JP2003129257A - Gold plating sealing agent - Google Patents
Gold plating sealing agentInfo
- Publication number
- JP2003129257A JP2003129257A JP2001322414A JP2001322414A JP2003129257A JP 2003129257 A JP2003129257 A JP 2003129257A JP 2001322414 A JP2001322414 A JP 2001322414A JP 2001322414 A JP2001322414 A JP 2001322414A JP 2003129257 A JP2003129257 A JP 2003129257A
- Authority
- JP
- Japan
- Prior art keywords
- sealing agent
- water
- present
- gold plating
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/165—Heterocyclic compounds containing sulfur as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、封孔処理剤、特に
基材金属とニッケルまたはニッケルを含んだ合金めっき
等を下地とした金または金合金めっき材用の封孔処理剤
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pore-sealing agent, and more particularly to a pore-sealing agent for gold or gold-alloy plated material having a base metal and nickel or an alloy plating containing nickel as a base.
【０００２】[0002]
【従来の技術】従来より、電子部品業界では、金の電気
的特性、高信頼性等優れた性能のため、金めっきを多く
の電子部品（コネクター、スイッチ、プリント基板等）
に使用してきた。2. Description of the Related Art Conventionally, in the electronic parts industry, gold plating has been used for many electronic parts (connectors, switches, printed circuit boards, etc.) because of its excellent performance such as electrical characteristics and high reliability of gold.
Have been used for.
【０００３】金めっきを行うには、まず、下地めっきと
して通常ニッケルめっきを行ってから、アルカリ浴また
は酸性浴を用いたストライク金めっきを行う必要があ
り、次いで、電子部品の場合、通常は、必要最少部位だ
けにはんだめっきを行うスポットめっき（部分めっき）
を行う。In order to perform gold plating, it is necessary to first perform nickel plating as a base plating, and then strike gold plating using an alkaline bath or an acidic bath. Spot plating (partial plating) to perform solder plating only on the minimum required area
I do.
【０００４】近年の電子機器の小形化、高密度化、そし
て高信頼性が要求される状況下では上述のような部品へ
の金めっきにも高い信頼性が求められている。In recent years, under the circumstances where miniaturization, high density and high reliability of electronic equipment are required, high reliability is also required for gold plating on the above-mentioned components.
【０００５】[0005]
【発明が解決しようとする課題】ところで、近年、電子
機器に対する経済性も強く求められており、上述のよう
な金めっきの際にも、コストダウンのために金めっきの
膜厚を薄くしてきた。その結果、薄くしためっき皮膜に
指数関数的にピンホールが増えた。このピンホールに腐
食性物質（水分、塩化物、硫化物、シアン化物、アンモ
ニア塩類等）が侵入することにより下地・素地を腐食
し、この腐食反応物が表面に析出して、接触抵抗上昇等
の問題を起こしている。By the way, in recent years, there has been a strong demand for economic efficiency in electronic equipment, and even in the case of gold plating as described above, the thickness of the gold plating has been reduced to reduce the cost. . As a result, pinholes increased exponentially in the thinned plating film. Intrusion of corrosive substances (water, chloride, sulfide, cyanide, ammonia salts, etc.) into these pinholes corrodes the substrate and substrate, and these corrosion reaction products precipitate on the surface, increasing contact resistance, etc. Is causing problems.
【０００６】そこで、耐食性の低下という問題に対応す
るために、金めっき後に封孔処理剤を塗布して性能を維
持するという方法をとってきた。しかしながら、現在、
市場で主に使用されている溶剤系封孔処理剤は、塩素系
物質、フロン系物質、アルコール等を含んでいて、環境
汚染等の問題を抱えている。Therefore, in order to address the problem of reduced corrosion resistance, a method has been adopted in which a sealing treatment agent is applied after gold plating to maintain the performance. However, currently
Solvent-based sealing agents used mainly in the market contain chlorine-based substances, CFC-based substances, alcohols, etc., and have problems such as environmental pollution.
【０００７】一方、封孔処理剤としては、インヒビター
含有水溶液に自己乳化剤を添加した水系封孔処理剤もあ
るが、これは、水系ということで、溶剤系封孔処理剤に
比べて耐食性が劣っている。On the other hand, as a pore-sealing agent, there is also a water-based pore-sealing agent prepared by adding a self-emulsifier to an inhibitor-containing aqueous solution. ing.
【０００８】特開平９−170096号公報等には、インヒビ
ターと、自己乳化剤との組み合わせによるエマルジョン
タイプの封孔処理剤が開示されており、そのときのイン
ヒビターとして、ベンゾトリアゾール系、イミダゾール
系、ベンズイミダゾール系、インドール系、メルカプト
ベンゾチアゾール系、そしてトリアジンチオール系の１
種以上が選ばれる。Japanese Unexamined Patent Publication (Kokai) No. 9-170096 discloses an emulsion-type pore-sealing agent comprising a combination of an inhibitor and a self-emulsifying agent, and as the inhibitor at that time, a benzotriazole type, an imidazole type, a benz Imidazole-based, indole-based, mercaptobenzothiazole-based, and triazinethiol-based 1
More than one seed is selected.
【０００９】しかしながら、かかる方法は、溶剤系封孔
剤と比べて乾燥性の点で問題があり、今日求められてい
る金めっきの腐食防止法としては満足されない。溶剤系
封孔処理剤に問題があれば、当然ながら、水系封孔処理
剤が考えられるが、上述のように水系の場合には、耐食
性が十分でなく、乾燥に時間を要する。しかし、環境問
題および経済性を考えると、溶剤系封孔処理剤にはそれ
らの問題を解消できないという固有の事情があり、結
局、水系封孔処理剤の優位性が将来的には確保できると
考えられる。However, such a method has a problem in dryness as compared with the solvent-based sealing agent, and is not satisfactory as a gold plating corrosion prevention method demanded today. If there is a problem with the solvent-based pore-sealing agent, naturally, the water-based pore-sealing agent may be considered, but as described above, in the case of the water-based pore-sealing agent, the corrosion resistance is not sufficient and it takes time to dry. However, considering environmental issues and economics, there are inherent circumstances in which solvent-based sealing agents cannot solve these problems, and eventually, the superiority of water-based sealing agents can be secured in the future. Conceivable.
【００１０】したがって、本発明の課題は、溶剤系封孔
処理剤に匹敵する耐食性を備えた水系封孔処理剤を提供
することである。さらに具体的には、本発明の課題は、
耐食性ばかりでなく、容易に乾燥し、取り扱いも容易
で、しかも環境汚染物質を含まない金めっき皮膜用の水
系封孔処理剤を提供することである。Therefore, an object of the present invention is to provide a water-based pore-sealing agent having corrosion resistance comparable to that of a solvent-type pore-sealing agent. More specifically, the object of the present invention is to
It is an object of the present invention to provide a water-based sealing agent for gold plating film which is not only corrosion resistant but also easily dried and easy to handle and does not contain environmental pollutants.
【００１１】[0011]
【課題を解決するための手段】本発明者らは、上述の課
題を解決すべく種々検討を重ね、金めっき用の水系封孔
処理剤にアミン化合物を添加することにより、耐食性が
向上するとの知見を得た。Means for Solving the Problems The inventors of the present invention have made various studies to solve the above-mentioned problems, and by adding an amine compound to a water-based sealing agent for gold plating, the corrosion resistance is improved. I got the knowledge.
【００１２】しかも、アミン化合物を添加した封孔処理
剤で処理することにより、後工程の水洗で処理物が撥水
して乾燥性が向上することを知り、本発明を完成した。
ここに、本発明は、インヒビターと、界面活性剤と、ア
ミン化合物とを含む封孔処理剤である。Moreover, it was found that the treatment with a sealing agent containing an amine compound makes the treated product water-repellent and improves the drying property by washing with water in the subsequent step, and completed the present invention.
Here, the present invention is a pore-sealing agent containing an inhibitor, a surfactant, and an amine compound.
【００１３】本発明の実施態様によれば、前記インヒビ
ターは、ベンゾトリアゾール系化合物、メルカプトベン
ゾチアゾール系化合物、そしてトリアジンチオール系化
合物から成る群から選んだ少なくとも1 種である。According to an embodiment of the present invention, the inhibitor is at least one selected from the group consisting of benzotriazole compounds, mercaptobenzothiazole compounds, and triazinethiol compounds.
【００１４】[0014]
【発明の実施の形態】インヒビター含有水溶液に界面活
性剤とアミン化合物を添加した封孔処理剤中で、めっき
材を陽極として直流電解することにより、基材金属、ニ
ッケルまたはニッケルを含んだ合金めっきとインヒビタ
ーとを結合させ防錆効果を得る。BEST MODE FOR CARRYING OUT THE INVENTION A base metal, nickel or an alloy containing nickel is plated by direct current electrolysis using a plated material as an anode in a sealing agent containing a surfactant and an amine compound added to an inhibitor-containing aqueous solution. And the inhibitor are combined to obtain a rust preventive effect.
【００１５】また、金または金合金めっ表面に界面活性
剤等を付着させて腐食電位発生を抑え、なおかつ潤滑性
を得る。本発明において用いるインヒビターは、下記に
示すベンゾトリアゾール系、メルカプトベンゾチアゾー
ル系、トリアジンチオール系から少なくとも１種選択さ
れ、封孔処理液中に合計で10〜5000mg／L 含有される。Further, a surfactant or the like is adhered to the surface of the gold or gold alloy plating to suppress the generation of corrosion potential and obtain lubricity. The inhibitor used in the present invention is selected from at least one of the following benzotriazole type, mercaptobenzothiazole type and triazine thiol type and is contained in the sealing treatment solution in a total amount of 10 to 5000 mg / L.
【００１６】本発明において使用するベンゾトリアゾー
ル系化合物は、下記一般式で表示される。
ベンゾトリアゾール系化合物The benzotriazole compound used in the present invention is represented by the following general formula. Benzotriazole compound
【００１７】[0017]
【化１】 [Chemical 1]
【００１８】R1はＨ、アルキル基、置換アルキル基を表
し、R2はアルカリ金属、Ｈ、アルキル基、置換アルキル
基を表す。好適例については表１にまとめて示す。R 1 represents H, an alkyl group or a substituted alkyl group, and R 2 represents an alkali metal, H, an alkyl group or a substituted alkyl group. Suitable examples are summarized in Table 1.
【００１９】[0019]
【表１】 [Table 1]
【００２０】本発明において使用するメルカプトベンゾ
チアゾール系化合物は、下記一般式で表示される。
メルカプトベンゾチアゾール系化合物The mercaptobenzothiazole compound used in the present invention is represented by the following general formula. Mercaptobenzothiazole compounds
【００２１】[0021]
【化２】 [Chemical 2]
【００２２】（R1は水素またはアルキル基、R2はアルカ
リ金属または水素）
好適例について表２にまとめて示す。(R 1 is hydrogen or an alkyl group, R 2 is an alkali metal or hydrogen) Preferred examples are summarized in Table 2.
【００２３】[0023]
【表２】 [Table 2]
【００２４】本発明において使用するトリアジンチオー
ル系化合物は、下記一般式で表示される。
トリアジンチオール系化合物The triazine thiol compound used in the present invention is represented by the following general formula. Triazine thiol compound
【００２５】[0025]
【化３】 [Chemical 3]
【００２６】R1は−SH、またはアルキル基またはアリー
ル基で置換されたアミノ基を表し、M1、M2は水素、アル
カリ金属を表す。好適例については表３にまとめて示
す。R 1 represents --SH or an amino group substituted with an alkyl group or an aryl group, and M 1 and M 2 represent hydrogen or an alkali metal. Suitable examples are summarized in Table 3.
【００２７】[0027]
【表３】 [Table 3]
【００２８】このように、本発明において使用するイン
ヒビターは環状窒素化合物であり、水溶液中に１種類も
しくは２種類以上含む。上記水系封孔処理剤中にアミン
化合物を添加することにより、耐食性がさらに向上す
る。また、封孔処理後に水洗を行うが、そのときに処理
物が撥水することにより、乾燥性の向上にも繋がる。As described above, the inhibitor used in the present invention is a cyclic nitrogen compound, and one or more kinds are contained in the aqueous solution. The corrosion resistance is further improved by adding an amine compound to the above water-based pore-sealing agent. Further, although water washing is carried out after the sealing treatment, the treated product becomes water repellent at that time, which leads to improvement in drying property.
【００２９】本発明において用いるアミン化合物は、封
孔処理液中に１〜20g/L 含有される。本発明において用
いるアミン化合物は、次の一般式で示される。The amine compound used in the present invention is contained in the sealing treatment solution in an amount of 1 to 20 g / L. The amine compound used in the present invention is represented by the following general formula.
【００３０】アミン化合物Amine compound
【００３１】[0031]
【化４】 [Chemical 4]
【００３２】R1、R2、R3はそれぞれＨ、アルキル基、ア
ルカノール基を表す。好適例については表４にまとめて
示す。R 1 , R 2 and R 3 represent H, an alkyl group and an alkanol group, respectively. Preferred examples are summarized in Table 4.
【００３３】[0033]
【表４】 [Table 4]
【００３４】本発明においては、りん酸エステル系界面
活性剤を少なくとも１種用いるが、それは、腐食防止膜
を形成すれば特に制限はない。封孔処理液中にかかるり
ん酸エステル系界面活性剤は、0.1 〜10g/L 含有する。In the present invention, at least one phosphate ester type surfactant is used, but it is not particularly limited as long as it forms a corrosion preventing film. The phosphate ester surfactant contained in the sealing treatment liquid is contained in an amount of 0.1 to 10 g / L.
【００３５】本発明で使用するリン酸エステル界面活性
剤は次の一般式で示される。The phosphate ester surfactant used in the present invention is represented by the following general formula.
【００３６】[0036]
【化５】 [Chemical 5]
【００３７】Ｒはアルキル基、置換アルキルを表し、Ｍ
はＨ、アルカリ金属を表し、ｎは酸化エチレンの平均的
付加モル数を表す。ここで、本発明における腐食防止の
原理を説明すると次の通りである。R represents an alkyl group or a substituted alkyl, and M
Represents H and an alkali metal, and n represents the average number of moles of ethylene oxide added. Here, the principle of corrosion prevention in the present invention will be described as follows.
【００３８】図１は、封孔処理前のめっき層の模式的説
明図であり、図２は封孔処理後の同様の模式的説明図で
ある。図中、金および金合金めっき皮膜やNiおよびNi合
金めつき皮膜のピンホールに水分が付着すると、これに
SO2 、C12 、NO2 等が溶解し、これにより基材金属や下
地として設けられたNiめっき層が腐食される。FIG. 1 is a schematic explanatory diagram of the plating layer before the sealing treatment, and FIG. 2 is a similar schematic explanatory diagram after the sealing treatment. In the figure, if water adheres to the pinholes of the gold and gold alloy plating film or the Ni and Ni alloy plating film,
SO 2, C1 2, NO 2 or the like is dissolved, thereby Ni plating layer provided as the base metal and the base is corroded.
【００３９】このような腐食を防ぐ方法として、金およ
び金合金めっき皮膜やNiおよびNi合金、めっき皮膜のピ
ンホールに依存するNiおよびNi合金や基材金属にインヒ
ビターを結合させ、さらにピンホールを含め金めっき皮
膜の上に腐食防止膜を形成することにより腐食電位の発
生を妨げる。この腐食防止膜が耐食性の向上に大きな影
響を及ぼす。As a method of preventing such corrosion, an inhibitor is bonded to gold and gold alloy plating films, Ni and Ni alloys, Ni and Ni alloys and base metals that depend on the pinholes of the plating film, and pinholes are further formed. By forming a corrosion prevention film on the gold plating film including the above, the generation of corrosion potential is prevented. This corrosion prevention film has a great influence on the improvement of corrosion resistance.
【００４０】さらに腐食防止膜に撥水性を持たせること
により乾燥性が改善される。封孔処理液中でめっき材を
陽極として直流電解する。電圧は、0.3 〜1.0Vの範囲で
十分である。封孔処理後は水洗を行い、このとき処理物
が撥水する。Further, by imparting water repellency to the corrosion prevention film, the drying property is improved. Direct current electrolysis is performed with the plated material as the anode in the sealing treatment liquid. A voltage in the range 0.3-1.0V is sufficient. After the sealing treatment, washing is performed with water, and at this time, the treated product becomes water repellent.
【００４１】操作としては現状の水系封孔処理剤のそれ
と同じである。ところで、特開平10−121271号公報に
は、銅または銅合金用の腐食抑制剤としてベンゾトリア
ゾールまたはトリルトリアゾールと、アミノアルキルー
ベンゾトリアゾールまたは−トリルトリアゾールと、ア
ミン化合物とを含むものが開示されているが、これは硫
化物を含む環境下での銅系金属の表面の耐変色性を改善
するためのものであり、本発明を何一つ教えるものでは
ない。The operation is the same as that of the current water-based sealing agent. By the way, JP-A-10-121271 discloses that containing benzotriazole or tolyltriazole as a corrosion inhibitor for copper or copper alloy, aminoalkyl-benzotriazole or -tolyltriazole, and an amine compound. However, this is to improve the discoloration resistance of the surface of the copper-based metal in an environment containing sulfide, and does not teach the present invention at all.
【００４２】次に、実施例によって本発明の作用効果を
さらに具体的に説明する。Next, the function and effect of the present invention will be described more specifically with reference to Examples.
【００４３】[0043]
【実施例】本例では、リン青銅を供試材として、これを
脱脂後、スルファミン酸Niめっきを行い、次いでシアン
浴を使ってストライク金めっきを行った。EXAMPLE In this example, phosphor bronze was used as a test material, and after degreasing, nickel sulfamate was plated, and then strike gold plating was performed using a cyan bath.
【００４４】金めっき皮膜の厚さは、0.1 μm 、Niめっ
き皮膜の厚さは1.0 μm であった。次いで、本発明にか
かる封孔剤を含有する水系めっき浴を使って、上記金め
っき物を陽極として電解を行いその上に封孔皮膜を設け
た。The gold plating film had a thickness of 0.1 μm, and the Ni plating film had a thickness of 1.0 μm. Then, using the water-based plating bath containing the sealing agent according to the present invention, electrolysis was performed using the above-mentioned gold-plated product as an anode to form a sealing film thereon.
【００４５】本例における本発明例では、水系封孔処理
剤１ないし３としては、それぞれ、ベンゾトリアゾール
系化合物、メルカプトベンゾチアゾール系化合物、そし
てトリアジンチオール系化合物を10〜5000mg/L、アミン
化合物 1〜20g/L 、そしてりん酸エステル系界面活性剤
0.1 〜10g/L を含有するものである。In the present invention example in this example, as the water-based pore-sealing agents 1 to 3, a benzotriazole compound, a mercaptobenzothiazole compound, and a triazinethiol compound, 10 to 5000 mg / L, and an amine compound 1 were used, respectively. ~ 20g / L, and phosphate ester surfactant
It contains 0.1 to 10 g / L.
【００４６】一方、従来例としては、特開平９−170096
号公報に開示するものである。評価試験の結果は表５に
まとめて示す。耐食性は、腐食の有無を三段階で評価し
たものであり、撥水性は、撥水の有無でもって評価し
た。On the other hand, as a conventional example, Japanese Patent Application Laid-Open No. 9-170096
It is disclosed in Japanese Patent Publication No. The results of the evaluation test are summarized in Table 5. Corrosion resistance was evaluated by correlating the presence or absence of corrosion in three stages, and water repellency was evaluated by the presence or absence of water repellency.
【００４７】[0047]
【表５】 [Table 5]
【００４８】以上より、本発明によれば、アミン化合物
の添加した封孔処理剤で処理することにより、後工程の
水洗後で処理物が撥水して乾燥性が向上することが分か
る。From the above, it can be seen that according to the present invention, by treating with the pore-sealing agent to which the amine compound is added, the treated material becomes water repellent after the subsequent washing with water and the drying property is improved.
【００４９】[0049]
【発明の効果】以上説明したように、本発明によれは、
アミン化合物を添加することによる耐食性および乾燥性
の向上が著しく、本発明の実用上の意義は大きいことが
分かる。As described above, according to the present invention,
It can be seen that the addition of the amine compound markedly improves the corrosion resistance and the drying property, and the practical significance of the present invention is great.
【図１】封孔処理前のめっき層の模式的説明図である。FIG. 1 is a schematic explanatory view of a plating layer before a sealing treatment.
【図２】封孔処理後の同様の模式的説明図である。FIG. 2 is a similar schematic explanatory view after a sealing process.
フロントページの続き Ｆターム(参考） 4K024 AA03 AA11 AB02 BA09 BB09 BB10 BB11 BC10 DB10 GA04 4K044 AA06 AB10 BA06 BA08 BA21 BB03 BB13 BC02 CA18 CA53 5G023 AA02 CA25 Continued front page F-term (reference) 4K024 AA03 AA11 AB02 BA09 BB09 BB10 BB11 BC10 DB10 GA04 4K044 AA06 AB10 BA06 BA08 BA21 BB03 BB13 BC02 CA18 CA53 5G023 AA02 CA25
Claims (2)
化合物とを含む水系封孔処理剤。1. A water-based pore-sealing agent containing an inhibitor, a surfactant, and an amine compound.
ル系化合物、メルカプトベンゾチアゾール系化合物、そ
してトリアジンチオール系化合物から成る群から選んだ
少なくとも１種である請求項１記載の水系封孔処理剤。2. The water-based sealing agent according to claim 1, wherein the inhibitor is at least one selected from the group consisting of benzotriazole compounds, mercaptobenzothiazole compounds, and triazinethiol compounds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001322414A JP3870225B2 (en) | 2001-10-19 | 2001-10-19 | Gold plating sealing agent and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001322414A JP3870225B2 (en) | 2001-10-19 | 2001-10-19 | Gold plating sealing agent and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003129257A true JP2003129257A (en) | 2003-05-08 |
| JP3870225B2 JP3870225B2 (en) | 2007-01-17 |
Family
ID=19139468
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001322414A Expired - Lifetime JP3870225B2 (en) | 2001-10-19 | 2001-10-19 | Gold plating sealing agent and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3870225B2 (en) |
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| WO2005073435A1 (en) * | 2004-01-30 | 2005-08-11 | Nippon Mining & Metals Co., Ltd. | Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
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| KR100796891B1 (en) * | 2004-01-30 | 2008-01-22 | 닛코킨조쿠 가부시키가이샤 | Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| EP2142485A1 (en) * | 2007-04-18 | 2010-01-13 | Enthone, Inc. | Metallic surface enhancement |
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| WO2005073435A1 (en) * | 2004-01-30 | 2005-08-11 | Nippon Mining & Metals Co., Ltd. | Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
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| US11124881B2 (en) | 2019-06-17 | 2021-09-21 | Chemical Denshi Co., Ltd. | Hydrophilic metal surface treatment agent |
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