JP3666512B2 - Thin plate substrate transfer device - Google Patents

Thin plate substrate transfer device Download PDF

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Publication number
JP3666512B2
JP3666512B2 JP13428994A JP13428994A JP3666512B2 JP 3666512 B2 JP3666512 B2 JP 3666512B2 JP 13428994 A JP13428994 A JP 13428994A JP 13428994 A JP13428994 A JP 13428994A JP 3666512 B2 JP3666512 B2 JP 3666512B2
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Japan
Prior art keywords
receiving
work table
thin plate
plate substrate
transfer
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Expired - Fee Related
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JP13428994A
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Japanese (ja)
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JPH088586A (en
Inventor
裕介 上田
昭広 椎野
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Rohm Co Ltd
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Rohm Co Ltd
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Description

【0001】
【産業上の利用分野】
本発明は、セラミック製の基板又はガラスマスク等のような薄板基板を、当該薄板基板に対する一つの作業テーブルから次の作業テーブル又は搬送台等に移送する装置に関するものである。
【0002】
【従来の技術】
一般に、セラミック製の基板等の薄板基板は、これを作業テーブルの上面に載せた状態で、当該薄板基板の表面に対して回路パターン等のマスク印刷等を行ったのち、前記作業テーブルから、次の作業テーブル又は搬送台等に移替え移送される。
【0003】
この場合における従来の移送装置は、図5〜図7に示すように、薄板基板1を、上下動する作業テーブル2の上面に載せ、この状態で、当該薄板基板1の表面に対して回路パターンのマスク印刷等を行う一方、前記作業テーブル2における左右両側のうち一方側には、一対の真空吸着式フィンガー3aを備えた受取り移送体3を、他方側には、同じく一対の真空吸着式フィンガー4aを備えた受取り移送体4を各々配設し、前記作業テーブル2を、その上面における薄板基板1に対するマスク印刷等が完了したのち、図7及び図8に示すように、両受取り移送体3,4よりも低い部位まで下降動することにより、当該作業テーブル2の上面における薄板基板1を、作業テーブル2から前記両受取り移送体3,4の上面に移し替え、次いで、前記両受取り移送体3,4が、前記作業テーブル2の側方の部位に配設した搬送台5の上部まで水平移動したのち、当該両受取り移送体3,4を下降動するか、或いは、搬送台5を上昇動することにより、前記両受取り移送体3,4の上面における薄板基板1を、両受取り移送体3,4から搬送台5に移し替えるように構成している。
【0004】
【発明が解決しようとする課題】
しかし、前記作業テーブル2の上面において薄板基板1に対するマスク印刷等を行うに際して、当該薄板基板1に割れが発生することがあり、このように薄板基板1が割れた場合、前記作業テーブル2を下降動しても、割れた薄板基板1は、図8に二点鎖線で示すように、両受取り移送体3,4のうちいずれか一方又は両方と作業テーブル2とに跨がって載ったままの状態になることにより、両受取り移送体3,4の上面側に移し替えることができないから、割れた薄板基板を作業テーブル2の上面から除去することができない事態を招来する。
【0005】
そこで、前記従来の移送装置では、前記のように、薄板基板1が作業テーブル2の上面において割れた場合には、前記両受取り移送体3,4の移動を停止して、割れた薄板基板の全てを、作業テーブル2の上面から作業者の手で取り除くようにしなければならないと言う問題があった。
本発明は、作業テーブルの上面における薄板基板が割れた場合、その割れが多方向であっても確実に検出して、この割れた薄板基板の全てを、前記作業テーブルの上面から自動的に取り除くことができるようにした装置を提供することを技術的課題とするものである。
【0006】
【課題を解決するための手段】
この技術的課題を達成するため本発明は、
「上面に薄板基板を載せた状態で上下動する作業テーブルの左右両側に、受取り移送体を、当該両受取り移送体が前記作業テーブルとその側方における搬送台等との間を往復動するように配設して成る移送装置において、前記両受取り移送体のうちいずれか一方の受取り移送体に、前記薄板基板に対する少なくとも二つのフィンガーを、他方の受取り移送体に、前記薄板基板に対する一つのフィンガーを各々設け、更に、前記両受取り移送体のうち他方の受取り移送体には、光を前記作業テーブルの上面と略平行に一方の受取り移送体に向かって発射するようにした発光素子を、一方の受取り移送体には、前記発光素子からの光に対する受光素子を各々設ける一方、前記作業テーブルの上方には、下面に多孔板を張設して成る真空吸引ボックスを、当該真空吸引ボックスが前記作業テーブルとその側方との間を往復動するように配設する。」
と言う構成にした。
【0007】
【作 用】
この構成において、作業テーブルの上面に載せた薄板基板に対するマスク印刷等の作業が完了すると、前記作業テーブルが、その両側に配設した両受取り移送体の上面よりも低い部位まで下降動することにより、その上面における薄板基板を、前記両受取り移送体における各フィンガーの上面に載るように移し替える。すると、前記両受取り移送体が、搬送台の方向に移動したのち下降動することにより、その上面における薄板基板を、当該両受取り移送体の上面から搬送台の上面に移し替えるのである。
【0008】
そして、前記薄板基板が、前記作業テーブルの上面でのマスク印刷等の作業において割れた場合、前記作業テーブルを両受取り移送体の上面よりも低い部位まで下降動したとき、割れた薄板基板が、両受取り移送体のうちいずれか一方又は両方と作業テーブルとに跨がるように載った状態になって、両受取り移送体のうち他方の受取り移送体に設けられている発光素子から一方の受取り移送体に設けられている受光素子への光を遮ることになるから、これによって、薄板基板が割れていることが検出できる。
【0009】
すると、この割れ検出に基づいて、前記作業テーブルが、両受取り移送体の上面よりも高い部位まで上降動することに次いで、真空吸引ボックスが、前記作業テーブルの上部まで移動して、この状態で真空吸引することにより、割れた薄板基板の全てを、当該真空吸引ボックスの下面における多孔板に密着・吸引したのち、作業テーブルの上方が側方の移動するから、前記作業テーブルの上面における割れた薄板基板の全てを、作業テーブルの上面から取り除くことができるのである。
【0010】
【発明の効果】
従って、本発明によると、作業テーブルの上面における薄板基板を、当該薄板基板のうち割れたものの全てを作業テーブルの上面から除去しながら、搬送台等に移送することを、自動的に行うことができるから、その作業能率を大幅に向上できる効果を有する。
【0011】
しかも、本発明は、作業テーブルの左右両側に配設した両受取り移送体のうち一方の受取り移送体に、薄板基板に対する少なくとも二つのフィンガーを、他方の受取り移送体に、薄板基板に対する一つのフィンガーを各々設けて、薄板基板を、前記三つのフィンガーにて3点支持に構成したことにより、従来のように、両受取り移送体の各々にフィンガー2個ずつ設けて薄板基板を4点支持に構成した場合よりも、多方向の割れを検出することができるから、薄板基板の割れを検出することの精度が高くて、搬送台等に割れた薄板基板が送り出されることを確実に低減できる効果をも有する。
【0012】
【実施例】
以下、本発明の実施例を、図1〜図4の図面について説明する。
この図において符号12は、上下動機構12aにて上下動するように構成した作業テーブルを示し、この作業テーブル12は、上昇動した状態で、その上面における薄板基板1に対してマスク印刷等の作業を行うと、下降動するように構成されている。
【0013】
符号13,14は、前記作業テーブル12の左右両側に配設した受取り移送体を示し、この両受取り移送体13,14は、図示しない機構により、前記作業テーブル12とその側方の部位に配設した搬送台15との間を水平方向に往復動すると共に、搬送台15の箇所において、搬送台15に向かって下降動するように構成されている。
【0014】
そして、前記両受取り移送体13,14のうち一方の受取り移送体13には、その内側面に、前記作業テーブル12に設けた二つの切欠部12b,12c内を上下方向に通過するようにした二つの真空吸着式のフィンガー13a,13bが設けられる一方、他方の受取り移送体14には、その内側面に、前記作業テーブル12に設けた一つの切欠部12d内を上下方向に通過するようにした一つの真空吸着式のフィンガー14aが設けられている。
【0015】
更に、前記他方の受取り移送体14には、光を前記作業テーブルの上面と略平行に一方の両受取り移送体13に向かって発射するようにした発光素子16を、一方の受取り移送体13には、前記発光素子16からの光に対する受光素子17を各々設ける。
また、符号18は、下面に金網19等の多孔板を張設した真空吸引ボックスを示し、この真空吸引ボックス18は、前記作業テーブル12と、その側方に配設した回収ボックス20との間に往復動するように構成され、且つ、この真空吸引ボックス18には、図示しない真空ブロワーへの真空吸引ダクト21が接続されている。
【0016】
この構成において、作業テーブル12の上面に載せた薄板基板1に対するマスク印刷等の作業が完了すると、前記作業テーブル12が、その両側に配設した両受取り移送体13,14の上面よりも低い部位まで下降動することにより、その上面における薄板基板1を、前記両受取り移送体13,14における各フィンガー13a,13b,14aの上面に載るように移し替える。すると、前記両受取り移送体13,14が、搬送台15の方向に移動したのち下降動することにより、その上面における薄板基板1を、当該両受取り移送体13,14の上面から搬送台15の上面に移し替えるのである。
【0017】
そして、前記薄板基板1が、前記作業テーブル12の上面でのマスク印刷等の作業において割れた場合、前記作業テーブル12を両受取り移送体13,14の上面よりも低い部位まで下降動したとき、割れた薄板基板1が、図4に二点鎖線で示すように、両受取り移送体13,14のうちいずれか一方又は両方と作業テーブル12とに跨がるように載った状態になって、両受取り移送体13,14に設けられている発光素子16から受光素子17への光が遮断されるから、これによって、薄板基板1が割れていることが検出できる。
【0018】
すると、この割れ検出に基づいて、前記作業テーブル12が、両受取り移送体13,14の上面よりも高い部位まで上降動し、真空吸引ボックス18が、前記作業テーブル12の上部まで移動して、この状態で真空吸引することにより、割れた薄板基板1の全てを、当該真空吸引ボックス18の下面における金網19等の多孔板に密着するように吸引し、次いで、前記真空吸引ボックス18が、作業テーブル12の上方からその側方に配設した回収ボックス20の上方まで移動したのち、真空吸引を解除することにより、前記作業テーブル12の上面において割れた薄板基板1の全てを、作業テーブル12の上面から回収ボックス20に入れるように取り除くことができるのである。
【0019】
なお、本発明によって取り扱う薄板基板は、セラミック製の薄板基板に限らず、ガラス製の薄板基板であっても良く、また、本発明は、前記実施例のように、薄板基板1を、作業テーブル12から搬送台15に移送する場合に限らず、薄板基板1を、作業テーブル12から次の工程における作業テーブルに移送する場合にも適用できることは言うまでもない。
【図面の簡単な説明】
【図1】本発明における実施例を示す斜視図である。
【図2】図1の平面図である。
【図3】図1及び図2のIII −III 視断面図である。
【図4】本発明における実施例の作用状態を示す図である。
【図5】従来の装置を示す斜視図である。
【図6】図5のVI−VI視断面図である。
【図7】従来の装置における作用状態を示す図である。
【図8】図7のVIII−VIII視断面図である。
【符号の説明】
1 薄板基板
12 作業テーブル
13 一方の受取り移送体
13a,13b 一方の受取り移送体におけるフィンガー
14 他方の受取り移送体
14a 他方の受取り移送体におけるフインガー
15 搬送台
16 発光素子
17 受光素子
18 真空吸引ボックス
19 金網
20 回収ボックス
21 真空吸引ダクト
[0001]
[Industrial application fields]
The present invention relates to an apparatus for transferring a thin substrate such as a ceramic substrate or a glass mask from one work table to the next work table or a transport table.
[0002]
[Prior art]
In general, a thin substrate such as a ceramic substrate is placed on the upper surface of the work table, and after performing mask printing or the like such as a circuit pattern on the surface of the thin substrate, from the work table, Are transferred to a work table or a transport table.
[0003]
As shown in FIGS. 5 to 7, the conventional transfer apparatus in this case places a thin substrate 1 on the upper surface of a work table 2 that moves up and down, and in this state, a circuit pattern with respect to the surface of the thin substrate 1. The receiving and transferring body 3 having a pair of vacuum suction fingers 3a is provided on one side of the left and right sides of the work table 2, and a pair of vacuum suction fingers on the other side. Each of the receiving transfer bodies 4 provided with 4a is disposed, and after the mask printing on the thin plate substrate 1 on the upper surface of the work table 2 is completed, as shown in FIGS. , 4 is moved down to a position lower than 4 to transfer the thin plate substrate 1 on the upper surface of the work table 2 from the work table 2 to the upper surfaces of the two receiving transfer bodies 3, 4. After both the receiving and transferring bodies 3 and 4 have moved horizontally to the upper part of the transfer table 5 disposed on the side portion of the work table 2, the both receiving and transferring bodies 3 and 4 are moved down or transferred. By moving up the table 5, the thin plate substrate 1 on the upper surfaces of the both receiving and transferring bodies 3 and 4 is transferred from the both receiving and transferring bodies 3 and 4 to the conveying table 5.
[0004]
[Problems to be solved by the invention]
However, when performing mask printing or the like on the thin plate substrate 1 on the upper surface of the work table 2, the thin plate substrate 1 may be cracked. When the thin plate substrate 1 is broken in this way, the work table 2 is lowered. Even if it moves, the broken thin plate substrate 1 remains on the work table 2 over either one or both of the receiving and transferring bodies 3 and 4, as shown by a two-dot chain line in FIG. In this state, since it cannot be transferred to the upper surface side of the both receiving and transferring bodies 3 and 4, a situation in which the broken thin plate substrate cannot be removed from the upper surface of the work table 2 is caused.
[0005]
Therefore, in the conventional transfer apparatus, as described above, when the thin plate substrate 1 is cracked on the upper surface of the work table 2, the movement of the two receiving transfer bodies 3 and 4 is stopped, and There was a problem that it was necessary to remove everything from the upper surface of the work table 2 by the operator's hand.
In the present invention, when a thin plate substrate on the upper surface of the work table is broken, even if the crack is multi-directional, it is reliably detected, and all of the broken thin plate substrates are automatically removed from the upper surface of the work table. It is an object of the present invention to provide an apparatus that can be used.
[0006]
[Means for Solving the Problems]
In order to achieve this technical problem, the present invention
“On both the left and right sides of a work table that moves up and down with a thin substrate mounted on the upper surface, the receiving and transporting bodies reciprocate between the work table and the side of the work table. In the transfer device, the at least two fingers with respect to the thin plate substrate are provided in one of the two receiving transfer members, and the one finger with respect to the thin plate substrate is provided in the other receiving transfer member. each is provided, further, the the other receiving the conveying member, of the two receiving conveying member, a light-emitting element in which the light to be emitted toward the top and conveying member substantially parallel to one of the receipt of said working table, whereas receiving the conveying member, while providing each light receiving element for light from the light emitting element, above the said working table, a vacuum suction box formed by stretched perforated plate on the lower surface of And arranged such that the vacuum suction box is reciprocated between its side and the working table. "
It was made the composition called.
[0007]
[Operation]
In this configuration, when the operation such as mask printing on the thin plate substrate placed on the upper surface of the work table is completed, the work table is moved down to a position lower than the upper surfaces of both receiving and transferring bodies disposed on both sides thereof. The thin plate substrate on the upper surface is transferred so as to be placed on the upper surface of each finger in the both receiving and transferring bodies. Then, the both receiving and transferring bodies move in the direction of the transfer table and then move downward to transfer the thin plate substrate on the upper surface from the upper surface of the both receiving and transferring bodies to the upper surface of the transfer table.
[0008]
And, when the thin plate substrate is broken in the operation such as mask printing on the upper surface of the work table, when the work table is lowered to a position lower than the upper surface of both receiving and transferring bodies, the broken thin plate substrate is One receiving unit from the light emitting element provided on the other receiving and transferring body in a state where it is placed so as to straddle either one or both of the receiving and transferring bodies and the work table. Since the light to the light receiving element provided in the transfer body is blocked, it can be detected that the thin plate substrate is broken.
[0009]
Then, on the basis of the detection of the crack, the work table moves up and down to a position higher than the upper surface of both receiving and transferring bodies, and then the vacuum suction box moves to the upper part of the work table, and this state Since the upper part of the work table moves sideways after all of the broken thin plate substrates are brought into close contact with and sucked into the porous plate on the lower surface of the vacuum suction box, the cracks on the upper surface of the work table. All of the thin plate substrate can be removed from the upper surface of the work table.
[0010]
【The invention's effect】
Therefore, according to the present invention, it is possible to automatically transfer the thin plate substrate on the upper surface of the work table to the transfer table or the like while removing all the broken ones of the thin plate substrates from the upper surface of the work table. Therefore, the work efficiency can be greatly improved.
[0011]
In addition, the present invention provides at least two fingers for the thin plate substrate in one of the receiving transfer members arranged on the left and right sides of the work table, and one finger for the thin plate substrate in the other receiving transfer member. And the thin plate substrate is configured to be supported at three points by the three fingers, so that, as in the prior art, two fingers are provided on each of the receiving and transferring bodies, and the thin plate substrate is configured to be supported at four points. Since it is possible to detect cracks in multiple directions, the accuracy of detecting cracks in the thin plate substrate is high, and the effect that the thin plate substrate can be reliably reduced from being sent out to the carrier table etc. Also have.
[0012]
【Example】
Embodiments of the present invention will be described below with reference to FIGS.
In this figure, reference numeral 12 denotes a work table configured to be moved up and down by a vertical movement mechanism 12a. The work table 12 is moved upward and is subjected to mask printing or the like on the thin plate substrate 1 on its upper surface. When the work is performed, it is configured to move downward.
[0013]
Reference numerals 13 and 14 denote receiving and transporting bodies disposed on both the left and right sides of the work table 12. The receiving and transporting bodies 13 and 14 are arranged on the work table 12 and its side parts by a mechanism (not shown). The apparatus is configured to reciprocate in the horizontal direction between the transport table 15 provided and to move downward toward the transport table 15 at the position of the transport table 15.
[0014]
And, one of the receiving and transferring bodies 13 and 14 has one receiving and transferring body 13 which passes through the two notches 12b and 12c provided on the work table 12 in the vertical direction on the inner surface thereof. Two vacuum suction-type fingers 13a and 13b are provided, and the other receiving and transferring body 14 has an inner surface passing through one notch 12d provided on the work table 12 in the vertical direction. One vacuum suction type finger 14a is provided.
[0015]
Further, the other receiving and transferring body 14 is provided with a light emitting element 16 that emits light toward one of the receiving and transferring bodies 13 substantially parallel to the upper surface of the work table. Includes a light receiving element 17 for the light from the light emitting element 16.
Reference numeral 18 denotes a vacuum suction box in which a perforated plate such as a wire mesh 19 is stretched on the lower surface. The vacuum suction box 18 is provided between the work table 12 and a collection box 20 disposed on the side thereof. The vacuum suction box 18 is connected to a vacuum suction duct 21 to a vacuum blower (not shown).
[0016]
In this configuration, when work such as mask printing on the thin plate substrate 1 placed on the upper surface of the work table 12 is completed, the work table 12 is lower than the upper surfaces of the receiving and transferring bodies 13 and 14 disposed on both sides thereof. The thin plate substrate 1 on the upper surface thereof is moved so as to be placed on the upper surfaces of the fingers 13a, 13b, 14a of the both receiving and transferring bodies 13, 14. Then, both the receiving and transferring bodies 13 and 14 move in the direction of the transfer table 15 and then move downward, so that the thin plate substrate 1 on the upper surface is moved from the upper surface of the both receiving and transferring bodies 13 and 14 to the transfer table 15. It is transferred to the upper surface.
[0017]
And, when the thin plate substrate 1 is broken in the operation such as mask printing on the upper surface of the work table 12, when the work table 12 is moved down to a position lower than the upper surfaces of both receiving and transferring bodies 13, 14, As shown by the two-dot chain line in FIG. 4, the broken thin plate substrate 1 is in a state of being placed so as to straddle either one or both of the receiving and transferring bodies 13 and 14 and the work table 12. Since the light from the light emitting element 16 provided on both receiving and transferring bodies 13 and 14 to the light receiving element 17 is blocked, it can be detected that the thin plate substrate 1 is broken.
[0018]
Then, based on this crack detection, the work table 12 moves up and down to a position higher than the upper surfaces of both receiving and transferring bodies 13 and 14, and the vacuum suction box 18 moves to the upper part of the work table 12. By vacuuming in this state, the entire thin substrate 1 is sucked so as to be in close contact with a perforated plate such as a wire mesh 19 on the lower surface of the vacuum suction box 18, and then the vacuum suction box 18 is After moving from the upper side of the work table 12 to the upper side of the collection box 20 disposed on the side thereof, the vacuum suction is released, so that all the thin plate substrates 1 that are cracked on the upper surface of the work table 12 are removed. It can remove so that it may put into the collection box 20 from the upper surface.
[0019]
The thin plate substrate handled by the present invention is not limited to a ceramic thin plate substrate, and may be a glass thin plate substrate. In the present invention, the thin plate substrate 1 is used as a work table as in the above embodiment. Needless to say, the present invention is not limited to the case where the thin plate substrate 1 is transferred from the work table 12 to the transfer table 15 but also when the thin plate substrate 1 is transferred from the work table 12 to the work table in the next process.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of the present invention.
2 is a plan view of FIG. 1. FIG.
3 is a cross-sectional view taken along the line III-III in FIGS. 1 and 2. FIG.
FIG. 4 is a diagram showing an operational state of an embodiment in the present invention.
FIG. 5 is a perspective view showing a conventional apparatus.
6 is a cross-sectional view taken along the line VI-VI in FIG. 5;
FIG. 7 is a diagram showing an operation state in a conventional apparatus.
8 is a cross-sectional view taken along the line VIII-VIII of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Thin board | substrate 12 Work table 13 One receiving transfer body 13a, 13b Finger 14 in one receiving transfer body Other receiving transfer body 14a Finger 15 in the other receiving transfer body Carrier 16 Light emitting element 17 Light receiving element 18 Vacuum suction box 19 Wire mesh 20 Collection box 21 Vacuum suction duct

Claims (1)

上面に薄板基板を載せた状態で上下動する作業テーブルの左右両側に、受取り移送体を、当該両受取り移送体が前記作業テーブルとその側方における搬送台等との間を往復動するように配設して成る移送装置において、前記両受取り移送体のうちいずれか一方の受取り移送体に、前記薄板基板に対する少なくとも二つのフィンガーを、他方の受取り移送体に、前記薄板基板に対する一つのフィンガーを各々設け、更に、前記両受取り移送体のうち他方の受取り移送体には、光を前記作業テーブルの上面と略平行に一方の受取り移送体に向かって発射するようにした発光素子を、一方の受取り移送体には、前記発光素子からの光に対する受光素子を各々設ける一方、前記作業テーブルの上方には、下面に多孔板を張設して成る真空吸引ボックスを、当該真空吸引ボックスが前記作業テーブルとその側方との間を往復動するように配設したことを特徴とする薄板基板の移送装置。The receiving transfer body is moved on both the left and right sides of the work table that moves up and down with the thin plate substrate placed on the upper surface, so that the both receiving transfer bodies reciprocate between the work table and the side of the work table. In the transfer device arranged, at least two fingers for the thin plate substrate are provided in one of the receiving transfer members, and one finger for the thin plate substrate is provided in the other transfer transfer member. each provided, further wherein the other of the receiving conveying member of both receiving the conveying member, a light emitting device light was to fire toward the top and substantially parallel to one of the receipt transport of the working table, the one The receiving and transferring body is provided with a light receiving element for the light from the light emitting element, and a vacuum suction box having a perforated plate on the lower surface above the work table. , The transfer device of the thin substrate, characterized in that the vacuum suction box is arranged to reciprocate between its side and the working table.
JP13428994A 1994-06-16 1994-06-16 Thin plate substrate transfer device Expired - Fee Related JP3666512B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13428994A JP3666512B2 (en) 1994-06-16 1994-06-16 Thin plate substrate transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13428994A JP3666512B2 (en) 1994-06-16 1994-06-16 Thin plate substrate transfer device

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JPH088586A JPH088586A (en) 1996-01-12
JP3666512B2 true JP3666512B2 (en) 2005-06-29

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AT411197B (en) * 2001-02-16 2003-10-27 Datacon Semiconductor Equip METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD
KR100731042B1 (en) * 2002-11-18 2007-06-22 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display and method for loading of substrate
JP5835722B2 (en) 2009-12-10 2015-12-24 オルボテック エルティ ソラー,エルエルシー Automatic ranking multi-directional serial processor
US8459276B2 (en) * 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
CN105417023A (en) * 2015-12-14 2016-03-23 苏州索力旺新能源科技有限公司 Stepping transportation device of conducting strips

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