JPH09148633A - Light emitting diode-aligned light source - Google Patents
Light emitting diode-aligned light sourceInfo
- Publication number
- JPH09148633A JPH09148633A JP7308723A JP30872395A JPH09148633A JP H09148633 A JPH09148633 A JP H09148633A JP 7308723 A JP7308723 A JP 7308723A JP 30872395 A JP30872395 A JP 30872395A JP H09148633 A JPH09148633 A JP H09148633A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- light
- light source
- white
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Facsimile Scanning Arrangements (AREA)
- Led Device Packages (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光ダイオード整列
光源、特にファクシミリ装置、ワードプロセッサあるい
は複写機の画像読み取り用イメージスキャナーで使用さ
れる光源に適した発光ダイオード整列光源に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode alignment light source, and more particularly to a light emitting diode alignment light source suitable for a light source used in an image scanner for image reading of a facsimile machine, a word processor or a copying machine.
【０００２】[0002]
【従来の技術】近年、画像読み取り用発光ダイオード整
列光源が、ファクシミリ装置、ワードプロセッサあるい
は複写機のイメージスキャナー部等において、イメージ
センサーで画像情報を読み取りたい原稿に光を照射する
ための部品として使用されている。2. Description of the Related Art In recent years, light emitting diode array light sources for image reading have been used as parts for illuminating a document whose image information is to be read by an image sensor in a facsimile machine, a word processor or an image scanner section of a copying machine. ing.
【０００３】以下に、従来の画像読み取り用の発光ダイ
オード整列光源について、図３〜図５を参照して説明す
る。A conventional light emitting diode array light source for image reading will be described below with reference to FIGS.
【０００４】図３はこの発光ダイオード整列光源を使用
した密着型イメージスキャナー部の要部断面図である。
この密着型イメージスキャナー部は、発光ダイオード整
列光源１、原稿２、セルフォックレンズアレイ４、およ
びイメージセンサー５で構成されている。３は光軸であ
る。FIG. 3 is a sectional view of a main part of a contact type image scanner section using the light emitting diode array light source.
The contact-type image scanner unit includes a light emitting diode alignment light source 1, a document 2, a SELFOC lens array 4, and an image sensor 5. 3 is an optical axis.
【０００５】この密着型イメージスキャナー部におい
て、原稿２上の読み取りラインに沿って発光ダイオード
整列光源１から光が照射され、原稿２からの反射光がセ
ルフォックレンズアレイ４で集束されて同一直線上に配
置されたイメージセンサー５へ導かれる。イメージセン
サー５で受光され、その微小画素に分解された画像情報
が各画素濃度に対する電気信号として取り出される。In this contact-type image scanner unit, light is emitted from the light emitting diode alignment light source 1 along the reading line on the original 2, and the reflected light from the original 2 is focused by the SELFOC lens array 4 and is on the same straight line. Is guided to the image sensor 5 arranged at. The image information received by the image sensor 5 and decomposed into minute pixels is taken out as an electric signal for each pixel density.
【０００６】図４および図５は、この密着型イメージス
キャナー部に用いられる発光ダイオード整列光源を示
す。図４はその斜視図、図５は断面図である。4 and 5 show a light emitting diode alignment light source used in the contact type image scanner unit. FIG. 4 is a perspective view thereof, and FIG. 5 is a sectional view thereof.
【０００７】この発光ダイオード整列光源部は、所定の
導電回路が形成されたプリント配線基板６、発光ダイオ
ード素子７、金属細線８、樹脂封止体９、および電流制
限用抵抗体１０で構成されている。This light emitting diode array light source section is composed of a printed wiring board 6 on which a predetermined conductive circuit is formed, a light emitting diode element 7, a thin metal wire 8, a resin sealing body 9 and a current limiting resistor 10. There is.
【０００８】導電回路が形成されたプリント配線基板６
の各所定箇所に、複数の発光ダイオード素子７が直線状
に導電性接着剤で取り付けられ、それらの一方の電極が
電気的に接続されている。発光ダイオード素子７の他方
の電極は、プリント配線基板６の他方の導電体に金属細
線８で接続されている。電流制限用抵抗体１０は発光ダ
イオード素子７への供給電流を所定の値に制限するため
のもので、直列に接続された一定数の発光ダイオード素
子群毎に対応させてプリント配線基板６上に取り付けら
れ、その導電体に電気的に接続されている。Printed wiring board 6 on which a conductive circuit is formed
A plurality of light emitting diode elements 7 are linearly attached to each of the predetermined positions with a conductive adhesive, and one electrode thereof is electrically connected. The other electrode of the light emitting diode element 7 is connected to the other conductor of the printed wiring board 6 by a thin metal wire 8. The current limiting resistor 10 is for limiting the current supplied to the light emitting diode element 7 to a predetermined value, and is provided on the printed wiring board 6 in correspondence with each fixed number of light emitting diode element groups connected in series. Mounted and electrically connected to the conductor.
【０００９】この密着型イメージスキャナー部によれ
ば、図３に示すように、発光ダイオード素子７から発し
た光は、透明な樹脂封止体９を通して発光面側全周囲の
外部へ放射され、その光の一部分が光軸３を照射する。According to this contact-type image scanner section, as shown in FIG. 3, the light emitted from the light emitting diode element 7 is radiated to the outside of the entire periphery of the light emitting surface side through the transparent resin encapsulant 9, A part of the light illuminates the optical axis 3.
【００１０】[0010]
【発明が解決しようとする課題】上述のような従来の発
光ダイオード整列光源に対して、市場においては発光ダ
イオード整列光源が取り付けられるセットの機能向上と
して原稿の読み取り速度を上げるために、さらなる高照
度化の要望がある。発光ダイオード整列光源の高照度化
を達成するためには発光ダイオード素子の高照度化が必
要であるが、近年その高照度化が横這い状態にあり、現
在のところこれ以上の照度アップを望めない状況であ
る。そのため、発光ダイオード１チップあたりの動作電
流増加が必要となってくるのであるが、電流制限用抵抗
による発熱量が増大し、発光ダイオード素子ジャンクシ
ョン部の許容温度を越えてしまうおそれが大きくなるた
め、発光ダイオードの信頼性保持に課題が残り、現状以
上の電流の増加による高照度化はむずかしい。In contrast to the conventional light emitting diode array light source as described above, in the market, in order to improve the reading speed of a document as a function improvement of a set to which the light emitting diode array light source is attached, further high illuminance is required. There is a request for conversion. It is necessary to increase the illuminance of the light emitting diode element to achieve higher illuminance of the light emitting diode aligned light source, but in recent years the increase in illuminance has leveled off, and at present it is not possible to expect further increase in illuminance. Is. Therefore, it is necessary to increase the operating current per chip of the light emitting diode, but the amount of heat generated by the current limiting resistor increases, and there is a high possibility that the allowable temperature of the junction part of the light emitting diode will be exceeded. There is still a problem in maintaining the reliability of the light emitting diode, and it is difficult to increase the illuminance by increasing the current more than the current one.
【００１１】そこで、発光ダイオード素子から発する光
を効率よく利用する必要が生じるが、透明な樹脂封止体
を通して発光面側全周囲の外部へ放射され、光軸へは一
部分の光しか照射しないので光の利用効率が悪く、光軸
に対して現状以上の高照度化がむずかしい。Therefore, it is necessary to efficiently use the light emitted from the light emitting diode element, but the light is emitted to the outside of the entire circumference of the light emitting surface side through the transparent resin encapsulant, and only a part of the light is emitted to the optical axis. The utilization efficiency of light is poor, and it is difficult to achieve higher illuminance than the current level on the optical axis.
【００１２】本発明は上述の課題を解決したもので、光
の利用効率が高く、光軸上を高照度化した画像読み取り
用発光ダイオード整列光源を提供することを目的とす
る。An object of the present invention is to solve the above problems and to provide a light source for aligning light emitting diodes for image reading, which has high light utilization efficiency and high illuminance on the optical axis.
【００１３】[0013]
【課題を解決するための手段】この目的を達成するため
に本発明の発光ダイオード整列光源は、導電回路が形成
されたプリント配線基板と、導電回路の所定箇所に直線
状に配列させて配置した複数の発光ダイオード素子と、
直線状に配列させた複数の発光ダイオード素子の両側に
発光ダイオード素子と平行に形成された一対の白色系樹
脂体と、一対の白色系樹脂間に直線状に配列させ配置し
た発光ダイオード素子を封止する透明樹脂体とを備え
る。In order to achieve this object, a light emitting diode array light source of the present invention is arranged in a linear arrangement at a predetermined position of a printed circuit board on which a conductive circuit is formed and a conductive circuit. A plurality of light emitting diode elements,
A pair of white resin bodies formed parallel to the light emitting diode elements on both sides of the light emitting diode elements arranged in a straight line, and a light emitting diode element arranged in a line between the pair of white resin is sealed. And a transparent resin body for stopping.
【００１４】この構成によれば、プリント配線基板の導
電回路の所定箇所に直線状に配置された発光ダイオード
素子の両側に発光ダイオード素子と平行に形成されチク
ソトロピック性を備えた一対の白色系樹脂体と、一対の
白色系の樹脂間に直線状に配置された複数の発光ダイオ
ード素子を透明な樹脂にて封止した透明樹脂体とから構
成されるので、発光ダイオード素子から発した光は、一
対の白色系樹脂体で反射して光軸上へ集まり、光を効率
よく利用できるので市場の要望である光源の高照度化が
実現できる。According to this structure, a pair of white resin having thixotropic properties is formed in parallel with the light emitting diode element on both sides of the light emitting diode element linearly arranged at a predetermined position of the conductive circuit of the printed wiring board. Since a body and a transparent resin body in which a plurality of light emitting diode elements linearly arranged between a pair of white resin are sealed with a transparent resin, the light emitted from the light emitting diode element is Since the light is reflected by the pair of white resin bodies and collected on the optical axis to efficiently use the light, it is possible to realize the high illuminance of the light source, which is a market demand.
【００１５】また、白色系樹脂体と透明樹脂体とをシリ
コーン樹脂で構成することにより、それらの樹脂硬化時
に混じり合うことがないので、個々に硬化させる必要が
なくなり、１回の硬化で所期の特性を得ることが可能と
なる。Further, since the white resin body and the transparent resin body are composed of the silicone resin, they do not mix with each other when the resins are cured, so that they do not need to be individually cured, and the curing can be performed only once. It is possible to obtain the characteristics of.
【００１６】さらにまた、白色系樹脂体がチクソトロピ
ック性と隠蔽性を有する樹脂で構成することで、光反射
効果を高めることができる。Furthermore, the light-reflecting effect can be enhanced by configuring the white resin body with a resin having thixotropic properties and hiding properties.
【００１７】[0017]
【発明の実施の形態】以下、本発明の発光ダイオード整
列光源の実施の形態の一例について、図１および図２を
参照しながら説明する。図１はこの例の斜視図、図２は
図１のＸ−Ｘ線に沿った断面図である。BEST MODE FOR CARRYING OUT THE INVENTION An example of an embodiment of a light emitting diode aligned light source of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view of this example, and FIG. 2 is a sectional view taken along line XX of FIG.
【００１８】図１および図２において、１１はプリント
配線基板、１２は発光ダイオード素子、１３は金属細
線、１４は白色樹脂体、１５は透明樹脂体、１６は導電
回路、１７はレジスト層である。1 and 2, 11 is a printed wiring board, 12 is a light emitting diode element, 13 is a fine metal wire, 14 is a white resin body, 15 is a transparent resin body, 16 is a conductive circuit, and 17 is a resist layer. .
【００１９】発光ダイオード素子１２は、各導電回路１
６の所定の箇所に、図１に示すように一つの直線上に位
置するよう所定の間隔をおいて配置し、導電性接着剤等
で取り付けるとともに、一方の電極の電気的な接続を行
い、他方の電極が他の導電回路１６の所定箇所に金属細
線１３で接続されている。導電回路１６の発光ダイオー
ド素子１２が取り付けられる所定箇所は、プリント配線
基板１１の裏面への光漏れを防止し、発光面側へ反射さ
せるために可能な限り広くする。The light emitting diode element 12 is formed by each conductive circuit 1.
At a predetermined position of 6, arranged at a predetermined interval so as to be located on one straight line as shown in FIG. 1, and attached with a conductive adhesive or the like, and electrically connect one electrode, The other electrode is connected to a predetermined portion of another conductive circuit 16 by a thin metal wire 13. The predetermined portion of the conductive circuit 16 to which the light emitting diode element 12 is attached is made as wide as possible in order to prevent light leakage to the back surface of the printed wiring board 11 and to reflect it to the light emitting surface side.
【００２０】発光ダイオード素子１２、導電回路１６の
一部分、および金属細線１３は、プリント配線基板１１
の主面上で直線状に配列された複数の発光ダイオード素
子１２の両側にそれと平行に形成された一対の白色樹脂
体１４と、その一対の白色樹脂体１４間の透明樹脂体１
５で封止、保護されている。The light emitting diode element 12, a part of the conductive circuit 16, and the thin metal wire 13 are provided on the printed wiring board 11.
A pair of white resin bodies 14 formed in parallel on both sides of the plurality of light emitting diode elements 12 linearly arranged on the main surface of the transparent resin body 1 and the transparent resin body 1 between the pair of white resin bodies 14.
5 is sealed and protected.
【００２１】その白色樹脂体は、光反射効果を上げるた
めに塗布直後の形状を硬化後も維持できるチクソトロピ
ック性を備え、隠蔽性を有する必要がある。たとえば、
東芝シリコーン株式会社製の樹脂材料「ＸＥ１３−Ａ８
５８４」を使用し、白色で遮光性、反射性の特性を有す
る隠蔽性を持たせるために顔料「ＭＥ５０ーＷ」を重量
比率で５％添加することが望ましい。この白色樹脂体の
光反射効果による照度アップ効果は、従来の構造に対し
て１.３倍であることが確認できた。また、透明樹脂体
は、発光ダイオード素子からの光取り出し効率を上げる
ためにスネルの法則より発光ダイオード素子の屈折率
３.５に近いものがよく、また発光ダイオード素子から
発した光の利用効率を上げるために、樹脂の内部で光が
直進し光の吸収や屈折や乱反射がない光透過率の高い樹
脂であることが必要である。たとえば、東芝シリコーン
株式会社製の樹脂材料「ＸＥ１４−１２８」が望まし
い。通常のシリコーンは官能基としてケイ素原子の置換
基をメチル基としたメチル系シリコーンであり、屈折率
の値は１.４０〜１.４２であるが、このシリコーン樹脂
は、高屈折率化のために官能基としてケイ素原子の置換
基をフェニル基としたフェニル系のシリコーンであり、
屈折率の値が１.５１〜１.５２である。また、日立製作
所株式会社製自記分光光度計で測定した光透過率の値は
９３％（セル厚み１ｍｍ時)である。この透明樹脂によ
る照度アップ効果は、従来の構造に対して１.１倍であ
ることが確認できた。よって、本樹脂封止体による照度
アップ効果は、白色樹脂体による効果１.３倍と透明樹
脂体による効果１.１倍とを乗じることにより１.４３倍
となる。In order to improve the light reflection effect, the white resin body needs to have a thixotropic property capable of maintaining the shape immediately after coating even after curing and have a concealing property. For example,
Resin material "XE13-A8" made by Toshiba Silicone Co., Ltd.
It is desirable to add 5% by weight of the pigment "ME50-W" in order to provide white and light-shielding and reflecting properties and concealing properties. It was confirmed that the effect of increasing the illuminance due to the light reflection effect of this white resin body was 1.3 times that of the conventional structure. Also, the transparent resin body is preferably close to the refractive index of 3.5 of the light emitting diode element according to Snell's law in order to improve the light extraction efficiency from the light emitting diode element, and the utilization efficiency of the light emitted from the light emitting diode element is improved. In order to raise the temperature, it is necessary for the resin to have a high light transmittance in which light goes straight inside the resin and does not absorb, refract or diffusely reflect the light. For example, a resin material “XE14-128” manufactured by Toshiba Silicone Co., Ltd. is desirable. Ordinary silicone is a methyl-based silicone having a methyl group as a substituent of a silicon atom as a functional group, and has a refractive index value of 1.40 to 1.42, but this silicone resin has a high refractive index. Is a phenyl-based silicone having a phenyl group as a substituent of a silicon atom as a functional group,
The value of the refractive index is 1.51 to 1.52. Further, the value of the light transmittance measured by a self-recording spectrophotometer manufactured by Hitachi, Ltd. is 93% (when the cell thickness is 1 mm). It was confirmed that the illuminance increasing effect of this transparent resin was 1.1 times that of the conventional structure. Therefore, the effect of increasing the illuminance by the present resin sealing body is 1.43 times by multiplying the effect by the white resin body by 1.3 times and the effect by the transparent resin body by 1.1 times.
【００２２】また、シリコーン樹脂の硬化工程において
は、樹脂塗布後、白色樹脂体と透明樹脂体の表面張力に
より二つの樹脂が混ざり合うことがないため、別々に硬
化させる必要がなく、１回の硬化で初期の目標レベルが
達成できることも確認した。そのため、製造工程が複雑
化することなく容易に高性能の発光ダイオード整列光源
を提供することができる。In the silicone resin curing step, after the resin is applied, the two resins do not mix due to the surface tension of the white resin body and the transparent resin body, so that it is not necessary to cure them separately. It was also confirmed that the initial target level could be achieved by curing. Therefore, a high-performance aligned LED light source can be easily provided without complicating the manufacturing process.
【００２３】また、本実施例において、透明樹脂体には
照度アップ効果を増すためにフェニル系シリコーンを用
いたが、無論通常のメチル系シリコーンを使用すること
もできる。その場合には、透明樹脂の屈折率の値が従来
樹脂と同等であるので、透明樹脂体による照度アップ効
果がなく、白色樹脂体による光反射効果のみとなり、
１.２倍となる。Further, in this embodiment, phenyl silicone was used for the transparent resin body in order to enhance the effect of increasing the illuminance, but of course, ordinary methyl silicone can be used. In that case, since the value of the refractive index of the transparent resin is the same as that of the conventional resin, there is no illuminance increasing effect by the transparent resin body, and only the light reflecting effect by the white resin body,
It will be 1.2 times.
【００２４】また、レジスト層１７は、発光ダイオード
素子１２の発する光を効率的に取り出すために、光反射
率の高い色たとえば白色とした。Further, the resist layer 17 has a color having a high light reflectance, for example, white in order to efficiently take out the light emitted from the light emitting diode element 12.
【００２５】本実施例によれば、発光ダイオード素子か
ら発した光は、直線状に配置された複数の発光ダイオー
ド素子の両側にそれと平行に形成された一対の白色樹脂
により反射されて光軸上へ集まり、また、一対の白色樹
脂間を屈折率の高い樹脂により封止することで発光ダイ
オード素子からの光取り出し効率を高め、さらに光透過
率の高い樹脂にすることで発光ダイオード素子から発し
た光が樹脂の内部で光の吸収や屈折や乱反射がなく減衰
することなく直進するので、光の利用効率が上がり光軸
上を高照度化する。According to the present embodiment, the light emitted from the light emitting diode element is reflected by the pair of white resins formed on both sides of the plurality of linearly arranged light emitting diode elements in parallel with the light emitting diode element, and the light is emitted on the optical axis. In addition, the light extraction efficiency from the light emitting diode element is improved by sealing the space between the pair of white resins with a resin having a high refractive index, and the light emitting diode element emits light with a resin having a higher light transmittance. The light travels straight inside the resin without being absorbed, refracted, or diffusely reflected without being attenuated, so that the light utilization efficiency is increased and the illuminance on the optical axis is increased.
【００２６】さらにプリント配線基板の導電体パターン
の変更により、任意の個数の発光ダイオード素子を任意
のピッチで直線状に配列することで、使用目的や用途に
応じて照度レベルを実現したり、発光ダイオード素子の
ピッチが等ピッチである等倍系照度分布、たとえば １
／ｃｏｓ４θカーブを描く縮小系照度分布を形成するこ
とが容易になり、市場の要望に応じた製品設計が容易と
なる。Further, by changing the conductor pattern of the printed wiring board, an arbitrary number of light emitting diode elements are linearly arranged at an arbitrary pitch to realize an illuminance level according to the purpose of use or use, or to emit light. Illuminance distribution where the pitch of the diode elements is equal pitch, for example, 1
It becomes easier to form a reduced system illuminance distribution that draws a / cos4θ curve, and product design that meets market demands becomes easier.
【００２７】[0027]
【発明の効果】本発明の発光ダイオード整列光源は、直
線状に配置された複数の発光ダイオード素子の両側に発
光ダイオード素子と平行に形成された一対の白色樹脂体
により発光ダイオード素子より発した光を反射し光軸上
へ集め、また一対の白色樹脂間に直線状に配置された発
光ダイオード素子を封止する透明樹脂を屈折率の高い樹
脂で封止することにより発光ダイオード素子からの光取
り出し効率を高め、さらに透明樹脂を光透過率の高い樹
脂にすることにより、発光ダイオード素子から発した光
が樹脂の内部で直進し光の吸収や屈折や乱反射がなく減
衰することなく直進するので、発光ダイオード素子から
発する光の利用効率が上がり、市場の要望である光源の
高照度化を実現することができる。The light emitting diode aligned light source of the present invention comprises a pair of white resin bodies formed in parallel with the light emitting diode elements on both sides of a plurality of linearly arranged light emitting diode elements to emit light emitted from the light emitting diode elements. Light is extracted from the light emitting diode element by reflecting the light and collecting it on the optical axis, and sealing the light emitting diode element linearly arranged between a pair of white resins with a resin with a high refractive index. By increasing the efficiency and making the transparent resin a resin with a high light transmittance, the light emitted from the light emitting diode element goes straight inside the resin, and goes straight without being attenuated without absorption or refraction or irregular reflection of the light. Utilization efficiency of light emitted from the light emitting diode element is improved, and it is possible to realize high illuminance of the light source, which is a market demand.
【図１】本発明の発光ダイオード整列光源における実施
の形態の一例を示す斜視図FIG. 1 is a perspective view showing an example of an embodiment of a light emitting diode aligned light source of the present invention.
【図２】図１のＸ−Ｘ線に沿った断面図FIG. 2 is a sectional view taken along line XX of FIG.
【図３】従来のイメージスキャナーの一例を示す要部断
面図FIG. 3 is a sectional view of an essential part showing an example of a conventional image scanner.
【図４】図４のイメージスキャナーで使用される発光ダ
イオード整列光源の斜視図FIG. 4 is a perspective view of a light emitting diode alignment light source used in the image scanner of FIG.
【図５】図４に示した発光ダイオード整列光源の断面図5 is a cross-sectional view of the light emitting diode alignment light source shown in FIG.
１１ プリント配線基板 １２ 発光ダイオード素子 １３ 金属細線 １４ 白色樹脂体 １５ 透明樹脂体 １６ 導電回路 １７ レジスト層 １８ 電流制限用抵抗体 11 Printed Wiring Board 12 Light Emitting Diode Element 13 Metal Fine Wire 14 White Resin Body 15 Transparent Resin Body 16 Conductive Circuit 17 Resist Layer 18 Current Limiting Resistor
Claims (3)
と、前記導電回路の所定箇所に直線状に配列させて配置
した複数の発光ダイオード素子と、前記直線状に配列さ
せた複数の発光ダイオード素子の両側にその配列方向に
沿って形成された一対の白色系樹脂体と、前記一対の白
色系樹脂間に直線状に配列させ配置した発光ダイオード
素子を封止する透明樹脂体とを備えた発光ダイオード整
列光源。1. A printed wiring board on which a conductive circuit is formed, a plurality of light emitting diode elements linearly arranged at predetermined locations of the conductive circuit, and a plurality of light emitting diode elements linearly arranged on the printed circuit board. Light emission including a pair of white-colored resin bodies formed on both sides of the pair along the arrangement direction, and a transparent resin body that seals the light-emitting diode elements arranged linearly between the pair of white-colored resins Diode aligned light source.
ン樹脂からなる請求項１に記載の発光ダイオード整列光
源。2. The light emitting diode aligned light source according to claim 1, wherein the white resin body and the transparent resin body are made of silicone resin.
蔽性を有する請求項１に記載の発光ダイオード整列光
源。3. The light emitting diode aligned light source according to claim 1, wherein the white resin body has thixotropic properties and concealing properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7308723A JPH09148633A (en) | 1995-11-28 | 1995-11-28 | Light emitting diode-aligned light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7308723A JPH09148633A (en) | 1995-11-28 | 1995-11-28 | Light emitting diode-aligned light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09148633A true JPH09148633A (en) | 1997-06-06 |
Family
ID=17984515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7308723A Pending JPH09148633A (en) | 1995-11-28 | 1995-11-28 | Light emitting diode-aligned light source |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09148633A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196644A (en) * | 2000-01-11 | 2001-07-19 | Nichia Chem Ind Ltd | Optical semiconductor device and manufacturing method thereof |
| JP2006060005A (en) * | 2004-08-19 | 2006-03-02 | Shin Etsu Chem Co Ltd | Light emitting device and its manufacturing method |
| JP2006066786A (en) * | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
| JP2006324589A (en) * | 2005-05-20 | 2006-11-30 | Sharp Corp | Led device and manufacturing method thereof |
| JP2008124518A (en) * | 2004-07-02 | 2008-05-29 | Samsung Electro-Mechanics Co Ltd | Rgb light-emitting diode package with improved color mixing properties |
| JP2012504341A (en) * | 2008-09-30 | 2012-02-16 | ブリッジラックス インコーポレイテッド | LED phosphor deposition method |
| US8284350B2 (en) | 2007-05-15 | 2012-10-09 | Hitachi, Ltd. | Lighting system and liquid crystal display using the same |
-
1995
- 1995-11-28 JP JP7308723A patent/JPH09148633A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196644A (en) * | 2000-01-11 | 2001-07-19 | Nichia Chem Ind Ltd | Optical semiconductor device and manufacturing method thereof |
| JP2008124518A (en) * | 2004-07-02 | 2008-05-29 | Samsung Electro-Mechanics Co Ltd | Rgb light-emitting diode package with improved color mixing properties |
| JP2006060005A (en) * | 2004-08-19 | 2006-03-02 | Shin Etsu Chem Co Ltd | Light emitting device and its manufacturing method |
| JP2006066786A (en) * | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
| JP2006324589A (en) * | 2005-05-20 | 2006-11-30 | Sharp Corp | Led device and manufacturing method thereof |
| US8284350B2 (en) | 2007-05-15 | 2012-10-09 | Hitachi, Ltd. | Lighting system and liquid crystal display using the same |
| JP2012504341A (en) * | 2008-09-30 | 2012-02-16 | ブリッジラックス インコーポレイテッド | LED phosphor deposition method |
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