JP4019236B2 - Optical device for solid-state imaging device - Google Patents
Optical device for solid-state imaging device Download PDFInfo
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- 238000003384 imaging method Methods 0.000 title claims description 68
- 230000003287 optical effect Effects 0.000 title claims description 37
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 238000001444 catalytic combustion detection Methods 0.000 description 25
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000005304 optical glass Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
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- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Color Television Image Signal Generators (AREA)
- Studio Devices (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、カラービデオカメラ等のビデオ装置に係り、色分解プリズムの所定位置に固体撮像デバイスを取り付けた固体撮像デバイス用光学装置に関する。
【０００２】
【従来の技術及び発明が解決しようとする課題】
カラービデオカメラ又は種々の工業用光学機器における固体撮像デバイスの取り付けは、色分解プリズムの各チャンネルの結像位置と固体撮像デバイスの受光結像面を一致（フォーカス）させるのみではなく、各チャンネル毎の固体撮像デバイス受光面の傾き（片ボケ）調整及び各チャンネル相互間のレジストレーション（光軸に垂直面の平行及び回転）調整を考慮して決定されなければならない。
【０００３】
このような調整を可能とするために、例えばビデオ装置として特開平２ー２４４９９３号公報が開示されている。その開示発明においては、プリズムあるいはトリミングフイルター面に取付用ガラス板を接着し、該取付用ガラス板上に蒸着形成されたハンダ層を含む金属被膜の被接合域に、金属製のＣＣＤ（Charge-Coupled Device)取付枠の突出した４本の足をハンダ付けしている。
また、取付用ガラス板にＣＣＤ取付枠の４本の足をハンダ等でろう接する場合、取付用ガラス板の面積及び厚さが相当有り、このためハンダ付け時の熱容量が大きくハンダ付けに時間を要し、熱で接合面が破損する場合もありハンダ付け作業は細心の注意と熟練性が必要で、作業性、生産性に問題があった。
一方、接合不良又は固体撮像デバイスの故障のため交換作業が生じた場合は、プリズムからＣＣＤ取付枠を取り外すことになるが、取り外し作業は取付用ガラス板上に蒸着形成した金属皮膜を破損又は剥離しないよう細心の注意と熟練性が必要となる。
【０００４】
また、例えば光学硝子組付け枠と付属品取付け法として実開平７ー１９７１４号公報が開示されている。その開示考案においては、光学硝子製プリズムの左右側面に取付ける金属製組付け枠の、プリズムの光射出面と同一面外側又は端面ハンダ付け部分を内側から肉抜き加工して、固体撮像デバイス取付け用付属品取付枠の４本の脚部をハンダ付けしている。
その開示考案では、光学硝子製プリズムの左右側面に取付ける金属製組付け枠の外側又は端面ハンダ付け部分を空洞部にするための肉抜き加工が困難であり、また金属製組付け枠自体の熱容量が大きく付属品取付枠の脚部のハンダ付け作業性、生産性に問題があった。
【０００５】
【課題を解決するための手段】
本発明者は，上記に鑑み鋭意研究の結果，次の構成発明によりそれらの課題を解決した。
（１）対物光学系からの撮像光を色分解する複数のプリズム面に複数の固体撮像デバイスを取り付けた固体撮像デバイス用光学装置において、
プリズムと、該プリズムの左右側面に固着したプリズム組付け枠と、プリズムの光射出面側に配設された複数の脚部を有する固体撮像デバイス取付板を備えてなり、
前記プリズム組付け枠は、プリズム材料と近似の熱膨張係数を有する板材であり、前記プリズム組付け枠のプリズム光射出面側の端面には、プリズムの光射出面側に一定間隔を隔てて配設される固体撮像デバイス取付板の脚部を接合するための複数の突出部を設け、
かつ該突出部の固体撮像デバイス取付板の脚部の接合面に複数のスリットを設けてなることを特徴とする固体撮像デバイス用光学装置。
【０００６】
（２）上記プリズム組付け枠は、プリズム材料と近似の熱膨張係数を有する金属板又は突出部の固体撮像デバイス取付板脚部の接合面がメタライズ処理されたセラミック板であることを特徴とする（１）項に記載の固体撮像デバイス用光学装置。
（３）突出部の固体撮像デバイス取付板の脚部を接合するための複数の突出部接合面に、複数の交叉するスリットを設けてなることを特徴とする（１）又は（２）項に記載の固体撮像デバイス用光学装置。
【０００７】
（４）固体撮像デバイス取付板の脚部を接合するための複数の突出部のスリット下方に、空洞部を設けてなることを特徴とする（１）〜（３）項のいずれか１項に記載の固体撮像デバイス用光学装置。
（５）前記固体撮像デバイス取付板は、中央部の撮像光通過領域を中空孔とし、四隅に前記プリズム組付け枠の突出部の表面形状と同一裏面の脚部を設けてなることを特徴とする（１）〜（４）項のいずれか１項に記載の固体撮像デバイス用光学装置。
（６）前記固体撮像デバイス取付板が金属製のものであることを特徴とする（１）〜（５）項のいずれか１項に記載の固体撮像デバイス用光学装置。
【０００８】
【発明の実施の形態】
本発明では、対物光学系からの撮像光を色分解するプリズムに複数の固体撮像デバイス（以後はＣＣＤと記載する）を取り付けた固体撮像デバイス用光学装置において、プリズムと、該プリズムの左右側面に固着する組付け枠と、複数のＣＣＤ取付板で構成し、前記組付け枠はプリズム材料と近似の熱膨張係数を有する金属板又は固体撮像デバイス取付板の脚部を接合する突出部にメタライズ処理したセラミック板で、該組付け枠にプリズムの光射出面と同一面にＣＣＤ取付板の脚部を接合するための複数の突出部を設け、該突出部のＣＣＤ取付板の脚部との接合面に複数のスリット又は複数の交叉するスリットを設け、一方ＣＣＤ取付板の四隅に前記組付け枠突出部の接合面と同一面積を有する脚部を設ける。
組付け枠の突出部とＣＣＤ取付板脚部の接合には、低温熔融性のハンダ等を使用し、ハンダゴテ、赤外線ランプ、レーザー等の加熱器を用いて接合する。
【０００９】
【実施例】
以下、本発明実施例の固体撮像デバイス用光学装置の構成及び作用を図に基づいて説明する。
図１は本発明のプリズムと組付け枠及び取付板の分解外観斜視図、図２は組付け枠突出部の１例の拡大斜視図、図３は組付け枠突出部の他の例の拡大斜視図、図４はプリズムと組付け枠と取付板の接合説明図、図５は本発明の固体撮像デバイス用光学装置の外観斜視図、図６は本発明の固体撮像デバイス用光学装置の側面図、図７は本発明の固体撮像デバイス用光学装置の正面図である。
図１〜図７において、１はプリズム、２は組付け枠、３は取付板、４は組付け枠突出部、５はスリット、６は交叉スリット、７は取付板の脚部、８は配線基盤、９は光学装置前面板、１０はＣＣＤ、１１は空洞部、１００は固体撮像デバイス用光学装置である。
【００１０】
図１において、プリズム１の左右側面に固着する組付け枠２は、プリズム１の材料と近似の熱膨張係数を有する金属板又は固体撮像デバイス取付板の脚部を接合する突出部にメタライズ処理したセラミック板で、該組付け枠２にプリズム１の光射出面と同一面にＣＣＤ用の取付板３を接合するための複数の組付け枠突出部４を設け、実施例の一つとして図２組付け枠突出部実施例１に示す通り突出部４は図２（ａ）はスリット５、図２（ｂ）はスリット５と空洞部１１有し、他例では図３組付け枠突出部実施例２に示す通り組付け枠突出部４は図３（ｃ）は交叉スリット６、図３（ｄ）は交叉スリット６と空洞部１１を有する。
取付板３は金属の接合可能な材質で、取付板の脚部７は組付け枠突出部４と同一面積を有する。図６において、配線基盤８に遮光のためのスポンジゴム等の可圧縮材を取り付けたＣＣＤ１０及び必要な電気部品を取り付けた後に組付け枠突出部４に接合する。
【００１１】
接合する際の作業については、接合用治具（図示せず）に図５に示す固体撮像デバイス用光学装置１００を取り付け、接合用治具に設置した対物光学系である撮像レンズを介して調整用パターンを撮像する。
一方、ＣＣＤ用の取付板の脚部７を接合用治具の位置調整用工具で保持し、ＣＣＤの受光面結像位置に撮像した調整用パターン像が一致するよう位置調整用工具を調整する。
その際、配線基盤８に取り付けた各固体撮像デバイス１０のビデオ信号をモニタテレビへ入力し、撮像した調整用パターン画像を見ながら、フォーカス、片ボケ、レジストレーション調整を行って良好な調整用パターン画像が得られるように調整する。
【００１２】
位置調整終了後、図４に示す通り、組付け枠２の突出部４と取付板の脚部７の接合を、低温熔融性のハンダ等を使用し、ハンダゴテ、赤外線ランプ、レーザー等の加熱器を用いて接合する。
組付け枠突出部４と取付板の脚部７の接合時は、熱容量の大きな組付け枠に熱を奪われる事なく局部的にハンダ付け温度が保持できるので短時間で作業が完了するためハンダ付け熱によるＣＣＤの位置ずれ等も防止できる。
また、スリット５又は交叉スリット６を設けたことにより、ずれ止めを兼ねたハンダ溜まりが生じ接合強度が強化される。
【００１３】
以上のようにして、前記組付け枠の突出部と固体撮像デバイス取付板の脚部をハンダ等でろう接する場合に、フォーカス、片ボケ、レジストレーション調整が容易で、しかも接合後は温度による影響や経時変化に耐性があり、尚且つ接合強度がある信頼性、作業性、生産性に優れた固体撮像デバイス用光学装置が提供できる。
また本発明は、カラービデオカメラや工業用カラーテレビカメラ等の二次元ＣＣＤを使用したカメラに利用する他に、一次元ＣＣＤ（ラインセンサー）の取り付け等、また、色分解プリズム以外のビームスプリッターに固体撮像デバイスを取り付ける場合にも使用出来る。
【００１４】
【発明の効果】
本発明によれば、次のような効果が発揮される。
プリズムの左右側面に固着した組付け枠は、突出部接合部に複数のスリットを設けたので、組付け枠の突出部と取付板の脚部をハンダ付け接合する場合、熱容量の大きな組付け枠全体に熱を奪われて温度降下することなく、局部的に好適なハンダ付け温度が保持でき、また、接合面にずれ防止を兼ねたハンダ溜まり（アンカー）ができるので、短時間に確実で強固で信頼性のある接合が可能である。
また、プリズムの左右側面に固着する組付け枠を、金属板で構成したものにあっては、その製作加工が容易でかつ放熱性が良く、ＣＣＤ等の発熱による高温化を回避し、さらにセラミック板にしたものにあっては、プリズム材料と近似の熱膨張係数を有するため、激しい温度差のある環境下においてもプリズムとのずれ又は剥離等を生ずることが少ない。
【００１５】
さらに、組付け枠の突出部接合面を複数の交叉するスリット面にしたものにあっては、接合面面積が大きくなり、また、接合面にずれ防止を兼ねたハンダ溜まりができるので、接合強度が一層強化され、より確実で信頼性の高い接合が可能となる。かつ突出部のスリット下方に空洞部を設けることにより、接合部が組付け枠全体に熱を奪われ温度降下することはさらに防止できる。
また、ＣＣＤ取付板の四隅に、組付け枠の突出部接合部分と同一形状寸法の裏面を有する脚部を設けたものにあっては、ハンダ接合時に取付板全体に熱を奪われることが少なく、局部的にハンダ付け温度が保持できるため、短時間で接合作業を完了することが可能である。
【００１６】
そしてまた、局部的で短時間であるためＣＣＤ等に熱伝導することが少なく、このためＣＣＤ等の熱破壊を防止でき、接合強度がある信頼性、作業性、生産性に優れ、しかも接合後は温度による影響や経時変化に耐性のある固体撮像デバイス用光学装置を提供できる。
また、ハンダ等で接合した組付け枠の突出部及びＣＣＤ取付板の部材は金属等であるため、ＣＣＤ取付板に接合不良又はＣＣＤの故障が生じた場合においても、簡単に取り外し、交換再接合が可能である。
【図面の簡単な説明】
【図１】本発明のプリズムと組付け枠及び取付板の分解外観斜視図。
【図２】組付け枠突出部の１例の拡大斜視図。
【図３】組付け枠突出部の他の例の拡大斜視図。
【図４】プリズムと組付け枠と取付板の接合説明図。
【図５】本発明の固体撮像デバイス用光学装置の外観斜視図。
【図６】本発明の固体撮像デバイス用光学装置の側面図。
【図７】本発明の固体撮像デバイス用光学装置の正面図。
【符号の説明】
１：プリズム ２：組付け枠
３：取付板 ４：組付け枠突出部
５：スリット ６：交叉スリット
７：取付板の脚部 ８：配線基盤
９：光学装置前面板 １０：ＣＣＤ
１１：空洞部
１００：固体撮像デバイス用光学装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a video apparatus such as a color video camera, and more particularly to an optical apparatus for a solid-state imaging device in which a solid-state imaging device is attached at a predetermined position of a color separation prism.
[0002]
[Prior art and problems to be solved by the invention]
Mounting a solid-state imaging device in a color video camera or various industrial optical instruments not only makes the imaging position of each channel of the color separation prism coincide with the light-receiving imaging surface of the solid-state imaging device, but also for each channel. The solid-state imaging device must be determined in consideration of the tilt (single blur) adjustment of the light receiving surface and the registration (parallel and rotation of the plane perpendicular to the optical axis) between the channels.
[0003]
In order to enable such adjustment, for example, Japanese Patent Laid-Open No. 244993/1993 is disclosed as a video apparatus. In the disclosed invention, a mounting glass plate is bonded to a prism or trimming filter surface, and a metal CCD (Charge--) is attached to a bonded region of a metal film including a solder layer deposited on the mounting glass plate. Coupled Device) The four legs protruding from the mounting frame are soldered.
In addition, when the four legs of the CCD mounting frame are soldered to the mounting glass plate with solder or the like, the area and thickness of the mounting glass plate are considerable, so the heat capacity during soldering is large and time is required for soldering. In addition, since the joint surface may be damaged by heat, the soldering work requires careful attention and skill, and there are problems in workability and productivity.
On the other hand, when replacement work occurs due to poor bonding or a solid-state imaging device failure, the CCD mounting frame will be removed from the prism, but the removal work will damage or peel off the metal film deposited on the mounting glass plate. Careful attention and skill are required to avoid this.
[0004]
Further, for example, Japanese Utility Model Laid-Open No. 7-19714 has been disclosed as an optical glass assembly frame and attachment method. In the disclosed device, a metal assembly frame to be attached to the left and right side surfaces of the optical glass prism is subjected to a lightening process on the same surface as the light exit surface of the prism or an end surface soldered portion from the inner side to mount a solid-state imaging device. The four legs of the accessory mounting frame are soldered.
In the disclosed device, it is difficult to perform the blanking process for making the outer or end face soldered portion of the metal assembly frame attached to the left and right side surfaces of the optical glass prism into a hollow portion, and the heat capacity of the metal assembly frame itself. However, there was a problem in the soldering workability and productivity of the legs of the accessory mounting frame.
[0005]
[Means for Solving the Problems]
As a result of intensive studies in view of the above, the present inventor has solved these problems by the following configuration invention.
(1) In an optical device for a solid-state imaging device in which a plurality of solid-state imaging devices are attached to a plurality of prism surfaces for color-separating imaging light from an objective optical system,
A prism, a prism assembly frame fixed to the left and right side surfaces of the prism, and a solid-state imaging device mounting plate having a plurality of legs disposed on the light exit surface side of the prism,
The prism assembly frame is a plate material having a coefficient of thermal expansion similar to that of the prism material, and is arranged on the end surface of the prism assembly frame on the prism light exit surface side with a certain interval on the light exit surface side of the prism. Providing a plurality of protrusions for joining the legs of the solid-state imaging device mounting plate provided,
An optical apparatus for a solid-state imaging device, wherein a plurality of slits are provided on a joint surface of a leg portion of the solid-state imaging device mounting plate of the protruding portion.
[0006]
(2) The prism assembly frame may be a metal plate having a thermal expansion coefficient approximate to that of the prism material or a ceramic plate in which the joint surface of the solid imaging device mounting plate leg of the protruding portion is metallized. The optical apparatus for a solid-state imaging device according to item (1).
(3) In the item (1) or (2), a plurality of intersecting slits are provided on a plurality of projecting portion joining surfaces for joining the legs of the solid-state imaging device mounting plate of the projecting portion. An optical apparatus for a solid-state imaging device as described.
[0007]
(4) According to any one of items (1) to (3), a hollow portion is provided below the slits of the plurality of protrusions for joining the legs of the solid-state imaging device mounting plate. An optical apparatus for a solid-state imaging device as described.
(5) The solid-state imaging device mounting plate is characterized in that the imaging light passage region at the center is a hollow hole, and leg portions on the same back surface as the surface shape of the protruding portion of the prism assembly frame are provided at the four corners. The optical apparatus for a solid-state imaging device according to any one of (1) to (4).
(6) The optical device for a solid-state imaging device according to any one of (1) to (5), wherein the solid-state imaging device mounting plate is made of metal.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, in an optical apparatus for a solid-state imaging device in which a plurality of solid-state imaging devices (hereinafter referred to as CCDs) are attached to a prism that separates imaging light from an objective optical system, It consists of a fixed assembling frame and a plurality of CCD mounting plates, and the mounting frame is metallized on a protrusion that joins the legs of a metal plate or solid-state imaging device mounting plate having a thermal expansion coefficient similar to that of the prism material. A plurality of protrusions for joining the legs of the CCD mounting plate on the same plane as the light emission surface of the prism, and joining the protrusions to the legs of the CCD mounting plate. A plurality of slits or a plurality of intersecting slits are provided on the surface, and legs having the same area as the joint surface of the assembly frame protrusion are provided at the four corners of the CCD mounting plate.
For joining the protrusion of the assembly frame and the leg of the CCD mounting plate, a low-melting solder or the like is used, and a soldering iron, an infrared lamp, a laser or other heater is used.
[0009]
【Example】
Hereinafter, the configuration and operation of the optical apparatus for a solid-state imaging device according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is an exploded external perspective view of a prism, an assembly frame and a mounting plate of the present invention, FIG. 2 is an enlarged perspective view of an example of an assembly frame protrusion, and FIG. 3 is an enlargement of another example of an assembly frame protrusion. FIG. 4 is an explanatory view showing the joining of the prism, the assembly frame, and the mounting plate, FIG. 5 is an external perspective view of the optical device for a solid-state imaging device of the present invention, and FIG. 6 is a side view of the optical device for a solid-state imaging device of the present invention. 7 and 7 are front views of the optical apparatus for a solid-state imaging device of the present invention.
1 to 7, 1 is a prism, 2 is an assembly frame, 3 is a mounting plate, 4 is an assembly frame protrusion, 5 is a slit, 6 is a cross slit, 7 is a leg of the mounting plate, and 8 is a wiring. Reference numeral 9 denotes an optical device front plate, 10 denotes a CCD, 11 denotes a cavity, and 100 denotes an optical device for a solid-state imaging device.
[0010]
In FIG. 1, the
The
[0011]
About the operation | work at the time of joining, the
On the other hand, the
At that time, a video signal of each solid-
[0012]
After the position adjustment is completed, as shown in FIG. 4, the low-melting solder is used to join the
When the
Further, the provision of the
[0013]
As described above, when the projecting part of the assembly frame and the leg part of the solid-state imaging device mounting plate are soldered with solder or the like, it is easy to adjust the focus, blur, and registration, and the effect of temperature after joining In addition, it is possible to provide an optical apparatus for a solid-state imaging device that is resistant to changes with time and has excellent bonding strength, workability, and productivity.
In addition to being used for cameras using a two-dimensional CCD such as a color video camera and an industrial color television camera, the present invention can be attached to a one-dimensional CCD (line sensor) or a beam splitter other than a color separation prism. It can also be used when a solid-state imaging device is attached.
[0014]
【The invention's effect】
According to the present invention, the following effects are exhibited.
The assembly frame fixed to the left and right side surfaces of the prism has a plurality of slits in the joint part of the projecting part, so when assembling the projecting part of the assembly frame and the leg part of the mounting plate by soldering, an assembly frame with a large heat capacity The soldering temperature can be maintained locally without deteriorating the temperature due to the overall loss of heat, and the solder pool (anchor) that also serves to prevent slippage can be formed on the joint surface, so that it is reliable and strong in a short time. And reliable bonding is possible.
Also, if the assembly frame that is fixed to the left and right sides of the prism is made of metal plates, the fabrication process is easy and heat dissipation is good, avoiding high temperatures due to heat generated by the CCD, etc. Since the plate has a thermal expansion coefficient that is close to that of the prism material, it is less likely to be displaced or peeled off from the prism even in an environment with a severe temperature difference.
[0015]
In addition, if the joint surface of the projecting part of the assembly frame is made up of multiple intersecting slit surfaces, the joint surface area will be large, and the joint surface will have a solder pool that also serves to prevent displacement, so the joint strength Is further strengthened, enabling more reliable and reliable bonding. In addition, by providing the hollow portion below the slit of the protruding portion, it is possible to further prevent the joint portion from depriving the entire assembly frame of heat and causing a temperature drop.
In addition, if the CCD mounting plate is provided with leg portions having back surfaces having the same shape and dimensions as the protruding portion joint portion of the assembly frame, the mounting plate is less likely to lose heat during solder joining. Since the soldering temperature can be maintained locally, the joining operation can be completed in a short time.
[0016]
Also, because it is localized and short in time, it is less likely to conduct heat to the CCD, etc., which can prevent thermal destruction of the CCD, etc., has excellent bonding strength, reliability, workability, and productivity, and after bonding. Can provide an optical apparatus for a solid-state imaging device that is resistant to the effects of temperature and changes over time.
In addition, since the assembly frame protrusion and the CCD mounting plate members joined with solder etc. are made of metal, etc., even if the CCD mounting plate has poor bonding or CCD failure, it can be easily removed, replaced and re-joined. Is possible.
[Brief description of the drawings]
FIG. 1 is an exploded external perspective view of a prism, an assembly frame and a mounting plate of the present invention.
FIG. 2 is an enlarged perspective view of an example of an assembly frame protrusion.
FIG. 3 is an enlarged perspective view of another example of the assembly frame protrusion.
FIG. 4 is an explanatory diagram of joining of a prism, an assembly frame, and a mounting plate.
FIG. 5 is an external perspective view of an optical apparatus for a solid-state imaging device according to the present invention.
FIG. 6 is a side view of an optical apparatus for a solid-state imaging device according to the present invention.
FIG. 7 is a front view of the optical apparatus for a solid-state imaging device according to the present invention.
[Explanation of symbols]
1: Prism 2: Assembly frame 3: Mounting plate 4: Assembly frame protrusion 5: Slit 6: Cross slit 7: Leg of mounting plate 8: Wiring base 9: Front plate of optical device 10: CCD
11: Cavity 100: Optical device for solid-state imaging device
Claims (6)
プリズムと、該プリズムの左右側面に固着したプリズム組付け枠と、プリズムの光射出面側に配設された複数の脚部を有する固体撮像デバイス取付板を備えてなり、
前記プリズム組付け枠は、プリズム材料と近似の熱膨張係数を有する板材であり、前記プリズム組付け枠のプリズム光射出面側の端面には、プリズムの光射出面側に一定間隔を隔てて配設される固体撮像デバイス取付板の脚部を接合するための複数の突出部を設け、
かつ該突出部の固体撮像デバイス取付板の脚部の接合面に複数のスリットを設けてなることを特徴とする固体撮像デバイス用光学装置。In an optical apparatus for a solid-state imaging device in which a plurality of solid-state imaging devices are attached to a plurality of prism surfaces for color-separating imaging light from an objective optical system,
A prism, a prism assembly frame fixed to the left and right side surfaces of the prism, and a solid-state imaging device mounting plate having a plurality of legs disposed on the light exit surface side of the prism,
The prism assembly frame is a plate material having a coefficient of thermal expansion similar to that of the prism material, and is arranged on the end surface of the prism assembly frame on the prism light exit surface side with a certain interval on the light exit surface side of the prism. Providing a plurality of protrusions for joining the legs of the solid-state imaging device mounting plate provided,
An optical apparatus for a solid-state imaging device, wherein a plurality of slits are provided on a joint surface of a leg portion of the solid-state imaging device mounting plate of the protruding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26050198A JP4019236B2 (en) | 1998-09-14 | 1998-09-14 | Optical device for solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26050198A JP4019236B2 (en) | 1998-09-14 | 1998-09-14 | Optical device for solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000092506A JP2000092506A (en) | 2000-03-31 |
| JP4019236B2 true JP4019236B2 (en) | 2007-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP26050198A Expired - Lifetime JP4019236B2 (en) | 1998-09-14 | 1998-09-14 | Optical device for solid-state imaging device |
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| JP (1) | JP4019236B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1804489A1 (en) * | 2005-12-27 | 2007-07-04 | Thomson Licensing | Color separation optical system for a colour television camera |
| JP5074133B2 (en) * | 2007-09-13 | 2012-11-14 | オリンパスメディカルシステムズ株式会社 | Prism unit for imaging device |
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| JP2000092506A (en) | 2000-03-31 |
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