WO2015083364A1 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- WO2015083364A1 WO2015083364A1 PCT/JP2014/005998 JP2014005998W WO2015083364A1 WO 2015083364 A1 WO2015083364 A1 WO 2015083364A1 JP 2014005998 W JP2014005998 W JP 2014005998W WO 2015083364 A1 WO2015083364 A1 WO 2015083364A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- light
- emitting device
- internal wiring
- wiring
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 15
- 229910001111 Fine metal Inorganic materials 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000059 patterning Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000009429 electrical wiring Methods 0.000 description 5
- 239000012787 coverlay film Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
Definitions
- the present invention relates to a light emitting device having a light emitting element embedded in a light-transmitting and flexible insulator.
- LEDs Light emitting devices using light emitting diodes
- optical devices such as indoor, outdoor, stationary, and mobile display devices, display lamps, various switches, signal devices, and general lighting. Yes.
- a plurality of LED elements are sandwiched between a pair of insulating substrates having translucency and flexibility, and a plurality of LEDs are filled with a translucent resin between the insulating substrates.
- a light emitting device formed by embedding an element in a transparent resin is known.
- electrical wiring for lighting the LED element is also embedded in the transparent resin together with the LED element. For this reason, transparency and flexibility are required also for the electric wiring to be embedded. Therefore, as the electrical wiring, for example, a mesh wiring formed of a thin wire made of a material having relatively high conductivity such as silver, or a transparent wiring formed by processing an ITO (Indium Tin Oxide) film, Used.
- ITO Indium Tin Oxide
- an object of the present invention is to provide a resin-embedded light emitting device including an external wiring portion that can be easily connected to an external device or the like.
- a light-emitting device is a flexible light-emitting device, and includes a light-emitting unit and an external wiring connected to the light-emitting unit.
- the light emitting unit includes a pair of light-transmitting and flexible insulating substrates, a plurality of light emitting elements arranged between the pair of insulating substrates, and an inner surface of at least one of the pair of insulating substrates.
- the end portion of the external wiring is divided into a plurality of wirings having a line width narrower than the line width of the internal wiring.
- the end portion of the internal wiring pattern is joined to the end portion of the external wiring divided into the plurality of wirings by an anisotropic conductive adhesive at the end portion of the insulating substrate.
- FIG. 1 is a schematic side view illustrating a schematic configuration of a light emitting device according to an embodiment of the present invention.
- FIG. 1B is a cross-sectional view of the light emitting device taken along one-dot chain line XX ′ in FIG.
- XX ′ is a top view which shows an example of an internal wiring pattern typically.
- FIG. 5 is a schematic cross-sectional view of a joint portion taken along a dashed line YY ′ in FIG.
- FIG. 5 which shows a junction part. It is a figure for demonstrating the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: It is sectional drawing corresponding to FIG. 2 which shows a light emission part. It is a figure for demonstrating the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: It is sectional drawing corresponding to FIG. 5 which shows a junction part. It is a figure for demonstrating the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: It is sectional drawing corresponding to FIG. 2 which shows a light emission part.
- a resin-embedded light emitting device (hereinafter referred to as a light emitting device) according to an embodiment of the present invention will be described.
- FIG. 1A is a schematic top view showing a schematic configuration of a light-emitting device according to the embodiment
- FIG. 1B is a side view showing a schematic configuration of the light-emitting device according to the embodiment.
- FIG. 2 is a cross-sectional view of the light emitting device taken along one-dot chain line XX ′ in FIG. 1A.
- the light emitting device 10 includes, for example, a light emitting unit 11 having a plurality of light emitting diode elements 15 (hereinafter referred to as LED elements 15) as a plurality of light emitting elements, a power source, and the like.
- An external wiring unit 12 that electrically connects an external device (hereinafter referred to as an external device or the like) (not shown) and the light emitting unit 11, and between the light emitting unit 11 and the external wiring unit 12, A joint portion 13 that electrically connects the external wiring portion 12 is provided.
- the translucent insulating sheet 14 includes a first translucent insulating substrate 16 and a second translucent insulating substrate 17 in the light emitting unit 11.
- the twelve LED elements 15 are arranged between the first translucent insulating substrate 16 and the second translucent insulating substrate 17. At least one of the pair of translucent insulating substrates 16 and 17, for example, the inner surface of the first translucent insulating substrate 16, that is, the surface facing the second translucent insulating substrate 17, A translucent internal wiring pattern 18 connected to the LED element 15 is deposited.
- thermoplastic and insulating light-transmitting resin layer 19 is also filled between the pair of light-transmitting insulating substrates 16 and 17.
- the twelve LED elements 15 and the internal wiring pattern 18 connected thereto are buried between the pair of insulating substrates 16 and 17 by the translucent resin layer 19.
- the first light-transmitting insulating substrate 16 and the second light-transmitting insulating substrate 17 are each made of a sheet-like resin material having insulating properties, light-transmitting properties, and flexibility.
- the sheet-like resin material include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethylene succinate (PES), and cyclic olefin resin (for example, Arton (trade name) manufactured by JSR).
- An acrylic resin or the like is used.
- the light transmittance of these substrates 16 and 17 is 90% or more, preferably 95% or more.
- These substrates 16 and 17 preferably have a thickness in the range of 50 to 300 ⁇ m from the viewpoint of flexibility and translucency of these substrates 16 and 17.
- the internal wiring pattern 18 provided on the surface of the first translucent insulating substrate 16 is formed on the entire surface of the first translucent insulating substrate 16, for example. It is formed by patterning an ITO film formed by depositing indium tin oxide (ITO). In patterning, the ITO film formed by vapor deposition is partially removed by laser processing, etching, or the like, and the underlying first light-transmissive insulating substrate 16 is exposed, so that a straight line having a minute width is formed on the ITO film. This is done by forming a shaped insulating region 20.
- ITO indium tin oxide
- the internal wiring pattern 18 includes a linear internal wiring pattern 18a having a wide line width, a plurality of minute wiring pieces 18b surrounded by the insulating region 20 and arranged linearly, and the first and second internal wiring patterns 18a.
- the wiring end portions 18c and 18d are configured.
- the plurality of LED elements 15 are connected in series to the first and second internal wiring end portions 18c and 18d as a whole by connecting positive and negative electrodes between the plurality of adjacent minute wiring pieces 18b. ing.
- ITO wiring has higher electrical resistance than metal wiring materials such as copper and aluminum. Accordingly, when the internal wiring pattern 18 is an ITO wiring as described above, the ITO wiring can maintain its translucency and reduce its own electrical resistance by increasing the line width of the wiring. Become.
- FTO fluorine-doped tin oxide
- IZO indium zinc oxide
- the internal wiring pattern 18 may be formed by patterning a fine metal wire made of Ag or the like on the entire surface of the first translucent insulating substrate 16. Good.
- the patterning is performed by partially cutting a mesh-like fine metal wire by laser processing or etching.
- the metal wiring material such as Ag does not have translucency
- the mesh-like metal fine wire can maintain translucency by thinning it and meshing it. Since such a mesh wiring uses a low-resistance metal wiring material such as Ag, the electrical resistance can be sufficiently lowered even if the wiring is thinned.
- FIG. 3B as in FIG.
- a mesh-like internal wiring pattern 18 having a wide line width is formed by forming a linear insulating region 20 having a very small width. Can be formed. Also in the mesh-like internal wiring pattern 18, by increasing the line width of the internal wiring pattern 18, the electrical resistance of the wiring can be further reduced.
- FIG. 3B parts corresponding to those in FIG. 3A are denoted by the same reference numerals, and detailed description thereof is omitted.
- the internal wiring pattern 18 shown in FIG. 3B is entirely formed of a fine metal mesh, but the first and second internal wiring ends 18c and 18d are not necessarily required to have translucency. Therefore, the first and second internal wiring end portions 18c and 18d may each be configured by a wide wiring as shown in FIG. 3A, which is configured by a low-resistance metal wiring material such as Ag.
- the internal wiring pattern 18 shown in FIGS. 3A and 3B is, for example, coated on the entire surface with a mixture of fine particles of a transparent conductive material having an average particle diameter in the range of 10 to 300 nm and a transparent resin binder by screen printing or the like,
- the wiring pattern may be formed by partially removing the coating film by performing laser processing or photolithography on the coating film and exposing the base insulating substrate.
- the internal wiring pattern 18 may be formed so as to connect the plurality of LED elements 15 in parallel between the first and second internal wiring end portions 18c and 18d.
- a plurality of LED elements 15 may be connected by a combination of series and parallel.
- the external wiring part 12 of the light emitting device 10 shown in FIG. 1 will be described.
- the external wiring portion 12 is connected to the end portions 18c and 18d of the internal wiring pattern 18 of the light emitting portion 11 at the joint portion 13, and is mainly composed of a flexible printed wiring board 21 and a connector 22 as shown in FIG. ing.
- the flexible printed wiring board 21 includes a base material 23 having insulating properties and flexibility, and an external wiring 24 provided on the surface of the base material 23.
- One end of the external wiring 24 extends to the position facing the internal wiring end portions 18 c and 18 d of the light emitting unit 11 together with the base material 23.
- the other end of the external wiring 24 is inserted into the connector 22 provided on the surface of the base material 23.
- Such a flexible printed wiring board 21 is configured to have higher flexibility than the light emitting unit 11.
- the translucency is not requested
- a polyimide is used for the base material 23 of the flexible printed wiring board 21, for example.
- the external wiring 24 does not need to be formed of a light-transmitting thin film conductive material such as ITO, for example, it is formed of normal copper or a metal wiring material whose surface is coated with gold. Yes.
- a cover lay film 25 made of polyimide is provided as a protective layer for the external wiring 24 in a partial region on the surface of the flexible printed wiring board 21.
- the connector 22 is provided on the base material 23.
- the connector 22 is used to electrically connect the external wiring 24 and a connection terminal (not shown) included in an external device or the like.
- the connector 22 includes a plurality of connection terminals into which connection terminals of an external device or the like are inserted.
- a reinforcing plate 26 that is less flexible than the light emitting unit 11 is provided.
- the reinforcing plate 26 facilitates the mounting of the connector 22 and also makes it easy to fix the connector 22 mounting portion of the flexible printed wiring board 21 to an external device (not shown) such as a display device or an optical device. Is provided.
- the external wiring portion 12 is provided with a plurality of fixing holes 27 so as to penetrate the base material 23 and the reinforcing plate 26 of the flexible printed wiring board 21.
- the connector 22 is being fixed on the surface of the base material 23 of the flexible printed wiring board 21 via the pad.
- the internal wiring end portions 18c and 18d of the light emitting unit 11 and the one end of the external wiring 24 of the flexible printed wiring board 21 are electrically connected to each other by an anisotropic conductive adhesive (ACF) 29 at the joint portion 13. Yes.
- ACF anisotropic conductive adhesive
- the anisotropic conductive adhesive 29 for example, an adhesive in which Ni having a particle diameter of about 2 ⁇ m in diameter is mixed as a conductive material in a thermosetting adhesive having a film thickness of about 25 ⁇ m is used.
- a protective tape 30 made of an insulating material is wound around the outer periphery of the joint portion 13.
- the light emitting portion 11 and the external wiring portion 12 are more firmly joined.
- the light emitting unit 11 and the external wiring unit 12 may be firmly bonded by forming a cured adhesive such as an epoxy resin on the outer periphery of the bonding unit 13.
- FIG. 4 is a schematic plan view of the external wiring portion 12 and the joint portion 13 as viewed from the direction of arrow A in FIG.
- FIG. 5 is a cross-sectional view of the joint 13 taken along the alternate long and short dash line YY ′ of FIG.
- the cover lay film 25 and the protective tape 30 as a protective layer of the external wiring 24 are omitted. Further, the protective tape 30 is omitted in FIG.
- the external wiring portion 12 and the joint portion 13 will be further described with reference to FIGS. 4 and 5.
- the internal wiring end portions 18c and 18d are formed by patterning the ITO thin film into a wide wiring pattern as described above. A positive voltage and a negative voltage applied to the LED element 15 are supplied to the internal wiring end portions 18c and 18d, respectively.
- the external wiring 24 of the flexible printed wiring board 21 includes a first external wiring 24a connected to the first internal wiring end 18c and a second external wiring connected to the second internal wiring end 18d. 24b.
- These external wirings 24a and 24b are divided into a plurality of divided wirings 31 having a line width narrower than the line widths of the first and second internal wiring end portions 18c and 18d except for the end portion connected to the connector 22. ing.
- the external wirings 24 a and 24 b are connected to the first and second internal wiring end portions 18 c and 18 d using an anisotropic conductive adhesive 29 at the end portion on the light emitting unit 11 side.
- each of the first and second external wirings 24a and 24b is composed of a number of strip-shaped divided wirings 31 having a line width of 250 ⁇ m, for example.
- the external wirings 24a and 24b are divided into the plurality of divided wirings 31 having a narrow line width, so that the external wirings 24a and 24b can be made flexible.
- the line width of each of the multiple divided wirings 31 is larger than the diameter of the conductive material included in the anisotropic conductive adhesive 29.
- the contact area between the first and second external wirings 24 a and 24 b and the anisotropic conductive adhesive 29 can be increased. Since it can be increased, as will be described later, the first and second external wirings 24a and 24b and the first and second internal wiring ends 18c and 18d are securely connected by the anisotropic conductive adhesive 29. And increase its reliability.
- a plurality of divided wirings 31 having a line width narrower than these line widths are connected by anisotropic conductive adhesive 29 on the first and second internal wiring end portions 18c and 18d.
- the opposing surfaces of the internal wiring end portions 18 c and 18 d and the divided wiring 31 are electrically connected via the conductive material 32 included in the anisotropic conductive adhesive 29 because the vertical distance between them is small.
- the horizontal interval between the divided wirings 31 or between the internal wiring end portions 18c and 18d is wider than the vertical interval, conduction through the conductive material 32 is not established. Accordingly, the divided wirings 31 and the internal wiring end portions 18c and 18d are electrically insulated.
- FIGS. 6A and 6B to 9A and 9B are views for explaining a method of manufacturing the light emitting device 10, and are sectional views corresponding to FIG. 6B, FIG. 7B, FIG. 8B, and FIG. 9B are views for explaining a method of manufacturing the light emitting device 10, and are sectional views corresponding to FIG.
- an ITO film is formed on the entire surface of the first translucent insulating substrate 16. Then, a part of the ITO film is removed by laser processing to expose the underlying first light-transmissive insulating substrate 16, and a linear insulating region 20 is formed.
- the internal wiring pattern 18 is formed by separating the ITO films formed on the entire surface of the first translucent insulating substrate 16 from each other by the linear insulating regions 20 or partially surrounding the insulating regions 20.
- the internal wiring pattern 18 thus formed includes a linear internal wiring pattern 18a having a wide line width, a plurality of micro wiring pieces 18b arranged in a straight line, And the first and second internal wiring end portions 18c and 18d.
- thermoplastic first light-transmissive resin layer 19-1 is formed on the surface of the first light-transmissive insulating substrate 16 including the internal wiring pattern 18 in the light-emitting portion 11.
- an anisotropic conductive adhesive 29 is formed on the first and second internal wiring end portions 18c and 18d of the internal wiring pattern 18 at the bonding portion 13.
- the anisotropic conductive adhesive 29 is preferably formed thinner than the diameter of the conductive material included in the anisotropic conductive adhesive 29, for example.
- a plurality of LED elements 15 are arranged on the surface of the first light-transmitting resin layer 19-1 via metal bumps 34.
- a second translucent insulating substrate 17 in which a thermoplastic second translucent resin layer 19-2 is formed on the lower surface on the plurality of LED elements 15 is provided with the translucent resin.
- the layer 19-2 is disposed so as to face the first translucent resin layer 19-1 on the first translucent insulating substrate 16.
- the flexible printed wiring board 21 is disposed so that the divided wiring 31 of the first and second external wirings 24a and 24b faces the anisotropic conductive adhesive 29. To do.
- each LED element 15 has the metal bumps 34 provided on these electrodes in contact with the internal wiring pattern 18 on the first translucent insulating substrate 16. Descent until In addition, the first translucent resin layer 19-1 formed on the first translucent insulating substrate 16 and the second translucent resin layer formed on the second translucent insulating substrate 17. 19-2 is mixed and integrated with each other, and is filled as a translucent resin layer 19 between the first and second translucent insulating substrates 16 and 17 and between the LED elements 15.
- the divided wiring 31 constituting the first and second external wirings 24 a and 24 b is embedded in the anisotropic conductive adhesive 29. It is.
- Each divided wiring 31 is in contact with the first and second internal wiring end portions 18 c and 18 d through the conductive material 32 included in the anisotropic conductive adhesive 29. Therefore, each divided wiring 31 and the first and second internal wiring ends 18c and 18d are electrically connected.
- the first light-transmissive insulating substrate 16 extending from the light emitting unit 11 and the flexible printed wiring board 21 extending from the external wiring unit 12 are fixed to each other by an anisotropic conductive adhesive 29.
- the protective tape 30 is wound around the joint 13 fixed by the anisotropic conductive adhesive 29 to complete the light emitting device 10.
- one end sides of the first and second external wires 24 a and 24 b formed on the flexible printed wiring board 21 are divided and a plurality of divided wires 31 spaced from each other. It is comprised by. Therefore, the first and second external wirings 24a and 24b of the flexible printed wiring board 21 and the first and second internal wiring end portions 18c and 18d of the first translucent insulating substrate 16 have a narrow line width.
- the divided wiring 31 is connected to the first and second internal wiring ends 18 c and 18 d having a thick line width through an anisotropic conductive adhesive 29. That is, as shown in FIG.
- the connection between the first and second internal wiring end portions 18c and 18d is sandwiched between the flexible printed wiring board 21 and the anisotropic conductive adhesive 29. This is performed by pressing on the light insulating substrate 16. At this time, the anisotropic conductive adhesive 29 is sandwiched between the thin line-shaped divided wiring 31 and the internal wiring end portions 18 c and 18 d, and the excess anisotropic conductive adhesive 29 includes a plurality of divided wirings 31. You can escape to the space between. Therefore, the anisotropic conductive adhesive 29 interposed between the thin line-shaped divided wiring 31 and the internal wiring end portions 18c and 18d can be distributed with a uniform film thickness. As a result, the reliability of the electrical connection between them can be improved.
- the end portions of the first and second external wirings 24a and 24b are constituted by the plurality of fine-line-shaped divided wirings 31, thereby the first and second internal wiring end portions.
- the reliability of electrical connection with 18c and 18d can be improved.
- the light emitting device 10 since the external wiring portion 12 including the connector 22 is provided at the end of the light emitting portion 11, the light emitting device 10 can be used as an external device or the like. Can be connected easily.
- the external wiring portion 12 is mainly configured by the flexible printed wiring board 21 having flexibility. That is, since the first and second external wirings 24a and 24b of the flexible printed wiring board 21 are formed by the plurality of thin line-shaped divided conductors 31, the first and second external wirings are thereby formed. 24a and 24b are made flexible. As described above, in the light emitting device 10 according to the embodiment, since the external wiring portion 12 configured by the flexible printed wiring board 21 is provided at the end of the light emitting portion 11, the degree of freedom of attachment to the external device or the like is increased. It is possible to provide the light emitting device 10 which is improved and has excellent versatility.
- FIG. 10 is a cross-sectional view of an essential part showing another embodiment of the light emitting part of the light emitting device.
- the same or corresponding components as those of the light emitting device shown in FIGS. 1 to 9A and 9B are denoted by the same reference numerals, and detailed description thereof is omitted.
- an internal wiring pattern 48 is formed on the surface of the second translucent insulating substrate 47.
- the plurality of LED elements 15 having a single-sided electrode structure some of the LED elements 15 are formed on the surface of the first light-transmissive insulating substrate 16 as in the light-emitting device 10 according to the above-described embodiment.
- the wiring pattern 18 is connected via the metal bump 34.
- the other LED elements 15 are connected to the internal wiring pattern 48 formed on the surface of the second translucent insulating substrate 47 through the metal bumps 34.
- the LED elements 15 connected to the internal wiring pattern 18 formed on the surface of the first light-transmissive insulating substrate 16 among the plurality of LED elements 15 are in series with each other.
- the LED elements 15 connected and connected to the internal wiring pattern 48 formed on the surface of the second translucent insulating substrate 47 are connected in series with each other.
- FIG. 11 is a cross-sectional view of an essential part showing still another embodiment of the light emitting part of the light emitting device. Also in this figure, the same or corresponding components as those of the light emitting device shown in FIGS. 1 to 9A and 9B are denoted by the same reference numerals, and detailed description thereof is omitted.
- an internal wiring pattern 58 is formed on the surface of the second translucent insulating substrate 57.
- the plurality of LED elements 55 disposed between the first light-transmissive insulating substrate 16 and the second light-transmissive insulating plate 57 are each provided with a first electrode on the upper surface which is a light emitting surface of the LED element body 55a.
- 55b is an LED element having a double-sided electrode structure in which a second electrode 55c is formed on the lower surface which is a non-light-emitting surface of the LED element body 55a.
- the first electrode 55b is directly connected to the internal wiring pattern 58 on the surface of the second light transmissive insulating substrate 57, and the second electrode 55c is the first light transmissive light.
- a metal bump 34 is connected to the internal wiring pattern 18 on the surface of the conductive insulating substrate 16.
- the plurality of LED elements 55 are arranged between the internal wiring pattern 18 on the surface of the first light-transmissive insulating substrate 16 and the internal wiring pattern 58 of the second light-transmissive insulating substrate 57. Connected in parallel.
- the internal wiring pattern formed in the light emitting portion can have various circuit configurations.
- SYMBOLS 10 Light-emitting device 11, 41, 51 ... Light emission part 12 ... External wiring part 13 ... Joint part 14 ... Translucent insulating sheet 15, 55 ... Light emitting diode (LED) element 55a ... LRD body 55b ... first electrode 55c ... second electrode 16 ... first translucent insulating substrate 17, 47, 57 ... second translucent insulating substrate 18, 48, 58 ... internal wiring pattern 18a ... linear internal wiring pattern 18b ... minute wiring piece 18c ... first internal wiring end 18d ... second internal wiring end DESCRIPTION OF SYMBOLS 19 ... Translucent resin layer 19-1 ... 1st translucent resin layer 19-2 ... 2nd translucent resin layer 20 ...
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
Description
11、41、51・・・発光部
12・・・外部配線部
13・・・接合部
14・・・透光性絶縁シート
15、55・・・発光ダイオード(LED)素子
55a・・・LRD本体
55b・・・第1の電極
55c・・・第2の電極
16・・・第1の透光性絶縁基板
17、47、57・・・第2の透光性絶縁基板
18、48、58・・・内部配線パターン
18a・・・直線状の内部配線パターン
18b・・・微小配線片
18c・・・第1の内部配線端部
18d・・・第2の内部配線端部
19・・・透光性樹脂層
19-1・・・第1の透光性樹脂層
19-2・・・第2の透光性樹脂層
20・・・絶縁領域
21・・・フレキシブルプリント配線板
22・・・コネクタ
23・・・基材
24・・・外部配線
24a・・・第1の外部配線
24b・・・第2の外部配線
25・・・カバーレイフィルム
26・・・補強板
27・・・固定孔
29・・・異方性導電接着剤(ACF)
30・・・保護テープ
31・・・分割配線
32・・・導電材
33・・・熱圧着ヘッド
34・・・金属バンプ
Claims (10)
- 発光部と、
前記発光部に接続される外部配線と、
を備え、
前記発光部は、透光性および可撓性を有する一対の絶縁基板と、
前記一対の絶縁基板間に配列された複数個の発光素子と、
前記一対の絶縁基板の少なくとも1方の内側表面に形成された、前記発光素子に接続される内部配線パターンと、
前記一対の絶縁基板間に設けられた、透光性および絶縁性を有する樹脂層と、
を備え、
前記外部配線の端部は、前記内部配線の線幅よりも狭い線幅を有する複数の配線に分割されており、
前記内部配線パターンの端部は、前記絶縁基板の端部において、前記複数の配線に分割された前記外部配線の端部と、異方性導電接着剤により接合されている、可撓性を有する発光装置。 - 前記外部配線は、可撓性および絶縁性を有する基材の第1の面上に設けられており、
前記外部配線の前記発光部と反対側の端部は、前記基材の第1面上に設置されたコネクタに接続されており、
前記基材および前記外部配線は、フレキシブルプリント配線板を構成する請求項1に記載の発光装置。 - 前記フレキシブルプリント配線板は、前記発光部より高い可撓性を有する請求項2に記載の発光装置。
- 前記フレキシブルプリント配線板は、非透光性である請求項2または3に記載の発光装置。
- 前記フレキシブルプリント配線板の前記基材の第2の面上において、前記コネクタと対向する位置には、前記発光部より低い可撓性を有する補強板が設けられている請求項2乃至4のいずれかに記載の発光装置。
- 前記発光部の前記内部配線パターンは、透光性の導電材料により形成されている請求項1乃至5のいずれかに記載の発光装置。
- 前記透光性の導電材料はITO膜である請求項6に記載の発光装置。
- 前記発光部の前記内部配線パターンは、メッシュ状の金属細線により形成されている請求項1乃至5のいずれかに記載の発光装置。
- 前記一対の絶縁基板間は、前記樹脂層で充填されている請求項1乃至8のいずれかに記載の発光装置。
- 前記内部配線パターンは透光性の導電材料またはメッシュ状の金属細線により形成され、
前記樹脂層は、前記一対の絶縁基板間を充填することにより前記複数個の発光素子およびこれに接続される前記内部配線パターンを前記一対の絶縁基板間に埋設し、
前記内部配線パターンの端部は、前記一対の絶縁基板の端部から露出しており、前記一対の絶縁基板の端部から露出した前記内部配線パターンの端部が、前記外部配線の端部と、前記異方性導電接着剤により接合している請求項1乃至9のいずれかに記載の発光装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015551387A JP6431485B2 (ja) | 2013-12-02 | 2014-12-01 | 発光装置 |
EP14867611.7A EP3079175A4 (en) | 2013-12-02 | 2014-12-01 | Light-emission device |
CN201480048555.1A CN105518885B (zh) | 2013-12-02 | 2014-12-01 | 发光装置 |
US15/077,143 US10461063B2 (en) | 2013-12-02 | 2016-03-22 | Light-emitting device |
US16/577,499 US10734365B2 (en) | 2013-12-02 | 2019-09-20 | Light-emitting device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-249455 | 2013-12-02 | ||
JP2013249455 | 2013-12-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/077,143 Continuation US10461063B2 (en) | 2013-12-02 | 2016-03-22 | Light-emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015083364A1 true WO2015083364A1 (ja) | 2015-06-11 |
Family
ID=53273148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/005998 WO2015083364A1 (ja) | 2013-12-02 | 2014-12-01 | 発光装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US10461063B2 (ja) |
EP (1) | EP3079175A4 (ja) |
JP (1) | JP6431485B2 (ja) |
CN (1) | CN105518885B (ja) |
WO (1) | WO2015083364A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9905545B2 (en) | 2014-03-25 | 2018-02-27 | Toshiba Hokuto Electronics Corporation | Light emitting device |
US10096581B2 (en) | 2014-09-26 | 2018-10-09 | Toshiba Hokuto Electronics Corporation | Light emitting module |
US10580949B2 (en) | 2014-09-26 | 2020-03-03 | Toshiba Hokuto Electronics Corporation | Light emitting module |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10396061B1 (en) * | 2018-03-22 | 2019-08-27 | International Business Machines Corporation | Transparent electronics for invisible smart dust applications |
JP2021036575A (ja) * | 2018-12-17 | 2021-03-04 | 東芝ホクト電子株式会社 | 発光装置、接合部の保護方法、発光装置の製造方法、及び、車両用灯具 |
CN209431157U (zh) * | 2019-02-10 | 2019-09-24 | 中山市蓝德电子有限公司 | 一种柔性led倒装软灯条 |
US20220186899A1 (en) * | 2019-02-21 | 2022-06-16 | HELLA GmbH & Co. KGaA | Lighting device, in particular lighting device for a vehicle |
KR20200114055A (ko) * | 2019-03-27 | 2020-10-07 | 주식회사 엘지화학 | 투명 발광소자 디스플레이 |
JP2021040053A (ja) | 2019-09-03 | 2021-03-11 | 東芝ホクト電子株式会社 | 発光装置、及び発光装置の製造方法 |
DE102022207555A1 (de) | 2022-07-25 | 2024-01-25 | Carl Zeiss Smt Gmbh | Optisches system, lithographieanlage mit einem optischen system und verfahren zum herstellen eines optischen systems |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10321365A (ja) * | 1997-05-20 | 1998-12-04 | Nec Shizuoka Ltd | 薄型発光体の電極端子構造 |
JP2009010204A (ja) * | 2007-06-28 | 2009-01-15 | Nichia Corp | 発光装置 |
JP2011134926A (ja) * | 2009-12-25 | 2011-07-07 | Nichia Corp | 半導体発光装置及びその製造方法 |
JP2012084855A (ja) | 2010-09-13 | 2012-04-26 | Toshiba Hokuto Electronics Corp | 発光装置 |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60111068U (ja) * | 1983-12-28 | 1985-07-27 | アルプス電気株式会社 | フレキシブルプリント基板 |
JPS60262430A (ja) | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPH0727924B2 (ja) | 1984-06-20 | 1995-03-29 | 松下電器産業株式会社 | 実装体の製造方法 |
JPH0638436B2 (ja) | 1985-02-22 | 1994-05-18 | カシオ計算機株式会社 | 半導体ペレツトと基板の接合方法 |
JPH0779192B2 (ja) | 1985-02-22 | 1995-08-23 | カシオ計算機株式会社 | 電子部品の接合方法 |
JPH04301817A (ja) * | 1991-03-29 | 1992-10-26 | Rohm Co Ltd | 液晶表示装置とその製造方法 |
JP2801487B2 (ja) * | 1992-04-30 | 1998-09-21 | シャープ株式会社 | パネルの実装構造および実装方法並びに樹脂供給硬化方法 |
US6437846B1 (en) * | 1993-03-15 | 2002-08-20 | Seiko Epson Corporation | Liquid crystal display device and electronic device including same |
US5822030A (en) * | 1994-09-16 | 1998-10-13 | Seiko Epson Corporation | Liquid crystal display device, its mounting structure and electronic device |
US5936850A (en) * | 1995-03-03 | 1999-08-10 | Canon Kabushiki Kaisha | Circuit board connection structure and method, and liquid crystal device including the connection structure |
US6087680A (en) * | 1997-01-31 | 2000-07-11 | Siemens Aktiengesellschaft | Led device |
JPH11145381A (ja) | 1997-11-12 | 1999-05-28 | Denso Corp | 半導体マルチチップモジュール |
JP3841130B2 (ja) | 1997-12-16 | 2006-11-01 | ローム株式会社 | 光半導体モジュール、およびその製造方法 |
JP3039507B2 (ja) * | 1998-03-06 | 2000-05-08 | 日本電気株式会社 | 液晶表示装置及びその製造方法 |
JP3610787B2 (ja) | 1998-03-24 | 2005-01-19 | セイコーエプソン株式会社 | 半導体チップの実装構造体、液晶装置及び電子機器 |
JP3462135B2 (ja) * | 1999-01-14 | 2003-11-05 | シャープ株式会社 | 二次元画像検出器およびアクティブマトリクス基板並びに表示装置 |
JP3529657B2 (ja) | 1999-02-05 | 2004-05-24 | 松下電器産業株式会社 | 熱可塑性樹脂基板に半導体素子を取付ける方法、非接触icカードの製造方法及び半導体素子を取付けた熱可塑性樹脂基板 |
JP2000299411A (ja) | 1999-02-10 | 2000-10-24 | Hitachi Maxell Ltd | チップ実装体及びその製造方法 |
US6601947B1 (en) * | 1999-03-31 | 2003-08-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
US20020139303A1 (en) * | 2001-02-01 | 2002-10-03 | Shunpei Yamazaki | Deposition apparatus and deposition method |
JP3748779B2 (ja) | 2001-02-16 | 2006-02-22 | 松下電器産業株式会社 | 半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート |
JP3792554B2 (ja) * | 2001-03-26 | 2006-07-05 | シャープ株式会社 | 表示モジュール及びフレキシブル配線板の接続方法 |
US7199515B2 (en) * | 2001-06-01 | 2007-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Organic light emitting element and light emitting device using the element |
JP2004184805A (ja) * | 2002-12-05 | 2004-07-02 | Tohoku Pioneer Corp | 導電配線の接続構造 |
US20070090387A1 (en) | 2004-03-29 | 2007-04-26 | Articulated Technologies, Llc | Solid state light sheet and encapsulated bare die semiconductor circuits |
AU2005232074A1 (en) * | 2004-03-29 | 2005-10-20 | LumaChip, Inc. | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
JP4317834B2 (ja) * | 2005-06-01 | 2009-08-19 | 株式会社カシオ日立モバイルコミュニケーションズ | 音出力装置、および、音出力制御プログラム |
FR2892594B1 (fr) * | 2005-10-21 | 2007-12-07 | Saint Gobain | Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications |
TWI351670B (en) * | 2006-05-18 | 2011-11-01 | Au Optronics Corp | Signal transmission assembly and display panel app |
DE102006034560B4 (de) * | 2006-07-26 | 2012-04-26 | Infineon Technologies Ag | Verstärkerstufe, Operationsverstärker und Verfahren zur Signalverstärkung |
JP5068067B2 (ja) * | 2006-11-22 | 2012-11-07 | 株式会社ジャパンディスプレイイースト | 表示装置および平面型表示装置 |
US7796224B2 (en) * | 2006-12-26 | 2010-09-14 | Sony Corporation | Liquid crystal display device |
JP5255779B2 (ja) * | 2007-03-30 | 2013-08-07 | ユー・ディー・シー アイルランド リミテッド | 表示装置の製造方法及びそれにより製造された表示装置 |
US8086308B2 (en) * | 2007-06-27 | 2011-12-27 | Pacesetter, Inc. | Implantable medical device for identifying and managing intrinsic reentrant tachycardia |
CN102422338B (zh) * | 2009-05-02 | 2015-04-01 | 株式会社半导体能源研究所 | 显示设备 |
US8562488B2 (en) * | 2009-10-05 | 2013-10-22 | The Cleveland Clinic Foundation | Systems and methods for improving motor function with assisted exercise |
JP5533183B2 (ja) | 2010-04-20 | 2014-06-25 | 日亜化学工業株式会社 | Led光源装置及びその製造方法 |
CN104012173B (zh) * | 2012-07-26 | 2016-08-24 | 松下电器产业株式会社 | 有机el装置 |
WO2014050876A1 (ja) * | 2012-09-25 | 2014-04-03 | シャープ株式会社 | 表示装置及び表示装置の製造方法 |
CN103680384B (zh) * | 2012-09-26 | 2016-05-11 | 乐金显示有限公司 | 具有柔性膜线缆的显示装置 |
KR101991892B1 (ko) * | 2013-02-18 | 2019-06-24 | 삼성디스플레이 주식회사 | 테이프 패키지 및 이를 구비한 평판 표시 장치 |
TWI626395B (zh) * | 2013-06-11 | 2018-06-11 | 晶元光電股份有限公司 | 發光裝置 |
KR102271585B1 (ko) * | 2014-02-10 | 2021-07-01 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6636233B2 (ja) | 2014-04-07 | 2020-01-29 | 株式会社小糸製作所 | 車両用灯具 |
JP6636736B2 (ja) * | 2014-07-18 | 2020-01-29 | 株式会社半導体エネルギー研究所 | 回路基板の作製方法、発光装置の作製方法、電子機器の作製方法、及び発光装置 |
JP2016097033A (ja) * | 2014-11-20 | 2016-05-30 | キヤノン株式会社 | 静電容量型トランスデューサ、及び被検体情報取得装置 |
JP6430341B2 (ja) * | 2015-08-06 | 2018-11-28 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
JP6831710B2 (ja) * | 2017-01-30 | 2021-02-17 | 株式会社ジャパンディスプレイ | 表示装置の製造方法、及び表示装置 |
-
2014
- 2014-12-01 EP EP14867611.7A patent/EP3079175A4/en not_active Withdrawn
- 2014-12-01 WO PCT/JP2014/005998 patent/WO2015083364A1/ja active Application Filing
- 2014-12-01 JP JP2015551387A patent/JP6431485B2/ja active Active
- 2014-12-01 CN CN201480048555.1A patent/CN105518885B/zh active Active
-
2016
- 2016-03-22 US US15/077,143 patent/US10461063B2/en active Active
-
2019
- 2019-09-20 US US16/577,499 patent/US10734365B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10321365A (ja) * | 1997-05-20 | 1998-12-04 | Nec Shizuoka Ltd | 薄型発光体の電極端子構造 |
JP2009010204A (ja) * | 2007-06-28 | 2009-01-15 | Nichia Corp | 発光装置 |
JP2011134926A (ja) * | 2009-12-25 | 2011-07-07 | Nichia Corp | 半導体発光装置及びその製造方法 |
JP2012084855A (ja) | 2010-09-13 | 2012-04-26 | Toshiba Hokuto Electronics Corp | 発光装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3079175A4 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9905545B2 (en) | 2014-03-25 | 2018-02-27 | Toshiba Hokuto Electronics Corporation | Light emitting device |
US10096581B2 (en) | 2014-09-26 | 2018-10-09 | Toshiba Hokuto Electronics Corporation | Light emitting module |
US10580949B2 (en) | 2014-09-26 | 2020-03-03 | Toshiba Hokuto Electronics Corporation | Light emitting module |
US10629570B2 (en) | 2014-09-26 | 2020-04-21 | Toshiba Hokuto Electronics Corporation | Light emitting module |
US10991866B2 (en) | 2014-09-26 | 2021-04-27 | Toshiba Hokuto Electronics Corporation | Light emitting module |
Also Published As
Publication number | Publication date |
---|---|
JP6431485B2 (ja) | 2018-11-28 |
US20200013763A1 (en) | 2020-01-09 |
EP3079175A4 (en) | 2018-04-11 |
CN105518885B (zh) | 2018-02-16 |
US20160276321A1 (en) | 2016-09-22 |
CN105518885A (zh) | 2016-04-20 |
JPWO2015083364A1 (ja) | 2017-03-16 |
US10461063B2 (en) | 2019-10-29 |
US10734365B2 (en) | 2020-08-04 |
EP3079175A1 (en) | 2016-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6431485B2 (ja) | 発光装置 | |
CN111048566B (zh) | 一种有机发光显示面板及显示装置 | |
US8860045B2 (en) | LED light sheet | |
JP5162979B2 (ja) | 発光装置 | |
JP2015076612A5 (ja) | ||
TW201334237A (zh) | 具有波長轉換層之發光二極體元件 | |
WO2017115712A1 (ja) | 発光モジュール | |
JP6191224B2 (ja) | 配線基板及びこれを用いた発光装置 | |
JP2016110858A (ja) | 面発光モジュール | |
JP2019067903A (ja) | 発光装置およびその製造方法 | |
US20200279983A1 (en) | Light emitting device and method of manufacturing light emitting device | |
JP2015192095A (ja) | Led発光装置及びled発光装置の製造方法 | |
TWI565120B (zh) | 發光元件及發光元件的製造方法 | |
WO2015079543A1 (ja) | 発光装置 | |
WO2014076912A1 (ja) | 有機エレクトロルミネッセンス素子及び照明装置 | |
US11664353B2 (en) | Light emitting device, and method for manufacturing light emitting device | |
JP6322828B2 (ja) | 発光モジュールおよび発光装置 | |
JP2016149223A (ja) | 発光装置 | |
JP2015106459A (ja) | 発光装置 | |
US20200279986A1 (en) | Light emitting device and method of manufacturing light emitting device | |
TWM505061U (zh) | 發光式封裝結構 | |
JP2015149448A (ja) | 発光モジュール、発光装置および発光モジュールの製造方法 | |
JP2015164096A (ja) | 照明パネル | |
KR102080692B1 (ko) | 조명장치 | |
JP2022189558A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14867611 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2015551387 Country of ref document: JP Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2014867611 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014867611 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |