法 | |
KR20120139115A (ko) | 표시 장치 및 그 제조 방법 | |
JP3624729B2 (ja) | Icチップ、ic構造体、液晶装置及び電子機器 | |
KR101838720B1 (ko) | 액정 표시 장치 | |
JP2007250825A (ja) | 基板の接続構造及びその製造方法 | |
JP4100315B2 (ja) | 電気光学装置の製造方法 | |
KR20080031311A (ko) | 접속 구조체의 제조 방법 | |
JP2002063958A (ja) | 電気光学装置および電子機器 | |
US20140132895A1 (en) | Liquid crystal display device and production method thereof | |
JP2004087940A (ja) | 電子部品の実装基板、電気光学装置、電気光学装置の製造方法及び電子機器 | |
KR20160080249A (ko) | 터치 스크린 일체형 표시 장치 및 이의 제조 방법 | |
KR20080020841A (ko) | 표시 패널의 전극 접속 장치 및 그 방법 | |
JP2005167274A (ja) | 半導体装置、半導体装置の製造方法並びに液晶表示装置 | |
KR101916200B1 (ko) | 터치윈도우 및 그 제조방법 | |
KR100683307B1 (ko) | 두께 편차를 갖는 이방성 도전 필름 | |
JP3684886B2 (ja) | 半導体チップの実装構造、液晶装置及び電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060227 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060227 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20070403 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071126 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071211 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080201 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080226 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080310 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120328 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120328 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130328 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140328 Year of fee payment: 6 |
|
LAPS | Cancellation because of no payment of annual fees |