JP2601029B2 - Solid-state imaging device - Google Patents
Solid-state imaging deviceInfo
- Publication number
- JP2601029B2 JP2601029B2 JP4356497A JP35649792A JP2601029B2 JP 2601029 B2 JP2601029 B2 JP 2601029B2 JP 4356497 A JP4356497 A JP 4356497A JP 35649792 A JP35649792 A JP 35649792A JP 2601029 B2 JP2601029 B2 JP 2601029B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- imaging device
- legs
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 title claims description 23
- 239000002184 metal Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 238000005476 soldering Methods 0.000 claims description 5
- 230000003595 spectral effect Effects 0.000 description 16
- 238000005219 brazing Methods 0.000 description 5
- 238000012856 packing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Color Television Image Signal Generators (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ＣＣＤ（Charge Cou
pled Device)等からなる固体撮像素子を使用したカラ−
ビデオカメラにおける固体撮像装置に関するものであ
る。This invention relates to a CCD (Charge Cou
color using a solid-state image sensor consisting of
The present invention relates to a solid-state imaging device in a video camera.
【０００２】[0002]
【従来の技術】ＣＣＤ等の固体撮像素子は、軽量で、か
つ小型であるため、このような固体撮像素子でカラ−ビ
デオカメラを構成するときは、撮像レンズから入射され
た被写体の画像を３色に分光する分光プリズムに対し
て、直接、固体撮像素子を取り付けることができるよう
になる。2. Description of the Related Art Since a solid-state image pickup device such as a CCD is lightweight and small, when a color video camera is constituted by such a solid-state image pickup device, three-dimensional images of a subject incident from an image pickup lens are required. The solid-state imaging device can be directly attached to the spectral prism that separates colors.
【０００３】第３図は、本出願人が先に提案した固体撮
像素子の取付装置（特願昭５９−２５７０６８号）を示
す斜視図で、１は矢印Ｐ方向から入射した光をＲ，Ｇ，
Ｂ線に沿って３方向に分光するための分光プリズムを示
す。この分光プリズム１は、例えば３個のプリズムから
構成されており、これらのプリズムを支持基台２によっ
て所定位置に固定したものである。Ｇ方向に分光された
光は分光プリズムの光射出面に置かれている緑色の像を
撮影するための固体撮像素子３Ｇによって受光される。FIG. 3 is a perspective view showing a solid-state imaging device mounting device (Japanese Patent Application No. 59-257068) previously proposed by the present applicant. ,
5 shows a spectral prism for splitting light in three directions along the line B. The spectral prism 1 includes, for example, three prisms, and these prisms are fixed at predetermined positions by a support base 2. The light separated in the G direction is received by the solid-state imaging device 3G for capturing a green image placed on the light exit surface of the spectral prism.
【０００４】４Ｇ、５Ｇは前記固体撮像素子３Ｇを分光
プリズム１の光射出面に取り付けるための第１、及び第
２の金具を示す。この第１、第２の金具４Ｇ、５Ｇは、
Ｒ方向の光射出面に示されている金具の分解斜視図によ
く示されているように、第１の金具４Ｒの一方の面には
固体撮像素子（図示せず）を位置決めするためのダボ６
Ｒと、取付用のネジ穴７Ｒが形成されており、周辺部に
は第２の金具５Ｒの脚部９Ｒと接合するため脚部８Ｒ、
８Ｒ………が設けられている。１０Ｒ、１１Ｒは分光プ
リズム１の光射出面から出力された光を、第１の金具４
Ｒにネジ止めされている固体撮像素子に受光させるため
の開口窓を示し、１２Ｒは第１、第２の金具４Ｒ、５Ｒ
の隙間を埋めるためのパッキング部材を示す。なお、Ｂ
方向における固体撮像素子及び取付用の金具は省略され
ているが、この部分にも前述したような取付用の金具、
及び固体撮像素子が取り付けられる。[0004] Reference numerals 4G and 5G denote first and second fittings for attaching the solid-state image pickup device 3G to the light exit surface of the spectral prism 1. The first and second fittings 4G, 5G are:
As is well shown in an exploded perspective view of the fitting shown on the light emitting surface in the R direction, a dowel for positioning a solid-state imaging device (not shown) is provided on one surface of the first fitting 4R. 6
R and a screw hole 7R for attachment are formed, and a leg 8R is formed in a peripheral portion for joining with a leg 9R of the second metal fitting 5R.
8R... Are provided. 10R and 11R convert the light output from the light exit surface of the spectral prism 1 into a first metal fitting 4
Reference numeral 12R denotes an opening window for allowing the solid-state imaging device screwed to R to receive light, and 12R denotes first and second fittings 4R and 5R.
2 shows a packing member for filling the gap of FIG. Note that B
Although the solid-state imaging device and the mounting bracket in the direction are omitted, the mounting bracket as described above also in this portion,
And a solid-state imaging device.
【０００５】このような固体撮像素子の取付構造による
と、第４図に示すように、第１の金具４Ｇ、４Ｒ、４Ｂ
に取り付けられている固体撮像素子３Ｇ、３Ｒ、３Ｂを
移動可能に支持している治具１３Ｒ、１３Ｇ、１３Ｂに
固定し、標準のテスト画像を分光プリズム１に入射した
とき、各固体撮像素子３Ｒ、３Ｇ、３Ｒから得られるク
ロマ画像信号が一致するようにそれぞれの治具１３Ｒ、
１３Ｇ、１３Ｂを移動してレジストレ−ションを調整
し、この調整位置で第１の金具４Ｇ、４Ｒ、４Ｂと、第
２の金具５Ｇ、５Ｒ、５Ｂの接合位置を決定し、各金具
の脚部８Ｒ、９Ｒ、８Ｇ、９Ｇ、８Ｂ、９Ｂを半田付け
等で溶着して、各固体撮像素子３Ｒ、３Ｇ、３Ｂを分光
プリズム１の光射出面に対してレジストレ−ションが最
良となる位置で固定することができる。According to such a solid-state image pickup device mounting structure, as shown in FIG. 4, the first metal fittings 4G, 4R, 4B
Are fixed to jigs 13R, 13G, and 13B that movably support the solid-state imaging devices 3G, 3R, and 3B attached thereto, and when a standard test image enters the spectral prism 1, each solid-state imaging device 3R , 3G, 3R, jigs 13R,
13G and 13B are moved to adjust the registration. At this adjustment position, the joining positions of the first metal fittings 4G, 4R and 4B and the second metal fittings 5G, 5R and 5B are determined, and the legs of each metal fitting are determined. 8R, 9R, 8G, 9G, 8B, 9B are welded by soldering or the like, and the solid-state imaging devices 3R, 3G, 3B are fixed to the light exit surface of the spectral prism 1 at a position where the registration is best. can do.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、第１、
第２の金具４（Ｒ、Ｇ、Ｂ),５（Ｒ、Ｇ、Ｂ）は金属性
とされており、その取付方向に３方向に分散しているの
で、脚部８（Ｒ、Ｇ、Ｂ),９（Ｒ、Ｇ、Ｂ）を半田付
け、又はろう付けする際に、例えば、第５図に示すよう
に溶融金属Ｓが接合部からたれ下がり、脚部８（Ｒ、
Ｇ、Ｂ),９（Ｒ、Ｇ、Ｂ）の対向面に溶融した金属が確
実に溶着しないという欠点が発生し、作業性及び固着が
悪いという問題がある。However, first,
Since the second metal fittings 4 (R, G, B) and 5 (R, G, B) are made of metal and are dispersed in three directions in their mounting directions, the leg portions 8 (R, G, B) In soldering or brazing B), 9 (R, G, B), for example, as shown in FIG.
G, B), 9 (R, G, B) have the disadvantage that the molten metal is not reliably welded to the opposing surfaces, resulting in poor workability and poor fixation.
【０００７】[0007]
【課題を解決するための手段】この発明はかかる問題点
を解消するためになされたもので、前記した第１、及び
第２の金具の脚部を相対向するように配置し、この相対
向する面を除いた部分をソルダレジスト層によって被覆
するようにしたものである。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and the first and second metal fittings are arranged so as to face each other. The portion excluding the surface to be covered is covered with a solder resist layer.
【０００８】[0008]
【作用】第１、第２の金具を接合するため脚部を水平方
向に引き出し、引き出した脚部の相対向する部分に、例
えばプリ半田等を施して、他の部分をソルダレジスト層
で被覆しているので、クリ−ム半田等によって第１、第
２の金具を溶着する場合、脚部の所定個所のみに半田が
溶着し、確実に固着することができる。In order to join the first and second metal fittings, the legs are pulled out in a horizontal direction, and opposing portions of the pulled-out legs are subjected to, for example, pre-solder, and the other portions are covered with a solder resist layer. Therefore, when the first and second metal fittings are welded by cream solder or the like, the solder is welded only to predetermined portions of the legs, and can be securely fixed.
【０００９】[0009]
【実施例】第１図は、この発明の一実施例である固体撮
像素子の取付装置を分解斜視図で示したもので、２１は
分光プリズム、２２は複数個のプリズムを所定の位置で
固定して分光プリズム２１を構成し、筐体等に固定する
ための支持基台、２３は第１の金具２４に固定される固
体撮像素子、２５は前記分光プリズム２１の光射出面に
固定される第２の金具を示す。FIG. 1 is an exploded perspective view showing an apparatus for mounting a solid-state image pickup device according to an embodiment of the present invention. Reference numeral 21 denotes a spectral prism, and reference numeral 22 denotes a plurality of prisms fixed at predetermined positions. And a support base for fixing to a housing or the like, 23 is a solid-state imaging device fixed to a first metal fitting 24, and 25 is fixed to a light exit surface of the spectral prism 21. 3 shows a second metal fitting.
【００１０】第１、及び第２の金具２４、２５には前述
したようにこれらを相互に結合するための４本の脚部２
４Ａ、及び２５Ａがほぼ水平方向に突出しており、中央
部分は光を通過させるための開口窓２４Ｂ、２５Ｂが形
成されている。２６は前記第１、第２の金具２４、２５
の接合面で挟接されるように配置されている遮光、防塵
用のパッキング部材を示し、２７は固体撮像素子２３を
第１の金具２４に固定するネジを示す。なお、これ等が
分光プリズム２１に固定された状態は、分光プリズム２
１の他の光路上におかれている符号２８によって示され
ている。The first and second metal fittings 24 and 25 have four legs 2 for connecting them to each other as described above.
4A and 25A protrude substantially in the horizontal direction, and open windows 24B and 25B for transmitting light are formed in the central portion. 26 is the first and second metal fittings 24 and 25
Indicates a light-shielding and dust-proof packing member arranged so as to be sandwiched between the joining surfaces of the solid-state imaging device, and 27 indicates a screw for fixing the solid-state imaging device 23 to the first metal fitting 24. The state in which these are fixed to the spectral prism 21 is the
Indicated by reference numeral 28 located on one other optical path.
【００１１】前記第１、第２の金具２４、２５の脚部２
４Ａ、２５Ａの対向する面は第１図、第２図に示すよう
に互いに相対向する面Ａのみに半田のぬれ性がよくなる
ようにプリ半田が斜線で示すように施されており、他の
部分は余剰半田が付着しないようにソルダレジスト層が
施されている。The leg 2 of the first and second metal fittings 24, 25
As shown in FIGS. 1 and 2, the opposing surfaces of 4A and 25A are pre-soldered only as shown by hatching so that the wettability of the solder is improved only on the opposing surfaces A. The portion is provided with a solder resist layer so that excess solder does not adhere.
【００１２】この発明の固体撮像素子の取付装置に採用
されている第１、及び第２の金具２４、２５は、上述し
たように互いに対向する脚部２４Ａ、２５Ａの接合面に
半田のぬれ性が向上するようなプリ半田が施されてお
り、他の部分はソルダレジスト層によって被覆するよう
に構成しているので、前述したようにレジストレ−ショ
ンの調整によって分光プリズム２１に対する固体撮像素
子２３の位置決めが行われたあとで、前記脚部２４Ａ、
２５Ａの接合面をクリ−ム半田等で溶着すると、第１、
第２の金具２４、２５が所定の位置で固着される。この
場合、第１、第２の金具２４、２５の接合面が相対向し
ており、この部分にのみ充分な半田溶着が行われるた
め、固着が確実にできるようになると同時に、余剰半田
が脚部２４Ａ、２５Ａの周辺にたれ下がり半田不良を引
き起すことを防止することができる。The first and second metal fittings 24, 25 employed in the solid-state image pickup device mounting apparatus of the present invention have solder wettability on the joint surfaces of the legs 24A, 25A facing each other as described above. And the other portions are covered with a solder resist layer, so that the solid-state imaging device 23 with respect to the spectral prism 21 is adjusted by adjusting the registration as described above. After the positioning is performed, the legs 24A,
When the joining surface of 25A is welded with cream solder or the like,
The second metal fittings 24 and 25 are fixed at predetermined positions. In this case, the joining surfaces of the first and second metal fittings 24 and 25 are opposed to each other, and sufficient solder welding is performed only at these portions, so that the fixing can be surely performed and, at the same time, the excess solder is attached to the legs. It is possible to prevent sagging around the parts 24A and 25A and causing solder failure.
【００１３】なお、溶着材として半田によるろう付けに
ついて説明したが、銅系の硬ろうによるろう付けを施し
てもよいことはいうまでもない。また、金具の材質がろ
う付けに対してぬれ性が良い場合はプリ半田を省略し、
ソルダレジスト層のみを施してもよい。Although brazing with solder has been described as a welding material, it goes without saying that brazing with copper-based hard brazing may be performed. Also, if the material of the bracket has good wettability to brazing, omit the pre-soldering,
Only a solder resist layer may be applied.
【００１４】[0014]
【発明の効果】以上説明したように、この発明の固体撮
像装置は、分光プリズムの光射出面に取り付けられてい
る第１の金具と、固体撮像素子が固定される第２の金具
を備え、前記第１、第２の金具の周辺部に突出して形成
された脚部の相対向する接合面のいずれか一方にプリ半
田を施し、かつ溶融金属が上記接合面を除いた部分に付
着しないようにソルダレジスト層が施されているので、
固体撮像素子を分光プリズムの光射出面に対して所定位
置に固定する際、位置合せが容易となると共に、溶着金
属が他の部分を汚染することなく溶着が確実に行われる
ようになり、そのため固体撮像素子の取り付け作業性が
大きく改善されるという効果がある。As described above, the solid-state imaging device according to the present invention includes the first metal fitting attached to the light exit surface of the spectral prism and the second metal fitting to which the solid-state imaging device is fixed. Formed so as to protrude around the first and second metal fittings
Been legs of opposing joint surfaces either one pre half
And the molten metal is applied to the
Since the solder resist layer is applied so that it does not wear ,
When the solid-state imaging device is fixed at a predetermined position with respect to the light exit surface of the spectral prism, alignment becomes easy, and
Welding can be performed reliably without contaminating other parts with the metal, thereby improving the workability of mounting the solid-state imaging device.
This has the effect of being greatly improved.
【図１】 固体撮像素子の取付装置を示す一実施例の分
解斜視図をである。FIG. 1 is an exploded perspective view of one embodiment showing a mounting device for a solid-state imaging device.
【図２】 第１の金具の脚部を示す斜視図である。FIG. 2 is a perspective view showing a leg of a first metal fitting.
【図３】 本出願人が先に提案した固体撮像素子の取付
装置を示す斜視図である。FIG. 3 is a perspective view showing a mounting device for a solid-state imaging device previously proposed by the present applicant.
【図４】 取付調整を説明するための分光プリズムの斜
視図である。FIG. 4 is a perspective view of a spectral prism for explaining attachment adjustment.
【図５】 半田付けの状態を示す説明図である。FIG. 5 is an explanatory view showing a state of soldering.
２１ 分光プリズム ２２ 支持基台 ２３ 固体撮像素子 ２４ 第１の金具 ２５ 第２の金具 ２４Ａ、２５Ａ 脚部 ２６ パッキング部材 DESCRIPTION OF SYMBOLS 21 Spectral prism 22 Support base 23 Solid-state image sensor 24 1st metal fitting 25 2nd metal fitting 24A, 25A Leg 26 Packing member
Claims (1)
面と平行に、かつ左右が対称となるように突出した複数
の第１の脚部を有する第１の金具と、 入射した光を複数の光射出面に分光する分光プリズム
と、 上記分光プリズムの光射出面に固定され、上記光射出面
と平行に、かつ、上記複数の第１の脚部とそれぞれ衝合
する位置に形成された第２の脚部を有する第２の金具
と、上記第１、及び第２の金具は、上記第１及び第２の脚部
が衝合する面を除いてソルダレジスト層を施し、この第
１、及び第２の脚部の衝合面のいずれか一方の表面にプ
リ半田を施し、 上記第２の金具を上記第１の金具に対して所定の位置に
位置合わせした後に、上記第１及び第２の脚部の衝合面
が 溶融金属によって固着されていることを特徴とする固
体撮像装置。1. A solid-state image sensor, and a plurality of the solid-state image sensors fixed and projecting in parallel with an imaging surface of the solid-state image sensor so as to be symmetrical left and right.
A first fitting having a first leg portion, a splitting prism for splitting incident light into a plurality of light emitting surfaces, and fixed to the light emitting surface of the splitting prism, in parallel with the light emitting surface, and Abuts with the plurality of first legs, respectively
A second fitting having a second leg formed at a position where the first and second fittings are formed.
A solder resist layer is applied except for the surface where
Press on one of the abutment surfaces of the first and second legs.
After re-soldering, place the second metal fitting in a predetermined position with respect to the first metal fitting.
After alignment, the abutment surfaces of the first and second legs
Is fixed by a molten metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4356497A JP2601029B2 (en) | 1992-12-22 | 1992-12-22 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4356497A JP2601029B2 (en) | 1992-12-22 | 1992-12-22 | Solid-state imaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2601029B2 true JP2601029B2 (en) | 1997-04-16 |
Family
ID=18449315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4356497A Expired - Lifetime JP2601029B2 (en) | 1992-12-22 | 1992-12-22 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2601029B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939580B2 (en) * | 1976-06-29 | 1984-09-25 | ナショナル住宅産業株式会社 | architectural structure |
-
1992
- 1992-12-22 JP JP4356497A patent/JP2601029B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939580B2 (en) * | 1976-06-29 | 1984-09-25 | ナショナル住宅産業株式会社 | architectural structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |