JP3616127B2 - Light emitting diode alignment light source - Google Patents

Light emitting diode alignment light source Download PDF

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Publication number
JP3616127B2
JP3616127B2 JP1518694A JP1518694A JP3616127B2 JP 3616127 B2 JP3616127 B2 JP 3616127B2 JP 1518694 A JP1518694 A JP 1518694A JP 1518694 A JP1518694 A JP 1518694A JP 3616127 B2 JP3616127 B2 JP 3616127B2
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Prior art keywords
emitting diode
light
light emitting
light source
printed wiring
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JP1518694A
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JPH07226537A (en
Inventor
幸一 竹迫
佳彦 帖佐
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Facsimile Heads (AREA)
  • Led Device Packages (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【０００１】
【産業上の利用分野】
本発明は発光ダイオード整列光源、特にファクシミリ、ワードプロセッサあるいは複写機の画像読み取り用イメージスキャナーで使用される光源に適した発光ダイオード整列光源に関するものである。
【０００２】
【従来の技術】
近年、画像読み取り用発光ダイオード整列光源が、ファクシミリ、ワードプロセッサあるいは複写機のイメージスキャナー部等において、イメージセンサーで画像情報を読み取りたい原稿に光を照射するための部品として使用されている。
【０００３】
以下に、従来の画像読み取り用の発光ダイオード整列光源について、図４〜図７を参照して説明する。
【０００４】
図４はこの発光ダイオード整列光源を使用した密着型イメージスキャナー部の要部断面図である。この密着型イメージスキャナー部は、発光ダイオード整列光源１、原稿２、セルフォックレンズアレイ４、およびイメージセンサー５で構成されている。３は光軸である。
【０００５】
この密着型イメージスキャナー部において、原稿２上の読み取りラインに沿って発光ダイオード整列光源１から光が照射され、原稿２からの反射光がセルフォックレンズアレイ４で集束されて同一直線上に配置されたイメージセンサー５へ導かれる。イメージセンサー５で受光され、その微小画素に分解された画像情報が各画素濃度に対する電気信号として取り出される。
【０００６】
図５および図６は、この密着型イメージスキャナー部に用いられる発光ダイオード整列光源を示す。図５はその斜視図、図６は断面図である。
【０００７】
この発光ダイオード整列光源部は、所定のパターンの導電体が形成されたプリント配線基板６、樹脂成型ケース８、発光ダイオードチップ７、その樹脂封止体９、および電流制限用抵抗体１９で構成されている。
【０００８】
樹脂成型ケース８の一主面側には、凹部が一定の間隔で直線上に形成されている。この樹脂成型ケース８が、プリント配線基板６に、凹部形成面とは反対の面側で取り付けられている。図では、複数本の樹脂成型ケース８が凹部配列方向に沿って１列に並べて取り付けられた例を示している。発光ダイオードチップ７が、樹脂成型ケース８の各凹部内において、図６に示すように、凹部の底部に引き出されているリード１７の一端部に取り付けられ、接続されている。発光ダイオードチップ７の他方の電極は、リード線で凹部底部に引き出された他方のリード１８の一端部に接続されている。樹脂成型ケース８の各凹部には透明なエポキシ樹脂が充填されて、発光ダイオードチップ７を封止するための樹脂封止体９が構成されている。各リード１７，１８の他方の端部はプリント配線基板６上の対応する導電体と接続されている。
【０００９】
電流制限用抵抗体１９は発光ダイオードチップ７への供給電流を所定の値に制限するためのもので、図５に示すように、各樹脂成型ケース８に保持された発光ダイオードチップ群に対応させてプリント配線基板６上に取り付けられ、その導電体に接続されている。
【００１０】
この密着型イメージスキャナー部によれば、図４に示すように、発光ダイオードチップ７から発した光は透明な樹脂封止体９を通して外部へ放射され、原稿２の画像情報を読み取りすべき部分３を照射する。
【００１１】
図７は、図５に示した発光ダイオード整列光源１の樹脂成型ケース８の配列方向の照度分布である。
【００１２】
【発明が解決しようとする課題】
上述のような従来の発光ダイオード整列光源１では、プリント配線基板６上に樹脂成型ケース８を取り付けた構造であるため、その構成部品点数を減らすことが非常に困難で、市場の要望である価格低減がむずかしい。また、樹脂成型ケース８の凹部の配列間隔で発光ダイオードチップ７の配列ピッチが決まるため、この発光ダイオード整列光源で縮小系照度分布（ｃｏｓｉｎ４乗則）を得ようとすると、電流制限用抵抗体１９の値を選定することによって発光ダイオードチップ７への供給電流を設定しなければならず、縮小系照度分布への対応が困難であった。無論、用途に応じた凹部間隔の樹脂成型ケースを準備しておき、適宜それを選んで使用することも考えられるが、価格上昇は避けられず、光源組立に際しての部品管理が非常に煩雑となり、実際的でない。
【００１３】
さらに、市場においてはセットの小型化、軽量化が求められていることから、セットの各構成部品に対しても軽薄短小化が求められている。しかし、従来の構造の発光ダイオード整列光源では小型化が非常に困難であり、市場ニーズに対応できないという問題点を有していた。
【００１４】
さらに、樹脂成型ケース８を使用しているため、図７に示したように、照度分布にむらが生じることが避けられず、両端部分から中央部分へ向かって単調に低くなる分布となっていない。
【００１５】
本発明は上記従来の問題点を解決するもので、部品点数の削減による低価格化と縮小系照度分布の形成が容易で、小型化への対応が可能な画像読み取り用発光ダイオード整列光源を提供することを目的とする。
【００１６】
【課題を解決するための手段】
この目的を達成するために、本発明の発光ダイオード整列光源は、導電回路が形成されたプリント配線基板と、導電回路の所定箇所上に直線状に配置され取り付けられて接続された複数の発光ダイオードチップと、これら発光ダイオードチップをプリント配線基板上で封止した透明な樹脂封止体とを備える。
【００１７】
【作用】
この構成によれば、プリント配線基板の導電体の所定箇所に発光ダイオードチップを取り付けることで電気的な接続がなされ、かつ基板上にそれらを透明樹脂封止体で封止したので、従来必要とされた樹脂成型ケースが不要となり、電気的な接続箇所数の大幅な低減、材料費の削減と部品点数削減、さらにはそれによる組立工程の短縮化で、コスト低減が可能となっただけでなく、光源の軽薄短小化が容易となり、さらにその設計の自由度が増した。また、プリント配線基板の導電体パターンの変更により、任意の個数の発光ダイオードチップを任意のピッチで直線状に配列することで、使用目的や用途に応じて照度レベルを実現したり、等倍系照度分布または縮小系照度分布を形成したりすることが容易になり、市場の要望に応じた製品設計が容易に可能となった。
【００１８】
【実施例】
以下、本発明の発光ダイオード整列光源における一実施例の構造について、図１および図２を参照しながら説明する。図１はこの実施例の斜視図、図２は図１のＸ−Ｘ線に沿った断面図である。
【００１９】
図１および図２において、１０はプリント配線基板、１１は発光ダイオードチップ、１２はレンズとしての機能をもつ透明樹脂封止体、１３はプリント配線製造技術で所定のパターンに形成された導電体、１４はレジスト層である。１９は電流制限用抵抗体で、発光ダイオードチップ１１への電流を所定の値に保持するためのものである。
【００２０】
プリント配線基板１０は、定尺シートをワークサイズに切断し、コストダウンのために多数個取りの構成として、それぞれの配線回路パターンの導電体１３を同時に形成し、最後に所定の寸法に分割したものである。
【００２１】
発光ダイオードチップ１１は各導電体１３の所定箇所に、図１に示すように直線状に取り付けられることで、その一方の電極が接続され、他方の電極が他の導電体１３の所定箇所に金属細線で接続されている。
【００２２】
直線状に配列された発光ダイオードチップ１１、それが電気的に接続された導電体１３、および金属細線は、プリント配線基板１０の主面上で共通の透明樹脂封止体１２によって封止され、保護されている。透明樹脂封止体１２は、図２に示すように断面がほぼ半円形状で棒状をなし、発光ダイオードチップ１１の発する光を集束するレンズとしての働きもする。そして、透明樹脂封止体１２は、プリント配線基板１０の主面上で、発光ダイオードチップ１１およびそれらが金属細線で接続された導電体１３の両側に形成された１対の帯状の導電体間に、透明樹脂材料を選択的に付着させ、その粘性流動を阻止した状態で硬化させたものである。これによって、透明樹脂封止体１２の断面がほぼ半円形状すなわち半円形状もしくは半楕円形状であって、棒状をしている。そして、そのプリント配線基板１０との接触面の幅は１対の帯状の導電体の間隔で規制されている。
【００２３】
透明樹脂材料を選択的に付着させるための方法としては、ロールを使用した印刷法やスクリーン印刷法が利用できる。
【００２４】
透明樹脂材料が所定の付着箇所から流出することを阻止するための導電体には、配線用導電体の一部を兼用してもよく、無論、流出阻止のためのみに配線用導電体形成時に同時に形成したものを使用してもよい。図２に示すように、この導電体上にレジスト層１４を形成して積層構造体とすると、その流出がさらに効果的に阻止できる。また、レジスト層１４を二重層、必要に応じて三重層以上に重ねて形成することで、流出阻止作用をよりいっそう高めることができる。本実施例では、レジスト層１４に厚く形成するのが紫外線硬化性樹脂に比べて容易な熱硬化性樹脂を使用した。レジスト層１４は、発光ダイオードチップ１１の発する光を効率的に取り出すために光反射の良好なたとえば白色であることが望ましく、シリコーン樹脂の流出防止のため部分的に二重にレジスト材を塗布するとより効果的である。無論、レジスト層１４のみで樹脂流出阻止用の帯状の構造体を作ることもできる。
【００２５】
透明樹脂材料は、チクソトロピック性の高いものであることが望ましい。本実施例では東芝シリコーン株式会社製シリコーン樹脂材料「ＴＳＪ３１５６」を使用した。このシリコーン樹脂材料は、芝浦システム株式会社製粘度測定計「ビスメトロン粘度計ＶＤＨ型」で測定した粘度の値は７０ｃｐ（最小値４０ｃｐ、最大値１００ｃｐ）である。
【００２６】
図３は、本実施例の発光ダイオードチップ１１配列方向に沿った照度分布を示す。図３から明らかなように、この照度分布は、従来使用されていた樹脂成型ケースを不要とすることで、照度が中央部分でもっとも低く、両端部分へ向かって単調に増大する分布とすることができた。
【００２７】
本実施例によれば、各発光ダイオードチップ１１は透明樹脂封止体１２で発光ダイオードチップ１１上に封止されているため、従来の発光ダイオード整列光源で使用されていた樹脂成型ケースが不要となったことで、材料費の削減と部品点数削減、さらにはそれによる組立工程の簡素化でコストを低減することができる。従来、発光ダイオード整列光源の使用目的やその用途に応じて樹脂成型ケースを準備しなければならず、また組立工程での部品管理が煩雑となっていたのが、本実施例では、樹脂成型ケースを不要としたので、発光ダイオード整列光源の使用目的や用途に応じて導電体１３のパターンを変更することにより、希望する照度レベルや、等倍系照度分布あるいは縮小系照度分布となるよう、発光ダイオードチップ１１の個数やその配列ピッチを容易に選ぶことができ、また、組立工程での部品管理等が容易となる。さらに、樹脂成型ケースを不要とすることで、発光ダイオード整列光源の電気的な接続箇所数が大幅に削減される。
【００２８】
さらに、発光ダイオード整列光源の使用目的やその用途に応じて導電体１３のパターンを変更して、発光ダイオードチップ１１の個数やその配列ピッチを選ぶことで、照度レベルや、等倍系照度分布あるいは縮小系照度分布を容易に得ることができ、市場の要望に応じた製品を迅速に設計することができる。
【００２９】
なお、本実施例では、電流制限用抵抗体１９をプリント配線基板１０の発光ダイオードチップ１１の載置面側に配置したが、電流制限用抵抗体１９を発光ダイオードチップ１１載置面とは反対側の面に配置してもよいことは言うまでもない。これにより、発光ダイオード整列光源をさらに小型化することができる。
【００３０】
【発明の効果】
本発明の発光ダイオード整列光源は、プリント配線基板の導電体の所定箇所に発光ダイオードチップを取り付けることで、発光ダイオードチップと導電体とが直接に接続され、かつプリント配線基板上に複数個の発光ダイオードチップを透明樹脂封止体で直接に封止したので、従来必要とされた樹脂成型ケースを必要とせず、電気的な接続箇所数を大幅に少なくすることができるとともに、部品点数が削減でき、材料費の低減、さらにはそれによる組立工程の簡素化とコスト低減が可能となっただけでなく、光源の軽薄短小化が容易となり、さらにその設計の自由度を高めることができた。また、プリント配線基板の導電体パターンを用途や使用目的に応じて変更することで、任意の個数の発光ダイオードチップを任意のピッチで直線状に配列することができ、使用目的や用途に応じて照度レベルを実現したり、等倍系照度分布または縮小系照度分布を形成したりすることが容易になり、市場の要望に応じた製品設計が容易に可能となった。
【図面の簡単な説明】
【図１】本発明の発光ダイオード整列光源における一実施例の斜視図
【図２】図１のＸ−Ｘ線に沿った断面図
【図３】図１の実施例の発光ダイオードチップ整列方向の照度分布の一例を示す図
【図４】従来のイメージスキャナーの一例を示す要部断面図
【図５】図４のイメージスキャナーで使用される発光ダイオード整列光源の斜視図
【図６】図５に示した発光ダイオード整列光源の断面図
【図７】図６の発光ダイオード整列光源の発光ダイオードチップ整列方向の照度分布を示す図
【符号の説明】
１０ プリント配線基板
１１ 発光ダイオードチップ
１２ 透明樹脂封止体
１３ 導電体
１４ レジスト層
１９ 電流制限用抵抗体[0001]
[Industrial application fields]
The present invention relates to a light emitting diode alignment light source, and more particularly to a light emitting diode alignment light source suitable for a light source used in an image scanner for image reading of a facsimile, a word processor or a copying machine.
[0002]
[Prior art]
In recent years, light-emitting diode alignment light sources for image reading are used as components for irradiating light on a document whose image information is to be read by an image sensor in a facsimile, a word processor, or an image scanner unit of a copying machine.
[0003]
Hereinafter, a conventional light emitting diode alignment light source for image reading will be described with reference to FIGS.
[0004]
FIG. 4 is a cross-sectional view of the main part of a contact image scanner unit using the light emitting diode aligned light source. The contact image scanner unit includes a light emitting diode alignment light source 1, a document 2, a selfoc lens array 4, and an image sensor 5. 3 is an optical axis.
[0005]
In this contact image scanner unit, light is emitted from the light emitting diode alignment light source 1 along the reading line on the document 2, and the reflected light from the document 2 is focused by the SELFOC lens array 4 and arranged on the same straight line. To the image sensor 5. Image information received by the image sensor 5 and decomposed into the minute pixels is taken out as an electric signal for each pixel density.
[0006]
5 and 6 show a light emitting diode aligned light source used in the contact image scanner unit. FIG. 5 is a perspective view thereof, and FIG. 6 is a sectional view thereof.
[0007]
The light-emitting diode alignment light source unit includes a printed wiring board 6 on which a conductor having a predetermined pattern is formed, a resin molding case 8, a light-emitting diode chip 7, a resin sealing body 9, and a current limiting resistor 19. ing.
[0008]
On one main surface side of the resin molding case 8, recesses are formed on a straight line at regular intervals. The resin molding case 8 is attached to the printed wiring board 6 on the surface side opposite to the recess forming surface. In the figure, an example is shown in which a plurality of resin molding cases 8 are attached in a line along the concave array direction. As shown in FIG. 6, the light-emitting diode chip 7 is attached to and connected to one end portion of a lead 17 that is drawn to the bottom of the recess in each recess of the resin molding case 8. The other electrode of the light-emitting diode chip 7 is connected to one end of the other lead 18 drawn out to the bottom of the recess by a lead wire. Each concave portion of the resin molded case 8 is filled with a transparent epoxy resin to form a resin sealing body 9 for sealing the light emitting diode chip 7. The other end of each lead 17, 18 is connected to a corresponding conductor on the printed wiring board 6.
[0009]
The current limiting resistor 19 is used to limit the supply current to the light emitting diode chip 7 to a predetermined value, and corresponds to the light emitting diode chip group held in each resin molding case 8 as shown in FIG. Are mounted on the printed circuit board 6 and connected to the conductor.
[0010]
According to this contact type image scanner unit, as shown in FIG. 4, the light emitted from the light emitting diode chip 7 is radiated to the outside through the transparent resin sealing body 9, and the portion 3 where the image information of the document 2 is to be read. Irradiate.
[0011]
FIG. 7 is an illuminance distribution in the arrangement direction of the resin molding case 8 of the light emitting diode alignment light source 1 shown in FIG.
[0012]
[Problems to be solved by the invention]
Since the conventional light emitting diode aligned light source 1 as described above has a structure in which the resin molded case 8 is mounted on the printed wiring board 6, it is very difficult to reduce the number of components, which is a market demand price. Reduction is difficult. In addition, since the arrangement pitch of the light emitting diode chips 7 is determined by the arrangement interval of the concave portions of the resin molding case 8, if an attempt is made to obtain a reduced system illuminance distribution (cosin 4th law) with this light emitting diode aligned light source, the current limiting resistor 19 The current supplied to the light-emitting diode chip 7 must be set by selecting the value of, and it was difficult to cope with the reduced system illuminance distribution. Of course, it is possible to prepare a resin molding case with a concave interval according to the application, and select and use it appropriately, but it is inevitable that the price will rise, and parts management at the time of light source assembly becomes very complicated, Not practical.
[0013]
Furthermore, since the market requires a smaller and lighter set, each component of the set is required to be lighter, thinner, and smaller. However, the light emitting diode aligned light source having the conventional structure has a problem that it is very difficult to miniaturize and cannot meet market needs.
[0014]
Furthermore, since the resin molding case 8 is used, as shown in FIG. 7, it is inevitable that the illuminance distribution is uneven, and the distribution does not monotonously decrease from both end portions toward the central portion. .
[0015]
The present invention solves the above-mentioned conventional problems, and provides a light-emitting diode aligned light source for image reading, which can easily reduce the cost by reducing the number of parts and form a reduced illuminance distribution and can cope with downsizing. The purpose is to do.
[0016]
[Means for Solving the Problems]
In order to achieve this object, a light emitting diode aligned light source according to the present invention includes a printed wiring board on which a conductive circuit is formed, and a plurality of light emitting diodes arranged and connected in a straight line on a predetermined portion of the conductive circuit. A chip and a transparent resin sealing body in which these light emitting diode chips are sealed on a printed wiring board.
[0017]
[Action]
According to this configuration, electrical connection is made by attaching the light-emitting diode chip to a predetermined portion of the conductor of the printed wiring board, and since they are sealed on the substrate with the transparent resin sealing body, conventionally required This eliminates the need for a plastic molded case, which not only significantly reduces the number of electrical connections, reduces material costs, reduces the number of parts, and shortens the assembly process. The light source can be made lighter, thinner and smaller, and the design flexibility has increased. In addition, by changing the conductor pattern of the printed circuit board, an arbitrary number of light-emitting diode chips can be arranged in a straight line at an arbitrary pitch to achieve an illuminance level according to the intended use and application, It becomes easy to form an illuminance distribution or a reduced illuminance distribution, and product design according to market demands can be easily performed.
[0018]
【Example】
Hereinafter, the structure of an embodiment of the light emitting diode aligned light source of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of this embodiment, and FIG. 2 is a sectional view taken along line XX of FIG.
[0019]
1 and 2, 10 is a printed wiring board, 11 is a light emitting diode chip, 12 is a transparent resin sealing body having a function as a lens, 13 is a conductor formed in a predetermined pattern by printed wiring manufacturing technology, Reference numeral 14 denotes a resist layer. Reference numeral 19 denotes a current limiting resistor for holding the current to the light emitting diode chip 11 at a predetermined value.
[0020]
The printed wiring board 10 is formed by cutting a standard sheet into a work size, forming conductors 13 of each wiring circuit pattern at the same time as a multi-piece construction for cost reduction, and finally dividing it into predetermined dimensions. Is.
[0021]
As shown in FIG. 1, the light emitting diode chip 11 is linearly attached to a predetermined portion of each conductor 13 so that one of the electrodes is connected and the other electrode is connected to a predetermined portion of the other conductor 13. Connected with thin wires.
[0022]
The light-emitting diode chips 11 arranged in a straight line, the conductors 13 to which the light-emitting diode chips 11 are electrically connected, and the metal thin wires are sealed by a common transparent resin sealing body 12 on the main surface of the printed wiring board 10, Protected. As shown in FIG. 2, the transparent resin sealing body 12 has a substantially semicircular cross section and has a rod shape, and also functions as a lens that focuses light emitted from the light emitting diode chip 11. The transparent resin sealing body 12 is formed between the pair of strip-shaped conductors formed on both sides of the light-emitting diode chip 11 and the conductor 13 connected with the thin metal wires on the main surface of the printed wiring board 10. Further, a transparent resin material is selectively attached and cured in a state where the viscous flow is prevented. Thereby, the cross section of the transparent resin sealing body 12 is substantially semicircular, that is, semicircular or semielliptical, and has a rod shape. The width of the contact surface with the printed wiring board 10 is regulated by the distance between the pair of strip-shaped conductors.
[0023]
As a method for selectively attaching the transparent resin material, a printing method using a roll or a screen printing method can be used.
[0024]
The conductor for preventing the transparent resin material from flowing out from a predetermined adhesion location may also be used as a part of the conductor for wiring. Of course, when forming the wiring conductor only for preventing outflow. You may use what was formed simultaneously. As shown in FIG. 2, when a resist layer 14 is formed on this conductor to form a laminated structure, the outflow can be more effectively prevented. Further, by forming the resist layer 14 so as to overlap the double layer, and if necessary, the triple layer or more, the outflow prevention action can be further enhanced. In the present embodiment, a thermosetting resin that is easily formed thicker than the ultraviolet curable resin is used in the resist layer 14. The resist layer 14 is preferably white, for example, which has good light reflection in order to efficiently extract the light emitted from the light-emitting diode chip 11. More effective. Of course, it is also possible to make a belt-like structure for preventing resin outflow by using only the resist layer 14.
[0025]
It is desirable that the transparent resin material has a high thixotropic property. In this example, a silicone resin material “TSJ3156” manufactured by Toshiba Silicone Co., Ltd. was used. This silicone resin material has a viscosity value of 70 cp (minimum value 40 cp, maximum value 100 cp) measured with a viscosity meter “Bismetron viscometer VDH type” manufactured by Shibaura System Co., Ltd.
[0026]
FIG. 3 shows an illuminance distribution along the arrangement direction of the light-emitting diode chips 11 of the present embodiment. As is apparent from FIG. 3, the illuminance distribution can be a distribution in which the illuminance is lowest in the central portion and monotonously increases toward both end portions by eliminating the need for a conventionally used resin molding case. did it.
[0027]
According to the present embodiment, each light-emitting diode chip 11 is sealed on the light-emitting diode chip 11 with the transparent resin sealing body 12, so that the resin molding case used in the conventional light-emitting diode alignment light source is unnecessary. As a result, the cost can be reduced by reducing the material cost and the number of parts, and further simplifying the assembly process. Conventionally, a resin molded case has to be prepared according to the purpose and use of the light-emitting diode alignment light source, and parts management in the assembly process has been complicated. Therefore, by changing the pattern of the conductor 13 in accordance with the purpose and application of the light emitting diode aligned light source, light emission is performed so that the desired illuminance level, equal magnification illuminance distribution, or reduced illuminance distribution can be obtained. The number of diode chips 11 and the arrangement pitch thereof can be easily selected, and component management and the like in the assembly process are facilitated. Furthermore, by eliminating the need for a resin molded case, the number of electrical connection points of the light emitting diode alignment light source can be greatly reduced.
[0028]
Furthermore, by changing the pattern of the conductor 13 according to the purpose of use and use of the light emitting diode alignment light source, and selecting the number of light emitting diode chips 11 and their arrangement pitch, A reduced system illuminance distribution can be easily obtained, and a product that meets market demands can be designed quickly.
[0029]
In this embodiment, the current limiting resistor 19 is disposed on the mounting surface side of the light emitting diode chip 11 of the printed wiring board 10. However, the current limiting resistor 19 is opposite to the light emitting diode chip 11 mounting surface. Needless to say, it may be arranged on the side surface. Thereby, the light emitting diode alignment light source can be further reduced in size.
[0030]
【The invention's effect】
The light-emitting diode alignment light source of the present invention is such that a light-emitting diode chip and a conductor are directly connected by attaching a light-emitting diode chip to a predetermined portion of a conductor of a printed wiring board, and a plurality of light emission on the printed wiring board. Since the diode chip is directly sealed with a transparent resin encapsulant, there is no need for a resin molding case, which is required in the past, and the number of electrical connections can be greatly reduced and the number of parts can be reduced. In addition to the reduction in material cost and the simplification and cost reduction of the assembly process, the light source can be easily made lighter, thinner, and smaller, and the degree of freedom in design can be increased. In addition, by changing the conductor pattern of the printed circuit board according to the application and purpose of use, any number of light-emitting diode chips can be arranged in a straight line at an arbitrary pitch. It has become easy to realize the illuminance level and to form the same-size illuminance distribution or the reduced illuminance distribution, and it has become possible to easily design products that meet market demands.
[Brief description of the drawings]
1 is a perspective view of an embodiment of a light-emitting diode alignment light source according to the present invention; FIG. 2 is a cross-sectional view taken along line XX of FIG. 1; FIG. 4 is a cross-sectional view of an essential part showing an example of a conventional image scanner. FIG. 5 is a perspective view of a light emitting diode aligned light source used in the image scanner of FIG. FIG. 7 is a cross-sectional view of the light emitting diode aligned light source shown in FIG. 7.
DESCRIPTION OF SYMBOLS 10 Printed wiring board 11 Light emitting diode chip 12 Transparent resin sealing body 13 Conductor 14 Resist layer 19 Current limiting resistor

Claims (1)

導電回路が形成されたプリント配線基板と、前記導電回路の所定箇所上に直線状に配置されて取り付けられ接続された複数の発光ダイオードチップと、前記発光ダイオードチップを前記プリント配線基板上で透明な樹脂材料を選択的に付着させ封止した樹脂封止体とを備えた発光ダイオード整列光源であって、前記透明な樹脂材料の流出防止用構造体が前記プリント配線基板上に設けられ、かつ前記導電回路と同時に形成された導電体であることを特徴とする発光ダイオード整列光源。A printed wiring board on which a conductive circuit is formed, a plurality of light emitting diode chips arranged and connected in a straight line on a predetermined portion of the conductive circuit, and the light emitting diode chips are transparent on the printed wiring board. a light emitting diode alignment light source with a resin sealing body that seals by selectively depositing the resin material, outflow prevention structure of the transparent resin material is provided on the printed circuit board, and wherein A light-emitting diode aligned light source characterized by being a conductor formed simultaneously with a conductive circuit .
JP1518694A 1994-02-09 1994-02-09 Light emitting diode alignment light source Expired - Fee Related JP3616127B2 (en)

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Application Number Priority Date Filing Date Title
JP1518694A JP3616127B2 (en) 1994-02-09 1994-02-09 Light emitting diode alignment light source

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JP2003039728A (en) * 2001-07-31 2003-02-13 Sanyo Electric Co Ltd Circuit unit and optical printing head with the same
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US7025485B2 (en) 2003-10-29 2006-04-11 Guide Corporation High mount stop lamp with printed circuit board
JP5555971B2 (en) * 2006-07-18 2014-07-23 日亜化学工業株式会社 Linear light-emitting device and planar light-emitting device using the same
JP5181505B2 (en) * 2007-03-22 2013-04-10 東芝ライテック株式会社 Light emitting device
JP4533405B2 (en) * 2007-05-31 2010-09-01 株式会社 日立ディスプレイズ LIGHTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE LIGHTING DEVICE
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DE102010031945A1 (en) * 2010-07-22 2012-01-26 Osram Opto Semiconductors Gmbh Semiconductor device and method for manufacturing a semiconductor device
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