JP4031784B2 - 発光モジュールおよびその製造方法 - Google Patents
発光モジュールおよびその製造方法 Download PDFInfo
- Publication number
- JP4031784B2 JP4031784B2 JP2004220850A JP2004220850A JP4031784B2 JP 4031784 B2 JP4031784 B2 JP 4031784B2 JP 2004220850 A JP2004220850 A JP 2004220850A JP 2004220850 A JP2004220850 A JP 2004220850A JP 4031784 B2 JP4031784 B2 JP 4031784B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light emitting
- emitting module
- conductive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims description 120
- 239000010410 layer Substances 0.000 claims description 62
- 239000012790 adhesive layer Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000011521 glass Substances 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 24
- 229910052709 silver Inorganic materials 0.000 description 22
- 239000004332 silver Substances 0.000 description 22
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 20
- 239000005038 ethylene vinyl acetate Substances 0.000 description 20
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Description
また、本発明の発光モジュールは、チップLEDを用いることで、導電性ペーストなどにより形成された回路パターンの隙間23から透光性を有する第2基板の側への発光もしくは第1基板での反射光によって、両面から発光体を視認することができるので、道路中央分離帯の警告灯もしくは路側帯の警告灯、道路コーナー部などでの路側帯照明などに用いることが可能となる。
2:導電層
3:導電性接着層
4:チップLED(発光素子)
5:透明接着層
6:第2基板
7:配線
8:接着層
9:第3基板
10:回路パターン
22:ランドパターン
23:隙間
31:構造体
111:構造体
Claims (13)
- 透光性を有し絶縁性を有する第1基板の上に、少なくとも、導電層、導電性接着層、所定個数の発光素子群が順次積層されてなる構造体が、透光性を有する第2基板と、第3基板との間にそれぞれ接着層を介して挟まれた構造を備えてなり、導電層が、発光素子群を発光させるための回路パターンを有しており、第3基板と接着層との間に、第3基板の全表面または一部表面を覆う反射層が設けられていることを特徴とする発光モジュール。
- 透光性を有し絶縁性を有する第1基板の上に、少なくとも、導電層、導電性接着層および所定個数の発光素子群が順次積層されてなる複数の構造体が、透光性を有する第2基板と、第3基板との間にそれぞれ接着層を介して挟まれた構造を備えてなり、導電層が、発光素子群を発光させるための回路パターンを有しており、第3基板と接着層との間に、第3基板の全表面または一部表面を覆う反射層が設けられていることを特徴とする発光モジュール。
- 第1基板および第2基板がフィルム、ガラス基板またはプラスチック基板からなる請求項1または2に記載の発光モジュール。
- 導電層が、導電性ペースト、金属箔または金属膜からなる請求項1または2に記載の発光モジュール。
- 第1基板が、内部に金属箔層または金属膜層を有している請求項1または2に記載の発光モジュール。
- 回路パターンは、直列状に接続される発光素子群の複数列がさらに並列状に接続されるパターンである請求項1または2に記載の発光モジュール。
- 透明接着層が、低温架橋型EVAからなる請求項1または2に記載の発光モジュール。
- 第3基板が、フィルム、ガラス基板またはプラスチック基板からなる請求項1または2に記載の発光モジュール。
- 請求項1または2に記載の発光モジュールの製造方法であって、第1基板の上に導電性ペーストを所定パターンで印刷または塗布し、その後、同ペーストを熱硬化させることで、導電層の回路パターンを得ることを特徴とする発光モジュールの製造方法。
- 請求項1または2に記載の発光モジュールの製造方法であって、第1基板の上に金属箔を接着剤によりラミネートし、この金属箔の上にレジスト材を塗布し、次いで、所定パターンで露光し、現像し、不要部分をエッチングにより除去し、その後、レジスト材を取り除くことで、導電層の回路パターンを得ることを特徴とする発光モジュールの製造方法。
- 請求項1または2に記載の発光モジュールの製造方法であって、第1基板の上に金属膜を蒸着またはスパッタリングにより成膜し、この金属膜の上にレジスト材を塗布し、次いで、所定パターンで露光し、現像し、不要部分をエッチングにより除去し、その後、レジスト材を取り除くことで、導電層の回路パターンを得ることを特徴とする発光モジュールの製造方法。
- 請求項1または2に記載の発光モジュールの製造方法であって、発光素子群を導電性接着層により導電層に接着させるに際し、第1基板の上に、接着用導電性ペーストにより導電性接着層の所定パターンを形成し、同パターンの上に発光素子群を実装し、その後、同ペーストを熱硬化させることを特徴とする発光モジュールの製造方法。
- 請求項1または2に記載の発光モジュールの製造方法であって、発光素子群を導電性接着層により導電層に接着させるに際し、第1基板の上に、クリーム半田により導電性接着層の所定パターンを形成し、同パターンの上に発光素子群を実装し、その後、リフロー炉による加熱処理を行うことを特徴とする発光モジュールの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004220850A JP4031784B2 (ja) | 2004-07-28 | 2004-07-28 | 発光モジュールおよびその製造方法 |
PCT/JP2005/013752 WO2006011522A1 (ja) | 2004-07-28 | 2005-07-27 | 発光モジュールおよびその製造方法 |
EP05767394.9A EP1788640A4 (en) | 2004-07-28 | 2005-07-27 | Light-emitting module and manufacturing method therefor |
US11/658,309 US20080284330A1 (en) | 2004-07-28 | 2005-07-27 | Light Emitting Module, and Method for Producing the Same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004220850A JP4031784B2 (ja) | 2004-07-28 | 2004-07-28 | 発光モジュールおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006041290A JP2006041290A (ja) | 2006-02-09 |
JP4031784B2 true JP4031784B2 (ja) | 2008-01-09 |
Family
ID=35786272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004220850A Expired - Fee Related JP4031784B2 (ja) | 2004-07-28 | 2004-07-28 | 発光モジュールおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080284330A1 (ja) |
EP (1) | EP1788640A4 (ja) |
JP (1) | JP4031784B2 (ja) |
WO (1) | WO2006011522A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140099396A (ko) * | 2013-02-01 | 2014-08-12 | 주식회사 아모그린텍 | 디스플레이 전극용 전극 패턴 형성방법 및 이에 의해 형성된 전극 패턴을 구비하는 디스플레이 전극 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007305621A (ja) * | 2006-05-08 | 2007-11-22 | New Paradigm Technology Inc | 発光構造物 |
JP4382788B2 (ja) * | 2006-09-11 | 2009-12-16 | シャープ株式会社 | 発光モジュール |
WO2009016581A2 (en) * | 2007-08-02 | 2009-02-05 | Koninklijke Philips Electronics N.V. | Light output device |
DE102008022414B4 (de) * | 2008-05-06 | 2013-03-14 | Rüdiger Lanz | Leuchtmittel zur Verwendung in einer Straßenbeleuchtung sowie eine Vorrichtung zur Straßenbeleuchtung |
TW201123125A (en) * | 2009-12-21 | 2011-07-01 | Aussmak Optoelectronic Corp | Light transmissible display apparatus |
IT1397437B1 (it) * | 2009-12-30 | 2013-01-10 | Europ Marchini S R L | Dispositivo di illuminazione a doppia faccia ad energia solare, in particolare per tende e tessuti. |
TWI520386B (zh) * | 2010-07-29 | 2016-02-01 | 神基科技股份有限公司 | 發光二極體總成的結構與其製造方法 |
US8573804B2 (en) * | 2010-10-08 | 2013-11-05 | Guardian Industries Corp. | Light source, device including light source, and/or methods of making the same |
WO2013143589A1 (en) * | 2012-03-28 | 2013-10-03 | V&R Electrics Solar Company | Lighting device comprising one or more solar cell and led |
JP2012216555A (ja) * | 2012-06-06 | 2012-11-08 | New Paradigm Technology Inc | 発光構造物 |
CN102927483A (zh) * | 2012-11-20 | 2013-02-13 | 田茂福 | 一体化倒装型led照明组件 |
CN103094453A (zh) * | 2013-01-05 | 2013-05-08 | 王知康 | 一种卡片式led照明光源的制造方法 |
CN107768362B (zh) * | 2013-03-28 | 2020-09-08 | 东芝北斗电子株式会社 | 发光装置及其制造方法 |
DE102013211457A1 (de) * | 2013-06-19 | 2014-12-24 | Osram Gmbh | Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe |
CA2938049A1 (en) * | 2014-01-27 | 2015-07-30 | Shanghai Sansi Electronic Engineering Co., Ltd | Led lighting device and lamp shade, and circuit preparation method thereof |
CA2938027A1 (en) * | 2014-01-27 | 2015-07-30 | Shanghai Sansi Electronic Engineering Co., Ltd | Led lighting device |
CN103791439B (zh) * | 2014-01-27 | 2015-05-06 | 上海三思电子工程有限公司 | 新型led照明装置 |
JP2016192449A (ja) * | 2015-03-30 | 2016-11-10 | 大日本印刷株式会社 | 一体型led素子用基板 |
JP6746908B2 (ja) * | 2015-12-25 | 2020-08-26 | 大日本印刷株式会社 | シースルー型のled表示装置及びそれを用いたled表示システム |
CN107093659B (zh) * | 2016-09-30 | 2019-11-01 | 深圳市玲涛光电科技有限公司 | 柔性面光源及其制造方法及电子设备 |
CN106848037B (zh) * | 2017-03-31 | 2017-12-15 | 谊美吉斯光电科技(福建)有限公司 | 带电压补偿的双层导电led光电玻璃及其制造工艺 |
EP3406962A1 (en) * | 2017-05-24 | 2018-11-28 | OSRAM GmbH | A lighting device and corresponding method |
EP3406961A1 (en) * | 2017-05-24 | 2018-11-28 | OSRAM GmbH | A light-emitting device and corresponding method |
CN113261120B (zh) * | 2019-11-27 | 2023-03-24 | 鹏鼎控股(深圳)股份有限公司 | 多面发光电路板及其制作方法 |
CN112856312A (zh) * | 2021-01-15 | 2021-05-28 | 上海绿政机电工程有限公司 | 一种多功能幕墙灯具 |
CN113183566B (zh) * | 2021-04-25 | 2021-11-26 | 合肥达视光电科技有限公司 | 一种具有贴膜线路的光电玻璃及生产工艺 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3757511A (en) * | 1971-05-17 | 1973-09-11 | Motorola Inc | Light emitting diode display for electronic timepiece |
JPS6149482A (ja) * | 1984-08-17 | 1986-03-11 | Sanyo Electric Co Ltd | 光起電力装置 |
US4845405A (en) * | 1986-05-14 | 1989-07-04 | Sanyo Electric Co., Ltd. | Monolithic LED display |
JPH0343687U (ja) * | 1989-09-06 | 1991-04-24 | ||
JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
JP3694085B2 (ja) * | 1996-02-27 | 2005-09-14 | ローム株式会社 | 面発光照明装置 |
DE10008203B4 (de) * | 2000-02-23 | 2008-02-07 | Vishay Semiconductor Gmbh | Verfahren zum Herstellen elektronischer Halbleiterbauelemente |
JP2001351418A (ja) * | 2000-06-07 | 2001-12-21 | Showa Shell Sekiyu Kk | 太陽光発電利用発光モジュール |
JP2002299694A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | 照明用led光源デバイス及び照明器具 |
AU2001277779B2 (en) * | 2001-08-13 | 2005-04-07 | Sphelar Power Corporation | Semiconductor device and method of its manufacture |
JP3851541B2 (ja) * | 2001-10-24 | 2006-11-29 | ローム株式会社 | チップ部品およびその製造方法 |
JP4161042B2 (ja) * | 2002-02-14 | 2008-10-08 | 株式会社アーテックインターナショナル | 表示用光源装置 |
JP2003303504A (ja) * | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | 発光ダイオードを用いた照明器具 |
GB0216787D0 (en) * | 2002-07-19 | 2002-08-28 | Pilkington Plc | Laminated glazing panel |
US7084935B2 (en) * | 2002-08-28 | 2006-08-01 | Adaptive Micro Systems, Llc | Display device with molded light guide |
JP2004127135A (ja) * | 2002-10-04 | 2004-04-22 | Konica Minolta Holdings Inc | 認証識別カード及び認証識別カードの製造方法 |
CN100585274C (zh) * | 2002-10-25 | 2010-01-27 | 森山产业株式会社 | 发光模块 |
BE1015302A3 (fr) * | 2003-01-10 | 2005-01-11 | Glaverbel | Vitrage comportant des composants electroniques. |
US7380690B2 (en) * | 2003-01-17 | 2008-06-03 | Ricoh Company, Ltd. | Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate |
JP4397394B2 (ja) * | 2003-01-24 | 2010-01-13 | ディジタル・オプティクス・インターナショナル・コーポレイション | 高密度照明システム |
US20060043382A1 (en) * | 2003-02-07 | 2006-03-02 | Nobuyuki Matsui | Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus |
JP4607429B2 (ja) * | 2003-03-25 | 2011-01-05 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
JP4135565B2 (ja) * | 2003-06-06 | 2008-08-20 | 松下電器産業株式会社 | 電子回路装置およびその製造方法 |
US7391153B2 (en) * | 2003-07-17 | 2008-06-24 | Toyoda Gosei Co., Ltd. | Light emitting device provided with a submount assembly for improved thermal dissipation |
US20050116235A1 (en) * | 2003-12-02 | 2005-06-02 | Schultz John C. | Illumination assembly |
US6881980B1 (en) * | 2004-06-17 | 2005-04-19 | Chunghwa Picture Tubes, Ltd. | Package structure of light emitting diode |
-
2004
- 2004-07-28 JP JP2004220850A patent/JP4031784B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-27 US US11/658,309 patent/US20080284330A1/en not_active Abandoned
- 2005-07-27 EP EP05767394.9A patent/EP1788640A4/en not_active Withdrawn
- 2005-07-27 WO PCT/JP2005/013752 patent/WO2006011522A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140099396A (ko) * | 2013-02-01 | 2014-08-12 | 주식회사 아모그린텍 | 디스플레이 전극용 전극 패턴 형성방법 및 이에 의해 형성된 전극 패턴을 구비하는 디스플레이 전극 |
KR102075636B1 (ko) | 2013-02-01 | 2020-02-12 | 주식회사 아모그린텍 | 디스플레이 전극용 전극 패턴 형성방법 및 이에 의해 형성된 전극 패턴을 구비하는 디스플레이 전극 |
Also Published As
Publication number | Publication date |
---|---|
JP2006041290A (ja) | 2006-02-09 |
EP1788640A1 (en) | 2007-05-23 |
US20080284330A1 (en) | 2008-11-20 |
WO2006011522A1 (ja) | 2006-02-02 |
EP1788640A4 (en) | 2014-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4031784B2 (ja) | 発光モジュールおよびその製造方法 | |
US10801704B2 (en) | Light emitting device | |
US7791089B2 (en) | LED packaging methods and LED-based lighting products | |
JP6540098B2 (ja) | 発光装置 | |
US10134714B2 (en) | Flexible circuit board for LED lighting fixtures | |
JP2006344978A (ja) | Ledパッケージ及びその製造方法、並びにそれを利用したledアレイモジュール | |
CN211375271U (zh) | 背光源灯板、背光源和显示装置 | |
WO2015083364A1 (ja) | 発光装置 | |
US20200279983A1 (en) | Light emitting device and method of manufacturing light emitting device | |
CN113168046B (zh) | 驱动基板及其制作方法、显示装置 | |
KR101121687B1 (ko) | 플렉서블 led 패키지 | |
US20060081833A1 (en) | Package structure of light-emitting device | |
US20120300457A1 (en) | Light-emitting device | |
KR101189401B1 (ko) | 연성 회로기판 및 그의 제조 방법 | |
KR101161408B1 (ko) | 발광 다이오드 패키지 및 그의 제조 방법 | |
CN111816752A (zh) | Mini LED制备方法及Mini LED | |
CN111580305A (zh) | 一种背光模组 | |
JP6733716B2 (ja) | 発光装置 | |
KR102063519B1 (ko) | 인쇄회로기판 및 이를 갖는 광원 모듈 | |
KR101101776B1 (ko) | 발광 장치 및 이의 제조방법 | |
US20130105842A1 (en) | Light-Emitting Module and Illumination Device | |
JP2017058634A (ja) | 融雪機能付led情報表示パネル及びled情報表示装置 | |
CN116577756A (zh) | 一种在激光雷达盖板上制作加热功能层的方法及激光雷达盖板 | |
CN103629557A (zh) | 光源模块及其制作方法 | |
TWM403601U (en) | Light emitting diode device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070227 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070427 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070822 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071016 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071019 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101026 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111026 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121026 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131026 Year of fee payment: 6 |
|
LAPS | Cancellation because of no payment of annual fees |