JP4084831B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP4084831B2 JP4084831B2 JP2007116901A JP2007116901A JP4084831B2 JP 4084831 B2 JP4084831 B2 JP 4084831B2 JP 2007116901 A JP2007116901 A JP 2007116901A JP 2007116901 A JP2007116901 A JP 2007116901A JP 4084831 B2 JP4084831 B2 JP 4084831B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- light emitting
- frame
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Led Device Packages (AREA)
Description
、そのような面を安定かつ効率よく形成することが困難となる傾向にある。したがって、貫通穴4aの内周面の算術平均粗さRaは0.004〜4μmが好ましい。
光素子5の熱であるチップジャンクション温度が65℃以上になり、発光素子5に加わる熱的負荷が大きくなり、1万時間を超える寿命を確保するのが困難になる。100W/m・K以上では、駆動電流値が20mAであっても発光素子5のジャンクション温度が50℃以下になり、1万時間を超える寿命の確保ができるとともに、さらに大きな駆動電流を入力することができ、発光素子5の光出力を向上させることができる。
2:基体
2a:搭載部
3:第1枠体
3a:配線導体
4:第2枠体
5:発光素子
Claims (2)
- 金属材料からなり、突出部を有する基体と、
絶縁材料からなり、前記突出部を囲む第1枠体と、
前記第1枠体部内に設けられており、前記第1の枠体の下面に導出された配線導体と、
ボンディングワイヤを介して前記配線導体に電気的に接続されており、前記突出部上に設けられた発光素子と、
前記基体の下面の高さ位置と前記第1の枠体の下面との間に設けられており、前記第1の枠体の下面において前記配線導体に電気的に接続されたリード端子と、
を備えた発光装置。 - 前記発光素子を覆っている透明樹脂をさらに備えたことを特徴とする請求項1記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007116901A JP4084831B2 (ja) | 2007-04-26 | 2007-04-26 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007116901A JP4084831B2 (ja) | 2007-04-26 | 2007-04-26 | 発光装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003012720A Division JP4009208B2 (ja) | 2003-01-21 | 2003-01-21 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007221166A JP2007221166A (ja) | 2007-08-30 |
JP4084831B2 true JP4084831B2 (ja) | 2008-04-30 |
Family
ID=38498026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007116901A Expired - Fee Related JP4084831B2 (ja) | 2007-04-26 | 2007-04-26 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4084831B2 (ja) |
-
2007
- 2007-04-26 JP JP2007116901A patent/JP4084831B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007221166A (ja) | 2007-08-30 |
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