CN104914113A - Printed circuit board automatic optical detection method - Google Patents
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- CN104914113A CN104914113A CN201510264713.3A CN201510264713A CN104914113A CN 104914113 A CN104914113 A CN 104914113A CN 201510264713 A CN201510264713 A CN 201510264713A CN 104914113 A CN104914113 A CN 104914113A
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Abstract
The invention provides a printed circuit board automatic optical detection method. The printed circuit board automatic optical detection method comprises 1, fixing a printed circuit board to be detected onto a working face of a first objective table by a vacuum adsorption method, 2, horizontally moving a second objective table to a position above the first objective table by a horizontal displacement electric cylinder, and simultaneously, carrying out optical detection on the upper surface of the printed circuit board to be detected by an optical module on the second objective table in movement, 3, vertically moving the second objective table by a vertical displacement electric cylinder so that the second objective table contacts with the printed circuit board to be detected, and fixing the printed circuit board to be detected to a working face of the second objective table by a vacuum adsorption method, and 4, horizontally moving the second objective table by the horizontal displacement electric cylinder and simultaneously, carrying out optical detection on the lower surface of the printed circuit board to be detected by an optical module on the first objective table in movement.
Description
Technical field
The present invention relates to printed circuit board (PCB) (Printed Circuit Board, PCB) and manufacture field, especially, relate to a kind of printed circuit board (PCB) automatic optics inspection (Automated Optical Inspection, AOI) method.
Background technology
Current printed circuit board (PCB) mainly utilizes automatic optics inspection scheme to detect the line defct on printed circuit board (PCB) two sides in manufacturing process, and such as line short, open circuit, pin hole, wiping is colored, line is young, line is thick, canine tooth etc.Traditional printed circuit board (PCB) automatic optical detection method is that the upper and lower of row rumble arranges line-scan digital camera and lower line-scan digital camera respectively, test print circuit board is advanced between upper line-scan digital camera and lower line-scan digital camera by row rumble, and on utilizing in traveling process, line-scan digital camera and lower line-scan digital camera are treated the both side surface surveying printed circuit board (PCB) and carried out taking pictures respectively realizing automatic optics inspection.
But the test print circuit board adopting row rumble to transmit may be subject to row rumble and beats and be in jounce condition in traveling process, be therefore difficult to realize fixing movement locus on microcosmic.Due to the existence of the problems referred to above, may there is erroneous judgement or the undetected problem of defect in traditional printed circuit board (PCB) automatic optical detection method in the testing process of printed circuit board (PCB).
In view of this, be necessary to provide a kind of printed circuit board (PCB) automatic optical detection method that can solve the problem.
Summary of the invention
One of them object of the present invention provides a kind of printed circuit board (PCB) automatic optical detection method to solve above-mentioned.
Printed circuit board (PCB) automatic optical detection method provided by the invention, comprising: A, utilize vacuum suction mode that test print circuit board is fixed to the workplace of the first objective table; B, by horizontal shift electricity cylinder, the second objective table to be moved horizontally to above described first objective table, and in moving process, to utilize the optical module of described second objective table to perform optical detection to the upper surface of described test print circuit board; C, by perpendicular displacement electricity cylinder, described second objective table to be moved vertically to and described test print circuit board contacts, and by vacuum suction mode, described test print circuit board is fixed to the workplace of described second objective table; D, by described horizontal shift electricity cylinder, described second objective table executive level to be moved, and in moving process, utilize the optical module of described first objective table to perform optical detection to the lower surface of described test print circuit board.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, before described steps A, also comprise: A0, described test print circuit board level is sent to the workplace of described first objective table, and in horizontal transmission process by blowing operation for described test print circuit board provides air-bed to carry out horizontal transmission to make described test print circuit board with suspended state.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described steps A comprises: A1, cancel described air-bed to tile the workplace of described first objective table to make described test print circuit board after described test print circuit board is sent to the workplace of described first objective table; A2, open vacuum pumping at the workplace of described first objective table and make the lower surface vacuum suction of described test print circuit board to the workplace of described first objective table.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described perpendicular displacement electricity cylinder is connected to described horizontal shift electricity cylinder, and described second objective table is arranged on the end of described perpendicular displacement electricity cylinder.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described step B comprises: B1, drive described perpendicular displacement electricity cylinder to be moved horizontally to above described first objective table together with the second objective table of its end by described horizontal shift electricity cylinder; B2, open and be arranged on CCD camera array and the line source of the workplace of described second objective table, in the process that described second objective table moves to above described first objective table, utilize described CCD camera array to perform optical scanning to the upper surface circuit of described test print circuit board and detect.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described step C comprises: C1, the upper surface driving the second objective table of its end to drop to described test print circuit board by described perpendicular displacement electricity cylinder contact, and in described second objective table decline process, close the vacuum suction of described first objective table and vertical operation is performed to described test print circuit board, be converted to suspended state to make described test print circuit board from vacuum adsorption state; C2, open vacuum pumping at the workplace of described second objective table and make the upper surface of described test print circuit board by vacuum suction to the workplace of described second objective table.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described step C also comprises: C3, drive the second objective table of its end to rise to preset height by described perpendicular displacement electricity cylinder, and wherein said preset height meets the shooting focal length requirement of the optical module of the workplace being positioned at described first objective table.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described step D comprises: D1, drive described perpendicular displacement electricity cylinder to move horizontally towards sorting platform direction together with the second objective table level of its end by described horizontal shift electricity cylinder; D2, open and be arranged on CCD camera array and the line source of the workplace of described first objective table, move horizontally in process at described second objective table, utilize the CCD camera array of described first objective table to perform optical scanning to the lower surface circuit of described test print circuit board and detect.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, also comprise: E, described test print circuit board is released into described sorting platform, and utilize described sorting platform to perform sorting process to described test print circuit board.
In a preferred embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention, described step e comprises: E1, above described second objective table moves to described sorting platform after close the vacuum suction of described second objective table and described test print circuit board be discharged into described sorting platform surface; E2, automatic optics inspection result according to described test print circuit board, utilize described sorting platform to be divided by described test print circuit board and see corresponding printed circuit board (PCB) off-sorting station.
Compared to prior art, printed circuit board (PCB) automatic optical detection method provided by the invention utilizes displacement electricity cylinder to carry out the transmission of test print circuit board, and by displacement electricity cylinder and vacuum plate sucking asynchronous operation, the displacement accuracy of test print circuit board can be improved and ensure the planarization of test print circuit board in automatic optics inspection process, reducing automatic optics inspection and occur erroneous judgement or the undetected problem of defect.In addition, described printed circuit board (PCB) automatic optical detection method completes the automatic optics inspection of the upper and lower surface for test print circuit board when the second objective table comes and goes and moves horizontally, and can also effectively improve automatic optics inspection efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of embodiment of automatic optical detecting system that printed circuit board (PCB) automatic optical detection method provided by the invention can be suitable for;
Fig. 2 is the schematic flow sheet of a kind of embodiment of printed circuit board (PCB) automatic optical detection method provided by the invention.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Printed circuit board (PCB) automatic optical detection method provided by the invention can be useful in printed circuit board (PCB) automatic optical detecting system 100 as shown in Figure 1.Described printed circuit board (PCB) automatic optical detecting system 100 comprises base station 11, displacement electricity cylinder 12, first objective table 13, second objective table 14 and sorting platform 15.Preferably, in a particular embodiment, described printed circuit board (PCB) automatic optical detecting system 100 can also comprise Control Server (not shown), for controlling the duty of described displacement electricity cylinder 12, described first objective table 13, described second objective table 14 and described sorting platform 15.
Described first objective table 13 and described second objective table 14 can be respectively lower objective table and upper objective table, and the two is respectively used to carry test print circuit board in the different phase of automatic optics inspection process in the mode of vacuum suction.Wherein, described first objective table 13 and described sorting platform 15 are separately positioned on the surface of described base station 11, and described second objective table 14 is connected to described displacement electricity cylinder 12, and arranges towards described base station 12.Described second objective table 14 can carry out horizontal shift and perpendicular displacement evenly under the effect of described displacement electricity cylinder 12.
In the present embodiment, as shown in Figure 1, described displacement electricity cylinder 12 can comprise horizontal shift electricity cylinder 121 and perpendicular displacement electricity cylinder 122; Described second objective table 14 is arranged on the end of described perpendicular displacement electricity cylinder 122, and described perpendicular displacement electricity cylinder 122 is connected to described horizontal shift electricity cylinder 121 further.Particularly, described horizontal shift electricity cylinder 121 can carry out horizontal shift operation under the control of described Control Server, thus makes described perpendicular displacement electricity cylinder 122 drive described second objective table 14 to move in the horizontal direction; And described perpendicular displacement electricity cylinder 122 can carry out perpendicular displacement operation under the control of described Control Server, thus described second objective table 14 is driven vertically to move.
In printed circuit board (PCB) automatic optical detecting system 100 provided by the invention, described horizontal shift electricity cylinder 121 and described perpendicular displacement electricity cylinder 122 can be servo electricity cylinder, adopt described horizontal shift electricity cylinder 121 and described perpendicular displacement electricity cylinder 122 not only can ensure automatic optics inspection process at the uniform velocity moving for test print circuit board, but also high displacement precision controlling can be realized, the displacement accuracy of such as its horizontal direction and vertical direction can reach more than 0.005 micron.
In a particular embodiment, surface relative with described second objective table 14 in described first objective table 13 can orientate the workplace 131 of described first objective table 13 as, and described workplace 131 can include circuit board positioning area 137 and optical module district 138 respectively along test print circuit board direction of transfer.
Described circuit board positioning area 137 is for positioning and fixing operation printed circuit board (PCB) to be measured when performing automatic optics inspection, such as, in one embodiment, as shown in Figure 1, described circuit board positioning area 137 can be provided with multiple position block 135 and multiplely vacuumize groove 132, and described multiple position block 135 is mainly used in positioning operation when test print circuit board level is sent to the workplace 131 of described first objective table 13 to described test print circuit board.Describedly multiplely vacuumize the circuit board positioning area 137 that groove 132 can be arranged on described first objective table 13 in a distributed manner, it is mainly used in carrying out vacuum pumping after described test print circuit board location, thus makes described test print circuit board can by the smooth surface being closely fixed on described circuit board positioning area 137 of vacuum suction mode.
Preferably, each vacuumizes groove 132 independently can be provided with non-return valve, described non-return valve be mainly used in the size of described test print circuit board less and cannot cover some vacuumize groove 132 be can close described in vacuumize the vacuum pumping of groove 132, thus the overall vacuum degree ensureing the workplace 131 of described first objective table 13 and the speed vacuumized.
In addition, described circuit board positioning area 137 can also be formed with multiple gas hole 136, described multiple gas hole 136 can be formed equally in a distributed manner at described circuit board positioning area 137, and itself and described multiple vacuumizing between groove 132 can be that mutual alternate intervals is arranged.Described gas hole 136 1 aspect may be used for being sent in the process of described first objective table 13 in described test print circuit board level providing air-bed by performing blowing operation under the control of described Control Server to described test print circuit board, thus make described test print circuit board can keep suspended state in traveling process, cause line fault to avoid described test print circuit board to occur copper face scraping owing to being subject to Action of Gravity Field; On the other hand, described gas hole 136 can also be used for providing thrust upwards by blowing operation to described test print circuit board after described test print circuit board completes the optical detection of upper surface circuit, so that described test print circuit board departs from described first objective table 13 and is adsorbed onto the workplace of described second objective table 14.
Described optical module district 138 can comprise CCD (Charge Coupled Device, charge-coupled image sensor) camera array 133 and line source 134.Wherein said CCD camera array 133 comprises multiple aligned CCD camera, and, the orientation of described multiple CCD camera is vertical with the direction of motion of described test print circuit board, with the overall width making the coverage of described CCD camera array 133 can cover described test print circuit board.Described line source 134 can be arranged on the edge in described optical module district 138, and substantially parallel with described CCD camera array 133.
The concrete structure of described second objective table 14 can be basically identical with described first objective table 13, repeats no more herein; But should be appreciated that in a particular embodiment, the gas hole 136 of described first objective table 13 can be optional structure for described second objective table 14, and in other words, described second objective table 14 can not arrange gas hole.
Based on above-mentioned printed circuit board (PCB) automatic optical detecting system 100, the present invention also provides a kind of printed circuit board (PCB) automatic optical detection method further, described automatic optical detection method can coordinate described first objective table 13 and the second objective table 14 by the displacement electricity cylinder 12 shown in Fig. 1, realizes the optical detection of described printed circuit board (PCB) automatic optical detecting system 100 for the upper and lower surface of described test print circuit board and the asynchronous operation of upper and lower article carrying platform suction disc.
Particularly, refer to Fig. 2, it is the schematic flow sheet of printed circuit board (PCB) automatic optical detection method provided by the invention.Described printed circuit board (PCB) automatic optical detection method can comprise the following steps:
Step S1, is sent to the first objective table by test print circuit board level;
Particularly, test print circuit board can pass through the first objective table 13 that horizontal conveyor (such as passing rumble) is sent to described automatic optical detecting system 100, and gas hole 136 unlatching of the first objective table 13 forms air-bed and makes described test print circuit board can be sent to the workplace 131 of described first objective table 13 with suspended state described in transport process.The air-bed that described gas hole 136 provides can reduce the friction force that described test print circuit board exists in horizontal transmission process on the one hand, therefore only need to provide a less thrust just can promote its workplace 131 along described first objective table 13 to described test print circuit board and carry out horizontal transmission, the suspension transmission of described test print circuit board can effectively avoid described test print circuit board in transmitting procedure, occur the problem that copper face scratches on the other hand.
Step S2, utilizes vacuum suction mode that described test print circuit board is fixed to the workplace of described first objective table;
Specifically, when described test print circuit board level is sent to described first objective table 13 and is stopped by described position block 135, described Control Server can judge that described test print circuit board has arrived the circuit board positioning area 137 of described first objective table 13.Now, can control described first objective table 13 closes described gas hole 136 to remove described air-bed to described Control Server on the one hand, and described test print circuit board can be declined and the first type surface of described first objective table 13 that tiles from suspended state; On the other hand, described Control Server vacuumizes groove 137 to carry out vacuum pumping described in can also opening simultaneously, thus make described test print circuit board can be smooth and closely attach to the surface of described circuit board positioning area 137 by the mode of vacuum suction, the phenomenon avoiding occurring that plate bending or plate stick up and affect the precision of automatic optics inspection.
Step S3, is moved horizontally to the second objective table above described first objective table by horizontal shift electricity cylinder, and in moving process, utilizes the optical module of described second objective table to perform optical detection to the upper surface of described test print circuit board;
Specifically, when described test print circuit board is fixed to the workplace 131 of described first objective table 13 by the mode of vacuum suction, described Control Server can control the horizontal shift operation of described horizontal shift electricity cylinder 121 further, namely the second objective table 14 of described perpendicular displacement electricity cylinder 122 and end thereof is driven to move horizontally along from described sorting platform 15 to the direction of described first objective table 13 by described horizontal shift electricity cylinder 121, and in the process of movement, the line source of described second objective table 14 and CCD camera array are opened and are performed automatic optics inspection, thus the automatic optics inspection moving horizontally in process the upper surface circuit completed for described test print circuit board realized at described second objective table 14.
Based on such scheme, when described second objective table 14 is moved horizontally to directly over described first objective table 13, the optical scanning that the line source of described second objective table 14 and CCD camera array complete just for all regions of upper surface of described test print circuit board detects.
Step S4, is moved vertically to described second objective table and described test print circuit board contacts by perpendicular displacement electricity cylinder, and by vacuum suction mode, described test print circuit board is fixed to the workplace of described second objective table;
After the upper surface optical detection of described test print circuit board completes, described Control Server can control described perpendicular displacement electricity cylinder 122 further and carry out perpendicular displacement operation, thus drives the second objective table 14 of its end to drop to contact with the upper surface of described test print circuit board; And, in the decline process of described second objective table 14, described Control Server can also close vacuumizing groove 132 and opening described gas hole 136 of described first objective table 13, is again converted to suspended state to make described test print circuit board from vacuum adsorption state.
On the other hand, described Control Server can also control described second objective table 14 and open it and vacuumize groove, thus realize after the workplace of described second objective table 14 contacts with the upper surface of described test print circuit board, by the mode of vacuum suction by smooth for described test print circuit board and be closely fixed to the workplace of described second objective table 14.
After this, described Control Server can control described perpendicular displacement electricity cylinder 122 further and drive the second objective table 14 of its end to carry out lifting operations, thus, the line source 134 of described first objective table 13 and CCD camera array 133 just face the lower surface of described test print circuit board; In a particular embodiment, the lifting height of described second objective table 14 can be decided according to the actual requirements, and is as the criterion with the shooting focal length of the CCD camera array 133 meeting described first objective table 13.
Step S5, is moved horizontally to described second objective table above sorting platform by described horizontal shift electricity cylinder, and in moving process, utilizes the optical module of described first objective table to perform optical detection to the lower surface of described test print circuit board;
After rising to preset height at test print circuit board described in described second objective table 14 vacuum suction and by described perpendicular displacement electricity cylinder 122, described Control Server can control described horizontal shift electricity cylinder 121 and carry out horizontal shift operation, thus the second objective table 14 driving described perpendicular displacement electricity cylinder 122 to be communicated with its end moves horizontally towards described sorting platform 15 direction; And, moving horizontally in process, described Control Server can also control CCD camera array 133 and the line source 134 unlatching execution automatic optics inspection of described first objective table 13, thus realizes the automatic optics inspection moving horizontally in process the lower surface circuit completed for described test print circuit board at described second objective table 14.
Step S6, is released into described sorting platform surface by described test print circuit board;
After described second objective table 14 moves to directly over described sorting platform 15, described Control Server can control described second objective table 14 and close it and vacuumize groove, now, because vacuum suction is cancelled, the surface of described sorting platform 15 fallen by described test print circuit board due to Action of Gravity Field, described sorting platform 15 can further under the control of described Control Server, optical detection result according to described test print circuit board sorts, by non-defective unit, upper surface defective products and lower surface defective products are sorted to corresponding printed circuit board (PCB) off-sorting station.
Compared to prior art, printed circuit board (PCB) automatic optical detection method provided by the invention utilizes displacement electricity cylinder to carry out the transmission of test print circuit board, and by displacement electricity cylinder and vacuum plate sucking asynchronous operation, the displacement accuracy of test print circuit board can be improved and ensure the planarization of test print circuit board in automatic optics inspection process, reducing automatic optics inspection and occur erroneous judgement or the undetected problem of defect.In addition, described printed circuit board (PCB) automatic optical detection method completes the automatic optics inspection of the upper and lower surface for test print circuit board when the second objective table comes and goes and moves horizontally, and can also effectively improve automatic optics inspection efficiency.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a printed circuit board (PCB) automatic optical detection method, is characterized in that, comprising:
A, utilize vacuum suction mode that test print circuit board is fixed to the workplace of the first objective table;
B, by horizontal shift electricity cylinder, the second objective table to be moved horizontally to above described first objective table, and in moving process, to utilize the optical module of described second objective table to perform optical detection to the upper surface of described test print circuit board;
C, by perpendicular displacement electricity cylinder, described second objective table to be moved vertically to and described test print circuit board contacts, and by vacuum suction mode, described test print circuit board is fixed to the workplace of described second objective table;
D, by described horizontal shift electricity cylinder, described second objective table executive level to be moved, and in moving process, utilize the optical module of described first objective table to perform optical detection to the lower surface of described test print circuit board.
2. printed circuit board (PCB) automatic optical detection method according to claim 1, is characterized in that, before described steps A, also comprises:
A0, described test print circuit board level is sent to the workplace of described first objective table, and in horizontal transmission process by blowing operation for described test print circuit board provides air-bed to carry out horizontal transmission to make described test print circuit board with suspended state.
3. printed circuit board (PCB) automatic optical detection method according to claim 2, is characterized in that, described steps A comprises:
A1, after described test print circuit board is sent to the workplace of described first objective table, cancels described air-bed tiles the workplace of described first objective table to make described test print circuit board;
A2, open vacuum pumping at the workplace of described first objective table and make the lower surface vacuum suction of described test print circuit board to the workplace of described first objective table.
4. printed circuit board (PCB) automatic optical detection method according to claim 1, is characterized in that, described perpendicular displacement electricity cylinder is connected to described horizontal shift electricity cylinder, and described second objective table is arranged on the end of described perpendicular displacement electricity cylinder.
5. printed circuit board (PCB) automatic optical detection method according to claim 4, is characterized in that, described step B comprises:
B1, described perpendicular displacement electricity cylinder is driven to be moved horizontally to above described first objective table together with the second objective table of its end by described horizontal shift electricity cylinder;
B2, open and be arranged on CCD camera array and the line source of the workplace of described second objective table, in the process that described second objective table moves to above described first objective table, utilize described CCD camera array to perform optical scanning to the upper surface circuit of described test print circuit board and detect.
6. printed circuit board (PCB) automatic optical detection method according to claim 4, is characterized in that, described step C comprises:
C1, the upper surface driving the second objective table of its end to drop to described test print circuit board by described perpendicular displacement electricity cylinder contact, and in described second objective table decline process, close the vacuum suction of described first objective table and vertical operation is performed to described test print circuit board, be converted to suspended state to make described test print circuit board from vacuum adsorption state;
C2, open vacuum pumping at the workplace of described second objective table and make the upper surface of described test print circuit board by vacuum suction to the workplace of described second objective table.
7. printed circuit board (PCB) automatic optical detection method according to claim 6, is characterized in that, described step C also comprises:
C3, drive the second objective table of its end to rise to preset height by described perpendicular displacement electricity cylinder, wherein said preset height meets the shooting focal length requirement of the optical module of the workplace being positioned at described first objective table.
8. printed circuit board (PCB) automatic optical detection method according to claim 1, is characterized in that, described step D comprises:
D1, described perpendicular displacement electricity cylinder is driven to move horizontally towards sorting platform direction together with the second objective table level of its end by described horizontal shift electricity cylinder;
D2, open and be arranged on CCD camera array and the line source of the workplace of described first objective table, move horizontally in process at described second objective table, utilize the CCD camera array of described first objective table to perform optical scanning to the lower surface circuit of described test print circuit board and detect.
9. printed circuit board (PCB) automatic optical detection method according to claim 8, is characterized in that, also comprise:
E, described test print circuit board is released into described sorting platform, and utilizes described sorting platform to perform sorting process to described test print circuit board.
10. printed circuit board (PCB) automatic optical detection method according to claim 9, is characterized in that, described step e comprises:
E1, above described second objective table moves to described sorting platform after close the vacuum suction of described second objective table and described test print circuit board be discharged into described sorting platform surface;
E2, automatic optics inspection result according to described test print circuit board, utilize described sorting platform to be divided by described test print circuit board and see corresponding printed circuit board (PCB) off-sorting station.
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| CN104949992A (en) * | 2015-05-19 | 2015-09-30 | 东莞市威力固电路板设备有限公司 | Printed circuit board (PCB) automated optical inspection (AOI) system and PCB objective table suitable for same |
| CN105486696A (en) * | 2015-11-20 | 2016-04-13 | 凌云光技术集团有限责任公司 | Circuit board conveying and detecting apparatus and circuit board conveying and detecting method |
| CN106183580A (en) * | 2016-07-08 | 2016-12-07 | 青岛理工大学 | Double-sided vacuum adsorption device, system and method with controllable regions |
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