JP3559228B2 - Rotary substrate processing equipment - Google Patents

Rotary substrate processing equipment Download PDF

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Publication number
JP3559228B2
JP3559228B2 JP2000238578A JP2000238578A JP3559228B2 JP 3559228 B2 JP3559228 B2 JP 3559228B2 JP 2000238578 A JP2000238578 A JP 2000238578A JP 2000238578 A JP2000238578 A JP 2000238578A JP 3559228 B2 JP3559228 B2 JP 3559228B2
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Prior art keywords
substrate
rotor
cleaning
back surface
liquid
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JP2002057138A (en
Inventor
勝利 中田
修 藤根
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Sumitomo Precision Products Co Ltd
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Sumitomo Precision Products Co Ltd
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  • Liquid Crystal (AREA)
  • Materials For Photolithography (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、液晶用ガラス基板や半導体ウエーハにウエット処理を行う回転式基板処理装置に関する。
【０００２】
【従来の技術】
液晶用ガラス基板の製造においては、素材であるガラス基板の表面にレジスト塗布、エッチング、レジスト剥離等の処理が繰り返される。このようなガラス基板の処理に使用される基板処理装置の一つとして回転式のものがある。
【０００３】
回転式の基板処理装置は、基板をロータ上で回転させながら、スプレーユニットにより上方から基板の表面にエッチング液、剥離液等の薬液を供給する。薬液による処理が終わると、別のスプレーユニットにより上方から基板の表面に洗浄用の純水を吹き付ける。洗浄が終わると、基板を高速で回転させて乾燥する。
【０００４】
洗浄については、基板の裏面の薬液による汚れを除去するために、裏面にも洗浄液を吹き付ける場合が多い。また、乾燥に関しては、遠心力が作用しない回転中心部の乾燥を促進するために、その中心部に表面側及び裏面側から窒素ガスを吹き付ける場合が多い。
【０００５】
一方、ロータについては、使用後の液体を回収するために、その外径を基板の回転円の最大径より大きくし、使用後の液体を基板上から外周側へ排出する際の液ガイドを兼ねる構造が通常採用されている。
【０００６】
【発明が解決しようとする課題】
しかしながら、このような従来の回転式基板処理装置においては、基板の裏面を洗浄する場合にあっても、乾燥後の基板の裏面、特に中央部裏面に薬液のミストが付着残存する問題のあることが判明した。この現象は、乾燥時に基板の回転中心部裏面に窒素ガスを吹き付ける場合に特に顕著であり、基板の裏面へ吹き付ける洗浄液を増量しても一向に解消されないことも明らかになった。
【０００７】
本発明の目的は、洗浄液の増量によっても除去されない基板裏面の汚れを確実に除去できる回転式基板処理装置を提供することにある。
【０００８】
【課題を解決するための手段】
上記目的を達成するために、本発明者らは洗浄・乾燥後の基板の中央部裏面に薬液のミストが付着残存する現象の原因を子細に調査した。その結果、基板を回転させるロータの裏面、とりわけ外周縁部の裏面に付着残存する薬液によるものであることが判明した。
【０００９】
即ち、ロータは、前述したように、使用後の液体を基板上から外周側へ排出する際の液ガイドを兼ねることもあって、薬液による処理中に薬液による汚れを生じる。ロータの表面に付着する汚れは、洗浄中に基板の裏面に吹き付けられ純水により除去されるが、この汚れは、ロータの裏面、とりわけ外周縁部の裏面に及んでおり、このロータ裏面の汚れは、洗浄中に基板の裏面に吹き付けられる純水によっては除去されない。その結果、洗浄後もロータ裏面に薬液が残存し、洗浄に続く回転乾燥時にミストとなって拡散し、基板の回転中心部裏面に窒素ガスを吹き付ける場合に、その中央部裏面に特に顕著に薬液ミストが再付着する。
【００１０】
本発明の回転式基板処理装置は、かかる知見に基づいて開発されたものであり、基板を処理槽内でほぼ水平に支持して回転させ、前記基板の回転円の最大径より大きい外径の円板であるロータと、基板の表面に薬液を供給する薬液供給手段と、基板の少なくとも表面に洗浄液を吹き付ける基板洗浄手段と、洗浄工程において前記ロータの裏面に洗浄液を吹き付けるロータ洗浄手段とを具備しており、これにより、洗浄液の増量によっても解消されない基板裏面の汚れを確実に除去し得る。
【００１１】
ロータ洗浄手段は、ロータの少なくとも外周縁部を含む裏面に洗浄液を散布する構成が好ましい。これにより基板裏面の汚れが特に効果的に除去され得る。
【００１２】
ロータは、基板に散布された薬液及び洗浄液を外周側へ排出する際の液ガイドを兼ねる構成が好ましい。この場合にあっても、基板裏面の汚れが確実に除去され得る。
【００１３】
基板洗浄手段は、基板の表面及び裏面に洗浄液を散布する構成が好ましい。また、基板の回転中心部裏面にガスを吹き付けるガスパージ手段と組み合わせるのが好ましい。この場合にあっても、基板裏面の汚れが確実に除去され得る。
【００１４】
【発明の実施の形態】
以下に本発明の実施形態を図面に基づいて説明する。図１は本発明の１実施形態を示す回転式基板処理装置の主要部の側面図である。
【００１５】
本実施形態の回転式基板処理装置は、液晶用ガラス基板１０のエッチング処理又はレジスト剥離処理に使用される。この回転式基板処理装置は、図示されない処理槽の中心部に配置されたロータ２０及びその回転駆動機構３０を備えている。
【００１６】
ロータ２０は、水平な円板であって、その上に複数のピン２１により基板１０を水平に支持する。このロータ２０は、基板１０に供給された薬液及び洗浄液を回収する際の液ガイドを兼ねており、その外径は、基板１０の回転円の最大径（対角寸法）より若干大きくされている。
【００１７】
回転駆動機構３０は、円筒状の回転軸３１の内側に固定軸３２を組み合わせた２重構造になっている。外側の回転軸３１は、そのヘッド部に同心状に取り付けられた前記ロータ２０を回転させる。固定軸３２のヘッド部には、ガスパージ手段としての窒素ガスノズル４０と、基板洗浄手段を構成する複数の純水ノズル５０とが取り付けられている。
【００１８】
窒素ガスノズル４０は、ヘッド部の中心位置に真上を向いて設けられており、乾燥工程において基板１０の回転中心部裏面に窒素ガスを吹き付ける。複数の純水ノズル５０は、窒素ガスノズル４０の周囲に外周側へ傾斜して設けられており、洗浄工程において基板１０の裏面に純水を洗浄液として吹き付ける。
【００１９】
回転駆動機構３０には又、ロータ洗浄手段としての純水ノズル６０が取り付けられている。純水ノズル６０は、ロータ２０の外周部裏面に下方から対向するように、回転駆動機構３０の固定部に支持部材６１により取り付けられている。この純水ノズル６０は、洗浄工程においてロータ２０の外周部裏面に純水を洗浄液として吹き付ける。
【００２０】
ロータ２０及び回転駆動機構３０の外側には、液回収カップ７０が設けられている。液回収カップ７０は、外カップ７１と内カップ７２を組み合わせた２重構造である。内カップ７２は昇降式で、ロータ２０の外径より僅かに大きい開口部を有し、薬液処理時は、基板１０上に供給された薬液を外カップ７１内に導くために、開口部をロータ２０の僅か下方に位置させる。洗浄時は、その廃液を内カップ７２内に導くために上昇する。
【００２１】
図示されない処理槽には更に、第１のスプレーユニット８０と、図示されない第２のスプレーユニットとが設けられている。第１のスプレーユニット８０は、複数の純水ノズル５０と共に基板洗浄手段を構成する。このスプレーユニット８０は、水平なヘッド８１と、ヘッド８１を支持する支持機構８２とを備えている。ヘッド８１は、基板１０の回転円の半径方向に並ぶ複数の純水ノズル８３から基板１０の表面に純水を吹き付ける。支持機構８２は、ヘッド８１を基板１０の表面に対向するカップ内の使用位置とカップ外の退避位置に移動させる。
【００２２】
図示されない第２のスプレーユニットは、薬液供給手段であって、第１のスプレーユニット８０とほぼ同じ構成であり、カップ内の使用位置でヘッドを基板１０の表面に対向させて、その表面に薬液としてエッチング液又は剥離液を散布供給する。
【００２３】
次に、本実施形態の回転式基板処理装置の機能について説明する。
【００２４】
処理すべき基板１０がロータ２０上にセットされると、図示されない第２のスプレーユニットのヘッドを基板１０の表面に対向させる。ロータ２０を駆動して基板１０を回転させながら、基板１０の表面にヘッドから薬液を供給する。基板１０の表面に供給された薬液は、基板１０の回転に伴う遠心力により外周側へ移動し、ロータ２０の表面を介して外カップ７１内に回収される。このとき、薬液の一部がロータ２０の裏面側へ回りこみ、その外周縁部に付着する。
【００２５】
薬液による処理が終わると、図示されない第２のスプレーユニットのヘッドを基板１０の表面上から退避させ、代わりに、第１のスプレーユニット８０のヘッド８１を基板１０の表面に対向させ、そのヘッド８１から、回転中の基板１０の表面に純水を吹き付ける。また、複数の純水ノズル５０から、その基板１０の裏面に純水を吹き付ける。更に、純水ノズル６０から、ロータ２０の外周部裏面にも純水を吹き付ける。
【００２６】
基板１０の表面及び裏面に純水が吹き付けられることにより、その両面が洗浄される。洗浄により生じる廃液は、ロータ２０の表面を介して内カップ７２内に回収される。このとき、ロータ２０の表面に付着する薬液も除去される。特に、基板１０の裏面から反射する純水によってその表面が洗浄される。ロータ２０の外周縁部裏面に付着する薬液は、基板１０の表面及び裏面に吹き付けられる純水によっては殆ど除去されないが、その除去のための専用の純水ノズル６０から噴出される純水により、ほぼ完全に除去される。
【００２７】
洗浄が終わると、ロータ２０を高速で回転させることにより、基板１０の表面及び裏面から残存水を除去する。また、遠心力が作用しない基板１０の中心部裏面に窒素ガスノズル７０から窒素ガスを吹き付ける。また、図示されない同様の窒素ガスノズルから、基板１０の中心部表面に窒素ガスを吹き付ける。このとき、ロータ２０の外周縁部裏面に薬液が残存していると、その薬液がミストになって拡散し、基板１０の中心部裏面に再付着するが、その薬液が事前に除去されているので、このミスト付着の懸念がない。
【００２８】
【発明の効果】
以上に説明したとおり、本発明の回転式基板処理装置は、洗浄工程においてロータの裏面に洗浄液を吹き付けるロータ洗浄手段を装備することにより、洗浄液の増量によっても除去されない基板裏面の汚れを確実に除去できる。特に、ガスパージによって回転中心部の乾燥効果を高める場合に、その汚れを確実に除去できるので、処理品質の向上に大きな効果を発揮する。
【図面の簡単な説明】
【図１】本発明の１実施形態を示す回転式基板処理装置の主要部の側面図である。
【符号の説明】
１０ 基板
２０ ロータ
３０ 回転駆動機構
４０ 窒素ガスノズル
５０ 純水ノズル（基板洗浄手段）
６０ 純水ノズル（ロータ洗浄手段）
７０ 液回収カップ
８０ スプレーノズル（基板洗浄手段）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a rotary substrate processing apparatus for performing a wet process on a liquid crystal glass substrate or a semiconductor wafer.
[0002]
[Prior art]
In the production of a glass substrate for liquid crystal, processes such as resist application, etching, and resist peeling are repeated on the surface of a glass substrate as a material. One of the substrate processing apparatuses used for processing such a glass substrate is a rotary type.
[0003]
The rotary type substrate processing apparatus supplies a chemical such as an etchant or a stripper to the surface of the substrate from above by a spray unit while rotating the substrate on a rotor. After the treatment with the chemical solution, pure water for cleaning is sprayed from above onto the surface of the substrate by another spray unit. When the cleaning is completed, the substrate is rotated at a high speed and dried.
[0004]
In cleaning, a cleaning liquid is often sprayed on the back surface of the substrate in order to remove stains caused by the chemical liquid on the back surface of the substrate. Regarding the drying, in order to promote the drying of the center of rotation where the centrifugal force does not act, the center is often blown with nitrogen gas from the front side and the back side.
[0005]
On the other hand, the rotor has an outer diameter larger than the maximum diameter of the rotating circle of the substrate in order to collect the used liquid, and also serves as a liquid guide when the used liquid is discharged from the substrate to the outer peripheral side. Structures are usually employed.
[0006]
[Problems to be solved by the invention]
However, in such a conventional rotary substrate processing apparatus, even when cleaning the back surface of the substrate, there is a problem that the mist of the chemical liquid adheres and remains on the back surface of the dried substrate, particularly on the back surface of the central portion. There was found. This phenomenon is particularly remarkable when nitrogen gas is blown onto the back surface of the center of rotation of the substrate during drying, and it has been clarified that even if the amount of cleaning liquid sprayed on the back surface of the substrate is increased, it is not eliminated at all.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide a rotary substrate processing apparatus capable of reliably removing dirt on the back surface of a substrate that is not removed even by increasing the amount of a cleaning liquid.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present inventors have closely investigated the cause of a phenomenon in which a mist of a chemical solution adheres and remains on the back surface of the central part of the substrate after cleaning and drying. As a result, it was found that the liquid was due to the chemical liquid remaining on the back surface of the rotor for rotating the substrate, especially on the back surface of the outer peripheral portion.
[0009]
That is, as described above, the rotor may also serve as a liquid guide when the used liquid is discharged from the substrate to the outer peripheral side, so that contamination with the chemical liquid occurs during the processing with the chemical liquid. Dirt adhering to the surface of the rotor is sprayed on the back surface of the substrate during cleaning and removed by pure water, but the dirt spreads on the back surface of the rotor, especially on the back surface of the outer peripheral portion. Is not removed by pure water sprayed on the back surface of the substrate during cleaning. As a result, the chemical solution remains on the back surface of the rotor even after cleaning, and becomes a mist during rotation drying after cleaning, and when the nitrogen gas is blown on the back surface of the rotational center portion of the substrate, the chemical solution is particularly prominent on the back surface of the central portion. Mist is re-adhered.
[0010]
The rotary substrate processing apparatus of the present invention has been developed based on such knowledge, and supports and rotates a substrate substantially horizontally in a processing tank, and has an outer diameter larger than the maximum diameter of the rotating circle of the substrate. and Ru disc der rotor, a chemical supply means for supplying a chemical solution to the surface of the substrate, and the substrate cleaning means for spraying a cleaning liquid to at least the surface of the substrate, and a rotor cleaning unit for spraying a cleaning liquid to the rear surface of the rotor in the cleaning process As a result, dirt on the back surface of the substrate, which is not eliminated even by increasing the amount of the cleaning liquid, can be reliably removed.
[0011]
The rotor cleaning means preferably has a configuration in which the cleaning liquid is sprayed on the back surface including at least the outer peripheral edge of the rotor. Thereby, the stain on the back surface of the substrate can be particularly effectively removed.
[0012]
It is preferable that the rotor also serves as a liquid guide when discharging the chemical liquid and the cleaning liquid sprayed on the substrate to the outer peripheral side. Even in this case, the stain on the back surface of the substrate can be reliably removed.
[0013]
Preferably, the substrate cleaning means is configured to spray a cleaning liquid on the front and back surfaces of the substrate. Further, it is preferable to combine with a gas purging means for blowing gas to the back surface of the rotation center of the substrate. Even in this case, the stain on the back surface of the substrate can be reliably removed.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a main part of a rotary substrate processing apparatus according to an embodiment of the present invention.
[0015]
The rotary substrate processing apparatus of the present embodiment is used for etching or resist stripping of the glass substrate 10 for liquid crystal. This rotary substrate processing apparatus includes a rotor 20 disposed at the center of a processing tank (not shown) and a rotation drive mechanism 30 thereof.
[0016]
The rotor 20 is a horizontal disk on which the substrate 10 is horizontally supported by a plurality of pins 21. The rotor 20 also serves as a liquid guide when collecting the chemical solution and the cleaning liquid supplied to the substrate 10, and has an outer diameter slightly larger than the maximum diameter (diagonal dimension) of the rotating circle of the substrate 10. .
[0017]
The rotation drive mechanism 30 has a double structure in which a fixed shaft 32 is combined inside a cylindrical rotation shaft 31. The outer rotating shaft 31 rotates the rotor 20 mounted concentrically on its head. A nitrogen gas nozzle 40 as a gas purging means and a plurality of pure water nozzles 50 constituting a substrate cleaning means are attached to the head of the fixed shaft 32.
[0018]
The nitrogen gas nozzle 40 is provided directly above the center of the head unit, and sprays nitrogen gas on the back surface of the rotation center of the substrate 10 in the drying process. The plurality of pure water nozzles 50 are provided around the nitrogen gas nozzle 40 so as to be inclined toward the outer periphery, and spray pure water as a cleaning liquid onto the back surface of the substrate 10 in the cleaning step.
[0019]
The rotary drive mechanism 30 is also provided with a pure water nozzle 60 as a rotor cleaning means. The pure water nozzle 60 is attached to a fixed portion of the rotation drive mechanism 30 by a support member 61 so as to face the outer peripheral portion rear surface of the rotor 20 from below. The pure water nozzle 60 sprays pure water as a cleaning liquid on the back surface of the outer peripheral portion of the rotor 20 in the cleaning process.
[0020]
A liquid recovery cup 70 is provided outside the rotor 20 and the rotation drive mechanism 30. The liquid recovery cup 70 has a double structure in which an outer cup 71 and an inner cup 72 are combined. The inner cup 72 is of an elevating type and has an opening slightly larger than the outer diameter of the rotor 20. In the case of chemical treatment, the opening is formed by a rotor to guide the chemical supplied on the substrate 10 into the outer cup 71. 20 slightly below. At the time of cleaning, the waste liquid rises to guide the waste liquid into the inner cup 72.
[0021]
The processing tank (not shown) is further provided with a first spray unit 80 and a second spray unit (not shown). The first spray unit 80 constitutes a substrate cleaning unit together with the plurality of pure water nozzles 50. The spray unit 80 includes a horizontal head 81 and a support mechanism 82 that supports the head 81. The head 81 sprays pure water onto the surface of the substrate 10 from a plurality of pure water nozzles 83 arranged in the radial direction of the rotation circle of the substrate 10. The support mechanism 82 moves the head 81 to a use position in the cup facing the surface of the substrate 10 and a retracted position outside the cup.
[0022]
The second spray unit (not shown) is a chemical liquid supply means and has substantially the same configuration as the first spray unit 80. The head is opposed to the surface of the substrate 10 at the use position in the cup, and the chemical liquid is applied to the surface. As an etching solution or a stripping solution.
[0023]
Next, the function of the rotary substrate processing apparatus of the present embodiment will be described.
[0024]
When the substrate 10 to be processed is set on the rotor 20, the head of the second spray unit (not shown) is made to face the surface of the substrate 10. While the rotor 20 is driven to rotate the substrate 10, a chemical is supplied from the head to the surface of the substrate 10. The chemical solution supplied to the surface of the substrate 10 moves to the outer peripheral side due to centrifugal force accompanying the rotation of the substrate 10 and is collected in the outer cup 71 through the surface of the rotor 20. At this time, a part of the chemical solution goes around the back surface of the rotor 20 and adheres to the outer peripheral edge thereof.
[0025]
When the treatment with the chemical solution is completed, the head of the second spray unit (not shown) is retracted from the surface of the substrate 10, and instead, the head 81 of the first spray unit 80 is opposed to the surface of the substrate 10, and the head 81 Then, pure water is sprayed on the surface of the rotating substrate 10. Further, pure water is sprayed from a plurality of pure water nozzles 50 on the back surface of the substrate 10. Further, pure water is also sprayed from the pure water nozzle 60 to the back surface of the outer peripheral portion of the rotor 20.
[0026]
By spraying pure water on the front and back surfaces of the substrate 10, both surfaces are cleaned. The waste liquid generated by the washing is collected in the inner cup 72 through the surface of the rotor 20. At this time, the chemical solution attached to the surface of the rotor 20 is also removed. In particular, the surface of the substrate 10 is cleaned by pure water reflected from the rear surface. The chemical liquid adhering to the outer peripheral edge rear surface of the rotor 20 is hardly removed by the pure water sprayed on the front surface and the rear surface of the substrate 10, but the pure water ejected from the pure water nozzle 60 dedicated for the removal is used. Almost completely removed.
[0027]
After the cleaning, the remaining water is removed from the front and back surfaces of the substrate 10 by rotating the rotor 20 at a high speed. Further, nitrogen gas is blown from the nitrogen gas nozzle 70 to the back surface of the central portion of the substrate 10 where no centrifugal force acts. Further, a nitrogen gas is sprayed onto the central surface of the substrate 10 from a similar nitrogen gas nozzle (not shown). At this time, if the chemical liquid remains on the outer peripheral edge rear surface of the rotor 20, the chemical liquid diffuses as a mist and re-adheres to the central rear surface of the substrate 10, but the chemical liquid has been removed in advance. Therefore, there is no concern about this mist adhesion.
[0028]
【The invention's effect】
As described above, the rotary substrate processing apparatus of the present invention is provided with the rotor cleaning means for spraying the cleaning liquid on the back surface of the rotor in the cleaning step, thereby reliably removing the dirt on the back surface of the substrate which is not removed even by increasing the cleaning liquid. it can. In particular, in the case where the drying effect of the rotation center portion is enhanced by gas purging, the stain can be surely removed, so that a great effect is achieved in improving the processing quality.
[Brief description of the drawings]
FIG. 1 is a side view of a main part of a rotary substrate processing apparatus according to an embodiment of the present invention.
[Explanation of symbols]
Reference Signs List 10 substrate 20 rotor 30 rotation drive mechanism 40 nitrogen gas nozzle 50 pure water nozzle (substrate cleaning means)
60 Pure water nozzle (rotor cleaning means)
70 liquid recovery cup 80 spray nozzle (substrate cleaning means)

Claims (5)

基板を処理槽内でほぼ水平に支持して回転させ、前記基板の回転円の最大径より大きい外径の円板であるロータと、基板の表面に薬液を供給する薬液供給手段と、基板の少なくとも表面に洗浄液を吹き付ける基板洗浄手段と、洗浄工程において前記ロータの裏面に洗浄液を吹き付けるロータ洗浄手段とを具備することを特徴とする回転式基板処理装置。The substrate is rotated by substantially horizontally supported in the processing tank, a disc der Ru rotor maximum diameter larger than the outer diameter of the rotation circle of the substrates, and the chemical supply means for supplying a chemical solution to the surface of the substrate, the substrate A substrate cleaning means for spraying a cleaning liquid on at least a front surface of the rotary substrate processing apparatus, and a rotor cleaning means for spraying a cleaning liquid on a back surface of the rotor in a cleaning step . 前記ロータは、基板に供給された薬液及び洗浄液を外周側へ排出する際の液ガイドを兼ねる請求項１に記載の回転式基板処理装置。2. The rotary substrate processing apparatus according to claim 1, wherein the rotor also serves as a liquid guide when discharging the chemical liquid and the cleaning liquid supplied to the substrate to the outer peripheral side. 3. 前記ロータ洗浄手段は、ロータの少なくとも外周部を含む裏面に洗浄液を吹き付ける請求項１に記載の回転式基板処理装置。2. The rotary substrate processing apparatus according to claim 1, wherein the rotor cleaning unit sprays a cleaning liquid on a back surface including at least an outer peripheral portion of the rotor. 前記基板洗浄手段は、基板の表面及び裏面に洗浄液を吹き付ける請求項１に記載の回転式基板処理装置。The rotary substrate processing apparatus according to claim 1, wherein the substrate cleaning unit sprays a cleaning liquid on a front surface and a back surface of the substrate. 前記基板洗浄手段は、基板の回転中心部裏面にガスを吹き付けるガスパージ手段と組み合わされる請求項４に記載の回転式基板処理装置。The rotary substrate processing apparatus according to claim 4, wherein the substrate cleaning unit is combined with a gas purge unit that blows a gas on a back surface of a rotation center of the substrate.
JP2000238578A 2000-08-07 2000-08-07 Rotary substrate processing equipment Expired - Fee Related JP3559228B2 (en)

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