JP3870225B2 - Gold plating sealing agent and method - Google Patents
Gold plating sealing agent and methodInfo
- Publication number
- JP3870225B2 JP3870225B2 JP2001322414A JP2001322414A JP3870225B2 JP 3870225 B2 JP3870225 B2 JP 3870225B2 JP 2001322414 A JP2001322414 A JP 2001322414A JP 2001322414 A JP2001322414 A JP 2001322414A JP 3870225 B2 JP3870225 B2 JP 3870225B2
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- Prior art keywords
- gold
- compound
- sealing agent
- plating
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/165—Heterocyclic compounds containing sulfur as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacture Of Switches (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、封孔処理剤、特に基材金属とニッケルまたはニッケルを含んだ合金めっき等を下地とした金または金合金めっき材用の封孔処理剤とその処理方法に関する。
【０００２】
【従来の技術】
従来より、電子部品業界では、金の電気的特性、高信頼性等優れた性能のため、金めっきを多くの電子部品（コネクター、スイッチ、プリント基板等）に使用してきた。
【０００３】
金めっきを行うには、まず、下地めっきとして通常ニッケルめっきを行ってから、アルカリ浴または酸性浴を用いたストライク金めっきを行う必要があり、次いで、電子部品の場合、通常は、必要最少部位だけにはんだめっきを行うスポットめっき（部分めっき）を行う。
【０００４】
近年の電子機器の小形化、高密度化、そして高信頼性が要求される状況下では上述のような部品への金めっきにも高い信頼性が求められている。
【０００５】
【発明が解決しようとする課題】
ところで、近年、電子機器に対する経済性も強く求められており、上述のような金めっきの際にも、コストダウンのために金めっきの膜厚を薄くしてきた。その結果、薄くしためっき皮膜に指数関数的にピンホールが増えた。このピンホールに腐食性物質（水分、塩化物、硫化物、シアン化物、アンモニア塩類等）が侵入することにより下地・素地を腐食し、この腐食反応物が表面に析出して、接触抵抗上昇等の問題を起こしている。
【０００６】
そこで、耐食性の低下という問題に対応するために、金めっき後に封孔処理剤を塗布して性能を維持するという方法をとってきた。
しかしながら、現在、市場で主に使用されている溶剤系封孔処理剤は、塩素系物質、フロン系物質、アルコール等を含んでいて、環境汚染等の問題を抱えている。
【０００７】
一方、封孔処理剤としては、インヒビター含有水溶液に自己乳化剤を添加した水系封孔処理剤もあるが、これは、水系ということで、溶剤系封孔処理剤に比べて耐食性が劣っている。
【０００８】
特開平９−170096号公報等には、インヒビターと、自己乳化剤との組み合わせによるエマルジョンタイプの封孔処理剤が開示されており、そのときのインヒビターとして、ベンゾトリアゾール系、イミダゾール系、ベンズイミダゾール系、インドール系、メルカプトベンゾチアゾール系、そしてトリアジンチオール系の１種以上が選ばれる。
【０００９】
しかしながら、かかる方法は、溶剤系封孔剤と比べて乾燥性の点で問題があり、今日求められている金めっきの腐食防止法としては満足されない。
溶剤系封孔処理剤に問題があれば、当然ながら、水系封孔処理剤が考えられるが、上述のように水系の場合には、耐食性が十分でなく、乾燥に時間を要する。しかし、環境問題および経済性を考えると、溶剤系封孔処理剤にはそれらの問題を解消できないという固有の事情があり、結局、水系封孔処理剤の優位性が将来的には確保できると考えられる。
【００１０】
したがって、本発明の課題は、溶剤系封孔処理剤に匹敵する耐食性を備えた水系封孔処理剤とそれを使った処理方法を提供することである。
さらに具体的には、本発明の課題は、耐食性ばかりでなく、容易に乾燥し、取り扱いも容易で、しかも環境汚染物質を含まない金めっき皮膜用の水系封孔処理剤を提供することである。
【００１１】
【課題を解決するための手段】
本発明者らは、上述の課題を解決すべく種々検討を重ね、金めっき用の水系封孔処理剤にアミン化合物を添加することにより、耐食性が向上するとの知見を得た。
【００１２】
しかも、アミン化合物を添加した封孔処理剤で処理することにより、後工程の水洗で処理物が撥水して乾燥性が向上することを知り、本発明を完成した。
ここに、本発明は、金または金合金めっき材の封孔処理に際して、ベンゾトリアゾール系化合物、メルカプトベンゾチアゾール系化合物、およびトリアジンチオール系化合物から成る群から選んだ少なくとも１種のインヒビターと、界面活性剤と、下記式で示されるアミン化合物とを含む封孔処理剤を含有する水溶液を用いて封孔処理を行い、次いで、得られた撥水性処理物を水洗・乾燥する封孔処理方法である。
【化４】
また、本発明は、ベンゾトリアゾール系化合物、メルカプトベンゾチアゾール系化合物、およびトリアジンチオール系化合物から成る群から選んだ少なくとも１種のインヒビター、界面活性剤と、下記式で示されるアミン化合物とを含む金または金合金めっき材の水系封孔処理剤である。
【化４】
【００１４】
【発明の実施の形態】
インヒビター含有水溶液に界面活性剤とアミン化合物を添加した封孔処理剤中で、めっき材を陽極として直流電解することにより、基材金属、ニッケルまたはニッケルを含んだ合金めっきとインヒビターとを結合させ防錆効果を得る。
【００１５】
また、金または金合金めっ表面に界面活性剤等を付着させて腐食電位発生を抑え、なおかつ潤滑性を得る。
本発明において用いるインヒビターは、下記に示すベンゾトリアゾール系、メルカプトベンゾチアゾール系、トリアジンチオール系から少なくとも１種選択され、封孔処理液中に合計で10〜5000mg／L 含有される。
【００１６】
本発明において使用するベンゾトリアゾール系化合物は、下記一般式で表示される。
ベンゾトリアゾール系化合物
【００１７】
【化１】
R1はＨ、アルキル基、置換アルキル基を表し、R2はアルカリ金属、Ｈ、アルキル基、置換アルキル基を表す。
好適例については表１にまとめて示す。
【００１９】
【表１】
本発明において使用するメルカプトベンゾチアゾール系化合物は、下記一般式で表示される。
メルカプトベンゾチアゾール系化合物
【００２１】
【化２】
（R1は水素またはアルキル基、R2はアルカリ金属または水素）
好適例について表２にまとめて示す。
【００２３】
【表２】
本発明において使用するトリアジンチオール系化合物は、下記一般式で表示される。
トリアジンチオール系化合物
【００２５】
【化３】
R1は−SH、またはアルキル基またはアリール基で置換されたアミノ基を表し、M1、M2は水素、アルカリ金属を表す。
好適例については表３にまとめて示す。
【００２７】
【表３】
このように、本発明において使用するインヒビターは環状窒素化合物であり、水溶液中に１種類もしくは２種類以上含む。
上記水系封孔処理剤中にアミン化合物を添加することにより、耐食性がさらに向上する。また、封孔処理後に水洗を行うが、そのときに処理物が撥水することにより、乾燥性の向上にも繋がる。
【００２９】
本発明において用いるアミン化合物は、封孔処理液中に１〜20g/L 含有される。
本発明において用いるアミン化合物は、次の一般式で示される。
【００３０】
アミン化合物
【００３１】
【化４】
R1、R2、R3はそれぞれＨ、アルキル基、またはアルカノール基を表す。
好適例については表４にまとめて示す。
【００３３】
【表４】
本発明においては、りん酸エステル系界面活性剤を少なくとも１種用いるが、それは、腐食防止膜を形成すれば特に制限はない。
封孔処理液中にかかるりん酸エステル系界面活性剤は、0.1 〜10g/L 含有する。
【００３５】
本発明で使用するリン酸エステル界面活性剤は次の一般式で示される。
【００３６】
【化５】
Ｒはアルキル基、置換アルキルを表し、ＭはＨ、アルカリ金属を表し、ｎは酸化エチレンの平均的付加モル数を表す。
ここで、本発明における腐食防止の原理を説明すると次の通りである。
【００３８】
図１は、封孔処理前のめっき層の模式的説明図であり、図２は封孔処理後の同様の模式的説明図である。図中、金および金合金めっき皮膜やNiおよびNi合金めつき皮膜のピンホールに水分が付着すると、これにSO2 、C12 、NO2 等が溶解し、これにより基材金属や下地として設けられたNiめっき層が腐食される。
【００３９】
このような腐食を防ぐ方法として、金および金合金めっき皮膜やNiおよびNi合金、めっき皮膜のピンホールに依存するNiおよびNi合金や基材金属にインヒビターを結合させ、さらにピンホールを含め金めっき皮膜の上に腐食防止膜を形成することにより腐食電位の発生を妨げる。この腐食防止膜が耐食性の向上に大きな影響を及ぼす。
【００４０】
さらに腐食防止膜に撥水性を持たせることにより乾燥性が改善される。
封孔処理液中でめっき材を陽極として直流電解する。電圧は、0.3 〜1.0Vの範囲で十分である。封孔処理後は水洗を行い、このとき処理物が撥水する。
【００４１】
操作としては現状の水系封孔処理剤のそれと同じである。
ところで、特開平10−121271号公報には、銅または銅合金用の腐食抑制剤としてベンゾトリアゾールまたはトリルトリアゾールと、アミノアルキルーベンゾトリアゾールまたは−トリルトリアゾールと、アミン化合物とを含むものが開示されているが、これは硫化物を含む環境下での銅系金属の表面の耐変色性を改善するためのものであり、本発明を何一つ教えるものではない。
【００４２】
次に、実施例によって本発明の作用効果をさらに具体的に説明する。
【００４３】
【実施例】
本例では、リン青銅を供試材として、これを脱脂後、スルファミン酸Niめっきを行い、次いでシアン浴を使ってストライク金めっきを行った。
【００４４】
金めっき皮膜の厚さは、0.1 μm 、Niめっき皮膜の厚さは1.0 μm であった。次いで、本発明にかかる封孔剤を含有する水系めっき浴を使って、上記金めっき物を陽極として電解を行いその上に封孔皮膜を設けた。
【００４５】
本例における本発明例では、水系封孔処理剤１ないし３としては、それぞれ、ベンゾトリアゾール系化合物、メルカプトベンゾチアゾール系化合物、そしてトリアジンチオール系化合物を10〜5000mg/L、アミン化合物 1〜20g/L 、そしてりん酸エステル系界面活性剤0.1 〜10g/L を含有するものである。
【００４６】
一方、従来例としては、特開平９−170096号公報に開示するものである。
評価試験の結果は表５にまとめて示す。
耐食性は、腐食の有無を三段階で評価したものであり、撥水性は、撥水の有無でもって評価した。
【００４７】
【表５】
以上より、本発明によれば、アミン化合物の添加した封孔処理剤で処理することにより、後工程の水洗後で処理物が撥水して乾燥性が向上することが分かる。
【００４９】
【発明の効果】
以上説明したように、本発明によれは、アミン化合物を添加することによる耐食性および乾燥性の向上が著しく、本発明の実用上の意義は大きいことが分かる。
【図面の簡単な説明】
【図１】封孔処理前のめっき層の模式的説明図である。
【図２】封孔処理後の同様の模式的説明図である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a sealing treatment agent, particularly a sealing treatment agent for gold or gold alloy plating material based on a base metal and nickel or an alloy plating containing nickel, and a treatment method thereof .
[0002]
[Prior art]
Conventionally, in the electronic component industry, gold plating has been used for many electronic components (connectors, switches, printed circuit boards, etc.) due to excellent performance such as electrical characteristics and high reliability of gold.
[0003]
In order to perform gold plating, it is necessary to first perform nickel plating as the base plating, and then to perform strike gold plating using an alkali bath or an acidic bath. Only spot plating (partial plating) for solder plating is performed.
[0004]
Under recent circumstances where electronic devices are required to be miniaturized, densified, and highly reliable, high reliability is also required for gold plating on the above-described components.
[0005]
[Problems to be solved by the invention]
By the way, in recent years, economical efficiency for electronic devices has been strongly demanded, and the thickness of the gold plating has been reduced in order to reduce the cost even in the above-described gold plating. As a result, pinholes increased exponentially in the thin plating film. Corrosive substances (moisture, chloride, sulfide, cyanide, ammonia salts, etc.) enter this pinhole to corrode the substrate and substrate, and this corrosion reaction product precipitates on the surface, increasing contact resistance, etc. Is causing problems.
[0006]
Therefore, in order to cope with the problem of a decrease in corrosion resistance, a method has been adopted in which a sealing agent is applied after gold plating to maintain the performance.
However, currently, the solvent-based sealing agent used mainly in the market contains chlorine-based materials, chlorofluorocarbon-based materials, alcohols, and the like, and has problems such as environmental pollution.
[0007]
On the other hand, as the sealing agent, there is an aqueous sealing agent in which a self-emulsifier is added to an aqueous solution containing an inhibitor. However, since this is aqueous, the corrosion resistance is inferior to that of a solvent-based sealing agent.
[0008]
JP-A-9-170096 and the like disclose an emulsion-type pore-sealing agent by a combination of an inhibitor and a self-emulsifier, and as an inhibitor at that time, benzotriazole, imidazole, benzimidazole, One or more of indole, mercaptobenzothiazole, and triazine thiol are selected.
[0009]
However, this method has a problem in terms of dryness compared with a solvent-based sealant, and is not satisfied as a corrosion prevention method for gold plating that is required today.
If there is a problem with the solvent-based sealing agent, a water-based sealing agent can be considered as a matter of course. However, as described above, in the case of an aqueous system, the corrosion resistance is not sufficient, and drying takes time. However, considering environmental issues and economics, solvent-based pore-opening agents have inherent circumstances that cannot solve these problems, and eventually the superiority of water-based pore-opening agents can be secured in the future. Conceivable.
[0010]
Accordingly, an object of the present invention is to provide an aqueous sealing agent having corrosion resistance comparable to that of a solvent-based sealing agent and a treatment method using the same .
More specifically, an object of the present invention is to provide an aqueous sealing agent for a gold plating film that is not only corrosion resistant but also easily dried, easy to handle, and free of environmental pollutants. .
[0011]
[Means for Solving the Problems]
The inventors of the present invention have made various studies to solve the above-mentioned problems, and have obtained the knowledge that the corrosion resistance is improved by adding an amine compound to the water-based sealing agent for gold plating.
[0012]
In addition, the present invention was completed by knowing that treatment with a sealing agent to which an amine compound was added repels the treated product by water washing in a later step and the drying property is improved.
Here, the present invention relates to at least one inhibitor selected from the group consisting of a benzotriazole compound, a mercaptobenzothiazole compound, and a triazine thiol compound, and a surface activity in the sealing treatment of a gold or gold alloy plating material. Sealing treatment is performed using an aqueous solution containing a sealing agent containing an agent and an amine compound represented by the following formula, and then the resulting water-repellent treatment is washed with water and dried. .
[Formula 4]
The present invention also provides a gold comprising at least one inhibitor selected from the group consisting of benzotriazole compounds, mercaptobenzothiazole compounds, and triazine thiol compounds, a surfactant, and an amine compound represented by the following formula : Or it is a water-system sealing agent of a gold alloy plating material .
[Formula 4]
[0014]
DETAILED DESCRIPTION OF THE INVENTION
In the sealing agent with surfactant and amine compound added to the inhibitor-containing aqueous solution, direct plating is applied to the plating material as the anode to bond the base metal, nickel or nickel-containing alloy plating to the inhibitor. Get rust effect.
[0015]
In addition, a surfactant or the like is attached to the surface of the gold or gold alloy to suppress the generation of corrosion potential and to obtain lubricity.
The inhibitor used in the present invention is selected from at least one of the following benzotriazoles, mercaptobenzothiazoles, and triazinethiols, and is contained in a total of 10 to 5000 mg / L in the sealing treatment solution.
[0016]
The benzotriazole-based compound used in the present invention is represented by the following general formula.
Benzotriazole compounds [0017]
[Chemical 1]
R 1 represents H, an alkyl group, or a substituted alkyl group, and R 2 represents an alkali metal, H, an alkyl group, or a substituted alkyl group.
Preferred examples are summarized in Table 1.
[0019]
[Table 1]
The mercaptobenzothiazole compound used in the present invention is represented by the following general formula.
Mercaptobenzothiazole compound [0021]
[Chemical 2]
(R 1 is hydrogen or an alkyl group, R 2 is an alkali metal or hydrogen)
Preferred examples are summarized in Table 2.
[0023]
[Table 2]
The triazine thiol compound used in the present invention is represented by the following general formula.
Triazine thiol compound
[Chemical 3]
R 1 represents —SH, or an amino group substituted with an alkyl group or an aryl group, and M 1 and M 2 represent hydrogen and an alkali metal.
Preferred examples are summarized in Table 3.
[0027]
[Table 3]
As described above, the inhibitor used in the present invention is a cyclic nitrogen compound, and is contained in one or more kinds in the aqueous solution.
Corrosion resistance is further improved by adding an amine compound to the aqueous sealing agent. In addition, although water washing is performed after the sealing treatment, the treated product becomes water repellent at that time, which leads to improvement in drying properties.
[0029]
The amine compound used in the present invention is contained in the sealing treatment liquid in an amount of 1 to 20 g / L.
The amine compound used in the present invention is represented by the following general formula.
[0030]
Amine compounds [0031]
[Formula 4]
R 1 , R 2 , and R 3 each represent H, an alkyl group, or an alkanol group.
Preferred examples are summarized in Table 4.
[0033]
[Table 4]
In the present invention, at least one phosphate ester-based surfactant is used, but there is no particular limitation as long as a corrosion prevention film is formed.
The phosphate ester-based surfactant in the sealing solution contains 0.1 to 10 g / L.
[0035]
The phosphate ester surfactant used in the present invention is represented by the following general formula.
[0036]
[Chemical formula 5]
R represents an alkyl group or substituted alkyl, M represents H or an alkali metal, and n represents the average number of moles of ethylene oxide added.
Here, the principle of corrosion prevention in the present invention will be described as follows.
[0038]
FIG. 1 is a schematic explanatory view of a plating layer before the sealing treatment, and FIG. 2 is a similar schematic explanatory view after the sealing treatment. In the figure, if water adheres to the pinholes of gold and gold alloy plating film or Ni and Ni alloy plating film, SO 2 , C1 2 , NO 2, etc. are dissolved in this, thereby providing the base metal or base The formed Ni plating layer is corroded.
[0039]
In order to prevent such corrosion, gold and gold alloy plating film, Ni and Ni alloy, Ni and Ni alloy and base metal that depend on the pinhole of plating film are combined with inhibitors, and gold plating including pinholes is also applied. Formation of a corrosion prevention film on the film prevents the generation of corrosion potential. This corrosion prevention film has a great influence on the improvement of the corrosion resistance.
[0040]
Further, the drying property is improved by imparting water repellency to the corrosion prevention film.
DC electrolysis is performed in the sealing solution using the plating material as an anode. A voltage in the range of 0.3 to 1.0 V is sufficient. After the sealing treatment, washing is performed, and at this time, the treated product becomes water repellent.
[0041]
The operation is the same as that of the current aqueous sealing agent.
By the way, JP-A-10-121271 discloses a material containing benzotriazole or tolyltriazole, aminoalkyl-benzotriazole or -tolyltriazole, and an amine compound as a corrosion inhibitor for copper or a copper alloy. However, this is intended to improve the discoloration resistance of the surface of the copper-based metal in an environment containing sulfide, and does not teach the present invention at all.
[0042]
Next, the effects of the present invention will be described more specifically with reference to examples.
[0043]
【Example】
In this example, phosphor bronze was used as a test material, this was degreased, Ni-sulfamate plating was performed, and then strike gold plating was performed using a cyan bath.
[0044]
The thickness of the gold plating film was 0.1 μm, and the thickness of the Ni plating film was 1.0 μm. Next, using the aqueous plating bath containing the sealing agent according to the present invention, electrolysis was performed using the gold-plated product as an anode, and a sealing film was provided thereon.
[0045]
In the present invention example in this example, as the water-based sealing agent 1 to 3, benzotriazole compound, mercaptobenzothiazole compound, and triazine thiol compound are 10 to 5000 mg / L, and amine compound 1 to 20 g / L, respectively. L and a phosphate ester type surfactant containing 0.1 to 10 g / L.
[0046]
On the other hand, a conventional example is disclosed in Japanese Patent Laid-Open No. 9-170096.
The results of the evaluation test are summarized in Table 5.
Corrosion resistance was evaluated in three stages for the presence or absence of corrosion, and water repellency was evaluated by the presence or absence of water repellency.
[0047]
[Table 5]
From the above, according to the present invention, it can be seen that treatment with a sealing agent to which an amine compound has been added makes the treated product water repellent after water washing in the subsequent step and the drying property is improved.
[0049]
【The invention's effect】
As described above, according to the present invention, it is understood that the corrosion resistance and the drying property are significantly improved by adding an amine compound, and the practical significance of the present invention is great.
[Brief description of the drawings]
FIG. 1 is a schematic explanatory view of a plating layer before sealing treatment.
FIG. 2 is a similar schematic explanatory view after sealing processing.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001322414A JP3870225B2 (en) | 2001-10-19 | 2001-10-19 | Gold plating sealing agent and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001322414A JP3870225B2 (en) | 2001-10-19 | 2001-10-19 | Gold plating sealing agent and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003129257A JP2003129257A (en) | 2003-05-08 |
| JP3870225B2 true JP3870225B2 (en) | 2007-01-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001322414A Expired - Lifetime JP3870225B2 (en) | 2001-10-19 | 2001-10-19 | Gold plating sealing agent and method |
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| JP (1) | JP3870225B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914359B (en) * | 2004-01-30 | 2011-12-28 | 日矿金属株式会社 | Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| KR100796891B1 (en) * | 2004-01-30 | 2008-01-22 | 닛코킨조쿠 가부시키가이샤 | Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| JP4721827B2 (en) * | 2005-08-29 | 2011-07-13 | 京セラ株式会社 | Wiring board manufacturing method |
| US7883738B2 (en) | 2007-04-18 | 2011-02-08 | Enthone Inc. | Metallic surface enhancement |
| KR101688756B1 (en) | 2013-07-24 | 2016-12-21 | 제이엑스금속주식회사 | Electronic component and process for producing same |
| JP6271233B2 (en) | 2013-11-29 | 2018-01-31 | ローム・アンド・ハース電子材料株式会社 | Surface treatment liquid |
| JP6370658B2 (en) * | 2014-09-25 | 2018-08-08 | Ｊｘ金属株式会社 | Antioxidant for Ni plating film of electronic component, electronic component, and method of manufacturing electronic component |
| JP6577769B2 (en) | 2015-06-30 | 2019-09-18 | ローム・アンド・ハース電子材料株式会社 | Gold or gold alloy surface treatment solution |
| JP6819973B2 (en) | 2019-06-17 | 2021-01-27 | 有限会社ケミカル電子 | Hydrophilic metal surface treatment agent |
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2001
- 2001-10-19 JP JP2001322414A patent/JP3870225B2/en not_active Expired - Lifetime
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