JP3983793B2 - Led照明光源の製造方法およびled照明光源 - Google Patents
Led照明光源の製造方法およびled照明光源 Download PDFInfo
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- JP3983793B2 JP3983793B2 JP2006512501A JP2006512501A JP3983793B2 JP 3983793 B2 JP3983793 B2 JP 3983793B2 JP 2006512501 A JP2006512501 A JP 2006512501A JP 2006512501 A JP2006512501 A JP 2006512501A JP 3983793 B2 JP3983793 B2 JP 3983793B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
- F21S6/002—Table lamps, e.g. for ambient lighting
- F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Description
12 LEDチップ
13 蛍光体樹脂部
20 透光性樹脂部(光拡散層)
21a 上面中央部
21b 上面周囲部
22 レンズ
30 多層基板
32 ベース基板
34 配線層
36 配線パターン
38 給電端子
40 反射板
42 反射面
44 開口部
50 ステージ
51 印刷版
51a 開口部
52 スキージ
55 樹脂ペースト
60,61 メタルマスク
62 スキージ
64,65,67,69 開口部
66,68,68' マスク
70 蛍光体ペースト
71 樹脂ペースト
90 ディスペンサ
92 上型
93 突起部
94 下型
96 基板
100 照明光源
160 本体部
164 受容部
165 スロット
200,300 照明光源
Claims (14)
- 少なくとも1つのLEDチップが設けられた基板を用意する工程(a)と、
前記LEDチップの少なくとも上面を覆う蛍光体樹脂部を前記基板上に形成する工程(b)と、
前記蛍光体樹脂部から出る光に作用するレンズを形成する工程(c)と、
を包含するLED照明光源の製造方法であって、
前記蛍光体樹脂部から発する光を散乱させる粒子が分散された光拡散層を前記蛍光体樹脂部と前記レンズとの間に形成する工程(d)と、
前記蛍光体樹脂部の上面における前記光拡散層の厚さを、前記上面の中央部よりも前記上面の周囲部で大きくする工程(e)と、を包含する、LED照明光源の製造方法。 - 前記光拡散層は、前記粒子が分散された透光性樹脂から形成されている、請求項1に記載のLED照明光源の製造方法。
- 前記蛍光体樹脂部は円柱形状を有している請求項2に記載のLED照明光源の製造方法。
- 前記光拡散層の厚さは、10μm以上1mm以下である、請求項1に記載のLED照明光源の製造方法。
- 前記粒子は、SiO2、MgO、BaSO4、Al2O3からなる群から選択される少なくとも1つの材料から形成される、請求項2に記載のLED照明光源の製造方法。
- 前記LEDチップは、ベアチップLEDであり、
前記ベアチップLEDは、前記基板にフリップチップ実装されている、請求項1に記載のLED照明光源の製造方法。 - 前記工程(b)および前記工程(d)は、印刷方式によって実行される、請求項1に記載のLED照明光源の製造方法。
- 基板上に実装された少なくとも1つのLEDチップと、
前記LEDチップの少なくとも上面を覆う蛍光体樹脂部と、
前記蛍光体樹脂部から出る光に作用するレンズと、を備え、
前記蛍光体樹脂部と前記レンズとの間に、前記光を散乱させる粒子が分散された光拡散層が設けられ、
前記蛍光体樹脂部の上面における前記光拡散層の厚さが、前記上面の中央部よりも前記上面の周囲部で大きい、LED照明光源。 - 前記蛍光体樹脂部は、前記LEDチップから放射された光を当該光の波長よりも長い波長の光に変換する蛍光体を含有し、
前記光拡散層は、前記粒子が分散された透光性樹脂から形成されている、請求項8に記載のLED照明光源。 - 前記光拡散層は、前記蛍光体樹脂部の上面における少なくとも周辺部を覆っている、請求項8に記載のLED照明光源。
- 前記蛍光体樹脂部は円柱形状を有している、請求項8に記載のLED照明光源。
- 前記光拡散層は、前記蛍光体樹脂部の表面を覆い、その厚さは略一様である請求項8に記載のLED照明光源。
- 前記透光性樹脂部を収納する開口部が設けられた反射板を前記基板上に備えており、
前記開口部を規定する側面が、前記LEDチップから出射される光を反射する反射面として機能する請求項8に記載のLED照明光源。 - 前記反射面と前記透光性樹脂部の側面とは離間している、請求項13に記載のLED照明光源。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004122550 | 2004-04-19 | ||
JP2004122550 | 2004-04-19 | ||
PCT/JP2005/006959 WO2005104247A1 (ja) | 2004-04-19 | 2005-04-08 | Led照明光源の製造方法およびled照明光源 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP3983793B2 true JP3983793B2 (ja) | 2007-09-26 |
JPWO2005104247A1 JPWO2005104247A1 (ja) | 2008-03-13 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006512501A Expired - Fee Related JP3983793B2 (ja) | 2004-04-19 | 2005-04-08 | Led照明光源の製造方法およびled照明光源 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7514867B2 (ja) |
JP (1) | JP3983793B2 (ja) |
CN (1) | CN100454596C (ja) |
WO (1) | WO2005104247A1 (ja) |
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- 2005-04-08 US US10/582,329 patent/US7514867B2/en not_active Expired - Fee Related
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JP2011523511A (ja) * | 2008-05-29 | 2011-08-11 | クリー インコーポレイテッド | 近距離場で光を混合する光源 |
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CN100454596C (zh) | 2009-01-21 |
US7514867B2 (en) | 2009-04-07 |
US20080074032A1 (en) | 2008-03-27 |
WO2005104247A1 (ja) | 2005-11-03 |
JPWO2005104247A1 (ja) | 2008-03-13 |
CN1910762A (zh) | 2007-02-07 |
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